Data Sheet, Rev 1.0, September 2007 TLE4946K High Precision Bipolar Hall-Effect Latch Sensors Edition 2007-09 Published by Infineon Technologies AG 81726 München, Germany © 2007 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. TLE4946K Revision History: 2007-09 Rev 1.0 Previous Version: Page Subjects (major changes since last revision) We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] TLE4946K 1 1.1 1.2 1.3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 2.2 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Electrical and Magnetic Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 7.1 7.2 7.3 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Distance between Chip and Package Surface . . . . . . . . . . . . . . . . . . . . . 10 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Data Sheet 1 1 1 1 2 Rev 1.0, 2007-09 High Precision Bipolar Hall-Effect Latch 1 Overview 1.1 Features • • • • • • • • • • • 2.7 V to 24 V supply voltage operation Operation from unregulated power supply High sensitivity and high stability of the magnetic switching points High resistance to mechanical stress by Active Error Compensation Reverse battery protection (– 18 V) Superior temperature stability Peak temperatures up to 195°C without damage Low jitter (typ. 1 µs) High ESD performance (± 6 kV HBM) Digital output signal SMD package SC59 (SOT23 compatible) 1.2 TLE4946K SC59 SC59 Functional Description The TLE4946K is a integrated circuit Hall-effect sensor designed specifically for highly accurate applications. Precise magnetic switching points and high temperature stability are achieved by active compensation circuits and chopper techniques on chip. Type Package TLE4946K SC59 Data Sheet 2 Rev 1.0, 2007-09 TLE4946K Overview 1.3 Pin Configuration (top view) Center of Sensitive Area 3 0.8 1 ± 0. 15 2 1.5 ± 0.15 SC59 Figure 1 Pin Definition and Center of Sensitive Area Table 1 Pin Definitions and Functions SC59 Pin No. Symbol Function 1 VS Supply voltage 2 Q Output 3 GND Ground Data Sheet 3 Rev 1.0, 2007-09 TLE4946K General 2 General 2.1 Block Diagram VS Voltage Regulator reverse polarity protected Bias and Compensation Circuits Oscillator and Sequencer Q Ref Amplifier Chopped Hall Probe Figure 2 2.2 Low Pass Filter Comparator with Hysteresis GND Block Diagram Circuit Description The chopped Hall IC Switch comprises a Hall probe, bias generator, compensation circuits, oscillator, and output transistor. The bias generator provides currents for the Hall probe and the active circuits. Compensation circuits stabilize the temperature behavior and reduce technology variations. The Active Error Compensation rejects offsets in signal stages and the influence of mechanical stress to the Hall probe caused by molding and soldering processes and other thermal stresses in the package. This chopper technique together with the threshold generator and the comparator ensure high accurate magnetic switching points. Data Sheet 4 Rev 1.0, 2007-09 TLE4946K Maximum Ratings 3 Maximum Ratings Table 2 Absolute Maximum Ratings Tj = – 40°C to 150°C Parameter Symbol Supply voltage VS Supply current IS through protection device Limit Values Unit min. max. – 18 – 18 – 18 18 24 26 V – 50 + 50 mA Output voltage VQ – 0.7 – 0.7 18 26 V Continuous output current IQ – 50 + 50 mA Junction temperature Tj – – – – 155 165 175 195 °C Storage temperature TS – 40 150 °C Magnetic flux density B – unlimited mT Conditions for 1 h, Rs ≥ 200 Ω for 5 min, Rs ≥ 200 Ω for 5 min @ 1.2 kΩ pull up for 2000 h (not additive) for 1000 h (not additive) for 168 h (not additive) for 3 x 1 h (additive) Note: Stresses above those listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 3 Parameter ESD voltage ESD Protection 1) Symbol VESD Limit Values min. max. – ±6 Unit Notes kV HBM, R = 1.5 kΩ, C = 100 pF TA = 25°C 1) Human Body Model (HBM) tests according to: EOS/ESD Association Standard S5.1-1993 and Mil. Std. 883D method 3015.7 Data Sheet 5 Rev 1.0, 2007-09 TLE4946K Operating Range 4 Operating Range Table 4 Operating Range Parameter Supply voltage Output voltage Junction temperature Output current Data Sheet Symbol Limit Values Unit min. typ. max. VS VQ Tj 2.7 – 18 V – 0.7 – 18 V – 40 – 150 °C IQ 0 – 20 mA 6 Conditions Rev 1.0, 2007-09 TLE4946K Electrical and Magnetic Parameters 5 Electrical and Magnetic Parameters Electrical Characteristics 1). Table 5 Parameter Symbol Limit Values Unit Conditions 6 mA 0.2 1 mA 0.3 0.6 V VS = 2.7 V ... 18 V VS = – 18 V IQ = 20 mA – 0.05 10 µA for VQ = 18 V – 0.02 1 µs RL = 1.2 kΩ; CL = 50 pF – 0.4 1 µs – 320 – min. typ. max. IS ISR VQSAT 2 4 0 – Output leakage current IQLEAK Output fall time tf tr Supply current Reverse current Output saturation voltage Output rise time Chopper frequency fOSC Switching frequency Delay time 3) Output jitter 4) Power-on time 5) kHz 2) fSW 0 – 15 td tQJ – 13 – µs – 1 – µsRMS Typical value for square wave signal 1 kHz – 13 – µs VS ≥ 2.7 V – 100 – K/W SC59 tPON Thermal resistance RthJA 6) see: Figure 3 “Timing Definition” on Page 9 kHz 1) over operating range, unless otherwise specified. Typical values correspond to VS =12 V and TA = 25°C 2) To operate the sensor at the max. switching frequency, the value of the magnetic signal amplitude must be 1.4 times higher than for static fields. This is due to the - 3 dB corner frequency of the low pass filter in the signal path. 3) Systematic delay between magnetic threshold reached and output switching 4) Jitter is the unpredictable deviation of the output switching delay 5) Time from applying VS ≥ 2.7 V to the sensor until the output state is valid 6) Thermal resistance from junction to ambient Calculation of the ambient temperature (SC59 example) e.g. for VS = 12.0 V, IStyp = 4 mA, VQSATtyp = 0.3 V and IQ = 20 mA : Power Dissipation: PDIS = 54.0 mW. In TA = Tj – (RthJA × PDIS) = 175°C – (100 K / W × 0.054 W) Resulting max. ambient temperature: TA = 169.6°C Note: Typical characteristics specify mean values expected over the production spread. Data Sheet 7 Rev 1.0, 2007-09 TLE4946K Electrical and Magnetic Parameters Table 6 Magnetic Characteristics TLE4946K 1) Parameter Symbol Tj [°C] Limit Values Unit min. typ. max. 15.8 14.0 9.6 19.2 17.0 13.7 mT Operate point BOP – 40 25 150 11.8 11.0 6.1 Release point BRP – 40 25 150 – 19.2 – 15.8 – 17.0 – 14.0 – 13.7 – 9.6 – 11.8 – 11.0 – 6.1 mT Hysteresis BHYS – 40 25 150 – 22.0 – – 28.0 – – 34.0 – mT Magnetic Offset BOFF – 40 25 150 – – 3.0 – – – – – 3.0 – mT – – - 2000 – ppm/°C – 20 µTRMS Temperature TC compensation of magn. thresholds Repeatability of magnetic thresholds 3) BREP – Notes 2) Typ. value for ∆B / ∆t > 12 mT/ms 1) over operating range, unless otherwise specified. Typical values correspond to VS = 12 V. 2) BOFF = (BOP + BRP) / 2 3) BREP is equivalent to the noise constant Field Direction Definion Positive magnetic fields related with south pole of magnet to the branded side of package. Data Sheet 8 Rev 1.0, 2007-09 TLE4946K Timing Diagram 6 Timing Diagram B OP Applied Magnetic Field B RP td VQ td tf tr 90% 10% Figure 3 Data Sheet Timing Definition 9 Rev 1.0, 2007-09 TLE4946K 7 Package Information 7.1 Package Marking 46 ym Package Information Year (y) = 0...9 Month (m) = 1...9, O - October N - November D - December AEA03643 Figure 4 Data Sheet Marking TLE4946K 10 Rev 1.0, 2007-09 TLE4946K Package Information 7.2 Distance between Chip and Package Surface d Branded Side d: Distance chip to upper side of IC SC59: 0.545 ±0.05 mm AEA03244 Figure 5 7.3 Distance Chip SC59 to Upper Side of IC Package Outlines 1.1 ±0.1 3 ±0.1 0.1 0.2 2.8 +0.2 -0.1 0.45 ±0.15 0.1 M 3 +0.1 2 0.1 M 0.95 0.95 (0.55) +0.1 0.15 -0.0 5 GPS09473 1 0.15 MAX. 1.6 +0.15 -0.3 3x0.4 +0.05 -0.1 0˚...8˚ MAX. GPS09473 Figure 6 Data Sheet SC59 11 Rev 1.0, 2007-09 TLE4946K Package Information PCB Footprint for SC59 The following picture shows a recommendation for the PCB layout. n 0.8 1.4 min 0.9 1.6 1.3 0.9 1.4 min 0.8 1.2 0.8 1.2 0.8 Reflow Soldering Figure 7 Wave Soldering Footprint SC59 (SOT23 compatible) Note: You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 12 Dimensions in mm Rev 1.0, 2007-09 TLE4946K Notes Data Sheet 13 Rev 1.0, 2007-09 TLE4946K Notes Data Sheet 14 Rev 1.0, 2007-09 TLE4946K Notes Data Sheet 15 Rev 1.0, 2007-09 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG