TC74HC564AP/AF,574AP/AF TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74HC564AP,TC74HC564AF,TC74HC574AP,TC74HC574AF Octal D-Type Filp-Flop with 3-State Output TC74HC564AP/AF Inverting TC74HC574AP/AF Non-Inverting TC74HC564AP, TC74HC574AP The TC74HC564A and HC574A are high speed CMOS OCTAL FLIP-FLOPs with 3-STATE OUTPUT fabricated with silicon gate C2MOS technology. They achieve the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. These 8-bit D-type flip-flops are controlled by a clock input (CK) and an output enable input ( OE ). The TC74HC564A has inverting outputs, and the TC74HC574A has non-inverting outputs. All inputs are equipped with protection circuits against static discharge or transient excess voltage. TC74HC564AF, TC74HC574AF Features • High speed: fmax = 62 MHz (typ.) at VCC = 5 V • Low power dissipation: ICC = 4 μA (max) at Ta = 25°C • High noise immunity: VNIH = VNIL = 28% VCC (min) • Output drive capability: 15 LSTTL loads • Symmetrical output impedance: |IOH| = IOL = 6 mA (min) ∼ tpHL Balanced propagation delays: tpLH − • • Wide operating voltage range: VCC (opr) = 2 to 6 V • Pin and function compatible with 74LS564/574 1 Weight DIP20-P-300-2.54A SOP20-P-300-1.27A : 1.30 g (typ.) : 0.22 g (typ.) 2007-10-01 TC74HC564AP/AF,574AP/AF Pin Assignment TC74HC564A TC74HC574A IEC Logic Symbol TC74HC564A TC74HC574A Truth Table Inputs Outputs OE CK D H X Q (574A) Q (564A) X Z Z L X Qn Qn L L L H L H H L X: Don’t care Z: High impedance Qn ( Qn ): No change 2 2007-10-01 TC74HC564AP/AF,574AP/AF System Diagram TC74HC564A TC74HC574A Absolute Maximum Ratings (Note 1) Characteristics Symbol Rating Unit Supply voltage range VCC −0.5 to 7 V DC input voltage VIN −0.5 to VCC + 0.5 V DC output voltage VOUT −0.5 to VCC + 0.5 V Input diode current IIK ±20 mA Output diode current IOK ±20 mA DC output current IOUT ±35 mA DC VCC/ground current ICC ±75 mA Power dissipation PD 500 (DIP) (Note 2)/180 (SOP) mW Storage temperature Tstg −65 to 150 °C Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be applied until 300 mW. 3 2007-10-01 TC74HC564AP/AF,574AP/AF Operating Ranges (Note) Characteristics Symbol Rating Unit Supply voltage VCC 2 to 6 V Input voltage VIN 0 to VCC V VOUT 0 to VCC V −40 to 85 °C Output voltage Operating temperature Topr 0 to 1000 (VCC = 2.0 V) Input rise and fall time 0 to 500 (VCC = 4.5 V) tr, tf ns 0 to 400 (VCC = 6.0 V) Note: The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Electrical Characteristics DC Characteristics Characteristics High-level input voltage Low-level input voltage Min Typ. Max Min Max 2.0 1.50 ⎯ ⎯ 1.50 ⎯ 4.5 3.15 ⎯ ⎯ 3.15 ⎯ 6.0 4.20 ⎯ ⎯ 4.20 ⎯ 2.0 ⎯ ⎯ 0.50 ⎯ 0.50 4.5 ⎯ ⎯ 1.35 ⎯ 1.35 6.0 ⎯ ⎯ 1.80 ⎯ 1.80 2.0 1.9 2.0 ⎯ 1.9 ⎯ 4.5 4.4 4.5 ⎯ 4.4 ⎯ 6.0 5.9 6.0 ⎯ 5.9 ⎯ IOH = −6 mA 4.5 4.18 4.31 ⎯ 4.13 ⎯ IOH = −7.8 mA 6.0 5.68 5.80 ⎯ 5.63 ⎯ 2.0 ⎯ 0.0 0.1 ⎯ 0.1 4.5 ⎯ 0.0 0.1 ⎯ 0.1 6.0 ⎯ 0.0 0.1 ⎯ 0.1 IOL = 6 mA 4.5 ⎯ 0.17 0.26 ⎯ 0.33 IOL = 7.8 mA 6.0 ⎯ 0.18 0.26 ⎯ 0.33 6.0 ⎯ ⎯ ±0.5 ⎯ ±5.0 μA ⎯ VIL IOH = −20 μA High-level output voltage VOH VIN = VIH or VIL IOL = 20 μA Low-level output voltage VOL Unit VCC (V) ⎯ VIH Ta = −40 to 85°C Ta = 25°C Test Condition Symbol VIN = VIH or VIL VIN = VIH or VIL V V V V 3-state output off-state current IOZ Input leakage current IIN VIN = VCC or GND 6.0 ⎯ ⎯ ±0.1 ⎯ ±1.0 μA Quiescent supply current ICC VIN = VCC or GND 6.0 ⎯ ⎯ 4.0 ⎯ 40.0 μA VOUT = VCC or GND 4 2007-10-01 TC74HC564AP/AF,574AP/AF Timing Requirements (input: tr = tf = 6 ns) Characteristics Symbol Minimum pulse width tW (H) (CK) tW (L) Minimum set-up time (Dn) Minimum hold time (Dn) Clock frequency Ta = 25°C Test Condition ⎯ ⎯ ts ⎯ th ⎯ f 5 Ta = −40 to 85°C VCC (V) Typ. Limit Limit 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 75 95 4.5 ⎯ 15 19 6.0 ⎯ 13 16 2.0 ⎯ 0 0 4.5 ⎯ 0 0 6.0 ⎯ 0 0 2.0 ⎯ 6 5 4.5 ⎯ 31 24 6.0 ⎯ 36 28 Unit ns ns ns MHz 2007-10-01 TC74HC564AP/AF,574AP/AF AC Characteristics (input: tr = tf = 6 ns) Characteristics CL (pF) VCC (V) Output transition time tTLH ⎯ tTHL 50 50 Propagation delay time tpLH (CK-Q, Q ) tpHL ⎯ 150 50 Output enable time tpZL tpZH RL = 1 kΩ 150 Output disable time tpLZ tpHZ RL = 1 kΩ 50 Ta = −40 to 85°C Ta = 25°C Test Condition Symbol Min Typ. Max Min Max 2.0 ⎯ 25 60 ⎯ 75 4.5 ⎯ 7 12 ⎯ 15 6.0 ⎯ 6 10 ⎯ 13 2.0 ⎯ 70 150 ⎯ 190 4.5 ⎯ 20 30 ⎯ 38 6.0 ⎯ 15 26 ⎯ 33 2.0 ⎯ 88 190 ⎯ 240 4.5 ⎯ 25 38 ⎯ 48 6.0 ⎯ 19 33 ⎯ 41 2.0 ⎯ 48 125 ⎯ 155 4.5 ⎯ 15 25 ⎯ 31 6.0 ⎯ 12 21 ⎯ 26 2.0 ⎯ 60 165 ⎯ 205 4.5 ⎯ 20 33 ⎯ 41 6.0 ⎯ 16 28 ⎯ 35 2.0 ⎯ 34 125 ⎯ 155 4.5 ⎯ 17 25 ⎯ 31 6.0 ⎯ 15 21 ⎯ 26 2.0 6 17 ⎯ 5 ⎯ 4.5 31 50 ⎯ 24 ⎯ 6.0 Unit ns ns ns ns Maximum clock frequency fmax 36 59 ⎯ 28 ⎯ Input capacitance CIN ⎯ ⎯ 5 10 ⎯ 10 pF COUT ⎯ ⎯ 10 ⎯ ⎯ ⎯ pF ⎯ ⎯ 54 ⎯ ⎯ ⎯ pF Output capacitance Power dissipation capacitance Note: CPD (Note) ⎯ 50 MHz CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC/8 (per bit) And the total CPD when n pcs. of flip flop operate can be gained by the following equation: CPD (total) = 39 + 15･n 6 2007-10-01 TC74HC564AP/AF,574AP/AF Package Dimensions Weight: 1.30 g (typ.) 7 2007-10-01 TC74HC564AP/AF,574AP/AF Package Dimensions Weight: 0.22 g (typ.) 8 2007-10-01 TC74HC564AP/AF,574AP/AF RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. 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Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 9 2007-10-01