TI SN75240PWR

www.ti.com
SLLS266F − FEBRUARY 1997 − REVISED JULY 2004
FEATURES
D Design to Protect Submicron 3-V or 5-V
Circuits from Noise Transients
APPLICATIONS
D USB 1.1 Host, Hub, or Peripheral Ports
D Port ESD Protection Capability Exceeds:
DESCRIPTION
The SN65220 is a single transient voltage suppressor and
the SN65240 and SN75240 are dual transient voltage
suppressors designed to provide electrical noise transient
protection to Universal Serial Bus (USB) 1.1 ports. Note
that the input capacitance of the device makes it
unsuitable for high-speed USB 2.0 applications.
SN65220DBV
(TOP VIEW)†
NC
1
GND
2
NC
3
6
A
5
GND
A
A1
A2
GND
4
B
B
B1
B2
GND
SN65240P, SN65240PW
SN75240P, SN75240PW
(TOP VIEW)
GND
C
GND
D
1
2
3
4
8
7
6
5
A
GND
B
GND
CURRENT vs VOLTAGE
7.5
5
2.5
Current − A
EQUIVALENT SCHEMATIC DIAGRAM
A or C
SN65220YZB
(Size: 925 mm x 925 mm +6 mm)
(TOP VIEW)
NC − No internal connection
†When read horizontally, Pin 1 is the bottom left pin.
Any cabled I/O can be subjected to electrical noise
transients from various sources. These noise transients
can cause damage to the USB transceiver and/or the USB
ASIC if they are of sufficient magnitude and duration.
USB ports are typically implemented in 3-V or 5-V digital
CMOS with very limited ESD protection. The SN65220,
SN65240, and SN75240 can significantly increase the
port ESD protection level and reduce the risk of damage
to the circuits of the USB port.
The IEC1000-4-2 ESD performance of the SN65220,
SN65240, and SN75240 is measured at the system level.
Therefore, system design impacts the results of these
tests. A high compliance level may be attained with proper
board design and layout.
SADI
D
D
D
D
− 15-kV Human Body Model
− 2-kV Machine Model
Available in a WCSP Chip-Scale Package
Stand-Off Voltage . . . 6 V Min
Low Current Leakage . . . 1 µA Max at 6 V
Low Capacitance . . . 35 pF Typical
0
−2.5
−5
−7.5
GND
−10
−10
−5
0
5
10
15
Voltage − V
B or D
(One Suppressor Shown)
NOTE: All GND terminals should be connected to ground.
NOTE A:
Typical current versus voltage curve was derived
using the IEC 1.2/50-µs surge waveform.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
!" # $%&" !# '%()$!" *!"&+ *%$"#
$ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+
*%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+
Copyright  1997 − 2003, Texas Instruments Incorporated
www.ti.com
SLLS266F − FEBRUARY 1997 − REVISED JULY 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
IEC1000-4-2 COMPLIANCE LEVEL
MAXIMUM TEST VOLTAGE
IEC1000-4-2
COMPLIANCE
LEVEL
CONTACT
DISCHARGE
(kV)
AIR
DISCHARGE
(kV)
1
2
2
2
4
4
3
6
8
4
8
15
PACKAGE/ORDERING INFORMATION
PRODUCT
SUPRESSORS
SN65220
SN65240
SN75240
1
2
2
TA
PACKAGE
PACKAGE
DESIGNATOR
MARKED
AS
WCSP−4
YZB
NWP or
65220
SOT23−6
DBV
SADI
DIP−8
P
TSSOP−8
PW
DIP−8
P
−40°C to 85°C
−40°C
−40
C to 85
85°C
C
0°C
0
C to 70
70°C
C
TSSOP−8
PW
ORDER NUMBER
SN65220YZBR (Reel)
SN65220YZBT (Mini Reel)
SN65220DBVR (Reel)
SN65220DBVT (Mini Reel)
SN65240P (Rail)
A65240
SN65240PW (Rail)
SN65240PWR (Reel)
SN75240P (Rail)
A75240
SN75240PW (Rail)
SN75240PWR (Reel)
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Continuous power dissipation
Electrostatic discharge
See Dissipation Rating Table
15 kV(2), 2 kV(3)
Peak power dissipation, PD(peak)
60 W
Peak forward surge current, IFSM
3A
Peak reverse surge current, IRSM
−9 A
Storage temperature range, Tstg
−65°C to 150°C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is
not implied.
(2) Human Body Model − Tested in accordance with JEDEC Standard 22, Test Method A114−A.
(3) Charged Device Model − Tested in accordance with JEDEC Standard 22, Test Method C101.
2
www.ti.com
SLLS266F − FEBRUARY 1997 − REVISED JULY 2004
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DBV
P
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
385 mW
DERATING FACTOR
ABOVE TA = 25°C‡
3.1 mW/°C
246 mW
200 mW
1150 mW
9.2 mW/°C
736 mW
598 mW
PW
520 mW
4.2 mW/°C
331 mW
268 mW
‡ This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
recommended operating conditions
SN75240
Operating free-air temperature, TA
SN65220, SN65240
MIN
MAX
0
70
−40
85
UNIT
°C
electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Ilkg
V(BR)
Leakage current
Breakdown voltage
VI = 6 V at A, B, C, or D terminals
VI = 1 mA at A, B, C, or D terminals
CIN
Input capacitance to ground
VI = 0.4 sin (4E6πt) + 0.5 V
MIN
TYP
6.5
7
35
MAX
UNIT
1
µA
8
V
pF
APPLICATION INFORMATION
Full-Speed or
Low-Speed USB
Host-or-Hub Port
Transceiver
Full-Speed or
Low-Speed USB
Down Stream
Transceiver
1.5 kΩ
(Full Speed Only)
27 Ω
D+
A
A
15 kΩ
15 kΩ
27 Ω
GND
SN75220 or
1/2 SNx5240
B
27 Ω
D+
D−
SN75220 or
1/2 SNx5240
D−
B
GND
1.5 kΩ
(Low Speed
Only)
27 Ω
3
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65220DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65220DBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65220DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65220DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65220YZBR
ACTIVE
DSBGA
YZB
4
3000 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
SN65220YZBT
ACTIVE
DSBGA
YZB
4
250
Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
SN65240P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN65240PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN65240PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65240PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65240PWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65240PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75240P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN75240PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN75240PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75240PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75240PWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
SN75240PWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75240PWRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Dec-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65220DBVR
DBV
6
SITE 48
179
8
3.2
3.2
1.4
4
8
Q3
SN65220DBVR
DBV
6
SITE 40
180
9
3.15
3.2
1.4
4
8
Q3
SN65220DBVT
DBV
6
SITE 48
179
8
3.2
3.2
1.4
4
8
Q3
SN65220DBVT
DBV
6
SITE 40
180
9
3.15
3.2
1.4
4
8
Q3
SN65240PWR
PW
8
SITE 41
330
12
7.0
3.6
1.6
8
12
Q1
SN75240PWR
PW
8
SITE 41
330
12
7.0
3.6
1.6
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Dec-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN65220DBVR
DBV
6
SITE 48
195.0
200.0
45.0
SN65220DBVR
DBV
6
SITE 40
182.0
182.0
20.0
SN65220DBVT
DBV
6
SITE 48
195.0
200.0
45.0
SN65220DBVT
DBV
6
SITE 40
182.0
182.0
20.0
SN65240PWR
PW
8
SITE 41
346.0
346.0
29.0
SN75240PWR
PW
8
SITE 41
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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