Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count Simtek package pn Package Manufacturer Mfg Pkg ID/Simtek part ID/Dwg ID Simtek package Outline JEDEC Case Outline Mil Case Outline ID Assembly Facility Plant Leadframe Plating Plating Process Ceramic Leads Lead Plating [Gold Underplate] Leads [Hot Solder Dip Finish] L [hot solder dip lead finish] 28 STK-91-01-2303 Kyocera PB-CA1771 / STK-91-01-2803 STK-40-05-007 MO-041 Figure C11, CQCC3-N28 Amkor Technologies ATP1 Gold Plate 60µ" min over 80-250µ" Nickel Electrolytic Kyocera 440 Black [Al2O3 90%] Alloy 42 [Fe 58% / Ni 42%] Gold Plate 80µ" Sn/Pb 60/40% L [hot solder dip lead finish] 32 STK-91-01-3202 NTK Technical Ceramics IRK32F1-5379C / STK-91-01-3202 STK-40-05-011 MO-041 Figure C11, CQCC3-N32 Amkor Technologies ATP1 Gold Plate 80µ" min Over 50-350µ" Nickel Electrolytic NTK ALN Alloy 42 [Fe 58% / Ni 42%] Gold Plate 80µ" Sn/Pb 60/40% PACKAGE DIMENSIONS & CHARACTERISTICS Nominal Cavity Volume Die Size Pad Size Theta Ja [still air] -approx Theta Ja [200fpm/1mps] - approx Theta Jc Lead Resistance Lead to Lead Capacitance 3 in .0035 mil 146x153x19 mil 214x205 C/W 98 C/W 55 C/W 3 800 mOhm Max pF 3pF max [1MHz] .0062 144x374x19 310x440 73 42 3 500 mOhm Max 3pF max [1MHz] SHIPPING INFORMATION Carrier Type Units Per Rail Total Product Weight rail gm 0.9 rail 34 1.3 Williams Advanced Materials Hi Rel Lid with Preform STK-92-10-0003 in .330x.530 .280x.480 .01" Kovar [Fe 54% / Co 17% / Ni 29%] µ" Gold 25µ" min on Nickel 50-350µ" Electrolytic Au 80% / Sn 20% in .002" Williams Advanced Materials Hi Rel Lid with Preform STK-92-10-0007 .430x.530 .360x.500 .01 " Kovar [Fe 54% / Co 17% / Ni 29%] Gold 25µ" min on Nickel 50-350µ" Electrolytic Au 80% / Sn 20% .002" qty 34 LID DETAIL Manufacturer Lid Type Simtek Lid ID Dimensions Lid Material Plating Plating Process Frame Frame Thickness PL0122 Simtek Corporation August 07 Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail Unit 28 350 LEADLESS CHIP CARRIER 32 450 LEADLESS CHIP CARRIER ASSEMBLY MATERIALS Die Attach Manufacturer Die Attach Type Die Attach Thickness Die Thickness Die Coating Wire Bond Material Wire Bond Diameter JMI 7000 Johnson Matthey Silver Glass mil 0.5 - 1.0 mil mil 19 mil None Al 99.99% mil 1.25 mil JMI 7000 Johnson Matthey Silver Glass 0.5 - 1.0 mil 19 mil None Al 99.99% 1.25 mil P596-0501-0202 Non Contact Complete Saw Through CO2 bubbler High Power. 100% High Power. 45 C=0 Manual 150-160°C, 10-30 minutes Automatic Reverse Ball Stitch Low & High Power. 100% Low & High Power. 45 C=0 Furnace / Nitrogen °C Peak 420+/-5°C min Dwell 7-10 Minutes @ 410°C min Rise 60.5 Min 100-400°C Cool 2.0-3.5 minutes 400-200°C Markem 4489 White [lot #] [assembly country] 150°C+10°C -0°C 1hr +30 -0 minutes 100% 10 cycles, -65°C to +150°C 100% 30KG P596-0501-0202 Non Contact Complete Saw Through CO2 bubbler High Power. 100% High Power. 45 C=0 Manual 150-160°C, 10-30 minutes Automatic Reverse Ball Stitch Low & High Power. 100% Low & High Power. 45 C=0 Furnace / Nitrogen Peak 420+/-5°C Dwell 7-10 Minutes @ 410°C Rise 60.5 Min 100-400°C Cool 2.0-3.5 minutes 400-200°C Markem 4489 White [lot #] [assembly country] 150°C+10°C -0°C 1hr +30 -0 minutes 100% 10 cycles, -65°C to +150°C 100% 30KG ASSEMBLY PROCESS FLOW Flow ID Wafer Mount Scribe Method Saw/Clean 2nd optical 2nd optical QA Die Attach Method Die Attach Cure Bonder: Manual/Auto Bond Type: Forward/Reverse Bond Type: At The Die Bond Type: At The Paddle 3rd Optical 3rd Optical QA Seal Method/Atmosphere Lid Seal Temp Profile Marking Ink Backside Mark Ink Cure Temp Cycle Centrifuge Fine Leak Gross Leak Final Visual QA Pack & Ship 100% He 5x10-8 atm cc/sec 100% 5torr 0.5H 75psig 1H 100% 45, C=0 100% He 5x10-8 atm cc/sec 100% 5torr 0.5H 75psig 1H 100% 45, C=0 Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure 10,000 In D/A, Wire Bond Areas Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure Amkor Procedure 10,000 In D/A, Wire Bond Areas PROCESS MONITORS Wire Bond Monitor Die Attach Monitor Lid Seal Monitor PIND Monitor Lead Trim Monitor Seal Area Particulate Monitor Area Particle Count Limits PL0122 Simtek Corporation August 07