LEADFRAME data sheet LQFP PowerQuad® 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 (PQ2) is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging provides extraordinary gains in power dissipation and speed through the use of innovative integrated, embedded copper heatsink. The IC is attached directly to the large, highly-efficient copper heatsink which readily dissipates generated heat. To enhance the thermal conduction from the IC to the mounting surface, the LQFP PQ2 package leads are mechanically connected, yet electrically isolated, to the heatsink by a proprietary process. Thermal resistance improvements greater than 55% are realized with this technology and without the use of any external cooling aids! The large heatsink also provides a “floating” ground plane to the signal leads of the package thereby reducing self-inductance by 50% over conventional plastic LQFPs. In addition, the patented LQFP PQ2 heatsink has integrated mechanical “locking” features to ensure total package integrity and eliminates moisture penetration. The end result is a high-power, high-speed IC package with the properties to enable new, smaller, denser, portable electronic products and emerging end applications to move from concept to production. High-performance operation and attributes of the LQFP PowerQuad® 2 include the following: • High conductive, solid exposed heatsink • 1.4 mm body for lightweight, portable applications • Direct die attach to heatsink • 50% reduction in package self-inductance • 50% improvement in θJa over standard LQFP • 32 to 144 lead counts • 7 x 7 - 20 x 20 mm body sizes (JEDEC standard packages MS-026) • Heatsink-up and down configurations available Thermal Resistance: Single-Layer PCB Pkg 100 ld 208 ld Body Pad Theta JA (°C/W) by Velocity (LFPM) Size (mm) Size (mm) 0 200 500 14 x 14 28 x 28 8.4 14.0 34.1 20.4 26.8 15.6 22.7 13.3 Multi-Layer PCB Pkg Body Size(mm) 100 ld 208 ld 14 x 14 28 x 28 Pad Theta JA (°C/W) by Velocity (LFPM) Size (mm) 0 200 500 8.4 14.0 18.1 12.8 15.5 10.4 14.1 9.3 Pre-JEDEC Standard Test Boards Reliability: Advanced design, manufacturing processes and materials assure long-term reliable performance. • Temp cycle • Thermal shock (liq) • Autoclave • Temp/Humidity • High temp storage -65/+150 °C, 1000 cycles -65/+150 °C, 1000 cycles 121 °C, 2 atm, 168 hours 85 °C/85%RH, 1000 hours 150 °C, 1000 hours Applications: Major semiconductor manufacturers and packaging engineers have chosen LQFP PQ2 as the IC package of choice for power microprocessors, controllers, DSPs, high speed logic/FPGAs, PLDs, ASICs and other advanced technologies. System designers and OEM product developers find the LQFP PQ2 solves power, thermal and speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support) in uses such as: laptops, notebooks, telecom, cordless/wireless, high-end audio/video, CPU/GUI board systems and many other small form-factor applications. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . www.amkor.com DS170G Rev Date: 05’06 LEADFRAME data sheet LQFP PowerQuad® 2 Cross-sections LQFP PowerQuad® 2 Process Highlights Die thickness (max) 15.0 mils Strip solder plating 85/15 Sn/Pb Marking Pad Lead inspection Laser/Optical Pack/ship options Bar Code/Dry Pack/TNR Test Services • Program generation/conversion • Product engineering • Wafer sort • 256 Pin x 20 MHz test system available • -55 °C to +165 °C test available • Burn-in Shipping Low profile tray (JEDEC Outline CS-007) Inverted Configuration Options: LOW PROFILE POWERQUAD® 2 PACKAGE FAMILY (mm) Lead Count 32 64 80 100 128 128 144 Body Size (mm) 7x7 14 x 14 14 x 14 14 x 14 14 x 14 20 x 20 20 x 20 Body Thickness (mm) 1.4 1.4 1.4 1.4 1.4 1.4 1.4 Lead Pitch (mm) 0.80 0.80 0.65 0.50 0.40 0.50 0.50 Form Length (mm) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Foot Tip To Tip Length (mm) (mm) 9.0 0.60 16.0 0.60 16.0 0.60 16.0 0.60 16.0 0.60 22.0 0.60 22.0 0.60 Board Standoff (mm) 0.10 0.10 0.10 0.10 0.10 0.10 0.10 JEDEC Package MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 Tray Matrix 10 x 25 6 x 15 6 x 15 6 x 15 6 x 15 5 x 12 5 x 12 Units Per Tray 250 90 90 90 90 60 60 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.