SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004 D Meet or Exceed the Requirements of ANSI D D D D D SN55188 . . . J OR W PACKAGE SN75188 . . . D, N, OR NS PACKAGE MC1488 . . . N PACKAGE (TOP VIEW) TIA / EIA-232-E and ITU Recommendation V.28 Current-Limited Output: 10 mA Typical Power-Off Output Impedance: 300 Ω Minimum Slew Rate Control by Load Capacitor Flexible Supply-Voltage Range Input Compatible With Most TTL Circuits VCC − 1A 1Y 2A 2B 2Y GND description/ordering information The MC1488, SN55188, and SN75188 are monolithic quadruple line drivers designed to interface data terminal equipment with data communications equipment in conformance with ANSI TIA/EIA-232-E, using a diode in series with each supply-voltage terminal as shown under typical applications. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC + 4B 4A 4Y 3B 3A 3Y 1A VCC − NC V CC+ 4B SN55188 . . . FK PACKAGE (TOP VIEW) 3 1Y NC 2A NC 2B 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A NC 4Y NC 3B 2Y GND NC 3Y 3A The SN55188 is characterized for operation over the full military temperature range of − 55°C to 125°C. The MC1488 and SN75188 are characterized for operation from 0°C to 70°C. 4 NC − No internal connection ORDERING INFORMATION PDIP (N) 0°C 0 C to 70 70°C C SOIC (D) SOP (NS) −55°C to 125°C ORDERABLE PART NUMBER PACKAGE† TA TOP-SIDE MARKING Tube of 25 MC1488N MC1488N Tube of 25 SN75188N SN75188N Tube of 50 SN75188D Reel of 2500 SN75188DR Reel of 2000 SN75188NSR SN75188 SN55188J SN55188J SNJ55188J SNJ55188J SNJ55188W SNJ55188W CDIP (J) Tube of 25 CFP (W) Tube of 150 SN75188 LCCC (FK) Tube of 55 SNJ55188FK SNJ55188FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( $'"! !$& ./.00 && $## # ##' "&# )#+# #'( && )# $'"! $'"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004 FUNCTION TABLE (drivers 2−4) A B H H L L X H X L H Y H = high level, L = low level, X = irrelevant logic diagram (positive logic) 1A 2A 2B 3A 3B 4A 4B 3 2 4 6 5 9 8 10 12 11 13 1Y 2Y 3Y 4Y Positive logic Y = A (driver 1) Y = AB or A + B (drivers 2 thru 4) schematic (each driver) To Other Drivers VCC + 8.2 kΩ 6.2 kΩ A Input(s) B 70 Ω 300 Ω 3.6 kΩ GND To Other Drivers 10 kΩ 3.7 kΩ VCC − To Other Drivers Resistor values shown are nominal. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 70 Ω Output SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC + at (or below) 25°C free-air temperature (see Notes 1 and 2) . . . . . . . . . . . . . . . . . 15 V Supply voltage, VCC − at (or below) 25°C free-air temperature (see Notes 1 and 2) . . . . . . . . . . . . . . . . −15 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 7 V Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 15 V Continuous total power dissipation (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Package thermal impedance, θJA (see Notes 3 and 4): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Case temperature for 60 seconds, FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: J or W package . . . . . . . . . . . . . . . . 300°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to the network ground terminal. 2. For operation above 25°C free-air temperature, refer to the maximum supply voltage curve, Figure 6. In the J package, SN55188 chips are alloy mounted. 3. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Selecting the maximum of 150°C can affect reliability. 4. The package thermal impedance is calculated in accordance with JESD 51-7. DISSIPATION RATING TABLE PACKAGE TA ≤ 25 25°C C POWER RATING DERATING FACTOR ABOVE TA = 25 25°C C TA = 70 70°C C POWER RATING TA = 125 125°C C POWER RATING FK 1375 mW 11.0 mW/°C 880 mW 275 mW J 1375 mW 11.0 mW/°C 880 mW 275 mW W 1000 mW 8.0 mW/°C 640 mW 200 mW recommended operating conditions SN55188 VCC + Supply voltage VCC − Supply voltage VIH VIL High-level input voltage TA Operating free-air temperature MC1488, SN75188 NOM MAX MIN NOM MAX 7.5 9 15 7.5 9 15 V −7.5 −9 −15 −7.5 −9 −15 V 1.9 Low-level input voltage 1.9 0.8 −55 POST OFFICE BOX 655303 UNIT MIN • DALLAS, TEXAS 75265 125 0 V 0.8 V 70 °C 3 SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004 electrical characteristics over operating free-air temperature range, VCC ± = ±9 V (unless otherwise noted) PARAMETER VOH VOL IIH IIL High-level output voltage Low-level output voltage VIL = 0.8 V, RL = 3 kΩ VIH = 1.9 V, RL = 3 kΩ MIN SN55188 TYP† MAX MC1488, SN75188 MIN TYP† MAX VCC + = 9 V, VCC − = − 9 V 6 7 6 7 VCC + = 13.2 V, VCC − = − 13.2 V 9 10.5 9 10.5 UNIT V VCC + = 9 V, VCC − = − 9 V −7‡ −6 −7 −6 −10.5‡ −9 −10.5 −9 10 µA −1 −1.6 −1 −1.6 mA V VCC + = 13.2 V, VCC − = − 13.2 V Low-level input current VI = 5 V VI = 0 IOS(H) Short-circuit output current at high level§ VI = 0.8 V, VO = 0 −4.6 −9 −13.5 −6 −9 −12 mA IOS(L) Short-circuit output current at low level§ VI = 1.9 V, VO = 0 4.6 9 13.5 6 9 12 mA ro Output resistance, power off VCC + = 0, VO = − 2 V to 2 V VCC − = 0, 300 VCC + = 9 V, No load All inputs at 1.9 V 15 20 15 All inputs at 0.8 V 4.5 6 4.5 6 VCC + = 12 V, No load All inputs at 1.9 V 19 25 19 25 All inputs at 0.8 V 5.5 7 5.5 7 VCC + = 15 V, No load, TA = 25°C All inputs at 1.9 V 34 34 All inputs at 0.8 V 12 12 VCC − = − 9 V, No load All inputs at 1.9 V VCC − = − 12 V, No load All inputs at 1.9 V All inputs at 0.8 V −0.5 −0.015 VCC − = − 15 V, No load, TA = 25°C All inputs at 1.9 V −34 −34 All inputs at 0.8 V −2.5 −2.5 VCC + = 9 V, No load VCC − = − 9 V, 333 333 VCC + = 12 V, No load VCC − = − 12 V, 576 576 ICC + ICC − PD High-level input current TEST CONDITIONS Supply current from VCC + Supply current from ICC − Total power dissipation 10 Ω 300 −13 All inputs at 0.8 V −17 −13 −0.5 −18 −23 20 mA −17 −0.015 −18 −23 mA mW † All typical values are at TA = 25°C. ‡ The algebraic convention, in which the less positive (more negative) limit is designated as minimum, is used in this data sheet for logic voltage levels only, e.g., if − 6 V is a maximum, the typical value is a more negative voltage. § Not more than one output should be shorted at a time. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004 switching characteristics, VCC± = ±9 V, TA = 25°C PARAMETER tPLH tPHL tTLH tTHL TEST CONDITIONS MIN Propagation delay time, low- to high-level output Propagation delay time, high- to low-level output Transition time, low- to high-level output† RL = 3 kΩ, See Figure 1 CL = 15 pF, Transition time, high- to low-level output† Transition time, low- to high-level output‡ tTLH RL = 3 kΩ to 7 kΩ, CL = 2500 pF, See Figure 1 tTHL Transition time, high- to low-level output‡ † Measured between 10% and 90% points of output waveform ‡ Measured between 3 V and − 3 V points on the output waveform (TIA / EIA-232-E conditions) TYP MAX UNIT 220 350 ns 100 175 ns 55 100 ns 45 75 ns 2.5 µs 3.0 µs PARAMETER MEASUREMENT INFORMATION 3V Input Input 1.5 V 1.5 V tPHL Pulse Generator (see Note A) Output RL 90% Output CL (see Note B) tTHL TEST CIRCUIT tPLH 50% 10% 50% 10% 90% 0V VOH VOL tTLH VOLTAGE WAVEFORMS NOTES: A. The pulse generator has the following characteristics: tw = 0.5 µs, PRR ≤ 1 MHz, ZO = 50 Ω. B. CL includes probe and jig capacitance. Figure 1. Test Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004 TYPICAL CHARACTERISTICS† OUPUT CURRENT vs OUTPUT VOLTAGE ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ VOLTAGE TRANSFER CHARACTERISTICS 12 9 16 VCC + = 9 V, VCC − = − 9 V 12 6 IOI − O Output Current − mA VO VO − Output Voltage − V 20 VCC + = 12 V, VCC − = − 12 V VCC + = 6 V, VCC − = − 6 V 3 0 −3 ÎÎÎ ÎÎÎ −6 −12 0 VCC + = 9 V VCC − = − 9 V TA = 25°C 8 4 0 −4 VOH(VI = 0.8 V) −16 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 VI − Input Voltage − V 2 −20 −16 −12 16 ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÎÎÎÎÎ ÁÁÁÁ ÎÎÎÎÎ 1000 VCC + = 9 V VCC − = − 9 V RL = ∞ TA = 25°C IOS(L) (VI = 1.9 V) 6 3 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÁÁ ÁÁ 0 VCC + = 9 V VCC − = − 9 V VO = 0 SR − Slew Rate − V/ µs IIOS OS − Short-Circuit Output Current − mA 12 SLEW RATE vs LOAD CAPACITANCE 12 100 10 −6 IOS(H) (VI = 0.8 V) −9 −12 −100 −75 −50 −25 0 25 50 75 100 125 150 1 10 TA − Free-Air Temperature − °C 100 Figure 5 † Data for temperatures below 0°C and above 70°C are applicable to SN55188 circuit only. POST OFFICE BOX 655303 1000 CL − Load Capacitance − pF Figure 4 6 −8 −4 0 4 8 VO − Output Voltage − V Figure 3 SHORT-CIRCUT OUTPUT CURRENT vs FREE-AIR TEMPERATURE −3 ÎÎÎÎ ÎÎÎÎ 3-kΩ Load Line −8 Figure 2 9 VOL(VI = 1.9 V) −12 RL = 3 kΩ TA = 25°C −9 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ • DALLAS, TEXAS 75265 10000 SLLS094C − SEPTEMBER 1983 − REVISED MAY 2004 THERMAL INFORMATION† MAXIMUM SUPPLY VOLTAGE vs FREE-AIR TEMPERATURE VCC − Maximum Supply Voltage − V 16 14 12 10 8 6 4 2 RL ≥ 3 kΩ (from each output to GND) 0 −75 −50 −25 0 25 50 75 100 TA − Free-Air Temperature − °C 125 Figure 6 † Data for temperatures below 0°C and above 70°C are applicable to the SN55188 circuit only. APPLICATION INFORMATION VCC + = 12 V VCC − = − 12 V Output to RTL −0.7 V to 3.7 V 1/4 SN55188 or SN75188 Output 3V Input From TTL or DTL Output to DTL −0.7 V to 5.7 V 1/4 SN55188 or SN75188 VCC + ’188 VCC + ’188 ± 15 V VCC − 5V VCC − Output to HNIL −0.7 V to 10 V 1/4 SN55188 or SN75188 Output to MOS −10 V to 0 V 1 kΩ 1/4 SN55188 or SN75188 10 kΩ −12 V Figure 7. Logic Translator Applications POST OFFICE BOX 655303 Diodes placed in series with the VCC+ and VCC − leads protect the SN55188/SN75188 in the fault condition in which the device outputs are shorted to ± 15 V, and the power supplies are at low voltage and provide low-impedance paths to ground. Figure 8. Power-Supply Protection to Meet Power-Off Fault Conditions of ANSI TIA / EIA-232-E • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-86889012A ACTIVE LCCC FK 20 1 TBD 5962-8688901CA ACTIVE CDIP J 14 1 TBD 5962-8688901DA ACTIVE CFP W 14 1 MC1488N ACTIVE PDIP N 14 25 MC1488NE4 ACTIVE PDIP N 14 25 SN55188J ACTIVE CDIP J 14 SN75188D ACTIVE SOIC D SN75188DE4 ACTIVE SOIC SN75188DR ACTIVE SN75188DRE4 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 SNPB N / A for Pkg Type Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 1 TBD A42 SNPB N / A for Pkg Type 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75188N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75188NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75188NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75188NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ55188FK ACTIVE LCCC FK 20 1 TBD SNJ55188J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ55188W ACTIVE CFP W 14 1 TBD A42 SNPB N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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