STLC2690 Bluetooth V2.1 and FM RDS transceiver system-on-chip Data Brief Features Description ■ Addition of the FM transmit functionality to Bluetooth and FM radio combo system-on-chip – Send music content stored on a portable device to any in-car or home FM tuner system – SureTuneTM technology to select the optimal FM transmit frequency ■ Simultaneous operation of Bluetooth and FM ■ Very low power consumption for battery powered devices – Designed in ST’s low power 65 nm RFCMOS technology The STLC2690 combines Bluetooth V2.1 + EDR and FM R(B)DS transceiver functionality on a single chip designed in ST low power 65 nm RFCMOS process. The device is fully optimized for mobile phones, smart phones, PDAs and portable multimedia player applications. The required board space has been minimized. Power consumption levels are optimized for battery powered devices and the high integration level allows a cost effective solution. The low external BOM count allows easy integration of the STLC2690 into products, enabling short time to market. ■ Increased link budget for both Bluetooth and FM to improve the connection stability ■ Small PCB footprint – WLCSP package, 0.6 mm height and 0.4 mm pitch – Only 10 external components – Easy layout – Require PCB footprint < 36 mm2 ■ Easy integration on mobile platforms – Support for low power and system reference clocks (up to 52 MHz) of the major cellular basebands – 1.8 V supply voltage – Several analog and digital audio and data interfaces supported – Reference design, development tools and guidelines January 2008 Figure 1. Rev 1 For further information contact your local STMicroelectronics sales office. Block diagram 1/6 www.st.com 6 Overview STLC2690 1 Overview 1.1 BluetoothTM features ● ● Bluetooth™ V2.1+EDR compliant – Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability – ACL and SCO links – Extended SCO (eSCO) links – Faster connection HW support for packet types – ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3, 3-DH5 – SCO: HV1, HV3 and DV – eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5 ● Wide band speech support ● Adaptive Frequency Hopping (AFH) ● Channel Quality Driven Data Rate (CQDDR) ● Transmit power – Power Class 2 and Power Class 1.5 with integrated PA – Class 1.5 typical output power above 10 dBm – Programmable output power – Power Class 1 compatible ● Sensitivity down to -90 dBm ● HCI – HCI H4 transport layer on UART and SPI – Bluetooth Type A transport layer on SDIO – HCI proprietary commands (for example peripherals control) – Single HCI command for patch/upgrade download – (e)SCO over HCI ● Pitch-Period Error Concealment (PPEC) for improved voice quality ● Efficient and flexible support for WLAN coexistence scenarios ● Low power consumption – Ultra low power architecture with 3 different low-power levels – Deep sleep modes, including Host-power saving feature – Dual wake-up mechanism – Current consumption with 1.8 V supply: Sniff mode (1.28 sec.): 75 µA eSCO: 2-EV3: 5.1 mA ACL: 3-DH5: 27 mA 2/6 STLC2690 Overview ● ● ● 1.2 Communication interfaces – UART up to 4 MHz – SPI interface – SDIO interface up to 25 MHz – PCM interface/I2S interface – I2C interface – Up to 16 additional flexibly programmable GPIOs – External interrupts possible through the GPIOs On-chip memory organization – On chip RAM, including provision for patches – On chip ROM, preloaded with SW up to HCI Ciphering support up to 128 bits key FM transceiver features ● Worldwide FM band (65 - 108 MHz) including Russian band ● RDS/RBDS processor ● On-chip demodulator, modulator and packet decoding and encoding ● World best, State of the art receiver sensitivity of - 2.5 dBµV ● Excellent receiver selectivity for audio and RDS ● Adaptive signal processing, to provide best audio quality versus received signal quality or in-band blockers. ● Autonomous ultra fast checking for alternate frequencies ● Fast search tuning ● Digital volume control and equalizer ● High output power linear transmitter ● Programmable transmit output level to comply with FCC and ETSI requirements ● Embedded filtering for coexistence in mobile handset ● Programmable AGC for optimized frequency deviation ● SureTuneTM technology to automatically select the optimal transmit frequency ● On-chip controller with ROM/RAM ● Analog and digital audio output and input ● Typical current consumption FM rx: 15 mA (1.8 V supply) ● Control interface: I2C or HCI ● High level API: easy software integration 3/6 Overview 1.3 STLC2690 Description The STLC2690 is a system-on-chip Bluetooth V2.1 + EDR transceiver and FM R(B)DS transceiver designed in ST low-power 65 nm RFCMOS process. The chip is offered in a Wafer Level Chip Scale Package (WLCSP) of 0.6 mm height and 0.4 mm pitch. The Bluetooth part is ROM-based, for applications requiring integration up to HCI level. Patch RAM is available, enabling multiple patches/upgrades and fast time to volume. The main interfaces are UART, SPI or SDIO for HCI transport, PCM or I2S for voice and a WLAN coexistence interface. The radio has been designed specifically for single chip requirements, for low power and minimum BOM count. The FM radio transceiver contains both a broadcast FM radio tuner and a FM transmitter for portable applications with worldwide FM band support. (De)multiplexing and (de)modulation are performed in a digital data path. A small embedded microcontroller manages the flexibility of the data path and takes care of the overall control of the transceiver. This microcontroller is also used for transmission and reception of the European Radio Data System (RDS) and the North American Radio Broadcast Data System (RBDS), including all required symbol decoding, block synchronization, error detection, and error correction functions. The FM can be controlled by the Host via a dedicated I2C interface or via the Bluetooth HCI interface. A Host-level API is offered in order to facilitate integration of the FM driver on the Host. Also a low-level API is supported. The Bluetooth transceiver and FM transceiver are integrated on the same silicon, and share at top-level power supplies, clocks and reset control. The chip integrates several regulators to generate the internally needed voltages from the Host platform supply input. The low external BOM count results in an overall PCB footprint of less than 36 mm2 (using 0201 components where possible, with a 0.3 mm spacing rule). The FM antenna matching network, which depends on the specific antenna implementation, is included in this footprint. 4/6 STLC2690 2 Ordering information Ordering information Table 1. Ordering information Order code Package STLC2690WTR 3 WLCSP Packing Tape on reel Revision history Table 2. Document revision history Date Revision 17-Jan-2008 1 Changes Initial release. 5/6 STLC2690 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6