PHILIPS TDA3606

INTEGRATED CIRCUITS
DATA SHEET
TDA3606
Multiple voltage regulator with
battery detection
Product specification
Supersedes data of 1997 Jul 15
File under Integrated Circuits, IC01
1998 Jun 16
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
FEATURES
GENERAL DESCRIPTION
• One VP-state controlled regulator
The TDA3606 is a low power voltage regulator. It contains:
• Regulator and reset outputs operate during load dump
1. One fixed voltage regulator with a foldback current
protection, intended to supply a microprocessor that
also operates during load dump
• Supply voltage range of −18 to +50 V
• Low quiescent current (battery detection switched off)
2. A reset-signal can be used to interface with the
microprocessor
• High ripple rejection
• Dual reset output.
3. Supply pin can withstand load dump pulses and
negative supply voltages
PROTECTIONS
4. Defined start-up behaviour; regulator will be switched
on at a supply voltage higher than 7.6 V and off when
the output voltage of the regulator drops below 2.4 V.
• Reverse polarity safe (down to −18 V without high
reverse current)
• Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
• ESD protected on all pins
• Load dump protection
• Foldback current limit protection for regulator
• DC short-circuit safe to ground and VP of regulator
output.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
operating
Iq(tot)
regulator on
5.6
14.4
25
V
jump start
t ≤ 10 minutes
−
−
30
V
load dump protection
during 50 ms; tr ≥ 2.5 ms
−
−
50
V
standby mode
−
95
120
µA
7 V ≤ VP ≤ 18 V
4.85
5.0
5.15
V
0.5 mA ≤ IREG ≤ 50 mA
4.8
5.0
5.2
V
IREG = 50 mA
−
−
0.4
V
total quiescent supply current
Voltage regulator
VREG
VREGd
output voltage regulator
drop-out voltage
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TDA3606T
SO8
1998 Jun 16
DESCRIPTION
plastic small outline package; 8 leads; body width 3.9 mm
2
VERSION
SOT96-1
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
BLOCK DIAGRAM
handbook, full pagewidth
VP
(14.4 V) 8
7
LOAD DUMP
PROTECTION
(5 V/50 mA)
REG
REGULATOR
REFERENCE
4.7
kΩ
5
RES2
&
VC
3
4.7
kΩ
6
RES1
TDA3606
REG
VI(bat)
1
2
BATTERY
BUFFER
VO(bat)
4
MGB852
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
VI(bat)
1
battery input voltage
VO(bat)
2
battery detection output voltage
VC
3
reset delay capacitor
GND
4
ground (0 V)
RES2
5
reset 2 output
RES1
6
reset 1 output
REG
7
regulator output
VP
8
supply voltage
1998 Jun 16
handbook, halfpage
VI(bat)
1
VO(bat)
2
8
VP
7
REG
6
RES1
5
RES2
TDA3606T
VC
3
GND
4
MGB856
Fig.2 Pin configuration.
3
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
RES1 will go HIGH by an internal pull-up resistor of 4.7 kΩ,
and is used to initialize the microprocessor. RES2 is used
to indicate that the regulator output voltage is within its
voltage range. This start-up feature is built-in to secure a
smooth start-up of the microprocessor at first connection,
without uncontrolled switching of the regulator during the
start-up sequence.
FUNCTIONAL DESCRIPTION
The TDA3606 is a voltage regulator intended to supply a
microprocessor (e.g. in car radio applications). Because of
low voltage operation of the application, a low-voltage drop
regulator is used in the TDA3606.
This regulator will switch on when the supply voltage
exceeds 7.5 V for the first time and will switch off again
when the output voltage of the regulator drops below
2.4 V. When the regulator is switched on, the RES1 and
RES2 outputs (RES2 can only be HIGH when RES1 is
HIGH) will go HIGH after a fixed delay time (fixed by an
external delay capacitor) to generate a reset to the
microprocessor.
All output pins are fully protected. The regulator is
protected against load dump and short-circuit (foldback
current protection).
Interfacing with the microprocessor can be accomplished
by means of a battery Schmitt-trigger and output buffer
(simple full/semi on/off logic applications). The battery
output will go HIGH when the battery input voltage
exceeds the HIGH threshold level.
50 V
handbook, full pagewidth
VP
4.35 V
4.35 V
regulator
2.4 V
reset 1
reset 2
reset delay
capacitor
2V
2V
on/off switch
2.1 V
battery input
2V
battery output
MGB857
Fig.3 Timing diagrams.
1998 Jun 16
4
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
supply voltage
operating
regulator on
−
25
V
jump start
t ≤ 10 minutes
−
30
V
load dump protection
during 50 ms; tr ≥ 2.5 ms
−
50
V
VP
reverse battery voltage
non-operating
−
−18
V
VI(bat)p
positive pulse voltage at battery input
VP = 14.4 V; RI = 5 kΩ
−
50
V
VI(bat)n
negative pulse voltage at battery input
VP = 14.4 V; RI = 5 kΩ
−
−100
V
Ptot
total power dissipation
Tamb = 25 °C
−
0.81
W
Tstg
storage temperature
non-operating
−55
+150
°C
Tamb
operating ambient temperature
−40
+85
°C
Tj
junction temperature
−40
+150
°C
operating
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
CONDITIONS
thermal resistance from junction to ambient in free air
VALUE
UNIT
155
K/W
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611E”. The number of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9397 750 00192.
1998 Jun 16
5
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; see Fig.5; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VP
Iq
supply voltage
operating
regulator on; note 1
5.6
14.4
25
V
jump start
t ≤ 10 minutes
−
−
30
V
load dump protection
during 50 ms, tr ≥ 2.5 ms
−
−
50
V
VP = 12.4 V; note 2
−
95
120
µA
VP = 14.4 V; note 2
−
100
−
µA
load dump; VP = 50 V
−
5
15
mA
6.2
7.5
8.2
V
quiescent current
Schmitt-trigger for regulator and reset 1
Vthr
rising supply voltage threshold
Vthf
falling voltage of regulator
threshold
Vhys
IREG = 5 mA
2.2
2.4
2.6
V
IREG = 30 mA
−
2.25
−
V
−
5.1
−
V
hysteresis
Schmitt-trigger for battery detection
Vthr
rising voltage threshold
1.95
2.05
2.15
V
Vthf
falling voltage threshold
1.85
1.95
2.05
V
Vhys
hysteresis
−
0.1
−
V
4.3
4.45
4.6
V
Schmitt-trigger for reset 2
Vthr
rising voltage of regulator
note 3
Vthf
falling voltage of regulator
note 3
Vhys
hysteresis
4.2
4.35
4.5
V
−
0.1
−
V
Reset 1/2 buffer
Isink
LOW-level sink current
2
−
−
mA
Rpu
internal pull-up resistor
VRES ≤ 0.8 V; note 3
3.7
4.7
5.7
kΩ
Io
output current
−
0.75
−
µA
Vthr
rising voltage threshold
1.4
2.0
2.8
V
td
delay time
Cd = 47 nF; note 4
40
125
−
ms
VOL
LOW-level output voltage
II = 0 mA
0
0.05
0.8
V
VOH
HIGH-level output voltage
Io = 5 µA; note 5
−
5.0
5.2
V
IOL
LOW-level output current
VOL ≤ 0.8 V
0.2
0.5
−
mA
IOH
HIGH-level output current
VOH ≥ 3 V
0.3
1.0
−
mA
Reset delay
Battery buffer
1998 Jun 16
6
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
SYMBOL
TDA3606
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Regulator (IREG = 5 mA)
Vo
0.5 mA ≤ IREG ≤ 50 mA
output voltage
4.8
5.0
5.2
V
7 V ≤ VP ≤ 18 V
4.85
5.0
5.15
V
18 V ≤ VP ≤ 50 V; load dump;
IREG = 30 mA
4.75
5.0
5.25
V
−
−
45
mA
Io
output current
load dump; VP > 25 V
∆VREG
line regulation
7 V ≤ VP ≤ 18 V
−
3
50
mV
∆VREGL
load regulation
0.5 mA ≤ IREG ≤ 30 mA
−
−
50
mV
SVRR
supply voltage ripple rejection
fi = 200 Hz; Vi(p-p) = 2 V;
Io = 5 mA
55
60
−
dB
VREGd
drop-out voltage
IREG = 50 mA; VP = 5 V; note 6
−
0.27
0.4
V
Iclr
current limit
VREG > 4.5 V; note 7
0.1
0.27
0.6
A
Iscr
short-circuit current
RL ≤ 0.5 Ω; note 8
15
60
−
mA
Notes
1. Minimum operating voltage, only if VP has exceeded 7.6 V.
2. The quiescent current is measured in stand-by mode. So, the battery input is connected to a low voltage source and
RL = ∞.
3. The voltage of regulator sinks as a result of a supply voltage drop.
Cd
C d × V thr
4. The delay time can be calculated with the following formula: t d = ∫ ------- dV thr = ----------------------- (ms)
I ch
I ch
5. Battery output voltage will be equal or less than the output voltage of regulator.
6. The drop-out voltage of regulator is measured between VP and VREG.
7. At current limit, Iclr is held constant (behaviour according to dashed line in Fig.4).
8. The foldback current protection limits the dissipated power at short-circuit (see Fig.4).
handbook, halfpage
MGB853
5.0 V
VREG
1V
Iscr
≥50 mA
IREG
Fig.4 Foldback current protection.
1998 Jun 16
7
Iclr
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
TEST AND APPLICATION INFORMATION
Test information
handbook, full pagewidth
7
VP
10 µF
VP
(1)
10 µF
8
3
reset 1 output
RL(RES1)
TDA3606
1 kΩ
5
reset 2 output
RL(RES2)
battery input voltage
1
1 kΩ
10 µF
VI(bat)
RL(REG)
1 kΩ .. 0.5 Ω
6
VC
regulator output
battery output voltage
2
RL(bat)
4
GND
1 kΩ
MGB808
(1) Capacitor not required for stability.
Fig.5 Test circuit.
of 100 µF is connected directly to pins 8 and 4 (supply and
ground) the noise is minimized.
Application information
NOISE
STABILITY
The noise at the output of the regulator depends on the
bandwidth of the regulator, which can be adjusted by
means of the output capacitor. In Table 1 the noise figures
are given.
Table 1
The regulator is stabilized by means of the output
capacitor. The value of the output capacitor can be
selected using the diagram shown in Fig.6. The following
two examples show the effects of the stabilization circuit
using different values for the output capacitor.
Noise figures
OUTPUT
CURRENT
IO (mA)
NOISE FIGURE (µV)(1)
Example 1
AT OUTPUT CAPACITOR CL (µF)
10
47
The regulator is stabilized using an electrolytic output
capacitor of 68 µF (ESR = 0.5 Ω). At −40 °C the capacitor
value is decreased to 22 µF and the ESR is increased to
3.5 Ω. The regulator will remain stable at a temperature of
−40 °C.
100
0.5
58
50
45
50
250
200
180
Note
1. Measured at a bandwidth of 10 Hz to 100 kHz.
Example 2
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (output
noise of the regulator is translated into a current noise by
means of the output capacitor). When a high frequency
capacitor of 220 nF in parallel with an electrolytic capacitor
The regulator is stabilized using an electrolytic output
capacitor of 10 µF (ESR = 3.3 Ω). At −40 °C the capacitor
value is decreased to 3 µF and the ESR is increased to
23.1 Ω. The regulator will be instable at a temperature of
−40 °C. This can be solved using a tantalum capacitor of
10 µF.
1998 Jun 16
8
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
handbook, full pagewidth
MBK118
8
ESR
(Ω) 6
(1)
4
stable region
2
(2)
0
0.68
1
10
100
output capacitor (µF)
1000
(1) Maximum ESR.
(2) Minimum ESR.
Fig.6 Curve for selecting the value of the output capacitor.
APPLICATION CIRCUITS
The maximum output current of the regulator equals:
In Fig.7 the quiescent current equals Iq + IRdivider.
The specified quiescent current equals Iq. When the
supply voltage is connected, the regulator will switch on
when the supply voltage exceeds 7.6 V. With the aid of a
timing capacitor at pin 3 the reset can be delayed (the
timer starts at the same moment as the regulator is
switched on).
150 – T amb
150 – T amb
I max = ------------------------------------------------------- = --------------------------------------- (mA)
R th j-a × ( V P – V REG )
155 × ( V P – 5 )
When Tamb = 85 °C, the maximum output current equals
45 mA. At lower ambient (Tamb < 0) temperature the
maximum output current equals 100 mA.
Forced reset can be accomplished by short-circuiting the
timer capacitor by using the push button switch. When the
push button is released again, the timer restarts (only
when the regulator is on) causing a second reset on both
RES1 and RES2.
1998 Jun 16
9
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
handbook, full pagewidth
TDA3606
choke
coil
2200
µF
on/off
(closed = on)
VP
8
8 V detector
R1
360 kΩ
7
VI(bat)
10 µF
1
R2
100 kΩ
TDA3606
VC
forced reset
REG
6
5
3
Cd
2
RES1
RES2
VO(bat)
4
MGB854
Fig.7 Typical application.
1998 Jun 16
10
used for
8 V detector
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.244
0.039 0.028
0.050
0.041
0.228
0.016 0.024
inches
0.010 0.057
0.069
0.004 0.049
0.01
0.01
0.028
0.004
0.012
θ
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03S
MS-012AA
1998 Jun 16
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
97-05-22
11
o
8
0o
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1998 Jun 16
12
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
TDA3606
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Jun 16
13
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
NOTES
1998 Jun 16
14
TDA3606
Philips Semiconductors
Product specification
Multiple voltage regulator with battery
detection
NOTES
1998 Jun 16
15
TDA3606
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Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/1200/03/pp16
Date of release: 1998 Jun 16
Document order number:
9397 750 03767