TA4401CT TOSHIBA Bipolar Linear Integrated Circuit SiGe Monolithic TA4401CT 1.9 ~ 2.5 GHz Band Power Amplifier PHS, Digital Cordless Telecommunication Application Wireless LAN IEEE802.11b/g Application Bluetooth Class 1 Application Features • • • • • : VCC = 3.0 V (typ.) for PHS : VCC = 3.3 V (typ.) for IEEE802.11g Large output power : Pout = 22.5 dBmW (min.) for PHS : Pout = 18 dBmW (min.) for IEEE802.11g High power gain : Gp = 35 dB (typ.) for PHS : Gp = 27.5 dB (typ.) for IEEE802.11g Nano-amp shutdown mode : ICC_OFF = 20 nA (typ.) when VCON = 0 V Small package : CST16 (CSON16-P-0303-0.50) package (2.9 mm × 2.9 mm × 0.48 mm) Single voltage operation Weight: 0.012 g (typ.) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit VCC (Note 1) 3.6 V VCON (Note 2) 3.6 V Pin –3 dBmW Pd (Note 3) 1 W Operating temperature range Topr –40 to +85 ˚C Storage temperature range Tstg –55 to +150 ˚C Supply voltage Input power Power dissipation Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: VCC = VCC1 = VCC2 = VCC3 Note 2: VCON = VCON12 = VCON3 Note 3: When mounted on 30 mm × 35 mm × 0.4 mm FR4 substrate at Ta = 25°C (double-sided substrate: the reverse side is the ground connection.) Caution This device is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. 1 2007-11-01 TA4401CT Electrical Characteristics (22.5 dBmW for PHS) VCC = 3 V, VCON = 2.7 V, f = 1.92 GHz, Ta = 25 °C, Zs = Zl = 50 Ω, unless otherwise noted. Characteristic Symbol Test Condition Min Typ Max Unit f ⎯ 1.880 ⎯ 1.920 GHz VCC ⎯ 2.7 3.0 3.3 V VCON = 0 V, No RF input (Pin = 0 mW) ⎯ 20 ⎯ nA 384-kbps π/4-QPSK modulated signal, Pout = 22.5 dBmW, Pin = adjusted (Pin1) ⎯ 200 225 mA ⎯ 4 6 mA 32 35 ⎯ dB Operating frequency Operating supply voltage Shutdown mode leakage current ICC_OFF Supply current ICC Control current ICON Power gain Gp Adjacent channel leakage power ratio Harmonics ACPR1 Δf = 600 kHz ⎯ −65 −55 dB ACPR2 Δf = 900 kHz ⎯ −70 −60 dB 2fo ⎯ −45 −30 dB 3fo ⎯ −60 −30 dB Output deviation | ΔPout | 384-kbps π/4-QPSK modulated signal, f = 1880, 1920 MHz, Pin = Pin1 ⎯ 0.5 1 dB Input VSWR VSWRin CW signal, Pin = -30 dBmW ⎯ 1.5 2.5 ⎯ Stability ⎯ VCC = 3.0 ~ 3.6 V, VCON = 2.7 V, Pout = 22.5 dBmW @ Zl = 50 Ω, Pin = adjusted, Zs = 50 Ω, VSWR Load = 6:1 all phases, Ta = -40 ~ +85˚C Load mismatch ⎯ VCC = 3.6 V, VCON = 2.7 V, Pin = -6 dBmW, Zs = 50 Ω, VSWR Load = 6:1 all phases No spurious ⎯ No degradation ⎯ Note 4: ICON = ICON12 + ICON3 Note 5: Load condition for stability and load mismatch tests is formed with appropriate short stab connected to POUT (Pin No.10) and adjusted to all phases. Note 6: All tests for the above electrical characteristics are measured using “Test Board 1”, shown below. Note 7: 1/2 duty operation. Typical Electrical Characteristics for Reference 1 (21 dBmW for PHS) VCC = 3 V, VCON = 2.7 V, f = 1.92 GHz, Ta = 25 °C, Zs = Zl = 50 Ω, unless otherwise noted. Characteristic Symbol Typ Unit 384-kbps π/4-QPSK modulated signal, Pout = 21 dBmW, Pin = adjusted 185 mA 36 dB ACPR1 Δf = 600 kHz −70 dB ACPR2 Δf = 900 kHz −75 dB 2fo −45 dB 3fo −60 dB Supply current ICC Power gain Gp Adjacent channel leakage power ratio Harmonics Test Condition Note 8: All tests for the above typical electrical characteristics are measured using “Test Board 1”, shown below. 2 2007-11-01 TA4401CT Typical Electrical Characteristics for Reference 2 (18 dBmW for IEEE802.11g) VCC = 3.3 V, VCON12 = 2.5 V, VCON3 = 1.7 V, f = 2.45 GHz, Ta = 25 °C, Zs = Zl = 50 Ω, unless otherwise noted. Characteristic Symbol Test Condition Typ Unit f ⎯ 2.45 GHz Operating supply voltage VCC ⎯ 3.3 V Shutdown mode leakage current ICC_OFF 20 nA 125 mA 3 mA 27.5 dB 3 % −37 dB −55 dB −48 dB −55 dB Operating frequency Supply current Control current Power gain Error vector magnitude Adjacent channel leakage power ratio Harmonics VCON = 0 V, No RF input (Pin = 0 mW) ICC ICON Gp 54-Mbps 64QAM OFDM framed signal, Pout = 18 dBmW (when unframed), Pin = adjusted EVM ACPR1 Δf = 20 MHz ACPR2 Δf = 40 MHz 2fo 3fo 54-Mbps 64QAM OFDM unframed signal, Pout = 18 dBmW, Pin = adjusted CW signal, Pout = 18 dBmW, Pin = adjusted Note9: All tests for the above typical electrical characteristics are measured using “Test Board 2”, shown below. 3 2007-11-01 TA4401CT Block Diagram and Marking (Top View) Pin 1 marking 16 13 16 12 1 4 1 13 4401 ** 4 9 12 Product name 9 Lot No. 5 8 5 8 Pin Description Number of pin Name of pin Description 1 NC Not connected to the pellet. Please connect to ground. 2 PIN RF input. DC block capacitor is built in. 3 NC Not connected to the pellet. Please connect to ground. 4 NC Not connected to the pellet. Please connect to ground. 5 VCON12 st nd Control pin of 1 stage and 2 stage amplifiers. 6 NC 7 VCON3 Not connected to the pellet. Please connect to ground. 8 NC Not connected to the pellet. Please connect to ground. 9 NC Not connected to the pellet. Please connect to ground. 10 VCC3/POUT 11 NC Not connected to the pellet. Please connect to ground. 12 NC Not connected to the pellet. Please connect to ground. 13 NC Not connected to the pellet. Please connect to ground. 14 VCC2 15 NC 16 VCC1 − GND_Bed rd Control pin of 3 stage amplifier. rd Supply pin of 3 stage amplifier/RF output pin. nd Supply pin of 2 stage amplifier. Not connected to the pellet. Please connect to ground. st Supply pin of 1 stage amplifier. Ground. This pin also works as heat dissipation pad. 4 2007-11-01 TA4401CT Circuit Diagram for PHS Application (Test Board 1) C1 C8 C2 VCC =3.0V S1 L2 L3 C4 C3 RF-INPUT L1 C5 RF-OUTPUT L4 C6 R1 VCON =2.7V C7 List of External Components Part Number Value Chip Series Manufacturer C1 0.1 uF GRM15 series MURATA Decoupling capacitor C2 0.1 uF GRM15 series MURATA Decoupling capacitor C3 1.5 pF GRM15 series MURATA Harmonics reduction capacitor C4 0.1 uF GRM15 series MURATA Decoupling capacitor C5 10 pF GRM15 series MURATA DC blocking capacitor C6 2 pF GRM15 series MURATA PA output matching C7 0.1 uF GRM15 series MURATA Decoupling capacitor C8 10 uF GRM21 series MURATA Decoupling capacitor L1 3 nH LQG15HN series MURATA PA input matching L2 1 nH LQG15HN series MURATA PA matching L3 27 nH LQG15HN series MURATA PA output matching L4 2 nH LQG15HN series MURATA PA output matching R1 51 Ω MCR01 series ROHM S1 - - - 5 Description VCON buffering resistor Micro-strip line (length = 1.2 mm, width = 0.4 mm) 2007-11-01 TA4401CT Circuit Diagram for 2.45-GHz Wireless LAN Application (Test Board 2) C1 C8 C2 VCC = 3.3V S1 L2 C4 C3 RF-INPUT L1 R1 C5 RF-OUTPUT L3 C6 C9 C7 VCON12 = 2.5V VCON3 = 1.7V List of External Components Part Number Value Chip Series Manufacturer C1 0.1 uF GRM15 series MURATA Decoupling capacitor C2 0.1 uF GRM15 series MURATA Decoupling capacitor C3 1.5 pF GRM15 series MURATA Harmonics reduction capacitor C4 0.1 uF GRM15 series MURATA Decoupling capacitor C5 10 pF GRM15 series MURATA DC blocking capacitor C6 1 pF GRM15 series MURATA PA output matching C7 0.1 uF GRM15 series MURATA Decoupling capacitor 10 uF GRM21 series MURATA Decoupling capacitor C9 0.1 uF GRM15 series MURATA Decoupling capacitor L1 2 nH LQG15HN series MURATA PA input matching L2 27 nH LQG15HN series MURATA PA output matching L3 1 nH LQG15HN series MURATA PA output matching R1 10 Ω MCR01 series ROHM S1 - - - C8 6 Description PA input matching Micro-strip line (length = 2 mm, width = 0.4 mm) 2007-11-01 TA4401CT Typical Operating Characteristics of Test Board 1 (PHS) Pout, ACPR, Icc - Pin 40 25 20 20 0 15 -20 10 -40 5 -60 0 -80 ACPR (dB) 30 -5 -100220 -10 -120200 -15 -140180 -20 -35 -160160 -30 -25 -20 -15 -10 -5 Pout (dBmW) ICC (mA) Pout (dBmW) Vcc = 3 V, Vcon = 2.7 V, f = 1.92 GHz, Ta = 25 °C Icc (mA) ACPR1 (dB) ACPR2 (dB) 0 Pin (dBmW) Gp, ACPR, Icc - Vcon 0 36 -20 34 -40 32 -60 30 -80 28 -100 26 -120220 24 -140200 22 -160180 20 -180160 3.1 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 ACPR (dB) 38 Gp (dB) ICC (mA) Gp (dB) Pout = 22.5 dBmW, Vcc = 3 V, f = 1.92 GHz, Ta = 25 °C 40 20 Icc (mA) ACPR1 (dB) ACPR2 (dB) Vcon (V) Temperature Characteristics 38 0 36 -20 34 -40 32 -60 30 -80 28 -100 26 -120 220 24 -140 200 22 -160 180 20 -60 -40 -20 0 20 40 60 80 ACPR (dB) Gp (dB) ICC (mA) Gp (dB) Pout = 22.5 dBmW, Vcc = 3 V, Vcon = 2.7 V, f = 1.92 GHz 20 40 Icc (mA) ACPR1 (dB) ACPR2 (dB) -180 160 100 Ta (°C) 7 2007-11-01 TA4401CT Typical Operating Characteristics of Test Board 2 (IEEE802.11g) Continuous Wave 30 350 25 300 20 250 15 200 10 150 5 100 0 50 Icc (mA) Pout (dBmW), Gp (dB) Vcc = 3.3 V, f = 2.45 GHz, Ta = 25 °C Pout (dBmW) -5 -35 Gp (dB) Icc (mA) 0 -25 -15 -5 5 Pin (dBmW) 54Mbps 64QAM-OFDM Unframed 0 28.2 -10 28 -20 27.8 -30 27.6 -40 27.4 -50 27.2 -60 ACPR, 2fo (dB) Gp (dB) Vcc = 3.3 V, f = 2.45 GHz, Ta = 25 °C 28.4 Gp (dB) ACPR1 (dB) ACPR2 (dB) 2f o (dB) 27 16.5 17 17.5 18 18.5 19 -70 19.5 Pout (dBmW) 54Mbps 64QAM OFDM Framed 5 400 4.5 360 4 320 3.5 280 3 240 2.5 200 2 160 1.5 120 1 80 0.5 40 0 Icc (mA) EVM (%) Vcc = 3.3 V, f = 2.45 GHz, Ta = 25 °C EVM (%) Icc (mA) 0 15 16 17 18 19 20 Pout (dBmW) 8 2007-11-01 TA4401CT Notice The circuits and measurements contained in this document are given only in the context of examples of applications for these products. Moreover, these example application circuits are not intended for mass production, since the high-frequency characteristics (the AC characteristics) of these devices will be affected by the external components which the customer uses, by the design of the circuit and by various other conditions. It is the responsibility of the customer to design external circuits which correctly implement the intended application, and to check the characteristics of the design. TOSHIBA assume no responsibility for the integrity of customer circuit designs or applications. 9 2007-11-01 TA4401CT Package Physical Dimensions CST16 Unit: mm ±0 .1 0.47 ± 0. 04 + 0. 01 0.01- 0. 00 5 + 0. 05 0.48 - 0. 04 5 2.9 ±0 .1 2.9 0.575 ±0 .0 5 +0 .0 5 1.3 ± 0. 1 0.25 -0 .0 3 0.05 ± 0. 03 1.5 ± 0. 1 +0 .0 5 0.4 -0 .0 3 0.5 Weight: 0.012 g (typ.) 10 2007-11-01 TA4401CT RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 11 2007-11-01