INTEGRATED CIRCUITS DATA SHEET TDA3810 Spatial, stereo and pseudo-stereo sound circuit Product specification File under Integrated Circuits, IC02 January 1985 Philips Semiconductors Product specification Spatial, stereo and pseudo-stereo sound circuit TDA3810 DESCRIPTION The TDA3810 integrated circuit provides spatial, stereo and pseudo-stereo sound for radio and television equipment. Features • Three switched functions: – spatial (widened stereo image) – stereo – pseudo-stereo (artificial stereo from a mono source) • Offset compensated operational amplifiers to reduce switch noise • LED driver outputs to facilitate indication of selected operating mode • Start/stop circuit to reduce switch noise and to prevent LED-flicker • TTL-compatible control inputs QUICK REFERENCE DATA Supply voltage (pin 18) VP typ. 12 V Supply current (LEDs off) IP typ. 6 mA Operating ambient temperature range Tamb 0 to +70 °C Input signals (r.m.s. value) Vi(rms) < 2 V Total harmonic distortion (stereo) THD typ. 0,1 % Channel separation (stereo) α typ. 70 dB Gain (stereo) Gv typ. 0 dB PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 November 25. January 1985 2 Product specification TDA3810 Fig.1 Block diagram/test circuit showing external components; for control inputs to pins 11 and 12 see truth table. Philips Semiconductors 3 Spatial, stereo and pseudo-stereo sound circuit January 1985 (1) Used in spatial mode for correction of high frequency only (optimal performance). Philips Semiconductors Product specification Spatial, stereo and pseudo-stereo sound circuit TDA3810 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 18) VP max. Storage temperature range Tstg −25 to +150 °C Operating ambient temperature range Tamb 0 to +70 °C Rth cr-a = K/W 18 V THERMAL RESISTANCE From crystal to ambient 80 CHARACTERISTICS VP = 12 V; Tamb = 25 °C; test circuit Fig.1 stereo mode (pin 11 to ground) unless otherwise specified. Output load: R6-10, 13-10 ≥ 4,7 kΩ; C6-10, 13-10 ≤ 150 pF. PARAMETER SYMBOL MIN. TYP. MAX. UNIT VP 4,5 − 16,5 V Supply current IP − 6 12 mA Reference voltage VS 5,3 6 6,7 V Supply voltage range (pin 18) Input voltage (pin 2 or 17) Vi(rms) − − 2 V Input resistance (pin 2 or 17) Ri 50 75 − kΩ Voltage gain Vo/Vi Gv − 0 − dB Channel separation (R/L) α 60 70 − dB THD − 0,1 − % RR − 50 − dB Vn(rms) − 10 − µV Antiphase crosstalk α − 50 − % Voltage gain Gv 1,4 2,4 3,4 dB THD = 0,2% (stereo mode) Total harmonic distortion f = 40 to 16 000 Hz; Vo(rms) = 1 V Power supply ripple rejection Noise output voltage (unweighted) left and right output SPATIAL MODE (pins 11 and 12 HIGH) PSEUDO-STEREO MODE The quality and strength of the pseudo-stereo effect is determined by external filter components. January 1985 4 Philips Semiconductors Product specification Spatial, stereo and pseudo-stereo sound circuit TDA3810 PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONTROL INPUTS (pins 11 and 12) Input resistance Ri 70 120 − kΩ Switching current −Ii − 35 100 µA Output current for LED −Io 10 12 15 mA Forward voltage VF − − 6 V LED DRIVERS (pins 7 and 8) Truth table CONTROL INPUT STATE LED SPATIAL PIN 7 MODE LED PSEUDO PIN 8 PIN 11 PIN 12 Mono pseudo-stereo HIGH LOW off on Spatial stereo HIGH HIGH on off Stereo LOW X off off LOW = 0 to 0,8 V (the less positive voltage) HIGH = 2 V to 5,5 V (the more positive voltage) X = don’t care January 1985 5 Philips Semiconductors Product specification Spatial, stereo and pseudo-stereo sound circuit TDA3810 PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 January 1985 EUROPEAN PROJECTION 6 Philips Semiconductors Product specification Spatial, stereo and pseudo-stereo sound circuit TDA3810 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1985 7