STA260 Sirius SDARS channel, service & source decoder Data Brief Features ■ 2 Satellite and 1 terrestrial signal demodulators and decoders ■ Advanced DSP processor to implement PAC audio decoder ■ Requires a single 17MHz clock reference; all high-speed clock signals are derived using on-chip PLL ■ Programmable I2S to support 32K/48K/44.1K audio sample rate (32K/48K Sample rates use internal clocks, 44.1K Sample rate uses external clock) ■ I2C master interface to control tuner and audio DAC ■ External control through UART interface using Sirius Standard Protocol (SSP) over RS-232 LFBGA289 (15x15x1.4mm) Description STA260 is a fully integrated 3rd generation Baseband signal processor for Sirius Satellite Digital Audio Radio Service (SDARS). It is implemented using ST Micro's advanced 90 µm CMOS090 technology. Analog to digital converters ■ Three internal 10 BIT A/D converters for 76.5MHZ if signals conversion It allows a highly efficient implementation of a Sirius “SDARS Satellite Digital Audio Radio Service” receiver when used with its companion STA210 tuner ASIC. Low power technology ■ 1.2V, 90 µm technology ■ 2.5V capable I/OS VFBGA244 (8x8x1.0mm) STA260 is packaged in a Low profile Fine pitch Ball Grid Array (LFBGA 15x15) and in Very thin Fine pitch Ball Grid Array (VFBGA 8x8). Table 1. Device summary Part Number(1) Package Packing STA260 LFBGA289 Tray STA260TR LFBGA289 Tape & reel STA260-8x8 VFBGA244 Tray 1. This device is Pb-Free ECOPACK® see Chapter 3: Package information. June 2007 Rev 1 For further information contact your local STMicroelectronics sales office. 1/7 www.st.com 7 Application block diagram 1 STA260 Application block diagram Figure 1. Application block diagram FLASH 1M x 16 STA210N Tuner FE 2 IF I2C IFAGC STA260 STA260 Baseband Baseband Processor Processor SDRAM 8Mbx8 or 16Mx8 2/7 Audio/I S Data AC00244 STA260 Electrical specifications 2 Electrical specifications 2.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol 2.2 Parameter Value Unit VDD 1.2V Power supply Voltage 1.32 V VDDIO 2.5V Power Supply Voltage 2.75 V AD_VDD 1.2V Power supply Voltage 1.32 V AD_VDD2 2.5V Power Supply Voltage 2.75 V APLL_VDD 2.5V Power Supply Voltage 2.75 V Vi Voltage on input pin -0.5 to (VDDIO + 0.5) V Vo Voltage on output pin -0.5 to (VDDIO + 0.5) V Tstg Storage Temperature -55 to +150 °C Top Operative Ambient Temperature -40 to +85 °C Tj Operative Junction Temperature -40 to +125 °C Thermal data Table 3. Symbol Rth j-amb Thermal data Parameter Thermal resistance Junction to ambient (1) LFBGA VFBGA Unit 35 50 °C/W 1. According to JEDEC specification on a 4 layers board 3/7 Package information 3 STA260 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. LFBGA (15x15x1.4mm 289 ball) mechanical data & package dimensions mm inch DIM. MIN. TYP. A A1 MAX. MIN. TYP. 1.400 0.210 MAX. 0.0551 0.0083 A2 0.985 0.0387 A3 0.200 0.0078 A4 0.800 0.350 D 14.850 15.000 15.150 0.5846 0.5906 0.5965 E 0.400 0.0315 b D1 OUTLINE AND MECHANICAL DATA 0.450 0.0138 0.0157 0.0177 12.800 0.5039 14.850 15.000 15.150 0.5846 0.5906 0.5965 E1 12.800 0.5039 e 0.800 0.0315 F 1.100 0.0433 Body: 15 x 15 x 1.4mm ddd 0.120 0.0047 eee 0.150 0.0059 fff 0.080 0.0031 LFBGA289 Low profile Fine Pitch Ball Grid Array 7963045 C 4/7 STA260 Package information Figure 3. VFBGA (8x8x1.0mm 180+64 ball) mechanical data & package dimensions mm inch DIM. MIN. TYP. A A1 MAX. MIN. TYP. 1.000 0.130 0.170 A2 0.620 A3 0.180 A4 MAX. 0.0394 0.210 0.0051 0.0067 0.0083 0.0244 0.0071 0.450 0.0177 b 0.220 0.260 0.300 0.0087 0.0102 0.0118 D 7.950 8.000 8.050 0.3130 0.3150 0.3169 7.950 8.000 D1 E OUTLINE AND MECHANICAL DATA 6.800 0.2677 8.050 0.3130 0.3150 0.3169 E1 6.800 0.2677 e 0.400 0.0157 F 0.600 Body: 8 x 8 x 1.0mm 0.0236 ddd 0.080 0.0031 eee 0.130 0.0051 fff 0.040 0.0016 VFBGA244 Very thin profile Fine Pitch Ball Grid Array 7520777 C 5/7 Revision history 4 STA260 Revision history Table 4. 6/7 Document revision history Date Revision 18-Jun-2007 1 Changes Initial release. STA260 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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