SCBS683H − MARCH 1997 − REVISED OCTOBER 2003 D Support Mixed-Mode Signal Operation D D D D OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q CLK SN54LVTH374 . . . FK PACKAGE (TOP VIEW) description/ordering information 2D 2Q 3Q 3D 4D These octal flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND CLK 5Q 5D The eight flip-flops of the ’LVTH374 devices are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs. 8Q D (5-V Input and Output Voltages With 3.3-V VCC) Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Support Unregulated Battery Operation Down to 2.7 V Ioff and Power-Up 3-State Support Hot Insertion Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) 1D 1Q OE VCC D SN54LVTH374 . . . J OR W PACKAGE SN74LVTH374 . . . DB, DW, NS, OR PW PACKAGE (TOP VIEW) ORDERING INFORMATION PACKAGE† ORDERABLE PART NUMBER Tube SN74LVTH374DW Tape and reel SN74LVTH374DWR SOP − NS Tape and reel SN74LVTH374NSR LVTH374 SSOP − DB Tape and reel SN74LVTH374DBR LXH374 Tube SN74LVTH374PW Tape and reel SN74LVTH374PWR CDIP − J Tube SNJ54LVTH374J SNJ54LVTH374J CFP − W Tube SNJ54LVTH374W SNJ54LVTH374W LCCC - FK Tube SNJ54LVTH374FK TA SOIC − DW −40°C to 85°C TSSOP − PW −55°C 125°C −55 C to 125 C TOP-SIDE MARKING LVTH374 LXH374 SNJ54LVTH374FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated (1&)$( (% #",$ )% 1 "2'(#)$( !)$, !"#$% #1& $ %,#(1(#)$(% , $-, $,&% 1 ,3)% %$"&,$% %$)!)! .))$0 !"#$( #,%%(/ !,% $ ,#,%%)('0 (#'"!, $,%$(/ 1 )'' ))&,$,% !"#$% #&'()$ $ *+ )'' ))&,$,% ), $,%$,! "',%% $-,.(%, $,! )'' $-, !"#$% !"#$( #,%%(/ !,% $ ,#,%%)('0 (#'"!, $,%$(/ 1 )'' ))&,$,% POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCBS683H − MARCH 1997 − REVISED OCTOBER 2003 description/ordering information (continued) A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. FUNCTION TABLE (each flip-flop) INPUTS OE CLK D OUTPUT Q L ↑ H H L ↑ L L L H or L X Q0 H X X Z logic diagram (positive logic) OE CLK 1 11 C1 1D 3 1D To Seven Other Channels 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2 1Q SCBS683H − MARCH 1997 − REVISED OCTOBER 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Current into any output in the low state, IO: SN54LVTH374 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74LVTH374 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Current into any output in the high state, IO (see Note 2): SN54LVTH374 . . . . . . . . . . . . . . . . . . . . . . . 48 mA SN74LVTH374 . . . . . . . . . . . . . . . . . . . . . . . 64 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This current flows only when the output is in the high state and VO > VCC. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4) SN54LVTH374 SN74LVTH374 MIN MAX MIN MAX 2.7 3.6 2.7 3.6 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 5.5 5.5 V IOH IOL High-level output current −24 −32 mA Low-level output current 48 64 mA ∆t/∆v Input transition rise or fall rate ∆t/∆VCC TA Power-up ramp rate 200 Operating free-air temperature −55 High-level input voltage 2 2 0.8 V 0.8 10 10 −40 V ns/V µs/V 200 125 V 85 °C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCBS683H − MARCH 1997 − REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 2.7 V, VCC = 2.7 V to 3.6 V, II = −18 mA IOH = −100 µA VCC = 2.7 V, IOH = −8 mA IOH = −24 mA VCC = 3 V Ioff II(hold) 2 0.5 0.4 0.4 IOL = 32 mA IOL = 48 mA 0.5 0.5 0.55 VCC = 0 or 3.6 V, IOL = 64 mA VI = 5.5 V 10 10 VCC = 3.6 V, VI = VCC or GND ±1 ±1 1 1 VCC = 3.6 V VI = VCC VI = 0 −5 −5 VCC = 3 V VI = 2 V V V 2 IOH = −32 mA IOL = 100 µA VI or VO = 0 to 4.5 V VI = 0.8 V UNIT VCC−0.2 2.4 0.5 VCC = 0, Data inputs VCC−0.2 2.4 −1.2 IOL = 24 mA IOL = 16 mA VCC = 3 V Data inputs −1.2 0.2 VOL Control inputs SN74LVTH374 TYP† MAX MIN 0.2 VCC = 2.7 V II SN54LVTH374 TYP† MAX MIN V 0.55 ±100 75 75 −75 −75 500 −750 µA µA µA VCC = 3.6 V‡, VI = 0 to 3.6 V IOZH IOZL VCC = 3.6 V, VCC = 3.6 V, VO = 3 V VO = 0.5 V 5 5 µA −5 −5 µA IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care ±100∗ ±100 µA IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care ±100∗ ±100 µA 0.19 0.19 ICC VCC = 3.6 V, IO = 0, VI = VCC or GND Outputs high Outputs low Outputs disabled ∆ICC§ VCC = 3 V to 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 VO = 3 V or 0 Co 5 5 0.19 0.19 0.2 0.2 3 3 7 7 mA mA pF pF ∗ On products compliant to MIL-PRF-38535, this parameter is not production tested. † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. § This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS683H − MARCH 1997 − REVISED OCTOBER 2003 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVTH374 VCC = 3.3 V ± 0.3 V MIN MAX SN74LVTH374 VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN MAX 150 MIN 150 MAX VCC = 2.7 V MIN 150 UNIT MAX fclock tw Clock frequency Pulse duration, CLK high or low 3.3 3.3 3.3 3.3 150 MHz ns tsu th Setup time, data before CLK↑ 1.6 2 1.5 2 ns Hold time, data after CLK↑ 0.8 0.5 0.8 0 ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54LVTH374 PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 3.3 V ± 0.3 V MIN fmax tPLH tPHL tPZH tPZL tPHZ MAX 150 CLK Q OE Q OE Q tPLZ † All typical values are at VCC = 3.3 V, TA = 25°C. SN74LVTH374 VCC = 2.7 V MIN MAX 150 VCC = 3.3 V ± 0.3 V MIN TYP† VCC = 2.7 V MAX 150 MIN MAX 150 MHz 1 5.1 5.6 1.8 2.9 4.5 5 1.5 5.1 5.2 1.8 2.9 4.2 4.3 0.8 5.6 6.6 1.3 2.8 4.7 5.6 1.2 5.4 6.2 1.6 3 4.7 5.2 1.5 5.6 5.7 1.9 3 4.6 4.9 0.8 5.2 5.3 2 3.1 4.5 4.6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT ns ns ns 5 SCBS683H − MARCH 1997 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test 6V Open S1 GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND 2.7 V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 2.7 V Input 1.5 V 1.5 V th 2.7 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V 1.5 V Input 1.5 V 0V tPHL tPLH VOH 1.5 V Output 1.5 V VOL 1.5 V 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ 3V 1.5 V tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPLH tPHL 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9951001Q2A ACTIVE LCCC FK 20 1 TBD 5962-9951001QRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 1 TBD Call TI N / A for Pkg Type TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type 5962-9951001QSA ACTIVE CFP W 20 SN74LVTH374DBLE OBSOLETE SSOP DB 20 SN74LVTH374DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374PWLE OBSOLETE TSSOP PW 20 SN74LVTH374PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH374PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54LVTH374FK ACTIVE LCCC FK 20 1 TBD SNJ54LVTH374J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54LVTH374W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type TBD (1) Call TI Call TI POST-PLATE N / A for Pkg Type The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2008 a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LVTH374DBR Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74LVTH374DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LVTH374PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVTH374DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74LVTH374DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74LVTH374PWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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