STMICROELECTRONICS STTS751

STTS751
2.25 V low-voltage local digital temperature sensor
Features
■
Operating voltage 2.25 V to 3.6 V
■
Operating temperature –40 °C to +125 °C
■
Programmable
– 10 different conversion rates
0.0625 to 32 conversions/sec.
1 conversion/sec. - default
– 4 different resolutions
9-bit (0.5 °C/LSB) to12-bit (0.0625 °C/LSB)
10-bit (0.25 °C/LSB) - default
■
Low supply current
– 50 µA (typ) for 8 conversions/sec.
– 20 µA (typ) for 1 conversion/sec.
– 3 µA (typ) standby
■
Accuracy
– ±1.0 °C (typ) 0 °C to +85 °C
– ±2.0 °C (typ) –40 °C to +125 °C
■
One-shot mode for power saving
■
Fast conversion time 21 ms (typ) 10-bit
■
Pull-up resistor value allows single pin to select
one of four slave addresses
■
Supports 400 kHz serial clock
Table 1.
SOT23-6L
■
SMBus 2.0 compatible
– SMBus ALERT (ARA) support
– SMBus timeout
■
RoHS/green
Applications
■
Solid state drives
■
Portable electronics
■
Notebook computers
■
Smart batteries
■
Servers
■
Telecom
Device summary
Order code
STTS751-0DP3F
STTS751-0WB3F
STTS751-1DP3F
STTS751-1WB3F
July 2010
UDFN-6L
Pull-up resistor value
SMBus address
7.5 K ±5%
1001 000 b
12 K ±5%
1001 001 b
20 K ±5%
0111 000 b
33 K ±5%
0111 001 b
7.5 K ±5%
1001 010 b
12 K ±5%
1001 011 b
20 K ±5%
0111 010 b
33 K ±5%
0111 011 b
Doc ID 16483 Rev 5
Comments
Address selection via resistor pull-up
on Addr/Therm pin
Address selection via resistor pull-up
on Addr/Therm pin
1/36
www.st.com
1
Contents
STTS751
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
SMBus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
5
2/36
3.1
SMBus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2
WRITE byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3
READ byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.4
SEND byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.5
RECEIVE byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.6
SMBus addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.7
SMBus timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.8
Alert response address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
STTS751 register summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1
STTS751 register formats and details . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2
Temperature register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.3
Temperature limit register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.4
Temperature examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.5
Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.6
Configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.7
Conversion rate register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.8
One-shot register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.9
Therm limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.10
Therm hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.11
SMBus timeout register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.12
STTS751 product ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.13
STTS751 manufacturer’s ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.14
STTS751 revision ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
EVENT output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Doc ID 16483 Rev 5
STTS751
Contents
6
Addr/Therm output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Doc ID 16483 Rev 5
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List of tables
STTS751
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
4/36
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SMBus WRITE byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus READ byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus SEND byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus RECEIVE byte protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus protocol response to ARA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Registers/pointers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Pointer register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Temperature register (two’s complement) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Temperature limit register (two’s complement format) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Temperature examples (two’s complement format) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Status register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Configuration register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Conversion resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Conversion rate register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Conversion rates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
One-shot register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Therm limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Therm hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
SMBus timeout register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Product ID register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Manufacturer’s ID register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision ID register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . 29
SOT23-6L (2.90 mm x 2.80 mm) package mechanical data . . . . . . . . . . . . . . . . . . . . . . . 30
Carrier tape dimensions for UDFN-6L and SOT23-6L packages . . . . . . . . . . . . . . . . . . . . 32
Reel dimensions for 8 mm carrier tape - UDFN-6L and SOT23-6L packages . . . . . . . . . . 33
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Doc ID 16483 Rev 5
STTS751
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pinout - SOT23-6L and UDFN-6L. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application hardware hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SMBus timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
EVENT output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Therm output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical drawing . . . . . . . . . . . . . . . . . . 29
SOT23-6L (2.90 mm x 2.80 mm) package mechanical drawing. . . . . . . . . . . . . . . . . . . . . 30
UDFN-6L package footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
SOT23-6L package footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Carrier tape for UDFN-6L and SOT23-6L packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Reel schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Doc ID 16483 Rev 5
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Description
1
STTS751
Description
The STTS751 is a digital temperature sensor which communicates over a 2-wire SMBus 2.0
compatible bus. The temperature is measured with a user-configurable resolution between
9 and 12 bits. At 9 bits, the smallest step size is 0.5 °C, and at 12 bits, it is 0.0625 °C. At the
default resolution (10 bits, 0.25 °C/LSB), the conversion time is nominally 21 milliseconds.
The open-drain EVENT output is used to indicate an alarm condition in which the measured
temperature has exceeded the user-programmed high limit or fallen below the low limit.
When the EVENT pin is asserted, the host can respond using the SMBus Alert Response
Address (ARA) protocol to which the STTS751 will respond by sending its slave address.
The STTS751 is a 6-pin device that supports user-configurable slave addresses. Via the
pull-up resistor on the Addr/Therm pin, one of four different slave addresses can be
specified. Two order numbers (STTS751-0 and STTS751-1) provide two different sets of
slave addresses bringing the total available to eight. Thus, up to eight devices can share the
same 2-wire SMBus without ambiguity, thereby allowing monitoring of multiple temperature
zones in an application.
The two-wire interface can support transfer rates up to 400 kHz. Two small footprint
packages are available: a UDFN-6L and a standard SOT23-6L package.
Figure 1.
Logic diagram
VDD
(1)
EVENT
SDA
STTS751-0
STTS751-1
Addr/Therm
SCL
GND
AM03028v1
1. This pin may not float.
Table 2.
6/36
Signal names
Symbol
Type
Description
Addr/Therm
Output
Address selection pin / thermal status pin
EVENT
Output
Event (alert) output
SDA
I/O
SCL
Input
SMBus interface clock input
VDD
Power
Device power supply
GND
Ground
Device ground
SMBus interface data I/O
Doc ID 16483 Rev 5
STTS751
Description
Figure 2.
Pinout - SOT23-6L and UDFN-6L
SOT23-6L
UDFN-6L
Addr/Therm
1
6
SDA
GND
2
5
EVENT
VDD
3
4
SCL
SCL
1
6
SDA
EVENT
2
5
GND
VDD
3
4
Addr/Therm
AM03029v1
Table 3.
Pin descriptions
Pin
Name
Description
SOT23-6L UDFN-6L
Open-drain output that can be used to turn on/off a fan or throttle a CPU
clock in the event of an overtemperature condition.
The pin at power-up determines the SMBus slave address according to the
pull-up resistor value as shown in Table 1.
Addr/Therm This pin must have a pull-up resistor connected to the same voltage as VDD
or tied to GND (pin cannot float).
Total capacitance on this pin must be <100 pF.
Note: By tying Addr/Therm to ground, the device functions as one address
device only. The Therm functionality is then not available. The address for
device STTS751-0 is 72h and the address for device STTS751-1 is 76h.
1
4
2
5
GND
GND
3
3
VDD
Power supply VDD
4
1
SCL
SMBus clock
5
2
EVENT
6
6
SDA
Open-drain interrupt output. Output supports the SMBus Alert (ARA).
Note: This pin may not float.
SMBus data input/output
Doc ID 16483 Rev 5
7/36
Description
Figure 3.
STTS751
Block diagram
V
DD
REGISTERS
Address Pointers
Temperature Registers
Status
SMBus
Interface
SDA
Configuration
Conversion Rate
SCL
High Limit Registers
Interrupt Enabling
EVENT
Low Limit Registers
VDD
One-Shot
Therm LIMIT
Addr/Therm
Therm HYSTERESIS
Sensor
Control Logic
SMBus Timeout
Product ID
Manufacturer ID
Revision ID
A to D
Converter
Digital Comparator
Alert Response
GND
Figure 4.
AM03030v1
Application hardware hookup
VDD
SCL
SDA
R
STTS751-0
STTS751-1
Host
Controller
EVENT
Addr/Therm
Fan
Driver
GND
AM03031v1
8/36
Doc ID 16483 Rev 5
STTS751
2
Functional description
Functional description
The STTS751 digital temperature sensor acquires the temperature and stores it in the
temperature register. The resolution is programmable which allows the host controller to
select the optimal configuration between sensitivity and conversion times. The STTS751
can be placed in standby mode to minimize power consumption.
The user can control the update rate of the temperature measurements via the configuration
register (Table 15 on page 17). Sample rates can be adjusted from once every 16 seconds
up to 32 samples per second, in powers-of-2 steps.
These devices also offer a one-shot feature. When the device is in the standby mode, writing
to the one-shot register initiates a single temperature conversion. The result is compared
with the limit registers, and the outputs updated accordingly. Then the device returns to the
standby mode. Operating the device in this mode allows for very low average power
consumption, thereby making this device ideal for low power applications.
The device supports the SMBus Alert Response address (ARA) protocol. The ARA is polled
by the controller (host) device that supports this protocol whenever it detects that the
EVENT pin has been asserted. The STTS751 will respond with its device address (refer to
Section 3.8 on page 12).
The STTS751 contains 16 registers. The register summary is shown in Table 9 on page 13.
Using register addresses not specified in the table may result in an incorrect response.
These registers and their functions are described in more detail in the following sections.
Doc ID 16483 Rev 5
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SMBus interface
STTS751
3
SMBus interface
3.1
SMBus protocol
The STTS751 communicates over a 2-wire serial interface compatible with the SMBus
standard. Temperature data, alarm limits and configuration information are communicated
over the bus. A detailed timing diagram is shown below in Figure 5.
Figure 5.
SMBus timing diagram
TLOW
SMCLK
THIGH
TR
THD; STA
THD; STA
TSU:STO
TF
THD:DAT
TSU:STA
TSU:DAT
SMDATA
P
S
S
P
TBUF
S - start condition
P - stop condition
The STTS751 supports standard SMBus protocols (see Table 4, 5, 6, and 7).
10/36
●
WRITE byte
●
READ byte
●
SEND byte
●
RECEIVE byte
●
Alert response address
Doc ID 16483 Rev 5
AM03067v1
STTS751
3.2
SMBus interface
WRITE byte
The WRITE byte protocol is used to write one byte of data to the registers as shown in
Table 4. The gray data is sent by the STTS751 while the white data is sent by the host.
Table 4.
SMBus WRITE byte protocol
Start
Slave address
WR
ACK
Register
address
ACK
Data
ACK
Stop
1 bit
7 bits
1 bit
1 bit
8 bits
1 bit
8 bits
1 bit
1 bit
3.3
READ byte
The READ byte protocol is used to read one byte of data from the registers as shown in
Table 5.
Table 5.
SMBus READ byte protocol
Start Slave address
WR
ACK
Register
address
1 bit
1 bit
1 bit
8 bits
3.4
7 bits
ACK Start Slave address RD
1 bit
1 bit
7 bits
ACK
Data
1 bit 1 bit
8 bits
NACK Stop
1 bit
1 bit
SEND byte
The SEND byte protocol is used to set the internal address register to the correct address. It
sends a register address with no data (see Table 6). The SEND byte can be followed by the
RECEIVE byte protocol described below in order to read data from the register.
Table 6.
SMBus SEND byte protocol
Start
Slave address
WR
ACK
Register address
ACK
Stop
1 bit
7 bits
1 bit
1 bit
8 bits
1 bit
1 bit
3.5
RECEIVE byte
The RECEIVE byte protocol is used to read data from the register when the internal register
address pointer is known (see Table 7). This can be used for consecutive reads of the same
register.
Table 7.
SMBus RECEIVE byte protocol
Start
Slave address
RD
ACK
Data
NACK
Stop
1 bit
7 bits
1 bit
1 bit
8 bits
1 bit
1 bit
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SMBus interface
3.6
STTS751
SMBus addresses
The STTS751 is available in two versions. Each version has 4 slave addresses determined
by the pull-up resistor value connected to the Addr/Therm pin. Refer to Table 1 for valid
address and recommended resistor values. The device will not respond to an invalid slave
address.
3.7
SMBus timeout
The STTS751 supports SMBus timeout which is enabled by default at power-up. This can
be disabled via bit 7 in the timeout register, refer to Section 4.11: SMBus timeout register.
When timeout is enabled, the STTS751 will time out after 25 to 35 ms of inactivity.
The STTS751 supports the SMBus timeout feature. If the host holds SCL low or the device
drives SDA low for more than tTIMEOUT (max), the STTS751 resets and releases the bus.
This feature is turned on by default. The STTS751 also supports timeout while in standby
mode and when the device is driving SDA low.
Note:
The STTS751 never drives the clock line and it does not support clock stretching.
3.8
Alert response address
The STTS751supports the SMBus alert response address (ARA) protocol. In the event of
an out-of-limit temperature measurement, the EVENT output will be asserted. In response,
the host (supporting the ARA protocol) will send the SMBus Alert Response Address to the
general (slave) address of 0001_100b. All devices with active interrupts will respond with
their client addresses as shown in Table 1 on page 1 (with the LSB bit set to 0).
The STTS751 will acknowledge the ARA and respond with its slave device address. Table 8
shows the ARA transfer. See Section 5 for more information.
Table 8.
SMBus protocol response to ARA
Field
START
ALERT
RESPONSE
ADDRESS
RD
ACK
STTS751
SLAVE
ADDRESS
NACK
STOP
Bits
1
7
1
1
8
1
1
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STTS751
4
STTS751 register summary
STTS751 register summary
The STTS751 uses 8-bit registers. Variables longer than 8 bits are managed in byte pairs.
For example, when reading a 10-bit temperature value (10 bits is the default resolution.) the
application must read two registers and then concatenate the upper byte with the 2 most
significant bits of the lower byte.
Table 9 below summarizes the register map for the device. Accessing any invalid address
results in indeterminate data.
Table 9.
Registers/pointers
STTS751 register map
Address
pointers (h)
Device registers name
Size
Type
Power-up default values
binary (dec)
00
Temperature value high byte
8
R
undefined
01
Status
8
R
undefined
02
Temperature value low byte
8
R
undefined
03
Configuration
8
R/W
0000 0000
04
Conversion rate
8
R/W
0000 0100
05
Temperature high limit high byte
8
R/W
0101 0101 (85 °C)
06
Temperature high limit low byte
8
R/W
0000 0000
07
Temperature low limit high byte
8
R/W
0000 0000 (0 °C)
08
Temperature low limit low byte
8
R/W
0000 0000
0F
One-shot
8
W
20
THERM limit
8
R/W
0101 0101 (85 °C)
21
THERM hysteresis
8
R/W
0000 1010 (10 °C)
22
SMBus timeout enable
8
R/W
1000 0000 (Enabled)
N/A
FD
Product ID register
8
R
STTS751-0
[0000 0000]
STTS751-1
[0000 0001]
FE
Manufacturer ID
8
R
0101 0011 (53h)
FF
Revision number
8
R
0000 0001
In the following sections are the detailed descriptions of the registers along with their powerup default values. Examples are also included.
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STTS751 register summary
4.1
STTS751
STTS751 register formats and details
The STTS751 register set is comprised of the 16 addresses shown in Table 9. The
individual registers are accessed by transferring their addresses via the SMBus interface as
shown in Section 3.2, 3.3, and 3.4. In the case of the RECEIVE byte sequence
(Section 3.5) the address used is the address sent in the previous WRITE, READ or SEND
byte sequence.
An example read sequence of the Therm hysteresis register, address 21h, with its default
value, 0Ah, is shown below. The slave address used is 90h. The gray data is sent by the
STTS751 while the white data is sent by the host.
Table 10.
Pointer register format
SLAVE
REGISTER
SLAVE
START
WR ACK
ACK START
RD ACK
ADDRESS
ADDRESS
ADDRESS
1001_000
0
0010_0001
1001_000
Note:
All eight bits are used to select the register.
4.2
Temperature register format
1
DATA
NACK STOP
0000_1010
The temperature data is a 12-bit number and is stored in two's complement format spanning
the high byte and low byte registers as shown in Table 11.
Table 11.
Temperature register (two’s complement)
b4
b3
b2
b1
b0
Power-up
default
(hex)
32 °C
16 °C
8 °C
4°C
2 °C
1 °C
00
1/
1/
0
0
0
0
00
ADDR
(hex)
R/W
Register
b7
b6
b5
00
R
Temperature - high byte
sign
64 °C
¼ °C
02
R
Temperature - low byte
½ °C
8
°C
16
°C
The integer portion of the temperature is stored in the high byte, and the fractional portion in
the low byte. The lower four bits of the low byte will always read 0. At power-up, the
STTS751 defaults to 10-bit resolution. Thus, bits b5 and b4 of the lower byte will also read 0
until the device is configured to a higher resolution (via the Tres bits in the configuration
register).
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STTS751
4.3
STTS751 register summary
Temperature limit register format
The high and low limit registers have the same format as the temperature register with the
integer portion of the two's complement value stored in the high byte and the fractional
portion in the low byte. These registers are read-write.
Note that the high limit defaults to 85 °C.
Table 12.
Temperature limit register (two’s complement format)
ADDR
(hex)
R/W
Register
b7
05
R/W
High limit - high byte
sign
06
R/W
High limit - low byte
½ °C ¼ °C
07
R/W
Low limit - high byte
sign
08
R/W
Low limit - low byte
½ °C ¼ °C
4.4
b6
b5
64 °C 32 °C
1/
8
°C
64 °C 32 °C
1
/8 °C
b4
b3
b2
16 °C
8 °C
4°C
0
0
8 °C
4°C
0
0
1/
16
°C
16 °C
1
/16 °C
b1
b0
Power-up
default (hex)
2 °C 1 °C 55 (85 °C, dec)
0
0
00
2 °C 1 °C
0
00
0
00
Temperature examples
The table below shows several examples of how the data is arranged in the high and low
byte pairs used for the temperature and limit registers.
Table 13.
Temperature examples (two’s complement format)
Weighting of the
bits
–64 °C
–63 °C
–1 °C
+1 °C
+5.3125 °C(1)
+125 °C
b7
b6
b5
b4
b3
b2
b1
b0
High byte
sign
64 °C
32 °C
16 °C
8 °C
4°C
2 °C
1 °C
Low byte
½ °C
¼ °C
1
1
/16 °C
0
0
0
0
High byte
1
1
0
0
0
0
0
0
Low byte
0
0
0
0
0
0
0
0
/8 °C
High byte
1
1
0
0
0
0
0
1
Low byte
0
0
0
0
0
0
0
0
High byte
1
1
1
1
1
1
1
1
Low byte
0
0
0
0
0
0
0
0
High byte
0
0
0
0
0
0
0
1
Low byte
0
0
0
0
0
0
0
0
High byte
0
0
0
0
0
1
0
1
Low byte
0
1
0
1
0
0
0
0
High byte
0
1
1
1
1
1
0
1
Low byte
0
0
0
0
0
0
0
0
1. With 12-bit resolution selected.
Note:
The maximum and minimum values for the temperature registers are 127.9375 (7F:F0h,
high byte : low byte) and –64 (C0:00h), respectively. This also applies to the high and low
limit registers.
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STTS751 register summary
4.5
Status register
Table 14.
Status register
STTS751
ADDR
(hex)
R/W
Register
b7
b6
b5
b4
b3
b2
01
R
Status
Busy
THIGH
TLOW
RFU
RFU
RFU
b1
b0
RFU THRM
Power-up
default
(hex)
undefined
The STTS751 status register is read-only and located at address 01h. The various status
bits function as described below.
Busy: [7] Bit =1 when a temperature conversion is in progress.
THIGH: [6] Bit = 1 indicates temperature high limit has been exceeded (TA > high limit).
THIGH is cleared when the status register is read, provided the condition no longer exists.
TLOW: [5] Bit = 1 indicates the is at or below the low limit (TA ≤ low limit). TLOW is cleared
when the status register is read, provided the condition no longer exists.
RFU: [4:1] Not used - reserved.
THRM: [0] Bit = 1 indicates the measured temperature has crossed the Therm limit. The
THRM bit will go low when the temperature falls below the Therm limit minus the Therm
Hysteresis. When the THRM bit is high, the Addr/Therm output will be asserted low.
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STTS751
4.6
STTS751 register summary
Configuration register
The STTS751 configuration register is read/write and controls the functionality of
temperature measurements. It is located at address 03h. The configuration register bits
function as described below.
Table 15.
Configuration register
ADDR
(hex)
R/W
Register
03
R/W
Configuration
b7
b6
MASK1 RUN/STOP
b5
b4
b3
b2
b1
b0
Power-up
default
(hex)
0
RFU
Tres1
Tres0
RFU
RFU
00
Description
MASK1: [bit 7]
0: EVENT is enabled. Any out-of-limit condition asserts the EVENT pin (active low).
1: EVENT is disabled.
RUN/STOP: [bit 6]
0: Device is running in continuous conversion mode.
1: Device is in standby mode drawing minimum power.
The RUN/STOP bit controls temperature conversions by the ADC. When this bit is 0, the
ADC converts temperatures in continuous mode, at a rate as selected by the Conversion
Rate register (Section 4.7). When the RUN/STOP bit is 1, the ADC will be in standby mode,
thus reducing current supply significantly.
Note:
The device can still be accessed via the SMBus while in standby mode.
When RUN/STOP is 1 and the one-shot register is written to, the ADC will execute a
temperature measurement and then return to standby mode.
[bit 5]: This bit must always be 0.
RFU: [bit 4] Not used - reserved.
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STTS751 register summary
STTS751
Tres1:Tres0 [bits 3 and 2]
These bits select one of the four programmable resolutions for temperature data on the
STTS751 providing resolutions down to 0.0625 °C/LSB. The default resolution is 10 bits,
0.25 °C/LSB.
Table 16.
Conversion resolution
Tres1:Tres0
Temperature resolution
LSB step size (°C)
00
10 bits (default)
0.25
01
11 bits
0.125
11
12 bits
0.0625
10
9 bits
0.5
RFU [bits 1 and 0] Not used - reserved.
4.7
Conversion rate register
The STTS751 conversion rate register is read/write and controls the number of times the
temperature value will be updated each second.
Table 17.
Conversion rate register
ADDR
(hex)
R/W
Register
b7
b6
b5
b4
04
R/W
Conversion rate
0
0
0
0
b3
b2
b1
CONV[3:0]
b0
Power-up
default (hex)
04 (1/sec)
The upper four bits of the register are reserved and default to 0 on power-up. The lower four
bits control the conversion rate as shown in the table below. The power-up default is 1
conversion per second. The current draw is proportional to the conversion rate, and goes up
at higher rates.
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STTS751
STTS751 register summary
Table 18.
Conversion rates
CONV[3:0]
(hex)
Conversions per second
Typical current (µA)
0
0.0625
15
1
0.125
2
0.25
3
0.5
4
1
5
2
6
4
7
8
8
16
9
32
A-F
reserved
Comment
20
50
9, 10, or 11-bit resolutions only
125
9 or 10-bit resolutions only
Note:
The user must program the conversion rate and resolution bits (Tres1:Tres0 in the
configuration register, address 03h) to be consistent with this table. For a sampling rate of
32 conversions per second, the maximum resolution is 10 bits. For 16 conversions per
second, the maximum is 11 bits.
4.8
One-shot register
The STTS751 can be configured to perform a single temperature conversion on demand.
When the device is placed in standby mode (by setting RUN/STOP to 1 in the configuration
register) a write to the one-shot register will invoke a temperature conversion. The device
will set the busy bit while the conversion is in progress. The conversion is complete when
the busy bit is cleared. The STTS751 returns to standby mode upon completion of the
conversion.
The one-shot register is write-only and is located at address 0Fh. The value written to
invoke the one-shot conversion is a don't care. The device responds only to the write at
address 0Fh and ignores the value written.
Note:
Writes to the one-shot register will be ignored when the STTS751 is in continuous
conversion mode (ie. when RUN/STOP=0).
Table 19.
One-shot register
ADDR
(hex)
R/W
Register
b7
b6
b5
b4
b3
b2
b1
b0
Power-up
default (hex)
0F
W
One shot
X
X
X
X
X
X
X
X
n/a
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STTS751 register summary
4.9
STTS751
Therm limit
The Therm limit is a read/write register located at address 20h. The power-on default value
is 85 °C (55h). The format is 8-bit, two's complement integer. This is the same format as
the upper byte of the temperature register (Section 4.2: Temperature register format).
Whenever the temperature exceeds the value of the therm limit, the Addr/Therm output will
be asserted (low). See Section 6 for more information.
Table 20.
Therm limit
ADDR
(hex)
R/W
Register
b7
b6
b5
b4
b3
b2
20
R/W
Therm
sign
64 °C
32 °C
16 °C
8 °C
4 °C
4.10
b1
b0
2 °C 1 °C
Power-up
default (hex)
55 (85 °C, dec)
Therm hysteresis
The Therm hysteresis values controls the hysteresis for Addr/Therm output. Once Therm
output has asserted, it will not de-assert until the temperature has fallen below the
respective therm limit minus the therm hysteresis value. See Section 5 for more
information.
The therm hysteresis register is read/write and is located at address 21h. The power-up
default value is 10 °C (0Ah). The format is 8-bit, two's complement integer.
Table 21.
Therm hysteresis
ADDR
(hex)
R/W
Register
b7
b6
b5
b4
b3
b2
21
R/W
Therm hysteresis
sign
64 °C
32 °C
16 °C
8 °C
4 °C
4.11
b1
b0
2 °C 1 °C
Power-up
default (hex)
0A (10 °C, dec)
SMBus timeout register
At power-up, the STTS751 is configured with an SMBus timeout of 25 to 35 milliseconds
(tTIMEOUT). See Section 3.7 for more information.
Table 22.
SMBus timeout register
ADDR
(hex)
R/W
22
R/W
Register
b7
SMBus timeout TIMEOUT
b6
b5
b4
b3
b2
b1
b0
Power-up
default (hex)
0
0
0
0
0
0
0
80
TIMEOUT: [bit 7]
1: SMBus timeout is enabled. Default condition.
0: SMBus timeout is disabled.
[bits 6:0] Not used - reserved.
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STTS751
STTS751 register summary
4.12
STTS751 product ID
The two versions of the STTS751 as shown in Table 1 can be identified via the read-only
Product ID register at address FDh. The STTS751-0 has a Product ID of 00h. The
STTS751-1 has a Product ID of 01h.
Table 23.
Product ID register
ADDR
(hex)
R/W
Register
FD
R
Product ID
4.13
b7
b6
b5
b4
b3
b2
b1
b0
hex
0
0
0
0
0
0
0
0
00: STTS751-0
0
0
0
0
0
0
0
1
01: STTS751-1
STTS751 manufacturer’s ID
The read-only manufacturer's ID is located at address FEh. For the STTS751, the value is
53h.
Table 24.
Manufacturer’s ID register
ADDR
(hex)
R/W
Register
b7
b6
b5
b4
b3
b2
b1
b0
hex
FE
R
Mfg ID
0
1
0
1
0
0
1
1
53
4.14
STTS751 revision ID
The STTS751 revision ID register pointer is read-only and can be accessed at address FFh.
The value is formatted as an unsigned, 8-bit integer.
Table 25.
Revision ID register
ADDR
(hex)
R/W
Register
b7
b6
b5
b4
b3
b2
b1
b0
FF
R
Revision ID
0
0
0
0
0
0
0
1
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EVENT output
5
STTS751
EVENT output
The STTS751 EVENT output is open drain and requires a pull-up resistor.
The EVENT pin is asserted (low) whenever the temperature exceeds the high limit or is
equal to or below the low limit. Once asserted, the output will remain asserted until the
STTS751 receives an SMBus Alert Response Address (ARA) from the host and
acknowledges with its slave address. The output will be deasserted when the ARA is
acknowledged. If the triggering condition is still true, the output will be reasserted at the next
temperature conversion.
Figure 6 below shows how the EVENT output functions.
Figure 6.
EVENT output
Temperature
Temperature high limit
Temperature low limit
Time
EVENT
SMBus ARA acknowledged
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AM03032v1
STTS751
6
Addr/Therm output
Addr/Therm output
The Addr/Therm pin functions normally as an output to alert the system of an over
temperature condition. It is open drain and requires a pull-up resistor. During power-up, the
pull-up value is sensed by the STTS751 to determine what its slave address will be as
depicted in Table 1.
The Therm output is asserted low whenever the temperature exceeds the Therm limit
(address 20h). Only the upper 8 bits of the temperature register are used in the
comparison with the Therm limit. Once asserted, Therm will remain asserted until
temperature falls below the Therm limit minus the therm hysteresis value. For example, if
the Therm limit is 25 °C, and the therm hysteresis value is 10 °C, the Therm output will
assert when the temperature exceeds 25 °C. It will remain asserted until the temperature
falls down to or below 15 °C (25 – 10).
This pin can be used to control a fan or other failsafe device as shown in Figure 4 on page 8.
Figure 7 below shows how the Therm output functions.
Figure 7.
Therm output
Therm
Hysteresis
Temperature
Therm limit
Therm Limit minus
Therm Hysteresis
Time
Addr/Therm
AM03033v1
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Maximum ratings
7
STTS751
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 26.
Absolute maximum ratings
Symbol
TSTG
TSLD(1)
Parameter
Storage temperature (VDD off)
Lead solder temperature
Value
Unit
–55 to 150
°C
260
°C
–0.3 to VDD + 0.3
V
VIO
Input or output voltage
VDD
Supply voltage
5.0
V
IO
Output current
20
mA
θJA
Thermal resistance (junction to ambient)
UDFN-6L
78
SOT23-6L
191
°C/W
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
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STTS751
8
DC and AC parameters
DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables that
follow, are derived from tests performed under the measurement conditions summarized in
Table 27: Operating and AC measurement conditions. Designers should check that the
operating conditions in their circuit match the operating conditions when relying on the
quoted parameters.
Table 27.
Operating and AC measurement conditions
Parameter
Conditions
Unit
VDD supply voltage - temperature sensor
2.25 to 3.6
V
Ambient operating temperature (TA)
–40 to +125
°C
5
ns
Input pulse voltages
0.2 VDD to 0.8 VDD
V
Input and output timing reference voltages
0.3 VDD to 0.7 VDD
V
Input rise and fall times
Figure 8.
AC measurement I/O waveform
Input and output timing
reference levels
Input levels
0.8 * VDD
0.7 * VDD
0.3 * VDD
0.2 * VDD
AM04731v1
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DC and AC parameters
Table 28.
STTS751
DC and AC characteristics
Symbol
Description
VDD
Supply voltage
IDD
ISB
Test condition(1)
Min
Typ(2)
2.25
Operating current dependent upon
conversion rate
Max
Unit
3.6
V
0.0625
conversions/second(3)
15
35
µA
1 conversion/second(3)
20
40
µA
8 conversions/second
50
85
µA
32 conversions/second
125
250
µA
3
8
µA
0 °C to 85 °C
±1.0
±1.5
°C
–40 °C to +125 °C
±2.0
±2.5
°C
9-bit
temperature data
0.5
°C/LSB
9
bits
10-bit temperature data
(default)
0.25
°C/LSB
10
bits
0.125
°C/LSB
11
bits
0.0625
°C/LSB
12
bits
Standby current
Temperature measurement
Accuracy(4)
Resolution
2.25 V to 3.6 V
STTS751 is programmable from 9 bits
to 12 bits (0.5 °C/LSB to 0.0625 °C)
11-bit temperature data
12-bit temperature data
tCONV
9-bit
10.5
14
ms
10-bit (default)
21
28
ms
11-bit
42
56
ms
12-bit
84
112
ms
Conversion time
VOL
Low level output voltage
Addr/Therm, EVENT
IOL = 4 mA
0.4
V
IOH
High level output leakage current
EVENT, SDA, Addr/Therm
VOH = VDD
1
µA
SMBus interface inputs (SDA, SCL)
VIH
Input logic high (SCL, SDA)
2.3 V ≤ VDD ≤ 3.6 V
VIL
Input logic low (SCL, SDA)
2.3 V ≤ VDD ≤ 3.6 V
IHI
Logical "1" input current
0 V ≤ VIN ≤ VDD
ILI
Logical "0" input current
0 V ≤ VIN ≤ VDD
CIN
Input capacitance (SDA)
ISINK
SMBus output low sink current
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0.7 x
VDD
V
0.3 x
VDD
V
–1
1
µA
–1
1
µA
5
SDA forced to 0.6 V
Doc ID 16483 Rev 5
6
pF
mA
STTS751
Table 28.
DC and AC parameters
DC and AC characteristics (continued)
Symbol
Description
Test condition(1)
Min
Pull-up supply voltage
(open drain)
(Addr/Therm)
VPV
EVENT, SDA, SCL
VPOR
Power On Reset threshold
(POR) - TS
VDD falling edge
tTIMEOUT
SMBus timeout(5)
tSP
Spike suppression
Pulse width of spikes that must
be suppressed by the input filter
Typ(2)
Max
Unit
–0.3
3.6
V
–0.3
5.5
V
1.75
V
25
Input filter on SCL and
SDA
35
ms
50
ns
1. Valid for ambient operating temperature: TA = –40 to +125 °C; VDD = 2.25 V to 3.6 V (except where noted).
2. Typical numbers are for TA = +25 °C; VDD = 3.0 V
3. Not tested, guaranteed by design.
4. Accuracy measurements made at resolutions > 10 bits.
5. SMBus timeout min and max are valid for TA = –30 to +125 °C.
Table 29.
AC characteristics
Symbol
Description
Min
fSCL
SMBus/I2C clock frequency
10
tHIGH
Clock high period
600
ns
tLOW
Clock low period
1.3
µs
tR
Clock/data rise time
300
ns
tF
Clock/data fall time
300
ns
tSU:DAT
Data setup time
100
ns
tHD:DI
Data in hold time
0
ns
tHD:DAT
Data out hold time
300
ns
tSU:STA
Start condition setup time
600
ns
tHD:STA
Hold time after (repeated) start condition. After this period,
the first clock cycle is generated.
600
ns
tSU:STO
Stop condition setup time
600
ns
tBUF
Bus free time between stop (P) and start (S) conditions
1.3
µs
Doc ID 16483 Rev 5
Typ
Max
Unit
400
kHz
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Package mechanical data
9
STTS751
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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Package mechanical data
Figure 9.
UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical drawing
8187820_A
Table 30.
UDFN-6L (2 mm x 2 mm x 0.5 mm) package mechanical data
mm
inches
Sym
Min
Typ
Max
Min
Typ
Max
A
0.45
0.50
0.55
0.018
0.020
0.022
A1
0.00
0.05
0.000
A3
0.065
0.002
0.003
b
0.20
0.25
0.30
0.008
0.010
0.012
D
1.95
2.00
2.05
0.077
0.079
0.081
E
1.95
2.00
2.05
0.077
0.079
0.081
e
L
0.65
0.50
0.60
0.026
0.70
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0.020
0.024
0.028
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Package mechanical data
STTS751
Figure 10. SOT23-6L (2.90 mm x 2.80 mm) package mechanical drawing
7049717_G
Table 31.
SOT23-6L (2.90 mm x 2.80 mm) package mechanical data
mm
inches
Sym
Min
Typ
A
Min
Typ
1.45
A1
0.00
A2
0.90
b
c
Max
0.057
0.15
0.000
1.30
0.035
0.30
0.50
0.012
0.020
0.08
0.22
0.003
0.009
1.15
0.006
0.045
D
2.90
0.114
E
2.80
0.110
E1
1.60
0.063
e
0.95
0.037
e1
1.90
0.075
0.051
L
0.30
0.45
0.60
0.012
0.018
0.024
θ
0°
4°
8°
0°
4°
8°
N
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Max
6
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STTS751
Package mechanical data
Figure 11. UDFN-6L package footprint
8187820_A(LP)
Figure 12. SOT23-6L package footprint
7049714_G(LP)
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Package mechanical data
STTS751
Figure 13. Carrier tape for UDFN-6L and SOT23-6L packages
P0
E
P2
D
T
A0
F
TOP COVER
TAPE
W
B0
P1
CENTER LINES
OF CAVITY
K0
USER DIRECTION OF FEED
AM03073v1
Table 32.
Carrier tape dimensions for UDFN-6L and SOT23-6L packages
Package
W
D
E
P0
P2
F
A0
B0
K0
P1
T
Unit
UDFN-6L
8.00
±0.30
1.50
+0.10/
–0.00
1.75
±0.10
4.00
±0.10
2.00
±0.05
3.50
±0.05
2.20
±0.10
2.20
±0.10
0.75
±0.10
4.00
±0.10
0.25
±0.05
mm
SOT23-6L
8.00
+0.30/
–0.10
1.50
+0.10/
–0.00
1.75
±0.10
4.00
±0.10
2.00
±0.10
3.50
±0.05
3.23
±0.10
3.17
±0.10
1.37
±0.10
4.00
0.254
mm
±0.10 ±0.013
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Package mechanical data
Figure 14. Reel schematic
T
40mm min.
Access hole
At slot location
B
D
C
N
A
G measured
Tape slot
In core for
Full radius
Tape start
2.5mm min.width
At hub
AM04928v1
Table 33.
Reel dimensions for 8 mm carrier tape - UDFN-6L and SOT23-6L packages
A
B
(max)
(min)
180 mm
(7 inch)
1.5 mm
Note:
C
13 mm
± 0.2 mm
D
N
(min)
(min)
20.2 mm
60 mm
G
8.4 mm
+ 2/–0 mm
T
(max)
14.4 mm
The dimensions given in Table 33 incorporate tolerances that cover all variations on critical
parameters.
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Part numbering
10
STTS751
Part numbering
Table 34.
Ordering information scheme
Example:
STTS751-0
DP
3
F
Device type
STTS751-0
STTS751-1
Package
DP = UDFN-6L
WB = SOT23-6L
Temperature range
3 = –40 °C to 125 °C
Shipping method
F = ECOPACK® package, tape & reel
E = ECOPACK® package, tubes
For other options, or for more information on any aspect of this device, please contact the
ST sales office nearest you.
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11
Revision history
Revision history
Table 35.
Document revision history
Date
Revision
06-Nov-2009
1
Initial release.
2
Updated Features; removed Therm2 throughout document (from
Section 1, 2, 3.8, 4.6, 4.10, 5, Figure 1, 2, 3, 4, 6, Table 2, 3, 15, 28);
updated Figure 3, Section 3.4, Section 4.6, Section 4.8, Section 4.10,
Table 10, 11, 12, 13, 14, 15, 17, 18, 19, 20, 21, 22, 23, 24, 25; added
package footprints (Figure 11 and 12); minor textual changes.
12-May-2010
3
Updated Section 3.7, Section 4.11, Section 5; Figure 6, 7, 11, 12;
Table 3, 9, 25, 28, Table 31; added tape and reel information
(Figure 13, 14 and Table 32, 33); minor textual changes in title and
document.
01-Jul-2010
4
Document status upgraded to full datasheet; updated cover page;
added footnote to Table 28; minor textual changes.
20-Jul-2010
5
Removed footnote from Table 28.
21-Jan-2010
Changes
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STTS751
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