TI SN75C3223EDBRG4

SLLS727A – MAY 2006 – REVISED JULY 2006
FEATURES
•
•
•
•
•
•
DB, DW, OR PW PACKAGE
(TOP VIEW)
EN
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
DESCRIPTION/ORDERING
INFORMATION
The SN65C3223E and SN75C3223E consist of two
line drivers, two line receivers, and a dual
charge-pump circuit with ±15-kV ESD protection pin
to pin (serial-port connection pins, including GND).
These devices meet the requirements of
TIA/EIA-232-F and provide the electrical interface
between an asynchronous communication controller
and the serial-port connector. The charge pump and
four small external capacitors allow operation from a
single 3-V to 5.5-V supply. The devices operate at
typical data signaling rates up to 1000 kbit/s.
19
18
4
5
17
16
6
7
15
8
9
13
12
10
11
14
EN
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
20
2
3
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
RHL PACKAGE
(TOP VIEW)
APPLICATIONS
•
•
•
•
•
•
1
1
C1+
NC
V+
C1–
C2+
C2–
V–
DOUT2
NC
RIN2
FORCEOFF
•
ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC 61000-4-2, Contact Discharge
– ±15-kV IEC 61000-4-2, Air-Gap Discharge
Meet or Exceed the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operate With 3-V to 5.5-V VCC Supply
Operate up to 1000 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
24
2
23 VCC
3
4
22 NC
21 GND
20 DOUT1
19 RIN1
5
6
8
18 ROUT1
17 FORCEON
9
10
16 DIN1
15 NC
7
11
14 DIN2
12
13
INVALID
•
ROUT2
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SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
NC − No internal connection
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the devices do not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 mA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the devices are activated automatically when a valid signal is applied to any receiver input. The INVALID output
is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than
30 µs. Refer to Figure 4 for receiver input levels.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
ORDERING INFORMATION
PACKAGE (1)
TA
SOIC – DW
0°C to 70°C
SSOP – DB
TSSOP – PW
SOIC – DW
–40°C to 85°C
SSOP – DB
TSSOP – PW
(1)
ORDERABLE PART NUMBER
Tube of 25
SN75C3223EDW
Reel of 2000
SN75C3223EDWR
Tube of 70
SN75C3223EDB
Reel of 2000
SN75C3223EDBR
Tube of 70
SN75C3223EPW
Reel of 2000
SN75C3223EPWR
Tube of 25
SN65C3223EDW
Reel of 2000
SN65C3223EDWR
Tube of 70
SN65C3223EDB
Reel of 2000
SN65C3223EDBR
Tube of 70
SN65C3223EPW
Reel of 2000
SN65C3223EPWR
TOP-SIDE MARKING
75C3223E
MY223E
MY223E
65C3223E
MU223E
MU223E
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLES
ABC
Each Driver (1)
INPUTS
(1)
OUTPUT
DOUT
DRIVER STATUS
X
Z
Powered off
Normal operation with
auto-powerdown disabled
DIN
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
X
X
L
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
Each Receiver (1)
INPUTS
(1)
2
RIN
EN
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
L
L
X
H
L
X
L
X
H
X
Z
Open
L
No
H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
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H
SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
13
17
12
8
20
FORCEOFF
DOUT2
11
Powerdown
14
FORCEON
DOUT1
INVALID
1
EN
ROUT1
ROUT2
15
16
10
9
RIN1
RIN2
Pin numbers are for the DB, DW, and PW packages.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.3
6
V
V+
Positive-output supply voltage range (2)
–0.3
7
V
0.3
–7
V
13
V
V–
Negative-output supply voltage
V+ – V–
Supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
θJA
range (2)
Package thermal impedance (3) (4)
Driver (FORCEOFF, FORCEON, EN)
–0.3
6
Receiver
–25
25
Driver
Receiver (INVALID)
–13.2
13.2
–0.3
VCC + 0.3
DB package
70
DW package
58
PW package
83
RHL package
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
UNIT
V
V
°C/W
TBD
–65
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
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3
SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
Recommended Operating Conditions (1)
See Figure 6
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control
high-level input voltage
DIN, EN, FORCEOFF, FORCEON
VIL
Driver and control
low-level input voltage
DIN, EN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, EN, FORCEOFF, FORCEON
VI
TA
(1)
VCC = 3.3 V
VCC = 5 V
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
0
5.5
–25
25
SN75C3223E
0
70
SN65C3223E
–40
85
Receiver input voltage
Operating free-air temperature
MIN
V
V
°C
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
II
ICC
(1)
(2)
4
Input leakage
current
Supply current
TEST CONDITIONS
EN, FORCEOFF,
FORCEON
MIN
TYP (2) MAX
±0.01
±1
µA
0.3
1
mA
Auto-powerdown disabled
VCC = 3.3 V or 5 V, TA = 25°C,
No load, FORCEOFF and FORCEON at VCC
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown enabled
No load, FORCEOFF at VCC, FORCEON at GND,
All RIN are open or grounded
1
10
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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UNIT
µA
SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
UNIT
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND
–5
–5.4
IIH
High-level input current
VI = VCC
±0.01
±1
µA
IIL
Low-level input current
VI at GND
±0.01
±1
µA
±35
±60
mA
IOS
Short-circuit output current (3)
ro
Output resistance
IOZ
(1)
(2)
(3)
VCC = 3.6 V, VO = 0 V
VCC = 5.5 V, VO = 0 V
VCC, V+, and V– = 0 V, VO = ±2 V
Output leakage current
300
V
V
Ω
10M
FORCEOFF = GND, VCC = 3 V to 3.6 V, VO = ±12 V
±25
FORCEOFF = GND, VCC = 4.5 V to 5.5 V, VO = ±12 V
±25
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Maximum
data rate
(see Figure 1)
RL = 3 kΩ,
One DOUT switching
tsk(p)
Pulse skew (3)
SR(tr)
Slew rate,
transition region
(see Figure 1)
(1)
(2)
(3)
MIN TYP (2) MAX
TEST CONDITIONS
CL = 1000 pF
CL = 250 pF,
VCC = 3 V to 4.5 V
1000
CL = 1000 pF,
VCC = 4.5 V to 5.5 V
1000
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ,
See Figure 2
RL = 7 kΩ,
CL = 150 pF to 1000 pF
RL = 3 kΩ
UNIT
250
kbit/s
300
8
ns
90
CL = 1000 pF
12
60
CL = 150 pF to 250 pF
24
150
V/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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5
SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
IOZ
Output leakage current
EN = VCC
ri
Input resistance
VI = ±3 V to ±25 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.6
1.4
UNIT
V
0.4
VIT+
(1)
(2)
MIN
TEST CONDITIONS
V
V
V
0.5
V
±0.05
µA
5
kΩ
3
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
150
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
tsk(p)
Pulse skew (3)
See Figure 3
50
ns
(1)
(2)
(3)
6
TEST CONDITIONS
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT(valid)
Receiver input threshold for
INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold for
INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = 1 mA,
FORCEOFF = VCC
FORCEON = GND,
VOL
INVALID low-level output voltage
IOL = 1.6 mA,
FORCEOFF = VCC
FORCEON = GND,
MAX
UNIT
2.7
V
V
0.3
V
VCC – 0.6
V
0.4
V
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TYP (1)
UNIT
tvalid
Propagation delay time, low- to high-level output
1
µs
tinvalid
Propagation delay time, high- to low-level output
30
µs
ten
Supply enable time
100
µs
(1)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
CL
(see Note A)
tTHL
3V
FORCEOFF
tTLH
VOH
3V
3V
Output
−3 V
−3 V
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
SR(tr) +
t
THL
6V
or t
TLH
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0V
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
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SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
GND
S1
RL
3 V or 0 V
Output
CL
(see Note A)
EN
3V
Input
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
VOH
Output
50%
0.3 V
Generator
(see Note B)
1.5 V
50 Ω
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
tPZL
(S1 at VCC)
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
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SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
PARAMETER MEASUREMENT INFORMATION (continued)
2.7 V
EN
50 Ω
0V
FORCEON
tvalid
50% V CC
50% V CC
0V
ten
INVALID
≈V+
V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
FORCEOFF
DIN
DOUT
≈V−
V−
TEST CIRCUIT
−3 V
VCC
INVALID
Output
CL = 30 pF
(see Note A)
2.7 V
−2.7 V
tinvalid
Autopowerdown
3V
0V
Receiver
Input
ROUT
Generator
(see Note B)
2.7 V
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉ
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
If Signal Remains Within This Region
for More Than 30 ms, INVALID Is Low †
0V
0.3 V
Indeterminate
2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers
reduces supply current to 1 µA
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
and
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SN65C3223E,, SN75C3223E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS727A – MAY 2006 – REVISED JULY 2006
APPLICATION INFORMATION
1
EN
2
20
Autopowerdown
VCC
C1+
FORCEOFF
19
CBYPASS
+
3
C1
V+
GND
18
= 0.1mF
C3 †
4
5
17
C1
16
C2+
DOUT1
RIN1
+
C2
6
15
C2
ROUT1
5 kΩ
7
C4
DOUT2
RIN2
ROUT2
14
V
FORCEON
+
8
13
9
12
10
11
DIN1
DIN2
INVALID
5 kΩ
† C3 can be connected to V
CC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
3.3 V " 0.3 V
C1
0.1 µF
C2, C3, and C4
0.1 µF
5 V " 0.5 V
0.047 µF
0.33 µF
3 V to 5.5 V
0.1 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65C3223EDB
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EDBG4
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EDBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EDBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EDW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EDWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3223EPWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDB
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDBG4
ACTIVE
SSOP
DB
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EDWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3223EPWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
The marketing status values are defined as follows:
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
16-Jul-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65C3223EDBR
DB
20
MLA
330
16
8.2
7.5
2.5
12
16
Q1
SN65C3223EDWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN65C3223EPWR
PW
20
MLA
330
16
6.95
7.1
1.6
8
16
Q1
SN75C3223EDBR
DB
20
MLA
330
16
8.2
7.5
2.5
12
16
Q1
SN75C3223EDWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN75C3223EPWR
PW
20
MLA
330
16
6.95
7.1
1.6
8
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN65C3223EDBR
DB
20
MLA
346.0
346.0
33.0
SN65C3223EDWR
DW
20
MLA
333.2
333.2
31.75
SN65C3223EPWR
PW
20
MLA
346.0
346.0
33.0
SN75C3223EDBR
DB
20
MLA
346.0
346.0
33.0
SN75C3223EDWR
DW
20
MLA
333.2
333.2
31.75
SN75C3223EPWR
PW
20
MLA
346.0
346.0
33.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page 3
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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