INTEGRATED CIRCUITS DATA SHEET TDA7072A/AT Single BTL power driver Objective specification File under Integrated circuits, IC01 July 1994 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT FEATURES GENERAL DESCRIPTION • No external components The TDA7072A/AT are single power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are specially designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors. • Very high slew rate • Single power supply • Short-circuit proof • High output current (0.6 A) • Wide supply voltage range Missing Current Limiter (MCL) • Low output offset voltage A MCL protection circuit is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical 300 mA). This level of 100 mA allows for headphone applications (single-ended). • Suited for handling PWM signals up to 176 kHz • ESD protected on all pins QUICK REFERENCE DATA SYMBOL PARAMETER VP positive supply voltage range Gv internal voltage gain IP total quiescent current SR CONDITIONS MIN. TYP. MAX. UNIT 3.0 5.0 18 V 32.5 33.5 34.5 dB − 4 8 mA slew rate − 12 − V/µs VP = 5 V; RL = ∞ IO output current − − 0.6 A Ibias input bias current − 100 300 nA fco cut-off frequency − 1.5 − MHz −3 dB ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA7072A 8 DIL plastic SOT97(1) TDA7072AT 8 mini-pack plastic SOT96A(2) Notes 1. SOT97-1; 1996 September 10. 2. SOT96-1; 1996 September 10. July 1994 2 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT VP handbook, full pagewidth 1 TDA7072A TDA7072AT I + i 5 positive output 2 positive input SHORT - CIRCUIT AND THERMAL PROTECTION 3 negative input I – i 4 n.c. 8 6 7 negative output MCD377 - 1 n.c. ground Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION VP 1 positive supply voltage IN+ 2 positive input IN− 3 negative input n.c. 4 not connected OUT+ 5 positive output GND 6 ground n.c. 7 not connected OUT− 8 negative output July 1994 handbook, halfpage VP 1 IN + 2 IN – 3 n.c. 4 TDA7072A TDA7072AT 8 OUT – 7 n.c. 6 GND 5 OUT + MCD378 Fig.2 Pin configuration. 3 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT feedback at 33.5 dB and the devices operate in a wide supply voltage range (3 to 18 V). The devices can supply a maximum output current of 0.6 A. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions. The differential inputs can handle common mode input voltages from ground level up to (VP −2.2 V). The devices have a very high slew rate. Due to the large bandwidth, they can handle PWM signals up to 176 kHz. FUNCTIONAL DESCRIPTION The TDA7072A/AT are single power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are particular designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors. Because of the BTL configuration, the devices can supply a bi-directional DC current in the load, with only a single supply voltage. The voltage gain is fixed by internal LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP positive supply voltage range − 18 V IORM repetitive peak output current − 1 A IOSM non repetitive peak output current − 1.5 A Ptot total power dissipation TDA7072A − 1.25 W TDA7072AT Tamb < 25 °C − 0.54 W Tstg storage temperature range −55 +150 °C Tvj virtual junction temperature − +150 °C Tsc short-circuit time − 1 hr see note Note to the limiting values The outputs can be short-circuited over the load, to the supply and to ground at all input conditions. THERMAL RESISTANCE SYMBOL Rth j-a PARAMETER THERMAL RESISTANCE from junction to ambient in free air TDA7072A 100 K/W TDA7072AT 155 K/W Note to the thermal resistance TDA7072A: VP = 5 V; RL = 8 Ω; The typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.36 A and Ptot = 0.76 W; Tamb (max) = 150 − 0.76 × 100 = 74 °C TDA7072AT: VP = 5 V; RL = 16 typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.18 A and Ptot = 0.38 W; Tamb (max) = 150 − 0.38 × 155 = 91 °C July 1994 4 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT CHARACTERISTICS VP = 5 V; f = 1 kHz; Tamb = 25 °C; unless otherwise specified (see Fig.3>). TDA7072A: RL = 8 Ω; TDA7072AT: RL = 16 Ω. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP positive supply voltage range 3.0 5.0 18 V IORM repetitive peak output current − − 0.6 A IP total quiescent current RL = ∞; note 1 − 4 8 mA ∆VOUT output voltage swing note 2 5.2 5.8 − V THD total harmonic distortion VOUT = 1 V (RMS) TDA7072A − 0.3 − % TDA7072AT − 0.1 − % 32.5 33.5 34.5 dB − 75 150 µV − − 1.5 MHz note 4 40 55 − dB Gv voltage gain Vno(rms) noise output voltage (RMS value) B bandwidth SVRR supply voltage ripple rejection note 3 |∆V5-8| DC output offset voltage RS = 500 Ω − − 100 mV VI(CM) DC common mode voltage range note 5 0 − 2.8 V CMRR DC common mode rejection ratio note 6 − 100 − dB ZI input impedance − 100 − kΩ Ibias input bias current − 100 300 nA SR slew rate − 12 − V/µs Notes to the characteristics 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The output voltage swing is typically limited to 2 x (VP −2.1 V) (see Fig.4). 3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS = 500 Ω. 4. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail. 5. The DC common mode voltage range is limited to (VP −2.2 V). 6. The common mode rejection ratio is measured at Vref = 1.4 V, VI(CM) = 200 mV and f = 1 kHz. July 1994 5 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT APPLICATION INFORMATION (1) VP = 5 V handbook, full pagewidth 220 µF 100 nF 1 TDA7072A TDA7072AT SERVO SYSTEM I + i 2 driver signal Rs Vref 5 (2) RL 500 Ω 3 I – i 8 6 4 n.c. 7 n.c. MCD379 ground (1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1. (1) RL can be: focus, tracking, sled function or spindle motor. Fig.3 Test and application diagram. + (VP – 2.1) V 0V MCD380 – (VP – 2.1) V Fig.4 Typical output voltage swing over RL. July 1994 6 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN July 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 7 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0098 0.014 0.0075 0.20 0.19 0.16 0.15 0.050 0.24 0.23 0.039 0.028 0.041 0.016 0.024 inches 0.0098 0.057 0.069 0.0039 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA July 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 8 o 8 0o Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. July 1994 9 Philips Semiconductors Objective specification Single BTL power driver TDA7072A/AT DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 10