SCBS130T − MAY 1992 − REVISED SEPTEMBER 2003 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 A1 A2 A3 A4 A5 A6 A7 A8 20 A2 A1 DIR VCC 1 SN54LVTH245A . . . FK PACKAGE (TOP VIEW) A3 A4 A5 A6 A7 19 OE 18 B1 2 3 17 B2 16 B3 4 5 15 B4 14 B5 6 7 13 B6 12 B7 8 9 10 11 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 B1 B2 B3 B4 B5 A8 GND B8 B7 B6 20 VCC 1 Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) SN74LVTH245A . . . RGY PACKAGE (TOP VIEW) SN54LVTH245A . . . J OR W PACKAGE SN74LVTH245A . . . DB, DW, NS, OR PW PACKAGE (TOP VIEW) DIR A1 A2 A3 A4 A5 A6 A7 A8 GND D B8 D D DIR D GND D D Bus Hold on Data Inputs Eliminates the Input and Output Voltages With 3.3-V VCC) Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Support Unregulated Battery Operation Down to 2.7 V Ioff and Power-Up 3-State Support Hot Insertion OE D Support Mixed-Mode Signal Operation (5-V description/ordering information These octal bus transceivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. ORDERING INFORMATION QFN − RGY SN74LVTH245ARGYR Tube SN74LVTH245ADW Tape and reel SN74LVTH245ADWR SOP − NS Tape and reel SN74LVTH245ANSR LVTH245A SSOP − DB Tape and reel SN74LVTH245ADBR LXH245A Tube SN74LVTH245APW Tape and reel SN74LVTH245APWR TSSOP − PW VFBGA − GQN LXH245A LVTH245A LXH245A SN74LVTH245AGQNR VFBGA − ZQN (Pb-free) −55°C 125°C −55 C to 125 C TOP-SIDE MARKING Tape and reel SOIC − DW −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER PACKAGE† TA Tape and reel SN74LVTH245AZQNR LXH245A CDIP − J Tube SNJ54LVTH245AJ SNJ54LVTH245AJ CFP − W Tube SNJ54LVTH245AW SNJ54LVTH245AW LCCC − FK Tube SNJ54LVTH245AFK SNJ54LVTH245AFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"& *%$"# $ " #'&$$!"# '& "+& "&# &,!# #"%&"# #"!*!* -!!". *%$" '$&##/ *&# " &$&##!). $)%*& "&#"/ !)) '!!&"&# '*%$"# $')!" " 012 !)) '!!&"&# !& "&#"&* %)&## "+&-#& "&* !)) "+& '*%$"# '*%$" '$&##/ *&# " &$&##!). $)%*& "&#"/ !)) '!!&"&# POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCBS130T − MAY 1992 − REVISED SEPTEMBER 2003 description/ordering information (continued) These devices are designed for asynchronous communication between data buses. They transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the devices so the buses are effectively isolated. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. SN74LVTH245A . . . GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 terminal assignments 4 1 2 3 4 A A A1 DIR B A3 B2 VCC A2 OE B C C A5 A4 B4 B3 D D A7 B6 A6 B5 E E GND A8 B8 B7 FUNCTION TABLE INPUTS OE DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation logic diagram (positive logic) DIR 1 19 A1 2 18 To Seven Other Channels Pin numbers shown are for the DB, DW, FK, J, NS, PW, RGY, and W packages. 2 OE POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 B1 B1 SCBS130T − MAY 1992 − REVISED SEPTEMBER 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Current into any output in the low state, IO: SN54LVTH245A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74LVTH245A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Current into any output in the high state, IO (see Note 2): SN54LVTH245A . . . . . . . . . . . . . . . . . . . . . . 48 mA SN74LVTH245A . . . . . . . . . . . . . . . . . . . . . . 64 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W (see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W (see Note 3): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W (see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W (see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W (see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This current flows only when the output is in the high state and VO > VCC. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 5) SN54LVTH245A SN74LVTH245A MIN MAX MIN MAX 2.7 3.6 2.7 3.6 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage 0.8 0.8 Input voltage 5.5 5.5 V IOH IOL High-level output current −24 −32 mA 48 64 mA ∆t/∆v Input transition rise or fall rate 10 10 ns/V ∆t/∆VCC TA Power-up ramp rate 200 Operating free-air temperature −55 High-level input voltage 2 Low-level output current Outputs enabled 2 V −40 V µs/V 200 125 V 85 °C NOTE 5: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCBS130T − MAY 1992 − REVISED SEPTEMBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH II = −18 mA IOH = −100 µA VCC = 2.7 V, IOH = −8 mA IOH = −24 mA VCC = 2.7 V VOL VCC = 3 V Ioff −1.2 VCC−0.2 2.4 −1.2 IOH = −32 mA IOL = 100 µA 2 0.2 0.2 IOL = 24 mA IOL = 16 mA 0.5 0.5 0.4 0.4 IOL = 32 mA IOL = 48 mA 0.5 0.5 V 0.55 IOL = 64 mA VI = VCC or GND 0.55 ±1 10 20 20 VCC = 3.6 V VI = VCC VI = 0 1 1 VCC = 0, VI or VO = 0 to 4.5 V VI = 0.8 V VCC = 3.6 V§, V V 2 ±1 A or B ports UNIT VCC−0.2 2.4 10 VCC = 3 V II(hold) SN74LVTH245A TYP† MAX MIN VI = 5.5 V VI = 5.5 V VCC = 3.6 V, VCC = 0 or 3.6 V, II A or B ports‡ MIN VCC = 2.7 V, VCC = 2.7 V to 3.6 V, VCC = 3 V Control inputs SN54LVTH245A TYP† MAX TEST CONDITIONS −5 VI = 2 V µA −5 ±100 75 75 −75 −75 500 −750 VI = 0 to 3.6 V µA µA IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care ±100∗ ±100 µA IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care ±100∗ ±100 µA VCC = 3.6 V, IO = 0, VI = VCC or GND 0.19 0.19 ICC Outputs high Outputs low Outputs disabled ∆ICC¶ VCC = 3 V to 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 VO = 3 V or 0 Cio 5 5 0.19 0.19 0.2 0.2 4 4 9 9 mA mA pF pF ∗ On products compliant to MIL-PRF-38535, this parameter is not production tested. † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ Unused terminals are at VCC or GND. § This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. ¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS130T − MAY 1992 − REVISED SEPTEMBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54LVTH245A PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE A or B tPHZ tPLZ OE A or B VCC = 3.3 V ± 0.3 V SN74LVTH245A VCC = 2.7 V VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN MAX MAX MIN TYP† MAX 0.7 3.7 4.2 1.2 2.3 3.5 4 0.7 3.7 4.2 1.2 2.1 3.5 4 1.2 5.7 7.4 1.3 3.2 5.5 7.1 1.6 5.7 6.8 1.7 3.4 5.5 6.5 1.8 6.2 6.8 2.2 3.5 5.9 6.5 1.8 5.3 5.5 2.2 3.4 5 5.1 MIN MIN UNIT MAX ns ns ns † All typical values are at VCC = 3.3 V, TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCBS130T − MAY 1992 − REVISED SEPTEMBER 2003 PARAMETER MEASUREMENT INFORMATION 6V 500 Ω From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND 2.7 V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 2.7 V Input 1.5 V 1.5 V th 2.7 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 2.7 V 1.5 V Input 1.5 V 0V VOH 1.5 V 1.5 V VOL Output tPLZ 3V 1.5 V tPZH VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V Output Waveform 1 S1 at 6 V (see Note B) tPLH tPHL 1.5 V tPZL tPHL tPLH Output 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9564201Q2A ACTIVE LCCC FK 20 1 TBD 5962-9564201QRA ACTIVE CDIP J 20 1 TBD 5962-9564201QSA ACTIVE CFP W 20 1 TBD 5962-9564201V2A ACTIVE LCCC FK 20 1 TBD 5962-9564201VRA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-9564201VSA ACTIVE CFP W 20 SN74LVTH245ADBLE OBSOLETE SSOP DB 20 SN74LVTH245ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245AGQNR ACTIVE GQN 20 1000 SNPB Level-1-240C-UNLIM SN74LVTH245ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245APWLE OBSOLETE TSSOP PW 20 SN74LVTH245APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH245ARGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74LVTH245ARGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74LVTH245AZQNR ACTIVE ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR BGA MI CROSTA R JUNI TBD TBD Addendum-Page 1 Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Orderable Device Status (1) Package Type SNJ54LVTH245AFK ACTIVE LCCC SNJ54LVTH245AJ ACTIVE SNJ54LVTH245AW ACTIVE Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) OR FK 20 1 TBD POST-PLATE N / A for Pkg Type CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CFP W 20 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Mailing Address: Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated