INFINEON TLE8261E

D a t a S h e e t , R e v. 1 . 0 , M ar c h 2 00 9
TLE8261E
U ni v e r s a l S y s t e m B as i s C h i p
H ER M ES
R ev . 1 . 0
A u to m o t i v e P o w e r
TLE8261E
Table of Contents
Table of Contents
1
HERMES Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4
4.1
4.2
State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
State Machine Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
5.1
5.2
5.3
5.4
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
16
17
18
19
6
6.1
6.2
6.3
6.4
6.5
Internal Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Voltage Regulator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Voltage Regulator Modes with SBC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21
21
21
22
23
7
7.1
7.2
7.3
7.4
7.5
External Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Voltage Regulator Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Voltage Regulator State by SBC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24
24
24
24
25
27
8
8.1
8.2
8.3
8.4
8.5
8.6
High Speed CAN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High-speed CAN Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAN Cell Mode with SBC Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Failure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPLIT Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
29
29
29
32
33
34
36
9
9.1
9.2
9.3
WK Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake-Up Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
40
40
40
42
10
10.1
10.2
10.3
Supervision Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
43
43
44
48
11
11.1
11.2
11.3
11.4
Interrupt Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Modes with SBC Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
49
49
53
53
53
Data Sheet
2
Rev. 1.0, 2009-03-31
TLE8261E
Table of Contents
11.5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
12
12.1
12.2
12.3
12.4
12.5
12.6
Limp Home . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limp Home output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Activation of the Limp Home Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Release of the Limp Home Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Vcc1µC undervoltage time-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
13.1
13.2
Configuration Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Configuration select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Config Hardware Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Corrupted data in the SPI data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Input Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Output Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Data Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Output Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
60
60
60
61
62
62
70
72
15
15.1
15.2
15.3
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ZthJA Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hints for SBC Factory Flash Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
74
77
78
79
16
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
17
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Data Sheet
3
55
55
55
56
56
56
58
Rev. 1.0, 2009-03-31
Universal System Basis Chip
HERMES
Rev. 1.0
1
TLE8261E
HERMES Overview
Scalable System Basis Chip Family
•
•
•
•
•
Six products for complete scalable application coverage
Complete compatibility (hardware and software) across the family
TLE8264-2E (3LIN), TLE8263-2E (2LIN) - 3 Limp Home outputs
TLE8264E (3LIN), TLE8263E (2LIN) - 1 Limp Home output
TLE8262E (1LIN), TLE8261E (no LIN) - 1 Limp Home output
Basic Features
•
•
•
•
•
•
•
•
•
•
•
Very low quiescent current in Stop and Sleep Modes
Reset input, output
Power on and scalable undervoltage reset generator
Standard 16-bit SPI interface
Overtemperature and short circuit protection
Short circuit proof to GND and battery
One universal wake-up input
Wide input voltage and temperature range
Cyclic wake in Stop Mode
Green Product (RoHS compliant)
AEC Qualified
PG-DSO-36-38
Description
The devices of the SBC family are monolithic integrated circuits in an enhanced power package with identical
software functionality and hardware features except for the number of LIN cells. The devices are designed for
CAN-LIN automotive applications e.g. body controller, gateway applications.
To support these applications, the System Basis Chip (SBC) provides the main functions, such as HS-CAN
transceiver for data transmission, low dropout voltage regulators (LDO) for an external 5 V supply, and a 16-bit
Serial Peripheral Interface (SPI) to control and monitor the device. Also implemented are a Time-out or a Window
Watchdog circuit with a reset feature, Limp Home circuitry output, and an undervoltage reset feature.
The devices offer low power modes in order to support application that are connected permanent to the battery.
A wake-up from the low power mode is possible via a message on the buses or via the bi-level sensitive
monitoring/wake-up input as well as from the SPI command. Each wake-up source can be inhibited.
The device is designed to withstand the severe conditions of automotive applications.
Type
Package
Marking
TLE8261E
PG-DSO-36-38
TLE8261E
Data Sheet
4
Rev. 1.0, 2009-03-31
TLE8261E
HERMES Overview
HS CAN Transceiver
•
•
•
•
•
•
•
•
•
Compliant to ISO 11898-2 and 11898-5 as well as SAE J2284
CAN data transmission rate up to 1 MBaud
Supplied by dedicated input VccHSCAN
Low power mode management
Bus wake-up capability via CAN message
Excellent EMC performance (very high immunity and very low emission)
Bus pins are short circuit proof to ground and battery voltage
8 kV ESD gun test on CANH / CANL / SPLIT
Bus failure detection
Voltage Regulators
•
•
•
•
•
Low-dropout voltage regulator
Vcc1µC, 200 mA, 5 V ±2% for external devices, such as microcontroller and RF receiver
Vcc2, 200 mA, 5 V ±2% for external devices or the internal HS CAN cell
Vcc3, current limitation by shunt resistor (up to 400 mA with 220 mΩ shunt resistor), 5 V ±4% with external PNP
transistor; for example: to supply additional external CAN transceivers
Vcc1µC, undervoltage Time-out
Supervision
•
•
•
•
•
Reset output with integrated pull-up resistor
Time-out or Window Watchdog, SPI configured
Watchdog Timer from 16 ms to 1024 ms
Check sum bit for Watchdog configuration
Reset due to Watchdog failure can be inhibited with Test pin (SBC SW Development Mode)
Interrupt Management
•
•
Complete enabling / disabling of interrupt sources
Timing filter mechanism to avoid multiple / infinite Interrupt signals
Limp Home
•
•
•
•
Open drain Limp Home outputs
Dedicated internal logic supply
Maximum safety architecture for Safety Operation Mode
Configurable Fail-Safe behavior
Data Sheet
5
Rev. 1.0, 2009-03-31
TLE8261E
Block Diagram
2
Block Diagram
The simplified block diagram illustrates only the basic elements of the SBC devices. Please refer to the information
for each device in the product family for more specific hardware configurations.
V CC2
VCC1µC
V CC3ref
VS
VCC3S HUNT
VS
VCC3B AS E
VS
VS
Vcc1µC
V cc2
V cc3
GND
Vint.
Vint.
SDI
SDO
CLK
CSN
SPI
SBC
STATE
MACHINE
Limp
Home
Limp home
INT
Interrupt
Control
RO
RESET
GENERATOR
WK
WK
VCCHSCAN
Vs
WAKE
REGISTER
CAN cell
TxD CAN
RxD CAN
CAN_H
SPLIT
CAN_L
Block diagram_TLE8261E.vsd
GND
Figure 1
Data Sheet
Simplified Block Diagram
6
Rev. 1.0, 2009-03-31
TLE8261E
Pin Configuration
3
Pin Configuration
3.1
Pin Assignments
RO
1
36
Test
CSN
2
35
Limp home
CLK
3
34
WK
SDI
SDO
4
33
n.c.
5
32
n.c.
GND
n.c.
6
31
GND
7
30
Vs
8
29
n.c.
n.c.
Vs
9
28
n.c.
n.c.
10
27
n.c.
Vcc3shunt
Vcc3base
11
26
12
25
n.c.
n.c.
GND
13
24
RxD CAN
Vcc3REF
14
23
TxDCAN
INT
15
22
GND
Vcc1µC
16
21
CANL
Vcc2
17
20
SPLIT
18
19
CANH
VccHSCAN
TLE8261
DSO 36 - Exposed Pad
Exposed
Die
Pad
Pinout_8261.vsd
Figure 2
Data Sheet
Pin Configuration
7
Rev. 1.0, 2009-03-31
TLE8261E
Pin Configuration
3.2
Pin Definitions and Functions
Pin
Symbol
Function
1
RO
Reset Input/Output; open drain output, integrated pull-up resistor; active low.
2
CSN
SPI Chip Select Not Input; CSN is an active low input; serial communication is
enabled by pulling the CSN terminal low; CSN input should be set to low only when
CLK is low; CSN has an internal pull-up resistor and requires CMOS logic level
inputs.
3
CLK
SPI Clock Input; clock input for shift register; CLK has an internal pull-down resistor
and requires CMOS logic level inputs.
4
SDI
SPI Data Input; receives serial data from the control device; serial data transmitted
to SDI is a 16-bit control word with the Least Significant Bit (LSB) transferred first:
the input has a pull-down resistor and requires CMOS logic level inputs; SDI will
accept data on the falling edge of the CLK signal.
5
SDO
SPI Data Output; this tri-state output transfers diagnostic data to the control device;
the output will remain tri-stated unless the device is selected by a low on Chip Select
Not (CSN).
6
GND
Ground
7
n.c.
Not connected
8
Vs
Power Supply Input; block to GND directly at the IC with ceramic capacitor. Ensure
to have no current flow from PIN8 to PIN9. PIN8 and PIN9 can be directly connected.
9
Vs
Power Supply Input; block to GND directly at the IC with ceramic capacitor. Ensure
to have no current flow from PIN8 to PIN9. PIN8 and PIN9 can be directly connected.
10
n.c.
Not connected
11
PNP Shunt; External PNP emitter voltage.
12
Vcc3 shunt
Vcc3 base
13
GND
Ground
14
Vcc3REF
External PNP Output Voltage
15
INT
Interrupt Output, configuration Input; used as wake-up flag from SBC Stop Mode
and indicating failures. Active low. Integrated pull up. During start-up used to set the
SBC configuration. External Pull-up sets config 1/3, no external Pull-up sets config
2/4.
16
Vcc1 µc
Voltage Regulator Output; 5 V supply; to stabilize block to GND with an external
capacitor.
17
Vcc2
Voltage Regulator Output; 5 V supply; to stabilize block to GND with an external
capacitor.
18
VccHSCAN
Supply Input; for the internal HS CAN cell.
19
CANH
CAN High Line; High in dominant state.
20
SPLIT
Termination Output; to support recessive voltage level of the bus lines.
21
CANL
CAN Low Line; Low in dominant state.
22
GND
Ground
PNP Base; External PNP base voltage.
23
TxDCAN
CAN Transmit Data Input; integrated pull-up resistor.
24
RxDCAN
CAN Receive Data Output
25
n.c.
Not connected
26
n.c.
Not connected
Data Sheet
8
Rev. 1.0, 2009-03-31
TLE8261E
Pin Configuration
Pin
Symbol
Function
27
n.c.
Not connected
28
n.c.
Not connected
29
n.c.
Not connected
30
n.c.
Not connected
31
GND
Ground
32
n.c.
Not connected
33
n.c
not connected
34
WK
Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals
coming from, for example, an external switch panel; also used as wake-up input;
35
Limp Home
Fail-Safe Function Output; Open drain. Active LOW.
36
Test
SBC SW Development Mode entry; Connect to GND for activation; Integrated pullup resistor. Connect to VS or leave open for normal operation.
EDP
-
Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.1)
1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed
die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC
performance.
Data Sheet
9
Rev. 1.0, 2009-03-31
TLE8261E
State Machine
4
State Machine
4.1
Block Description
First battery connection
(POR)
AND
config0 not active
Condition / event
SBC Init mode
(256ms max after reset relaxation)
SPI cmd
Vcc1
on
Vcc2/3
off
L.H.
inact
CAN
inact
SBC action
WD
conf
SPI cmd
SPI cmd
SBC SW Flash mode
Vcc1
on
Vcc2/3
on/off
L.H.
act/inact
CAN
Tx/Rx
WD trig
WD
fixed
Vcc2/3
on/off
L.H.
act/inact
CAN
conf
NOT reset clamped
(high or low)
OR
NOT undervoltage
at Vcc1
SBC Sleep mode
Vcc1
off
WK event stored
LH entry condition
stored
OR
Restart entry
condition stored
L.H.
act/inact
Vcc1
on
Vcc2/3
on/off
L.H.
act/inact
CAN
Vcc2/3
off
WD
off
SPI cmd
SBC Stop mode
SPI cmd
Vcc2/3
on/off
Vcc1
on
CAN
Wakable/
off
Reset
act.
Init mode not successful
L.H.
act/inact
WD
WD trig
fixed/off
CAN
wakable/
off
First battery connection
(POR)
AND
config 0
Config 1/3:
Reset clamped HIGH during restart / init
waked or off
SBC SW Development
mode
Vcc1
Vcc2/3
WD
mode set mode set mode set
CAN, WK Wake-up
OR
Release of over temperature at Vcc1
L.H.
CAN
mode set mode set
(Wake-up event stored)
(LH entry condition stored)
SBC Fail-Safe mode
Config 2/4:
Reset clamped LOW (any
mode)
WD trig
Wake up event
SBC Restart mode
1st (config2) or 2nd (config4) WD trig failure
in Normal / Stop / SW Flash mode
WD
conf
SPI cmd
Detection of falling edge at reset
pin (any mode)
OR
undervoltage reset at VCC1µC
(any mode)
Config 1/3:
Reset clamped LOW (any
mode)
Vcc1
on
SPI cmd
SPI cmd
OR
WD failed
1st (config1) or 2nd (config3) WD trig
failure
in Normal / Stop / SW Flash mode
SBC Normal mode
reset (initiated by SBC )
Vcc1
off
Vcc2/3
off
L.H.
act
CAN
sleep
SBC Factory Flash mode
Config 2/4:
Reset clamped HIGH during Restart
or Init mode
WD
off
Vcc1 over temperature shutdown
OR
V S > VUV_ON & Undervoltage time
out on VCC1
Vcc1
ext.
Vcc2/3
off
L.H.
inact.
CAN
off
WD
off
Power mode managment 8261.vsd
Figure 3
Data Sheet
Power Mode Management
10
Rev. 1.0, 2009-03-31
TLE8261E
State Machine
4.2
State Machine Description
The System Basis Chip (SBC) offers ten operating modes: Power On Reset, Init, Normal, Restart, Software Flash,
Sleep, Stop, Fail-Safe, Software Development, and Factory Flash Mode. The modes are controlled with one test
pin and via three mode select bits MS2..0, within the SPI. Additionally, the SBC allows five configurations,
accessed via two external pins and one SPI bit.
4.2.1
Configuration Description
Table 1 provides descriptions and conditions for entry to the different configurations of the SBC.
Table 1
SBC Configuration
Configuration
Description
Test pin
INT Pin
WD to
LH bit
config 0
Software Development Mode
0V
n.a
n.a
config 1
After missing the WD trigger for the first time, the state of Vcc1µC Open / VS External 0
remain unchanged, LH pin is active, SBC in Restart Mode
pull-up
config 2
After missing the WD trigger for the first time, Vcc1µC turns OFF,
LH pin is active, SBC in Fail-Safe Mode
No ext.
pull-up
config 3
After missing the WD trigger for the second time, the state of
Vcc1µC remain unchanged, LH pin is active, SBC in Restart
Mode
External 1
pull-up
config 4
After missing the WD trigger for the second time, Vcc1µC turns
OFF, LH pin is active, SBC in Fail-Safe Mode
No ext.
pull-up
0
1
In SBC SW Development Mode, Config 1 to 4 are accessible.
4.2.2
SBC Power ON Reset (POR)
At VS > VUVON, the SBC starts to operate, by reading the test pin and then by turning ON Vcc1µC. When Vcc1µC
reaches the reset threshold VRT1, the reset output remains activated for tRD1 and the SBC enters then the Init Mode.
In the event that Vs decreases below VUVOFF, the device is completely disabled. For more details on the disable
behavior of the SBC blocks, please refer to the chapter specific to each block.
4.2.3
SBC Init Mode
At entering the SBC Init Mode, the SBC starts to read the Test pin. The SBC starts-up in SBC Init Mode, and, after
powering-up, waits for the microcontroller to finish its startup and initialization sequences. Vcc2/3 are OFF and the
Watchdog is configurable but not active. CAN is inactive and Limp Home output is inactive. From this transition
mode, the SBC can be switched via SPI command to the desired operating mode, SBC Normal or Software Flash
Mode. If the SBC does not receive any SPI command, or receive wrong SPI command (i.e. not send the device
to SBC Normal or SBC SW Flash Mode) within a 256 ms time frame after the reset relaxation, it will enter into SBC
Restart Mode and activate the Limp Home output.
Note: In Init Mode it is recommended to send one SPI command that sets the device to Normal Mode, triggers the
watchdog the first time and sets the required watchdog settings.
Data Sheet
11
Rev. 1.0, 2009-03-31
TLE8261E
State Machine
4.2.4
SBC Normal Mode
SBC Normal Mode is used to transmit and receive CAN messages. In this mode, Vcc1µC is always “ON” Vcc2 and
Vcc3 can be turned-on or off by SPI command. In Normal Mode the watchdog needs to be triggered. It can be
configured via SPI, window watchdog and time-out watchdog is possible (default value is time-out 256 ms). All the
wake-up sources can be inhibited in this mode. The Limp Home output can be enabled or disabled via SPI
command. Via SPI command, the SBC can enter Sleep, Stop or Software Flash Mode. A reset is triggered by the
SBC when entering the Software Flash Mode. It is recommended to send at first SPI command the watchdog
setting. Please refer to Chapter 12.4.
4.2.5
SBC Sleep Mode
During SBC Sleep Mode, the lowest power consumption is achieved by having the main and external voltage
regulators switched-off. As the microcontroller is not supplied, the integrated Watchdog is disabled in Sleep Mode.
The last Watchdog configuration is not stored. The CAN module is in Wake-capable or OFF modes and the Limp
Home output is unchanged, as before entering the Sleep Mode. If a wake-up appears in this mode, the SBC goes
into Restart Mode automatically. In Sleep Mode, not all wake-up sources should be inhibited, this is required to
not program the device in a mode where it can not wake up. If all wake sources are inhibited when sending the
SBC to Sleep Mode, the SBC does not go to Sleep Mode, the microcontroller is informed via the INT output, and
the SPI bit “Fail SPI” is set. The first SPI output data when going to SBC Normal Mode will always indicate the
wake up source, as well as the SBC Sleep Mode to indicate where the device comes from and why it left the state.
Note: Do not change the transceiver settings in the same SPI command that sends the SBC to Sleep Mode.
4.2.6
SBC Stop Mode
The Stop Mode is used as low power mode where the µC is supplied. In this mode the voltage regulator Vcc1µC
remains active. The other voltage regulator (Vcc2/3) can be switched on or off.
The watchdog can be used or switched off. If the watchdog is used the settings made in Normal Mode are also
valid in Stop Mode and can not be changed.
The CAN is not active. It can be selected to be off or used as wake-up source. If all wake up sources are disabled,
(CAN, WK, cyclic wake) the watchdog can not be disabled, the SBC stays in Normal Mode and the watchdog
continues with the old settings.
If a wake-up event occurs the INT pin is set to low. The µC can react on the interrupt and set the device into Normal
Mode via SPI. There is no automatic transition to SBC Normal Mode.
There are 4 Options for SBC Stop Mode
•
•
•
•
WD on (the watchdog needs to be served as in Normal Mode
WD off (special sequence required see Chapter 10.2.4)
Cyclic Wake up with acknowledge (interrupt is sent after set time and needs to be acknowledged by SPI read)
Cyclic Wake-up, Watchdog off (interrupt is sent after set time)
Cyclic Wake-Up Feature
SBC Stop Mode supports the cyclic wake-up feature. By default, the function is OFF. It is possible to activate the
cyclic wake-up via “Cyclic WK on/off” SPI bit. This feature is useful to monitor battery voltage, for example, during
parking of the vehicle or for tracking RF data coming via the RF receiver. The Cyclic Wake-up feature sends an
interrupt via the pin INT to the µC after the set time. The cyclic wake-up feature shares the same clock as the
Watchdog. The time base set in the SPI for the Watchdog will be used for the cyclic wake-up. The timer has to be
set before activating the function. With the cyclic wake-up feature the watchdog is not working as known from the
other modes. In the case that both functions (Watchdog and cyclic wake-up) are selected, the cyclic wake-up is
activated and each interrupt has to be acknowledged by reading the SPI Wake register before the next Cyclic
Wake-Up comes. Otherwise, the SBC goes to SBC Restart Mode.
Data Sheet
12
Rev. 1.0, 2009-03-31
TLE8261E
State Machine
4.2.7
SBC Software Flash Mode
SBC Software Flash Mode is similar to SBC Normal Mode regarding voltage regulators. In this mode, the Limp
Home output can be set to active LOW via SPI and the communication on CAN is activated to receive flash data.
The Watchdog configuration is fixed to the settings used before entering the SBC SW Flash Mode. When the
device comes from SBC Normal Mode, a reset is generated at the transition.
From the SBC Software Flash Mode, the SBC goes into SBC Restart Mode, the config setting has no influence
on the behavior. A mode change to SBC Restart Mode can be caused by a SPI command, a time-out or Window
Watchdog failure or an undervoltage reset. When leaving the SBC Software Flash Mode a reset is generated.
4.2.8
SBC Restart Mode
They are multiple reasons to enter the SBC Restart Mode and multiple SBC behaviors described in Table 2.
In any case, the purpose of the SBC Restart Mode is to reset the microcontroller.
•
•
•
•
•
From SBC SW Flash Mode, it is used to start the new downloaded code.
From SBC Normal, SBC Stop Mode and SBC SW Flash Mode it is reached in case of undervoltage on Vcc1µC,
or due to incorrect Watchdog triggering.
From SBC Sleep Mode it is used to ramp up Vcc1µC after wake
From SBC Init Mode, it is used to avoid the system to remain undefined.
From SBC Fail-safe Mode it is used to ramp up Vcc1µC after wake or cool down of Vcc1µC.
From SBC Restart Mode, the SBC goes automatically to SBC Normal Mode. The delay time tRDx is programmable
by the “Reset delay” SPI bit. The Reset output (RO) is released at the transition. SBC Restart Mode is left
automatically by the SBC without any microcontroller influence. The first SPI output data will provide information
about the reason for entering Restart Mode. The reason for entering Restart Mode is stored and kept until the
microcontroller reads the corresponding “LH0..2” or “RM0..1” SPI bits. In case of a wake up from Sleep Mode the
wake source is seen at the interrupt bits (Configuration select 000), an interrupt is not generated.
Entering or leaving the SBC Restart Mode will not result in deactivation of the Limp Home output (if activated).
The first SPI output data when going to SBC Normal Mode will always indicate the reason for the SBC Restart
event.
Data Sheet
13
Rev. 1.0, 2009-03-31
TLE8261E
State Machine
Table 2
SBC Restart Mode Entry Reasons and Actions
SBC Mode and Configuration Entering reason
Actions
Mode
LH output
Vcc1µC
Init Mode
Config
Init Mode time-out
ON
remains ON LOW
LH 0..2
n.a.
Reset low from
outside
Unchanged
remains ON LOW
RM 0..1
config 1/3
Reset clamped
ON
remains ON LOW
LH 0..2
n.a
undervoltage reset
unchanged
ramping up
RM 0..1
config 3
Software Flash
Sleep
WD trigger failure
config 4
Software
Development
Mode
ON
LH 0..2
OFF after 1st
remains ON LOW
ON after 2nd
RM 0..1 after 1st
LH 0..2 after 2nd
OFF after 1st
RM 0..1 after 1st2)
Reset low from
outside
Unchanged
remains ON LOW
RM 0..1
config 1/3
Reset clamped
ON
remains ON LOW
LH 0..2
n.a
undervoltage reset
unchanged
remains ON LOW
RM 0..1
n.a
SPI cmd
unchanged
remains ON LOW
RM 0..1
n.a
WD trigger failure
unchanged
remains ON LOW
RM 0..1
n.a.
Reset low from
outside
Unchanged
remains ON LOW
RM 0..1
config 1/3
Reset clamped
ON
remains ON LOW
LH 0..2
n.a
Wake-up event
unchanged
ramping up
LOW
WK bits register
n.a
undervoltage reset
unchanged
ramping up
LOW
RM 0..1
config 3
Fail-Safe
LOW
n.a.
config 1
Stop1)
SPI Out Bits
n.a
config 1
Normal1)
RO
WD trigger failure
config 4
ON
LH 0..2
OFF after 1st
remains ON LOW
ON after 2nd
RM 0..1 after 1st
LH 0..2 after 2nd
OFF after 1st
RM 0..1 after 1st2)
n.a.
Reset low from
outside
Unchanged
remains ON LOW
RM 0..1
config 1/3
Reset clamped
ON
remains ON LOW
LH 0..2
n.a.
Wake-up event
ON
ramping up
LOW
LH 0..2
n.a
undervoltage reset
unchanged
ramping up
LOW
RM 0..1
n.a.
Reset low from
outside
Unchanged
remains ON LOW
RM 0..1
config 1/3
Reset clamped
ON
remains ON LOW
LH 0..2
1) Config 2 will never enter Restart Mode in case of WD failure but directly Fail-Safe Mode
2) Goes to Fail-Safe Mode after the second consecutive failure
Data Sheet
14
Rev. 1.0, 2009-03-31
TLE8261E
State Machine
4.2.9
SBC Fail-Safe Mode
In SBC Fail-Safe Mode, all voltage regulators are OFF and the transceivers are in Wake-Capable Mode. The Limp
Home output is active.
Conditions to enter the SBC Fail-Safe Mode are:
•
•
•
•
Watchdog trigger failure in configuration 2 or 4
Vcc1µC undervoltage time-out in any configuration if VS is above VLHUV range.
Temperature shutdown of Vcc1µC in any configuration.
Reset clamped in Config. 2/4
In case of Vcc1µC overtemperature shutdown, the SBC will latch and wait to cool down below the thermal hysteresis,
and will go back to SBC Restart Mode.
In case of a wake-up event, the SBC will go to SBC Restart Mode (not in case of Vcc1µC overtemperature
shutdown), storing the wake-up event and resetting the Watchdog trigger failure counter. The first SPI output data
when going to SBC Normal Mode will always indicate the reason for the SBC Fail-Safe Mode.
4.2.10
SBC Software Development Mode
If the Test pin is connected to GND (Config 0 active) during powering-up, the SBC enters SBC Software
Development Mode. SBC Software Development Mode is a super set of the other modes so it is possible to use
all the modes of the SBC with the following difference. In SBC Software Development Mode, no reset is generated
and VCC1µC is not switched off due to Watchdog trigger failure. If a Watchdog trigger failure occurs, it will be
indicated by the INT output (reset bit). The SBC Fail-Safe Mode or SBC Restart Mode are not reached in case of
wrong Watchdog trigger but the other reasons to enter these modes are still valid.
4.2.11
SBC Factory Flash Mode
In this mode, the SBC is completely powered OFF and the microcontroller is supplied externally. The mode is
detected when VCC1µC is powered from external and the voltage on Vs is not powered from external. The current
flow out of Vs must be limited to the maximum rating. The external supply voltage should be below the absolute
maximum rating stated in Chapter 5.1. The reset can be driven by an external circuit, or pulled high with a pull-up
resistor.
Note: Please respect the absolute maximum ratings when the device is in SBC Factory Flash Mode.
Data Sheet
15
Rev. 1.0, 2009-03-31
TLE8261E
General Product Characteristics
5
General Product Characteristics
5.1
Absolute Maximum Ratings
Absolute Maximum Ratings 1)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit
Test Conditions
–
Min.
Max.
-0.3
40
V
-0.5
5
V/µs –
-0.3
5.5
V
–
-27
40
V
–
5.1.5
VS
dVS/dt
Supply Voltage Slew Rate
Regulator Output Voltage
Vcc1µC/2/3
CAN Bus Voltage (CANH, CANL)
VCANH/L
Differential Voltage CANH, CANL, SPLIT VdiffESD
-40
40
V
CANH-CANL<|40 V|;
CANH-SPLIT<|40 V|
CANL-SPLIT<|40 V|;
5.1.6
Input Voltage at VCCHSCAN
-0.3
5.5
V
–
5.1.7
Voltage at SPLIT, WK
-27
40
V
–
5.1.8
Voltage at Test
-0.3
40
V
–
5.1.9
Voltage at Vcc3base, Vcc3shunt, Vcc3REF
VCCHSCAN
VSPLIT
VTest,max
Vcc3base
VLH
VI
-0.3
40
V
–
-0.3
40
V
–
-0.3
VCC1µC +
V
0 V < VS < 28 V
0 V < VCC1µC < 5.5 V
V
0 V < VS < 28 V
0 V < VCC1µC < 5.5 V
Voltages
5.1.1
5.1.2
5.1.3
5.1.4
Supply Voltage
5.1.10 Voltage at Limp Home (LH, pin)
5.1.11 Logic Voltages Input Pin (SDI, CLK,
CSN, TxDCAN)
5.1.12 Logic Voltage Output PIN (SDO, RO,
INT, RxDCAN)
0.3V
VDRI,RD
-0.3
VCC1µC +
0.3V
Currents
IVS
-500
–
mA
VS < VCC
Tj
Tstg
-40
150
°C
–
-55
150
°C
–
5.1.16 Electrostatic Discharge Voltage at
CANH, CANL, SPLIT versus GND
VESD
-6
6
kV
2)
HBM (100 pF via
1.5 kΩ)
5.1.17 Electrostatic Discharge Voltage
VESD
-2
2
kV
2)
HBM (100 pF via
1.5 kΩ)
5.1.18 Electrostatic Discharge CDM
Corner Pins (Pin 1, 18, 19, 36)
VESD_CDM -750
750
V
3)
500
V
3)
5.1.13 Reverse current on pin Vs
Temperatures
5.1.14 Junction Temperature
5.1.15 Storage Temperature
ESD Susceptibility
Electrostatic Discharge CDM
_C
VESD_CDM -500
1) Not subject to production test; specified by design
2) ESD susceptibility Human Body Model “HBM” according to JESD22-A114
3) ESD susceptibility Charged Device Model “CDM” according to ESDA STM5.3.1
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Data Sheet
16
Rev. 1.0, 2009-03-31
TLE8261E
General Product Characteristics
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
5.2
Pos.
Functional Range
Parameter
Symbol
Limit Values
Min.
Max.
Unit
Test Conditions
5.2.1
Supply Voltage
VS
VUV OFF
28
V
After VS rising above
VUV ON;1)
5.2.2
Supply Voltage
VS
VUV OFF
40
V
2)
5.2.3
SPI Clock Frequency
–
4
MHz
3)
5.2.4
SPI Clock Frequency
–
1
MHz
VS > 5.5 V
If VUV ON> VS> VUV OFF;
5.2.5
Junction Temperature
-40
150
°C
–
5.2.6
Undervoltage “OFF”
3
4
V
-1)
5.2.7
Undervoltage “ON
4.5
5.5
V
-1)
5.2.8
Supply Voltage for Limp Home
Output Active
fclkSPI
fclkSPI
Tj
VUV OFF
VUV ON
VS_LH
5.5
40
V
Pull up to VS
RLHO = 40kΩ
tpulse = 400 ms
40 V load dump;
Ri = 2Ω
1) In the case Vs < VUVOFF, the SBC is switched OFF and will restart in INIT Mode at next Vs rising.
2) During load dump, the others pins remains in their absolute maximum ratings
3) Not subject to production test, specified by design
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
Data Sheet
17
Rev. 1.0, 2009-03-31
TLE8261E
General Product Characteristics
5.3
Pos.
5.3.1
5.3.2
Thermal Characteristics
Parameter
Symbol
Limit Values
Min.
Typ.
Unit
Test Conditions
Max.
Junction Ambient
RthJA_1L
–
40
K/W
1) 3)
300 mm2
cooling area
Junction Ambient
RthJA_4L
–
25
K/W
2) 3)
Junction to Soldering Point
RthJSP
–
5
–
K/W
3)
2s2p + 600 mm2
cooling area
Thermal Prewarning and Shutdown Junction Temperatures;
5.3.3
VCC1µC, Thermal Pre-warning
5.3.4
VCC1µC, Thermal Prewarning
5.3.5
VCC1µC, VCC2 Thermal Shutdown
TjPW
120
145
170
°C
-3)
∆TPW
–
25
–
K
3)
TjSDVcc
150
185
200
°C
3)
ON Temperature
Hysteresis
Temperature
5.3.6
VCC1µC, VCC2 Thermal Shutdown
Hysteresis
∆TSDVcc
–
35
–
K
3)
5.3.7
VCC1µC, Ratio of SD to PW
Temperature
TjSDVcc/
–
1.20
–
–
3)
5.3.8
CAN Transmitter Thermal
Shutdown Temperature
TjSDCAN
150
–
200
°C
3)
5.3.9
CAN Transmitter Thermal
Shutdown Hysteresis
∆TCAN
–
10
–
K
3)
TjPW
1) Specified Rthja value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 single layer. The product (chip +
package) was simulated on a 76.4 x 114.3 x 1.5 mm board.
2) According to Jedec JESD51-2,-5,-7 at natural convection on 2s2p board for 2W. Board: 76.2x114.3x1.5mm³ with 2 inner
copper layers (35µm thick)., with thermal via array under the exposed pad contacted the first inner copper layer and
600mm2 cooling are on the top layer (70µm)
3) Not subject to production test; specified by design;
Data Sheet
18
Rev. 1.0, 2009-03-31
TLE8261E
General Product Characteristics
5.4
Current Consumption
VS = 5.5 V to 28 V; all outputs open; Without VCC3; Tj = -40 °C to +150 °C; all voltages with respect to ground;
positive current defined flowing into pin; unless otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit
Test Condition
Normal Mode;
5.4.1
Current Consumption for
Internal Logic
IVS_logic
–
–
2
mA
SBC Normal Mode
ICC1µC = ICC2 = 0mA;
CAN OFF mode;
5.4.2
IVS_CAN
Additional current
Consumption for CAN Cell
–
–
10
mA
CAN Normal Mode;
Recessive state; VCC2
connected to VCCHSCAN
VTxD = Vcc1µC;
without RL
–
–
12
mA
CAN Normal Mode;
dominant state; VCC2
connected to VCCHSCAN
VTxD = low;
without RL;
–
58
75
µA
SBC Stop Mode;
Vs = 13.5 V;
VCC1µC“ON”;
VCC2/3“OFF”
CAN wake capable;
Tj = 25°C
65
85
–
70
90
–
78
100
Stop Mode
5.4.3
Current Consumption
Data Sheet
IVS
19
Tj = 85°C1)
µA
SBC Stop Mode;
Vs = 13.5 V;
VCC1µC/2“ON”;
VCC3“OFF”
CAN wake capable;
Tj = 25°C
Tj = 85°C1)
Rev. 1.0, 2009-03-31
TLE8261E
General Product Characteristics
5.4
Current Consumption (cont’d)
VS = 5.5 V to 28 V; all outputs open; Without VCC3; Tj = -40 °C to +150 °C; all voltages with respect to ground;
positive current defined flowing into pin; unless otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
28
40
32
50
12
–
Unit
Test Condition
µA
SBC Sleep Mode;
Tj = 25°C
Vs = 13.5 V;
VCC1µC/2/3“OFF”
CAN wake capable;
Sleep Mode
5.4.4
5.4.5
Current consumption, all
Wake Up Sources
available.
Quiescent Current
Reduction when Wake
Capable CAN Cell
Disabled
IVS_sleep_ –
SBC
IVS_sleep_ 5
CAN
Tj = 85°C1)
µA
1)
SBC Sleep Mode;
Tj = 25°C;
VS = 13.,5 V;
VCC1µC/2/3“OFF”
CAN OFF
1) Not subject to production test; specified by design
Data Sheet
20
Rev. 1.0, 2009-03-31
TLE8261E
Internal Voltage Regulator
6
Internal Voltage Regulator
6.1
Block Description
V CC 1µC
Vs
V CC2
Vref
1
State
Machine
Overtemperature
Shutdown
Bandgap
Reference
INH
1
Vref
Charge
Pump
INTE RNA L RE GULA TOR DIA GRA M. V S D
GND
Figure 4
Functional Block Diagram
The internal voltage regulators are dual low-drop voltage regulators that can supply loads up to ICC1µC/2_max. An
input voltage up to VSMAX is regulated to Vcc1µC/2_nom = 5.0 V with a precision of ±2%. Due to its integrated reset
circuitry, featuring two SPI configurable power-on timing (tRDx) and three SPI configurable output voltages (VRTx)
monitoring, the device is well suited for microcontroller supply. The design enables stable operation even with
ceramic output capacitors down to 470nF, with ESR < 1 Ω @ f = 10 kHz. The device is designed for automotive
applications, therefore it is protected against overload, short circuit, and overtemperature conditions. Figure 4
shows the functional block diagram. If the VS voltage is lower than VUV_OFF, the DMOS of the voltage regulator is
switched to high impedance. The body diodes of the DMOS might go into conduction when VCC1µC or VCC2 > VS
(no reverse protection).
6.2
Internal Voltage Regulator Modes
It is possible to turn Vcc1µC via SBC Modes and Vcc2 activity ON or OFF via SPI command or by entering SBC
modes. The limiting current for the both regulators is ICC1µC_max/ICC2.
6.3
Internal Voltage Regulator Modes with SBC Mode
Depending on the SBC Mode in use, Vcc1µC and Vcc2 can be either ON or OFF by definition, Vcc2 can be also turned
ON or OFF, via SPI. Table 3 identifies the possible states of the voltage regulators, based on the various SBC
modes.
Data Sheet
21
Rev. 1.0, 2009-03-31
TLE8261E
Internal Voltage Regulator
Table 3
Internal Voltage Regulators States
SBC Mode
Vcc1µC
INIT Mode
ON
OFF
Normal Mode
ON
ON
Sleep Mode
OFF
OFF
Restart Mode
ON
unchanged
Software Flash Mode
ON
ON
OFF
Stop Mode
ON
ON
OFF
Fail-Safe Mode
OFF
OFF
6.4
Application information
6.4.1
Timing Diagram
Vcc2
OFF
Figure 5 shows the ramp up and down of the VS, and the dependency of Vcc1µC. At the first ramp up from SBC Init
Mode, the reset threshold VRT and time tRO are set to the default value. See Chapter 10.1
Vs
VUV ON
V UV OFF
t
Vcc1µC
VRTx,r
VRTx,f
t
GND
RO
SBC OFF
SBC Init
Any mode
SBC OFF
t
Figure 5
Ramp up / Down of Main Voltage Regulator
An undervoltage time-out on Vcc1µC is implemented. Refer to Chapter 12 for more information on this function.
6.4.2
Under voltage detection at Vcc2
The Vcc2 voltage regulator integrates an under voltage detection. When Vcc2 voltage goes below VUV_VCC2, the
failure is indicated by an interrupt and the failure is reported into the diagnosis frame of the SPI.
Data Sheet
22
Rev. 1.0, 2009-03-31
TLE8261E
Internal Voltage Regulator
6.5
Electrical Characteristics
VS = 5.5 V to 28 V; CCC1µC = CCC2 = 470 nF; all outputs open; SBC Normal Mode;
Tj = -40 °C to +150 °C; all voltages with respect to ground; positive current defined flowing into pin; unless
otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Unit Test Condition
Min.
Typ.
Max.
Voltage Regulator; Pin Vcc1 µC
6.5.1
Output Voltage
VCC1µC
4.9
5.0
5.1
V
0 mA <ICC1µC<200 mA;
5.5 V < VS < 28 V;
6.5.2
Line Regulation
∆VCC1µC,Li
–
–
20
mV
6 V < VS < 16 V;
ICC1µC = 0 A
6.5.3
Load Regulation
∆VCC1µC,Lo
–
–
50
mV
5 mA <ICC1µC<200 mA;
VS = 6 V
6.5.4
Power Supply Ripple
Rejection
PSRR
–
40
–
dB
6.5.5
Output Current Limit
Icc1µC max
200
–
500
mA
Vr = 1 Vpp;
fr = 100 Hz;1)
Vcc1µC = 4.5 V;
power transistor thermally
monitored;
6.5.6
Drop Voltage
VDR Vcc1µC
–
–
0.5
V
ICC1µC = 150 mA; 2)
Voltage Regulator; Pin Vcc2
6.5.7
Output Voltage
VCC2
4.9
5.0
5.1
V
0 <ICC2<200 mA;
5.5 V < VS < 28 V;
6.5.8
Line Regulation
∆VCC2,Li
–
–
20
mV
6 V < VS < 16 V;
ICC2 = 0 A;
6.5.9
Load Regulation
∆VCC2,Lo
–
–
50
mV
5 mA <ICC2<200 mA;
VS = 6 V
6.5.10
Power Supply Ripple
Rejection
PSRR
–
40
–
dB
6.5.11
Output Current Limit
Icc2
200
–
500
mA
Vr = 1 Vpp;
fr = 100 Hz;1)
Vcc2 = 4.5 V;
power transistor thermally
monitored;
6.5.12
Drop Voltage
6.5.13
Under voltage detection
on Vcc2
VDR_Vcc2
VUV_VCC2
–
–
0.5
V
4.5
4.65
4.8
V
ICC2 = 150 mA;2)
VCC2 falls until INT = LOW
1) specified by design; not subject to production test.
2) Measured when the output voltage has dropped 100 mV from the nominal Value obtained at Vs = 13.5 V. Specified drop
voltage for Vs > 4 V.
Data Sheet
23
Rev. 1.0, 2009-03-31
TLE8261E
External Voltage Regulator
7
External Voltage Regulator
7.1
Block Description
Vcc3 is activated via SPI. The external voltage regulator circuitry is designed to drive an external PNP transistor to
increase output current flexibility. Four pins are used: VS, Vcc3base, Vcc3shunt and Vcc3ref. One transistor is tested
during production. An input voltage up to VSMAX is regulated to VQ,nom = 5.0 V with a precision of ±4%. The output
current of the transistor is monitored via an external shunt resistor. The state of Vcc3 is reported in the diagnostic
SPI register. When battery voltage is below the minimum operating battery voltage Vs < VVextUV, the external
voltage regulator switches off. Figure 7 shows the behavior during this phase. The shunt is used for overcurrent
limitation. If this feature is not needed, connect pins Vcc3shunt and Vs together.
Since the junction temperature of the external PNP transistor cannot be read, it cannot be protected against over
temperature by the SBC, and so the thermal behavior has to be checked by the application.
VS
Vcc3shunt
Vcc 3base
Vcc 3ref
R BE
V S-VCC3shunt >
Vshunt_threshold
ICC3base
+
-
VREF
State machine
External voltage diagram .vsd
Figure 6
Functional Block Diagram
7.2
External Voltage Regulator Mode
It is possible to turn the Vcc3 ON or OFF via SPI command, depending on the SBC modes. Table 4 identifies the
possible states, based on the different SBC modes.
7.3
External Voltage Regulator State by SBC Mode
Table 4 shows the possible states of the Vcc3 external voltage regulator as a function of the SBC mode.
Table 4
External Voltage Regulator State by SBC Mode
SBC Mode
Vcc3
INIT Mode
OFF
Normal Mode
ON
OFF
Sleep Mode
OFF
Restart Mode
Unchanged
SW Flash Mode
ON
OFF
Stop Mode
ON
OFF
Fail-Safe Mode
OFF
Data Sheet
24
Rev. 1.0, 2009-03-31
TLE8261E
External Voltage Regulator
7.4
Application Information
7.4.1
Timing information
Figure 7 shows the typical timing, ramp up and ramp down of the External Voltage Regulator, in regards to the VS
pin.
Vs
V VextU V
VU V_OFF
t
Vcc3
Vcc 3
SPI
t
GND
Undervoltage Managment vcc 3.vsd
Figure 7
Supply Voltage Management
7.4.2
External Components
During production test, the listed parameter are tested with the PNP transistor MJD253 from ON semi.
Characterization is done with the BCP52-16 from Infineon (ICC3<200 mA). Other PNP transistors can be used.
Function must be checked in the application.
Figure 8 shows the hardware set up used.
VS
RSHUNT
V CC3
T1
ICC3
C1
C2
Vcc3shunt
VS
Vcc3ref
Vcc3base
RBE
V S-V CC3shunt >
Vshunt_threhold
ICC3base
+
-
V REF
State machine
External voltage diagram_appli_note.vsd
Figure 8
Data Sheet
Hardware Set Up
25
Rev. 1.0, 2009-03-31
TLE8261E
External Voltage Regulator
Table 5
Bills of material for the VCC3 function
Device
Vendor
Reference / Value
C2
Murata
10µF/10V GCM31CR71AA106K
RSHUNT
-
220mΩ
T1
ON semi
MJD253
7.4.3
Calculation of RSHUNT
The maximum current ICC3max where the limit starts and the bit ICC3>ICC3max is set is determined by the shunt
resistor RShunt and the Output Current Shunt Voltage Threshold Vshunt_threshold.
The resistor can be calculated as following
U shunt_threshold
R SHUNT = -------------------------------------I CC3max
7.4.4
Unused Pins
In case the Vcc3 is not used in the application, it is recommended to connect the unused pins of Vcc3 as followed.
Connect Vcc1shunt to Vs. (It is also possible to leave the pin open)
Leave Vcc3base open
Leave Vcc3ref open
Do not enable the Vcc3 via SPI as this leads to increased current consumption.
Data Sheet
26
Rev. 1.0, 2009-03-31
TLE8261E
External Voltage Regulator
7.5
Electrical Characteristics
VS = 5.5 V to 28 V; SBC Normal Mode; all outputs open;
Tj = -40 °C to +150 °C; all voltages with respect to ground; positive current defined flowing into pin; unless
otherwise specified.
Pos.
Parameter
Symbol Limit Values
Min.
Typ.
Unit
Test Condition
70
mA
VCC3base = 28V
Max.
Parameters independent from test set-up
7.5.1
External Regulator
Control Drive Current
Capability
Icc3base
20
7.5.2
Input Current Vcc3ref
10
25
50
µA
7.5.3
Input Current Vcc3 Shunt
Pin
Icc3ref
Icc3shunt
10
25
50
µA
Vcc3ref = 5 V
Vcc3shunt = VS
7.5.4
VCC3 Undervoltage
VCC3,UV
4.0
4.25
4.5
V
–
VCC3 Undervoltage
VCC3,UV, 20
100
250
mV
detection hysteresis
hys
110
130
mV
1)
-
5
µs
Vcc3 = 6V to 0V;
ICC3base,50% = 20mA
Detection
7.5.5
7.5.6
Output Current Shunt
Voltage Threshold
Vshunt_thr 88
7.5.7
Current increase
regulation reaction time
trIinc
eshold
-
Figure 9
7.5.8
Current decrease
regulation reaction time
trIdec
-
-
5
µs
Vcc3 = 0V to 6V; ICC3base,50%
= 20mA Figure 9
7.5.9
Leakage current of Vcc3base Icc3base_lk when Vcc3 disabled
7.5.10
Leakage current of Vcc3ref
when Vcc3 disabled
7.5.11
Leakage current of
Vcc3shunt when Vcc3
disabled
Icc3ref_lk
-2
Icc3shunt_l -
-
5
µA
0
2
µA
-
5
µA
k
7.5.12
Base to emitter resistor
RBE
50
100
200
kΩ
7.5.13
External regulator
minimum Vs voltage
VVextUV
4.5
-
5.5
V
7.5.14
External regulator
minimum Vs voltage
hysteresis
VVextUVhy -
0.2
-
V
VCC3base = VS
Tj = 25°C
VCC3ref = 5V
Tj = 25°C
VCC3shunt = VS
Tj = 25°C
VCC3base = VS - 0.3V
VCC3 OFF
s
Parameters dependent on the test set-up, according to the Figure 8
7.5.15
External Regulator Output Vcc3
Voltage
4.8
5
5.2
V
0 mA <ICC3<400 mA;
5.5 V < VS < 28 V;2)
7.5.16
Load Regulation
∆VCC3,Lo -
-
50
mV
2 mA <ICC3<200 mA;
7.5.17
Line Regulation
∆VCC3,Li
-
50
mV
6 V < VS <16 V;
-
1) Threshold at which the current limitation starts to operate.
2) Tolerance includes load regulation and line regulation.
Data Sheet
27
Rev. 1.0, 2009-03-31
TLE8261E
External Voltage Regulator
Timing diagram for regulator reaction time “current increase regulation reaction time” and “current decrease
regulation reaction time”
VCC3
t
ICCbase
ICC3base,50%
trlinc
Figure 9
Data Sheet
trldec
t
Regulator Reaction Time
28
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
8
High Speed CAN Transceiver
8.1
Block Description
VccHSCAN
SPI Mode
Control
VCC1µC
RTD
Driver
CANH
Output
Stage
CANL
Temp.Protection
TxD CAN
+
timeout
To SPI diagnostic
V ccHS CAN
RxD Diag
VCC1µC
RxDCAN
MUX
SPLIT
Receiver
R SPLIT
Vs
GND
Wake
Receiver
V SPLIT
can block .vsd
Figure 10
Functional Block Diagram
8.2
High-speed CAN Description
The Controller Area Network (CAN) transceiver part of the SBC provides high-speed (HS) differential mode data
transmission (up to 1 Mbaud) and reception in automotive and industrial applications. It works as an interface
between the CAN protocol controller and the physical bus lines compatible to ISO/DIS 11898-2 and 11898-5 as
well as SAE J2284.
The CAN transceiver offers low power modes to reduce current consumption. This supports networks with partially
powered down nodes. To support software diagnostic functions, a CAN Receive-only Mode is implemented.
It is designed to provide excellent passive behavior when the transceiver is switched off (mixed networks,
clamp15/30 applications).
A wake-up from the CAN Wake capable Mode is possible via a message on the bus. Thus, the microcontroller can
be powered down or idled and will be woken up by the CAN bus activities.
Refer to Figure 11 for a description of the matching of the transceiver modes with the SBC mode.
The CAN transceiver is designed to withstand the severe conditions of automotive applications and to support
12 V applications.
Data Sheet
29
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
8.2.1
CAN Normal Mode
To transfer the CAN transceiver into the CAN Normal Mode, an SPI word must be sent. This mode is designed for
normal data transmission/reception within the HS CAN network. It can be accessed in Normal Mode of the SBC,
as well as in SBC Software Flash Mode, and SBC Software Development Mode.
Transmission
The signal from the microcontroller is applied to the TxDCAN input of the SBC. The bus driver switches the
CANH/L output stages to transfer this input signal to the CAN bus lines.
Reduced Electromagnetic Emission
To reduce electromagnetic emissions (EME), the bus driver controls CANH/L slopes symmetrically.
Reception
Analog CAN bus signals are converted into digital signals at RxD via the differential input receiver. In CAN Normal
and CAN Receive Only Mode, the split pin is used to stabilize the Recessive Common Mode signal. The RxD pin
is diagnosed and the detected failure is reported to the SPI diagnostic register.
8.2.2
CAN Wake Capable Mode
This mode, which can be used in SBC Stop, Sleep, Restart and Normal Modes by programming via SPI and is
automatically accessed in SBC Fail-Safe Mode, is used to monitor bus activities. A wake up signal on the bus
results in different behavior of the SBC, as described in Table 6. After wake-up the transceiver can be switched
to CAN Normal Mode for communication. To enable the CAN wakeable mode after a wake via CAN, the CAN
transceiver must be switched to CAN Normal Mode, CAN Receive Only Mode or CAN Off, before switching to CAN
Wakeable Mode again.
Table 6
Action Due to a CAN Wake Up
SBC Mode
SBC Mode after wake
Vcc1µC
INT
Sleep Mode
Restart Mode
Ramping up
HIGH
1)
RxD
Int. Bit
WK CAN
LOW
1
Stop Mode
Stop Mode
ON
LOW
LOW
1
Restart Mode
Restart Mode
Ramping up / ON
HIGH
LOW
1
Fail-Safe Mode
Restart Mode
Ramping up
HIGH
LOW
1
LOW
1
Normal Mode
Normal Mode
1)
ON
LOW
1) When not masked via SPI
Wake-Up in SBC Sleep Mode
Wake-up is possible via a CAN message (filtering time t > tWU), it automatically transfers the SBC into the SBC
Restart Mode and from there to Normal Mode the RxD pins in set to LOW, see Figure 11. The microcontroller is
able to detect the low signal on RxD and to read the wake source out of the “Wake Register Interrupt” register
(000) via SPI. No Interrupt is generated when coming out of Sleep Mode.
Data Sheet
30
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
CAN_H
CAN_L
WAKE
PATTERN
BUS
OFF
Communication
starts
BUS
WAIT
t
Vdiff
t
V cc1µC/
tWU
HSCAN
t
RxD
CAN Wake
capable mode
CAN Waked
CAN Normal mode
t
RO
tROx
SBC Sleep mode
SBC Restart
SPI command
SBC Normal mode
t
Application with sleep .vsd
Figure 11
Timing during Transition from Sleep to Normal Mode
Wake-Up in SBC Stop Mode
In SBC Stop Mode, if a wake-up is detected, it is signaled by the INT output and by the “WK CAN” SPI bit. It is
also signaled by RxDCAN put to low. The microcontroller should set the device to SBC Normal Mode, there is no
automatic transition to Normal Mode. In Normal Mode the transceiver can be enabled via SPI.
Wake-Up in SBC Restart or SBC Fail-Safe Mode
In SBC Restart or SBC Fail-Safe Mode, if a wake-up is detected, it is signaled by the “WK CAN” SPI bit.
Wake-Up in SBC Normal Mode
In SBC Normal Mode, if a wake-up is detected, it is signaled by the “WK CAN” SPI bit and INT output, and RxD
remains LOW.
Data Sheet
31
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
8.2.3
CAN OFF Mode
CAN OFF Mode, which can be accessed in the SBC Stop, Sleep, Restart and Normal modes, and automatically
accessed in SBC Init and Factory Flash modes, is used to completely stop CAN activities. In CAN OFF Mode, a
wake up event on the bus will be ignored.
8.2.4
CAN Receive Only Mode
In CAN Receive Only Mode (RxD only), the driver stage is de-activated but reception is still operational. This mode
is accessible by an SPI command.
8.2.5
CAN Cell in Disabled State
During disable state, when Vs < VUV_OFF, the CAN cell does not have enough supply voltage. In this state, the
CANH and CANL pins are set to high impedance, to guarantee passive behavior. The maximum current that can
flow in the CANH and CANL pins in this mode are specified by ICANH,lk and ICANL,lk.
8.3
CAN Cell Mode with SBC Mode
Table 7 shows all the CAN modes accessible to the current SBC Mode. Automatic transition from one CAN mode
to an other is only allowed in the same column.
.
Table 7
HS CAN States, Based on SBC modes
SBC Mode
CAN Mode
INIT Mode
OFF
Normal Mode
OFF
Wake capable
Stop Mode
OFF
Wake capable
Sleep Mode
OFF
Wake capable
Restart Mode
OFF
Wake capable
Fail-Safe Mode
Wake capable
SW Flash Mode
Normal
8.3.1
Normal
Receive only
SBC Normal Transition to Sleep or Stop Mode
During the transition from SBC Normal to Sleep or Stop Modes, the receiver module is deactivated and replaced
by the low power mode receiver for wake-up capability. The next message can be only a wake-up call. It is possible
to set the SBC directly from SBC Normal Mode (with CAN Normal Mode) to SBC Sleep or Stop Mode, but this is
not recommended, because a wake pattern on the CAN network that could occurs during SPI communication
could get lost. It is preferable, in SBC Normal Mode to first send the CAN transceiver into CAN Wake Capable
Mode, and then set the entire device to SBC Sleep or Stop Mode. In the unlikely case that the device would see
a wake up call during the transmission order “SBC go to sleep”, the device will store this event and bypass the
“SBC go to sleep” command to go back into SBC Restart Mode.
Do not change the Transciever setting with the same SPI command that is used to sent the device to Sleep Mode.
8.3.2
Transition from SBC Sleep to other Modes
In SBC Sleep Mode, a wake-up on the CAN cell will set the SBC to Restart Mode automatically if the CAN Wake
Capable Mode of the SBC is selected via SPI. Figure 11 shows the typical timing.
Data Sheet
32
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
8.4
Failure Detection
All failures are reported in the SPI diagnostic encoder, the TxD time-out is reported as TxD shorted to GND. In
case of local failure and Bus Dominat Clamped failure, the transceiver is automatically switched to the CAN
Receive only Mode.
8.4.1
TxD Time-out Feature
If the TxD signal is dominant for a time t > tTxD, the TxD time-out function deactivates the transmission of the signal
at the bus. This is implemented to prevent the bus from being blocked permanently due to an error. The
transmission is released after switching the CAN to Active Mode via SPI. Refer to Figure 12.
TxD Time -out
Interrupt
TxD CAN
SPI setting : CAN
Normal Mode
VC C1µC
GND
Vdiff
t
tTxD_TO
t
Txd timeout .vsd
Figure 12
TxD Time-out diagram
8.4.2
Bus Dominant Clamping
If the HS CAN bus signal in dominant for a time t > tBUS_TO, a bus dominant clamping is detected. The CAN
transceiver is switched to Receive Only Mode. The failure is signaled via SPI. If the bits are not masked the INT
pin is set to low. For operation the transceiver needs to be switched back to Normal Mode via SPI.
8.4.3
TxD to RxD Short Circuit Feature
Similar to the TxD time-out, a TxD to RxD short circuit would also block the bus communication. To avoid this, the
CAN transceiver provides TxD to RxD short circuit detection. In this case, it is recommended to switch OFF the
SBC HS CAN supply (e.g. Vcc2) via SPI command to prevent disturbances on the CAN bus. This failure is reported
into the diagnostic frame of the SPI. The INT pin is set LOW if not disabled via SPI. The transmitter is automatically
inhibited and goes back to normal operation after a SPI command.
8.4.4
Overtemperature
The driver stages are protected against overtemperature. Exceeding the shutdown temperature results in
deactivation of the CAN transceiver. The CAN transceiver is activated gain after cooling down, the device stays in
CAN Active Mode. To avoid a bit failure after cooling down, the signals can be transmitted again only after a
dominant to recessive edge at TxD.
Figure 13 shows how the transmission stage is deactivated and activated again. First, an overtemperature
condition causes the CAN transceiver to be deactivated. After the overtemperature condition is no longer present,
the transmission is released automatically after the TxD bus signal has changed to recessive level.
Data Sheet
33
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
Failure
Overtemp
ON
Overtemperature
OFF
t
TxDCAN
VCC1µC
GND
t
Vdiff
D
Recessive
Dominant
R
t
Figure 13
Release of the Transmission after Overtemperature
8.4.5
Permanent RxD Recessive Clamping
If the RxD signal is permanently recessive (such as shorted to Vcc1µC), although there is a message sent on the
bus, the host microcontroller of this transceiver could start a message at any time because the bus appears to be
idle. To prevent this node from disturbing communication on the bus, the SBC offers permanent RxD recessive
clamping. If the RxD signal is permanently recessive, the failure is diagnosed and the transmitter is deactivated
as long as the error occurs. The transmitter is reactivated after an SPI command.
8.4.6
VccHSCAN Undervoltage
The CAN transceiver cell has no dedicated under voltage detection and use the VCC2 or VCC3 under voltage
circuitry. The µC can switch of the CAN in case of undervoltage.
8.4.7
Bus failures
In case one of the following bus failures is detected by the SBC the interrupt bit CAN BUS is set to “1” and an
interrupt is generated, if not masked. The CAN transceiver does not change the mode due to a detected bus
failure.
Bus Failures
•
•
•
•
•
•
CANH short to GND
CANH short to Vs
CANH short to Vcc
CANL short to GND
CANL short to Vs
CANL short to Vcc
A short of CANH to CANL is detected by the microcontroller as the signal sent on TxD is not received on RxD.
8.5
SPLIT Circuit
SPLIT circuitry is activated during CAN Normal and Receive Only Mode and de-activated (SPLIT pin high ohmic)
during CAN Wake Capable and OFF Modes. The SPLIT pin is used to stabilize the recessive common mode signal
in Normal Mode and RxD Only Mode. This is achieved with a stabilized voltage of 0.5 x VccHSCAN typical at SPLIT.
A correct application of the SPLIT pin is shown in Figure 14. The SPLIT termination for the left and right nodes is
implemented with two 60 Ω resistors and one 10 nF capacitor. The center node in this example is a stub node and
the recommended value for the split resistances is 1.5 kΩ.
Data Sheet
34
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
In the case the application doesn’t request the SPLIT pin feature, the pin has to be left open.
CANH
CANH
TLE 8264
SPLIT
10nF
TLE 6251 DS
60Ohm
60Ohm
CAN
Bus
split
termination
split
termination
60Ohm
SPLIT
10nF
60Ohm
CANL
CANL
10nF
split
termination
at stub
1,5 kOhm
CANH
1,5 kOhm
SPLIT
CANL
TLE 6251 G
NERR
Figure 14
Application example for the SPLIT Pin
.
Data Sheet
35
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
8.6
Electrical Characteristics
4.75 V < VccHSCAN < 5.25 V; VS = 5.5 V to 28 V; RL = 60 Ω; CAN Normal Mode; Tj = -40 °C to +150 °C; all voltages
with respect to ground; positive current flowing into pin; unless otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
–
0.80
0.90
Unit
Test Condition
V
Vdiff = VCANH - VCANL
CAN Bus Receiver
Differential Receiver
Threshold Voltage,
recessive to dominant
edge
Vdiff,rd_N
Differential Receiver
Threshold Voltage,
dominant to recessive
edge
Vdiff,dr_N
8.6.3
Common Mode Range
CMR
8.6.4
Differential Receiver
Hysteresis
8.6.5
8.6.1
8.6.2
CAN Normal Mode
0.50
0.60
–
V
Vdiff = VCANH - VCANL
CAN Normal Mode
–
12
V
–
Vdiff,hys_N –
110
–
mV
CAN Normal Mode
CANH, CANL Input
Resistance
Ri
10
20
30
kΩ
Recessive state
8.6.6
Differential Input
Resistance
Rdiff
20
40
60
kΩ
Recessive state
8.6.7
Wake-up Receiver
Threshold Voltage,
recessive to dominant
edge
Vdiff, rd_W –
0.8
1.15
V
CAN Wake Capable Mode
8.6.8
Wake-up Receiver
Threshold Voltage,
dominant to recessive
edge
Vdiff, dr_W 0.4
0.7
–
V
CAN Wake Capable Mode
8.6.9
Wake-up Receiver
Differential Receiver
Hysteresis
Vdiff,
120
–
mV
CAN Wake Capable Mode
Data Sheet
-12
–
hys_W
36
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
8.6
Electrical Characteristics (cont’d)
4.75 V < VccHSCAN < 5.25 V; VS = 5.5 V to 28 V; RL = 60 Ω; CAN Normal Mode; Tj = -40 °C to +150 °C; all voltages
with respect to ground; positive current flowing into pin; unless otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Unit
Test Condition
Min.
Typ.
Max.
2.0
–
3.0
V
CAN Normal Mode
no load
-500
–
50
mV
CAN Normal Mode
VTxD = Vcc1µC;
no load
CAN Bus Transmitter
VCANL/H
8.6.10
CANH/CANL Recessive
Output Voltage
8.6.11
CANH, CANL Recessive Vdiff_r_N
Output Voltage Difference
Vdiff = VCANH - VCANL
8.6.12
CANL Dominant Output
Voltage
VCANL
0.5
–
2.25
V
CAN Normal Mode
VTxD = 0 V;
VccHSCAN = 5 V
8.6.13
CANH Dominant Output
Voltage
VCANH
2.75
–
4.5
V
CAN Normal Mode
VTxD = 0 V;
VccHSCAN = 5 V
8.6.14
CANH, CANL Dominant
Vdiff_d_N
Output Voltage Difference
Vdiff = VCANH - VCANL
1.5
–
3.0
V
CAN Normal Mode
VTxD = 0 V;
VccHSCAN = 5 V
8.6.15
CANH, CANL Dominant
Vdiff_d_N
Output Voltage Difference
Vdiff = VCANH - VCANL
1.5
–
3.0
V
CAN Normal Mode
VTxD = 0 V;
VccHSCAN = 5 V
RL = 50Ω
8.6.16
CANH Short Circuit
Current
ICANHsc
-200
-80
-50
mA
8.6.17
CANL Short Circuit
Current
ICANLsc
50
80
200
mA
CAN Normal Mode
VCANLshort = 18 V
8.6.18
Leakage Current
ICANH,lk
ICANL,lk
–
2
–
µA
VS = VccHSCAN = 0 V;
0 V < VCANH,L< 5 V
VSPLIT
0.3 ×
0.5 ×
0.7 ×
V
CAN Normal Mode
-500 µA < ISPLIT < 500 µA
ISPLIT
-5
0
5
µA
CAN Wake capable Mode;
-27 V < VSPLIT < 40 V
–
600
–
Ω
–1)
0.8 ×
–
–
V
CAN Normal Mode
IRxD(CAN) = -2 mA;
–
–
0.2 ×
V
CAN Normal Mode
IRxD(CAN) = 2 mA;
0.7 ×
V
CAN Normal Mode
recessive state
–
V
CAN Normal Mode
dominant state
CAN Normal Mode
VCANHshort = 0 V
SPLIT Termination Output; Pin SPLIT
8.6.20
SPLIT Output Voltage
8.6.21
Leakage Current
8.6.22
SPLIT Output Resistance RSPLIT
VccHSCAN VccHSCAN VccHSCAN
Receiver Output RxD
8.6.23
8.6.24
HIGH level Output Voltage VRxD,H
LOW Level Output
Voltage
VRxD,L
VCC1µC
Vcc1µC
Transmission Input TxD
8.6.26
8.6.27
HIGH Level Input Voltage VTD,H
Threshold
LOW Level Input Voltage
Threshold
Data Sheet
VTD,L
–
–
Vcc1µC
0.3 ×
–
Vcc1µC
37
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
8.6
Electrical Characteristics (cont’d)
4.75 V < VccHSCAN < 5.25 V; VS = 5.5 V to 28 V; RL = 60 Ω; CAN Normal Mode; Tj = -40 °C to +150 °C; all voltages
with respect to ground; positive current flowing into pin; unless otherwise specified.
Pos.
8.6.28
8.6.29
Parameter
TxD Input Hysteresis
TxD Pull-up Resistance
Symbol
Limit Values
Unit
Test Condition
Min.
Typ.
Max.
VTD,hys
–
0.12 ×
–
mV
1)
RTD
20
40
80
kΩ
–
Vcc1µC
Dynamic CAN-Transceiver Characteristics
8.6.30
Min. Dominant Time for
Bus Wake-up
tWU
0.75
3
5
µs
CAN Wake capable Mode
8.6.31
Propagation Delay
TxD-to-RxD LOW
(recessive to dominant)
td(L),TR
–
150
255
ns
CAN Normal Mode
CL = 47 pF;
RL = 60 Ω;
VccHSCAN = 5 V;
CRxD = 15 pF
8.6.32
Propagation Delay
TxD-to-RxD HIGH
(dominant to recessive)
td(H),TR
–
150
255
ns
CAN Normal Mode
CL = 47 pF;
RL = 60 Ω;
VccHSCAN = 5 V;
CRxD = 15 pF
8.6.33
Propagation Delay
td(L),T
TxD LOW to bus dominant
–
50
120
ns
CAN Normal Mode
CL = 47 pF;
RL = 60 Ω;
VccHSCAN = 5 V
8.6.34
Propagation Delay
TxD HIGH to bus
recessive
td(H),T
–
50
120
ns
CAN Normal Mode
CL = 47 pF;
RL = 60 Ω;
VccHSCAN = 5 V
8.6.35
Propagation Delay
td(L),R
bus dominant to RxD LOW
–
100
135
ns
CAN Normal Mode
CL = 47 pF;
RL = 60 Ω;
VccHSCAN = 5 V;
CRxD = 15 pF
8.6.36
Propagation Delay
bus recessive to RxD
HIGH
td(H),R
–
100
135
ns
CAN Normal Mode
CL = 47 pF;
RL = 60 Ω;
VccHSCAN = 5 V;
CRxD = 15 pF
8.6.37
TxD Permanent Dominant tTxD_TO
Time-out
0.3
0.6
1.0
ms
CAN Normal Mode
8.6.38
Bus Dominant Time-out
tBUS_TO
0.3
0.6
1.0
ms
CAN Normal Mode1)
1) Not subject to production test; specified by design.
Data Sheet
38
Rev. 1.0, 2009-03-31
TLE8261E
High Speed CAN Transceiver
V TxD
Vcc1µC
GND
V DIFF
t d(L),T
V diff, rd_N
V diff, dr_N
t d(L),R
V RxD
t
t d(H),T
t
t d(H),R
t d(L),TR
td(H),TR
V cc1µC
0.8 x V cc1µC
GND
0.2 x V cc1µC
t
CA N dy namic c harac teris tics .v sd
Figure 15
Data Sheet
Timing Diagrams for Dynamic Characteristics
39
Rev. 1.0, 2009-03-31
TLE8261E
WK Pin
9
WK Pin
9.1
Block Description
Internal supply
I PU_MON
IWK
State
machine
I PD_MON
Wake.vsd
Figure 16
Functional Block Diagram
The internal voltage regulator (Vcc1µC) and the entire SBC can wake up by changing the wake input voltage. The
WK input pin is a bi-level sensitive input. This means that both transitions, HIGH to LOW and LOW to HIGH, result
in a wake-up. The filtering time is tWK, f.The wake-up capability can be enabled or disabled via SPI command. In
case of reverse polarity, no special protection must be set if the absolute maximum rating is respected. When the
SBC is below the minimum VUVOFF, (SBC OFF Mode) the pin WK is at high impedance; a wake event will be
ignored.
The state of the WK pin (low or high) can always be read in Normal Mode, Stop Mode and SW Flash Mode at the
bit WK State. When setting the bit “WK PIN on/off” to 1, the device wakes up from Sleep Mode with a high to low
or low to high transition. From Fail-Safe Mode the device will always go to Restart Mode with a high to low or low
to high transition. If the bit “WK PIN on/off” is set to 1 in Normal, Stop or SBC SW Flash Mode the interrupt bits
“WK 0 WK pin” and/or “WK 1 WK pin” are set in case of a change on the WK pin and an interrupt is generated if
not masked. With the bits “WK 0 WK pin” and “WK 1 WK pin” the interrupt for low to high transition and high to low
transition can be masked separately.
9.2
Wake-Up Timing
Figure 17 shows typical wake-up timing and parasitic filtering. The filtering time is tWK, f.. This is used to avoid a
parasitic wake-up due to EMC disturbances. Specifically, the voltage transition on pin WK must be higher than the
VWK,TH and longer than tWK,f to be understood as a wake-up signal.
Data Sheet
40
Rev. 1.0, 2009-03-31
TLE8261E
WK Pin
VWK
V WK,th
V WK,th
t
t WK,f
t WK,f
No Wake Event
Wake Event
Wake Pin Diagram .vsd
Figure 17
Wake-up Timing
9.2.1
Transition from Normal to Sleep Mode.
The SBC can not be sent from Normal Mode to Sleep Mode with uncleared interrupt in the WK interrupt bits “WK
0 WK pin” and “WK 1 WK pin”. This is implemented to avoid that a wake information from the WK pin gets lost
during the transition from Normal to Sleep Mode. If a wake up appears during the µC sets the SBC to Sleep Mode,
the SBC will wake up directly after going to Sleep Mode. There is no difference if the bits “WK 0 WK pin” or “WK
1 WK pin” bit were set during the transition or were just not cleared before sending the SPI command for Sleep
Mode, the SBC will wake-up after entering the Sleep Mode. Therefore it always needs to be ensured that the bits
are cleared before sending the SBC to Sleep Mode.
Data Sheet
41
Rev. 1.0, 2009-03-31
TLE8261E
WK Pin
9.3
Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; all voltages with respect to ground; positive current defined flowing into
pin; unless otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit
Test Condition
–
9.3.1
WK Input Threshold
Voltage
VWK,th
2
3
4
V
9.3.2
Input Hysteresis
0.1
–
0.7
V
9.3.3
WK Filter Time
10
–
25
µs
–
9.3.4
Input Current
VI, hys.
tWK, f
IWK
-2
–
2
µA
9.3.5
WK pin pull up current
–
-3
µA
9.3.6
WK pin pull down current
–
30
µA
VWK = 0 V;
VWK > 5V
VWK = 3.8 V
VWK = 2 V
Data Sheet
I PU_MON -30
I PD_MON 3
42
Rev. 1.0, 2009-03-31
TLE8261E
Supervision Functions
10
Supervision Functions
10.1
Reset Function
10.1.1
Description
The reset output pin RO provides information to the microcontroller, for example, in the event that the output
voltage has fallen below the undervoltage threshold VRT1/2/3. When connecting the SBC to battery voltage, the
reset signal remains LOW initially. When the output voltage Vcc1µC has reached the reset threshold VRT1,r, the reset
output RO remains LOW for the reset delay time trd1. After that the RO is released to HIGH. A reset can also occur
due to faulty Watchdog refresh.See Chapter 10.2. The reset threshold as well as the reset delay time can be
adjusted via SPI. The RO pin has an integrated pull-up resistor.
10.1.2
Reset diagnosis
The RO pin is diagnosed for both short circuit to Vccx and GND. Depending on the configuration, in case of RO
failure, the SBC goes to SBC Fail-Safe or Restart Mode and activate the Limp Home output.
In case of short circuit to GND, it is detected in any SBC mode except SBC Restart Mode. At the falling edge of
the RO, when supposed to be HIGH, the SBC enters automatically the SBC Restart Mode. If after the trd and RO
relaxation, the RO pin is still LOW, then the SBC detects the clamping to LOW failure. The microcontroller is in
permanent reset.
In case of short circuit to Vccx, the SBC cannot detect the short circuit before a reset should occur. So reset
clamped is detected when the SBC goes to SBC Restart Mode or during Init Mode.
10.1.3
VCC
Reset Timing
VRTx
t < t RR
undervoltage
tRD1
tCW
tLW
tCW
SPI
SPI
Init
WD
Trigger
tOW
tOW
tRDx
WD
Trigger
tCW
tLW
SPI
Init
t
tRR
RO
t
t
SBC Init
SBC Normal
SBC Restart
SBC Normal
Res_per_8264.vsd
Figure 18
Data Sheet
Reset Timing Diagram
43
Rev. 1.0, 2009-03-31
TLE8261E
Supervision Functions
10.1.4
Reset from Outside
If the reset pin RO is pulled to low from outside while no reset low is issued by the SBC, the device goes to Restart
Mode. In Restart Mode an reset is issued by the SBC, the RO pin is set to low for the time tRD1 or tRD2. If the RO
pin is pulled to low for longer time Reset clamped is detected.
10.2
Watchdog
Two different Watchdogs are possible in the SBC. It can be either a Window Watchdog or a Time-out Watchdog.
The Watchdog can also be inhibited in SBC Stop Mode and SBC SW Flash Mode via SPI. The Watchdog timing
is programmed via SPI command. As soon as the Watchdog is activated, the timer starts running and the
Watchdog must be served. Please refer to Table 8 to match the SBC Modes with the Watchdog Modes.
The default setting for the Watchdog is Time-out Watchdog with a 256 ms timer. The long open window allows the
microcontroller to run its initialization sequences and then to trigger the Watchdog via the SPI.
The Watchdog is served by a SPI bit and should toggle with the correct frequency. The default value is a 0, so the
first trigger bit must be a 1.
In case of a Watchdog reset, the Watchdog immediately starts with a long open window when entering SBC
Normal Mode. With the reset the watchdog bit is set to 0, so the first watchdog trigger after reset is a change to 1.
In SBC Software Development Mode, no reset is generated due to watchdog failure, if a watchdog failure occurs
it is indicated by the SPI Reset bit and via INT pin. All watchdog modes are accessible in regards to the normal
operation modes.
Table 8
Watchdog Functionality by SBC Modes
SBC Mode
Watchdog Mode
Remarks
INIT Mode
Watchdog Programmable;
Watchdog is not active.
INIT Mode should be left in less than 256 ms (see
Chapter 12)
Normal Mode
WD Programmable;
–
Time-out or Window Watchdog
Software Flash Mode
Mode is fixed
SBC retains the set-up as in the mode before entering
the Software Flash Mode
Stop Mode
Mode is fixed
SBC retains the set up as in the mode before entering
the Stop Mode
Sleep Mode
OFF
SBC does not retain the set-up.
Fail-Safe Mode
OFF
SBC does not retain the set-up
Restart Mode
OFF
SBC will start default Watchdog setting (256ms
Time-out Watchdog) when entering Normal Mode.
Data Sheet
44
Rev. 1.0, 2009-03-31
TLE8261E
Supervision Functions
10.2.1
Time-out Watchdog
The Time-out Watchdog is an easier and less secure type of watchdog. Compared to the Window Watchdog there
is no closed window existing. The watchdog trigger can be done any time within the watchdog time.
A watchdog trigger is detected as a write access to the “WD Refresh” within the SPI control word. The bit needs
to be toggle (transition HIGH to LOW or LOW to HIGH) within the watchdog window. The trigger is accepted when
the CSN input becomes HIGH.
A correct watchdog trigger starts a new window. The period is selected via the Window Watchdog timing bit field
in the range of 16 ms to 1024 ms. For the safe trigger area the tolerance of the oscillator has to be taken into
consideration, so the safe trigger time is below 90% of the programmed Watchdog time. It is possible to refresh
the Watchdog with any SPI programming with the mode selection Normal, Stop, SW Flash or Read Only.
Should the trigger signal not meet the window, depending on the configuration, the SBC will go to SBC Restart
Mode or to Fail-Safe Mode. A watchdog reset is created by setting the reset output RO low. In config 1 and config
3 the watchdog starts again in Normal Mode with the default watchdog setting (256ms Time-out Watchdog). The
watchdog failure can be read at the bits RM0, RM1, LH0, LH1, LH2 via SPI.
10.2.2
Window Watchdog
A Watchdog trigger is detected as a write access to the “WD Refresh” within the SPI control word. The bit needs
to be toggle (transition HIGH to LOW or LOW to HIGH) in the open window. The trigger is accepted when the CSN
input becomes HIGH.
A correct Watchdog trigger results in starting the Window Watchdog by a closed window with a width of typically
50% of the selected Window Watchdog reset period. This period, selected via the Window Watchdog timing bit
field, is in the range of 16 ms to 1024 ms. This closed window is followed by an open window, with a width of typical
50% of the selected period. From now on, the microcontroller must serve the Watchdog by periodically toggling
the Watchdog bit. This bit toggling access must meet the open window. The tolerance of the oscillator has to be
taken into consideration, so the safe window to trigger the Watchdog is from 55% to 90% of the programmed
Window Watchdog time. It is possible to refresh the Watchdog with any SPI programming with the mode selection
Normal, Stop, SW Flash or Read Only. A correct Watchdog service immediately results in starting the next closed
window (see Figure 19, safe trigger area).
Should the trigger signal not meet the open window, depending on the configuration the SBC will go to SBC
Restart Mode or to Fail-Safe Mode. A watchdog reset is created by setting the reset output RO low (see
Figure 20). In config 1 and config 3 the watchdog starts again in Normal Mode with the default watchdog setting
(256ms Time-out Watchdog). The watchdog failure can be read at the bits RM0, RM1, LH0, LH1, LH2 via SPI.
Data Sheet
45
Rev. 1.0, 2009-03-31
TLE8261E
Supervision Functions
Window Watchdog Timing (SPI)
tWD
tCWmax
tOWmax
tCWmin
tOWmin
Uncertainty
closed window
open window
uncertainty
t / [t WDPER]
0.45
safe trigger area
0.55
0.9
1.0
1.1
Wd1_per .vsd
Figure 19
Window Watchdog Definitions
tCW
tCW
WD
Refresh
bit
tCW
tOW
tOW
t CW+tOW
tOW
tLW
tLW
tLW
tCW
tCW
tOW
tWDR
RO
t
Watchdog
timer reset
t
normal
operation
Time-out
(too long)
normal
operation
timeout
(too short)
normal
operation
Wd2_per.vsd
Figure 20
Window Watchdog Timing Diagram for config 1 and config 3
10.2.3
Changing the Watchdog Settings
The settings of the watchdog can be changed during the operation of the watchdog. The change is done with a
SPI programming into the Watchdog Configuration Register. The new setting is programmed together with a valid
watchdog trigger according to the old settings. The timer with the new settings starts with this SPI command. The
toggling of the “WD Refresh” bit needs to be continued (transition HIGH to LOW or LOW to HIGH) with the new
settings.
If the new settings were not valid, the watchdog will continue with the old settings and generate a “Wrong WD Set”
interrupt.
Data Sheet
46
Rev. 1.0, 2009-03-31
TLE8261E
Supervision Functions
10.2.4
Inhibition of the watchdog
During SBC Stop Mode and SBC SW Flash Mode, it is possible to deactivate the watchdog. To avoid unwished
deactivation of the watchdog, a special protocol has to be followed, prior deactivating the watchdog. Please refer
to Figure 21. In the case the exact process below is not respected, the SBC remains in the previous state, and an
interrupt is generated (if not inhibited), and the Wrong WD set bit in the SPI is set.
When the microcontroller requests the SBC to go back to SBC Normal Mode, the Watchdog is reactivated. The
watchdog settings that were valid before entering Stop Mode with watchdog off are valid. The watchdog timer
starts with entering Normal Mode. In case window watchdog was selected the watchdog starts with a closed
window. When setting the WD Refresh bit to 0 for the command that sends the device to Normal Mode the first
watchdog trigger is a change to 1. As in Stop Mode the watchdog settings can not be changed, it is also not
possible to change the watchdog settings with the command that sets the SBC from Stop Mode into Normal Mode.
First battery connection
(POR)
AND
config0 not active
SBC Init mode
(256ms max after reset relaxation)
WD conf
WD not active
SPI cmd
SBC Normal mode
Cyclic WK
ON / OFF
SPI cmd =
SBC SW Flash mode
&,WD OFF
WD trig
WD conf
WD active
SPI cmd =
SBC Normal mode
& WD OFF
& WD Trigger
SBC Normal mode
WD active
SPI cmd =
SBC SW Flash mode
&,WD OFF
& WD Trigger
SPI cmd =
SBC Stop mode
& WD OFF
& WD Trigger
SBC Stop mode
SBC SW Flash mode
Cyclic WK
ON / OFF
WD OFF
WD OFF
inhibition of the WD .vsd
Figure 21
Inhibition of the watchdog
During SBC Stop Mode, when the cyclic wake feature is used and the watchdog is not disabled, it is necessary
that the microcontroller acknowledges the interrupt by reading the SPI Wake register before the next Cyclic Wake
occures. Otherwise, a reset is performed by setting the SBC to SBC Restart Mode.
Data Sheet
47
Rev. 1.0, 2009-03-31
TLE8261E
Supervision Functions
10.3
Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Pos.
Parameter
Symbol Limit Values
Unit
Test Condition
Min.
Typ.
Max.
Reset Threshold Voltage, VRT1,f
4.5
4.65
4.75
V
default setting, Vcc falling
VRT1,r
VRT2,f
VRT2,r
VRT3,f
4.6
4.75
4.85
V
default setting, Vcc rising
3.5
3.65
3,75
V
SPI option;Vcc falling
3.6
3.75
3,85
V
SPI option; Vcc rising
3.2
3.35
3.45
V
SPI option;VS ≥ 4 V; Vcc
falling
VRT3,r
3.3
3.45
3.55
V
SPI option; VS ≥ 4 V, Vcc
rising
VRT1_HR
VRT2_HR
VRT3_HR
VRT,hys
250
–
–
mV
default setting1)
1.25
–
–
V
SPI option;1)
1.55
–
–
V
SPI option; VS ≥ 4 V 1)
20
100
200
mV
-
–
0.2
0.4
V
0.7 x
–
VCC1µC
V
IRO = 1 mA for
VCC1µC = VRT1/2/3;
IRO = 200 µA for
VRT1/2/3> VCC1µC ≥ 1 V
IRO = -20µA
Reset Generator; Pin RO
10.3.1
Reset Threshold Voltage
Headroom
10.3.2
Reset Threshold
Hysteresis
10.3.3
Reset Low Output Voltage VRO
10.3.4
Reset High Output
Voltage
VRO
10.3.5
Reset Pull-up Resistor
10.3.6
Reset Reaction Time
RRO
tRR
VCC1µC
+ 0.3 V
10
20
40
kΩ
4
10
26
µs
VRO = 0 V
VCC1µC < VRT1/2
to RO = L
10.3.7
Reset Delay Time
tRD1
4.5
5.0
5.5
ms
default SPI setting;
after Power-On-Reset
tRD2
450
500
550
µs
SPI setting option
tLW
–
256
–
ms
2)
fCLKSBC
-10
0
10
%
–
Watchdog Generator
10.3.8
Long Open Window
default setting
Internal Oscillator
10.3.9
Internal Oscillator
tolerance
1) Headroom between actual output voltage on VCC1µC and Reset Threshold Voltage for falling Vcc.
2) Specified by design; not subject to production test. Tolerance defined by internal oscillator tolerance fCLKSBC.
Data Sheet
48
Rev. 1.0, 2009-03-31
TLE8261E
Interrupt Function
11
Interrupt Function
11.1
Interrupt Description
The interrupt pin has a general purpose function to point out to the microcontroller either a wake up, a failure
condition or the switch on of a voltage regulator. Table 9 shows the possible interrupt sources in the device, and
Figure 22 gives the hardware set-up. The interrupt function is designed to inform the microcontroller of any wakeup event, overtemperature or overtemperature pre-warning as well as other failures. These events turn the INT
pin to active LOW. All interrupt sources can be masked via a SPI bit, then no interrupt is generated for this event.
For failures on under-voltage the interrupt is dual-sensitive. This means that an interrupt is generated when the
failure appears, as well as when the failure disappears. For failures on over-temperature, communication failures
and voltage regulator over current and undervoltage, the dedicated SPI interrupt bit indicated first the interrupt
source and then the state of the device. So, the bit is set to failure 1 at the event, and remains latched at least until
the microcontroller reads the bit. For the SBC failure (Wrong WD Setting, Reset, Fail SPI) and wake events, the
INT indicates only an event and the bit is cleared with a dedicated SPI read.
The INT pin is released when an SPI read is done to Interrupt Register 000 with a “Read Only” command, or after
interrupt time out tINTTO. If the interrupt cause was a wake event, the interrupt bit can be read in Interrupt Register
000 and the bit is cleared. If it was an other interrupt source the bit INT is set, and interrupt register 001 and 010
need to be read. With a “Read Only“command the event triggered interrupt bits are cleared. The INT bit will be set
to “0” when all bits in interrupt register 001 and 010 are set to “0”. If an interrupt is masked (bit set to “0”) only the
interrupt does not occur, the interrupt bit in the SPI is shown.
Figure 22 shows a simplified diagram of the INT output. In Init Mode before RO goes high the INT pin is used to
set the configuration of the device to config 1/3 or config 2/4, see Chapter 13.
V cc 1µC
RINT
INT
Time
out
Interrupt logic
INTERRUPT BLOCK.VSD
Figure 22
Interrupt Block Diagram
Table 9
Interrupt sources
Interrupt sources
INT Activation
SPI bit
State
Over temperature pre-warning VCC1µC
Rising
OTP VCC1µC
Over temperature VCC2
Rising
OT VCC2
Over temperature HS CAN
Rising
OT HSCAN
Rising
CAN Failure 1..0
Event/
CAN Bus
State
Temperature
Event /
State
Communication failure
CAN Failure
Voltage regulator
Data Sheet
49
Rev. 1.0, 2009-03-31
TLE8261E
Interrupt Function
Table 9
Interrupt sources
Interrupt sources
INT Activation
SPI bit
1)
Rising and falling
1)
Undervoltage at VCC3(except during switch off )
Rising and falling
Over current at VCC3 (except during inhibition)
Rising
Undervoltage at VCC2 (except during switch off )
State
1)
Rising
1)
Rising
UV_VCC2
UV_VCC3
ICC3 > ICC3MAX
UV_VCC2
UV_VCC3
SPI data corrupted
Rising
SPI Fail
Reset (SBC SW Development only)
Rising
Reset
Wrong watchdog setting
Rising
Wrong WD set
Wake at CAN
Rising
WK CAN
Wake at WK
Rising
WK WK pin 1..0
Cyclic WK
Rising
Cyclic WK
Voltage at VCC2 (during switch on )
Voltage at VCC3 (during switch on )
Event /
State
Event
SBC Failure
Event
Wake
Event
1) When VCC2/3 is switched off no interrupt is generated due to the undervoltage at VCC2/3. When switching on VCC2/3 an
interrupt is generated when the command is sent to the SBC via SPI.
11.1.1
Interrupt for switching on Vcc2 and Vcc3
The Interrupt for Vcc2 and Vcc3 are generated when the SPI command for switching on the voltage regulator is
executed. The interrupt bit is set to “1“ and can be cleared with a Read Only command after the under voltage
threshold is reached. If the Read Only is done before the reset threshold is reached, the interrupt bit can not be
cleared as the undervoltage condition is still present. In this case a second interrupt can be issued for releasing
the undervoltage condition.
In case of a short to GND on Vcc2 or Vcc3 the interrupt for switching on the voltage regulator is issued, but the
µC can not clear the interrupt bit as the voltage regulator does not reach the undervoltage threshold.
11.1.2
Example of Interrupt Events and Read-out
The examples show single interrupt events. SPI read is done with “Read Only”. The shown interrupts are not
masked. Watchdog trigger is not shown in the examples.
The interrupt UV_Vcc2 that is generated by switching on VCC2 is shown in Figure 23. The interrupt is sensitive on
rising event only.
Data Sheet
50
Rev. 1.0, 2009-03-31
TLE8261E
Interrupt Function
Vcc2 switched off
by SPI
Rising event (Vcc2 above limit) is shown
Vcc2 switched on
by SPI
Vcc2
INT pin
SPI DI programming
Read Only
Mode Select Bits 111
required
optional
optional
Conf. Select 000
Conf. Select 001
Conf. Select 002
INT bit
0
X
1
X
X
X
0
UV_VCC2
X
0
X
1
X
0
X
Interrupt_ SwitchOn_ VCC2 .vsd
Figure 23
Data Sheet
Interrupt Vcc2 switch-on.
51
Rev. 1.0, 2009-03-31
TLE8261E
Interrupt Function
The interrupt UV_Vcc2 that is generated by an under-voltage on VCC2 is shown in Figure 24. The interrupt is
sensitive on rising and falling event and the interrupt bit also shows the state of the device and function.
Undervoltage
on Vcc2
Falling event (Vcc2 below limit), rising event (Vcc2
above Limit) as well as state is shown
Vcc2
INT pin
SPI DI programming
Read Only
Mode Select Bits 111
required
required
optional
optional
Conf. Select 000
Conf. Select 001
Conf. Select 002
INT bit
1
X
X
X
1
1
X
X
X
0
UV_VCC2
X
1
X
1
X
X
1
X
0
X
Interrupt_UV_VCC2.vsd
Figure 24
Interrupt VCC2 under-voltage.
The interrupt OT_Vcc2 that is generated by an over temperature on VCC2 is shown in Figure 25. The interrupt is
sensitive on rising event and the interrupt bit also shows the state of the device and function.
Overtemperature
on Vcc2
Rising event (apperance of overtemperature) is
shown, as well as the state.
OT_VCC2
INT pin
SPI DI programming
Read Only
Mode Select Bits 111
required
optional
Conf. Select 000
Conf. Select 001
Conf. Select 002
INT bit
1
X
X
X
1
X
0
OT_VCC2
X
1
X
1
X
0
X
Interrupt_OT_VCC2.vsd
Figure 25
Data Sheet
Interrupt Vcc2 Over Temperature.
52
Rev. 1.0, 2009-03-31
TLE8261E
Interrupt Function
11.2
Interrupt Timing
Figure 26 illustrates the interrupt timing. The INT output is set LOW as soon as an interrupt condition occurs. The
INT pin is released after a SPI interrupt buffer read out command, that is performed with a Read Only command
(111) to register (000). In case consecutive interrupt sources are indicated before the SPI read out, only one INT
LOW will be raised but the SPI read out will indicate the interrupt sources. A time-out feature is implemented. The
INT pin can be active LOW only for the time tINTTO. Afterwards, the INT pin is released but the INT source is still
valid or present in the SPI register. Between two activations of the INT, there is at least a delay of tINTTO. If an
interrupt occurs in the meantime, the information is stored and the INT will go LOW after tINTO. The INT pulse width
is at minimum tINT.
interrupt source 1
active
t
inactive
interrupt source 2
active
inactive
t
INT output
tINT
tINT TO
tINTTO
tINTTO
t
tINTTO
SPI read out
interupt timing.vsd
SPI read out
SPI read out
Figure 26
Interrupt Timing
11.3
Interrupt Modes with SBC Modes
SPI read out
The interrupt function is possible only in SBC Normal and Stop Mode.
After an SBC Restart Mode, all interrupt sources are enabled.
11.4
Interrupt Application Information
By default, all interrupt sources are activated. Please refer to the dedicated chapter for the definition of the
interrupt.
The INT output is active for at least tINT, even if the corresponding interrupt register is read out immediately after
the interrupt event occurs.
If no SPI read is done after the interrupt is generated (INT pin low) the INT output becomes active (INT pin high)
again after tINTTO.
If two interrupt cases occur after each other and the SPI read (with read-only) is done after the second interrupt
case, both interrupt bits are cleared. Although the interrupt bits for both interrupt cases are cleared the second
interrupt will be issued by INT pin Low. This can lead to an interrupt where all interrupt bits are read as “0”.
Data Sheet
53
Rev. 1.0, 2009-03-31
TLE8261E
Interrupt Function
11.5
Electrical Characteristics
.
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin unless otherwise specified.
Pos.
Parameter
Symbol Limit Values
Unit
Test Condition
Min.
Typ.
Max.
5.4
6
6.6
ms
−
10
–
–
µs
1)
–
0.2
0.4
V
0.7 x
–
VCC1µC
V
IINT = 1 mA
IINT = -20µA
Interrupt output; Pin INT
11.5.1
Interrupt delay Time-out
11.5.2
INT pulse width
11.5.3
INT Low Output Voltage
11.5.4
INT High Output Voltage
11.5.5
tINTTO
tINT
VINTOL
VINTOH
VCC1µC
+ 0.3 V
RINT
10
20
40
kΩ
VINT = 0 V
INT Config LOW input
voltage
VCFGLO
0.3 x
–
–
V
–
INT Config HIGH input
voltage
VCFGHI
–
–
0.7 x
V
–
INT Config pull down
RCFG
–
kΩ
–
INT Pull-up Resistor
Configuration select; Pin INT
11.5.6
11.5.7
11.5.8
Vcc1µC
Vcc1µC
250
–
1) Not subject to production test, specified by design.
Data Sheet
54
Rev. 1.0, 2009-03-31
TLE8261E
Limp Home
12
Limp Home
12.1
Description
12.2
Limp Home output
The Limp Home output is an active LOW open drain transistor, please refer to Figure 27; therefore, it is necessary
to connect at least an external pull-up resistor at.
The Limp Home output is activated due to a failure condition or via SPI, see Chapter 12.3. If Vs is below VLHUV,
the Limp Home cannot be activated and remains as a high impedance.
Limp home
Limp home logic
LIMP HOME.VSD
Figure 27
Limp Home block diagram
12.2.1
Test Pin
The Test pin is used to set the SBC chip into SBC Software Development Mode. When the Test pin is connected
to GND, the SBC starts in SBC Software Development Mode. When the pin is left open, or connected to Vs the
SBC starts into normal operation. Please refer to Figure 3. The Test pin has an integrated pull-up resistor
(switched ON only during SBC Init Mode) to prevent the SBC device from starting in SBC Software Development
Mode during normal life of the vehicle, as for example when the battery has been disconnected. To avoid
disturbance, the Test pin is monitored during the Init Mode (from the time VS > VUVON until Init Mode is left). If the
pin is low for the Init Mode time, Software Development Mode is reached. The mode is stored during the complete
time where VS is above VUVOFF. It means to leave Software Development Mode, the SBC must go back to SBC
OFF mode.
Data Sheet
55
Rev. 1.0, 2009-03-31
TLE8261E
Limp Home
12.3
Activation of the Limp Home Output
The reason to activate the Limp Home pins and the consequences are listed in Table 10 and Table 11.
Table 10
Limp Home, Function of the SBC Mode
SBC Mode
Limp Home Outputs
INIT Mode
OFF
Normal Mode
OFF
ON via SPI
Stop Mode
Unchanged
Sleep Mode
Unchanged
Restart Mode
Unchanged
Fail-Safe Mode
ON
SW Flash Mode
Unchanged
Table 11
ON if it was ON until the successful Watchdog
setting and deactivation via SPI.
Automatic Activation of Limp Home Output
SBC Mode
Reason
INIT Mode
INIT time-out (tINITTO)
Normal Mode
1st Watchdog failure (config 1/2)
2nd Watchdog failure (config 3/4)
Restart Mode
Reset output permanent short circuit to Vcc1µC
Reset output permanent short circuit to GND
Vcc1µC undervoltage time-out
Any mode
If previously turned ON in SBC Normal Mode, via SPI command
Vcc1µC thermal shutdown
12.4
Release of the Limp Home Output
When Limp Home is activated via SPI command, then it is released via SPI command. This is useful for diagnosis
purpose for example.
Otherwise, the Limp Home outputs are released only in SBC Normal Mode with the following conditions: After the
device has been set to SBC Restart Mode, automatically entering SBC Normal Mode, a successful Watchdog
trigger must be sent via SPI. At this point, the Limp Home outputs remain active. Then the microcontroller needs
to send by SPI command the deactivation of the Limp Home.
12.5
Vcc1µC undervoltage time-out
A Vcc1µC undervoltage time-out condition is given, when
1) the Vcc1µC output voltage is below the reset threshold (VRT1, VRT2, VRT3),
2) VS is higher then the threshold (VSthUV1, VSthUV2, VSthUV3) and
3) the condition is valid longer then the Vcc1µC under voltage time-out (tVcc1UVTO).
A Vcc1µC undervoltage time-out will sent the device into Fail-Safe Mode. Limp Home output stag will be activated
(for Vs > VLHUV)
Figure 28 gives an example of the Limp Home output activation, due to a Vcc1µC undervoltage time-out.
Data Sheet
56
Rev. 1.0, 2009-03-31
TLE8261E
Limp Home
Vs
VSthUVx
t
Vcc1µC
VRTx
VRTx
GND
t
RO
tVcc1UVTO
SBC Sleep
Limp home
SBC Restart
Wake Up
tRDx
SBC Normal
SBC Restart
SBC Fail safe
t
tRR
GND
t
undervoltage time out.vsd
Figure 28
Data Sheet
Vcc1µC undervoltage time-out timing
57
Rev. 1.0, 2009-03-31
TLE8261E
Limp Home
12.6
Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin unless otherwise specified.
Pos.
Parameter
Symbol Limit Values
Min.
Typ.
Max.
–
1
–
Unit
Test Condition
–
With SPI set.
Limp Home;
Watchdog edge count
difference to set Limp
Home activated
nLH
12.6.2
Limp Home low output
voltage (active)
VLHLO
–
0.2
0.4
V
ILH = 1mA
12.6.3
Limp Home high output
current (inactive)
ILHHI
0
–
2
µA
VLH = 28V
12.6.4
INIT Time-out
256
–
ms
1)
12.6.5
Vcc1µC under voltage
Time-out
tINITTO
–
tVcc1UVTO 900
1024
1150
ms
12.6.6
Vs threshold for Vcc1µC
VSthUV1
5.3
–
6.3
V
VRT1 default setting
under voltage Time-out
(Vs needs to be above, to V
SthUV2
activate Vcc1µC under
VSthUV3
voltage Time-out)
4.3
–
5.3
V
4.0
–
5.0
V
VRT2 SPI option
VRT3 SPI option
4.5
–
5.5
V
–
0.2
–
V
–
–
–
3
V
–
VTest,hys
VTest,LO
100
300
700
mV
–
1
–
–
V
–
RTest
20
40
80
kΩ
VLH_PL/Test = 0V
12.6.1
2
12.6.7
Threshold for Limp Home VLHUV
minimum Vs
12.6.8
Limp Home Vs voltage
hysteresis
VLHUVhys –
Default Setting
Test
12.6.11
HIGH Level Input Voltage VTest,HI
Threshold
12.6.12
Input Hysteresis
12.6.13
LOW Level Input Voltage
Threshold
12.6.14
Pull-up Resistor
SBC Init Mode
1) Not subject to production test, specified by design.
Data Sheet
58
Rev. 1.0, 2009-03-31
TLE8261E
Configuration Select
13
Configuration Select
13.1
Configuration select
The Configuration select is used to set the device for two different SBC behaviors; please refer to Chapter 4.2.1
for detailed information. Depending on the requirements of the application, the Vcc1µC is switched off and the device
goes to Fail-Safe Mode in case of watchdog fail (1 or 2 fail) or reset clamped. To turn Vcc1µC OFF (Config 2/4), the
INT pin is not connected to a pull up resistor externally. In case the Vcc1µC is not switched off (Config 1/3) the INT
pin is connected to Vcc1µC with a pull up resistor. The configuration is only read during Init Mode, after that the
configuration is stored.
13.2
Config Hardware Descriptions
In Init Mode before the RO pin goes high the INT pin is pulled to low with a weak pull down resistor RCFG, the pull
up resistor RINT is switched off. When Vcc1µC is high, above the reset threshold VRT1 and before the RO pin goes
high the level on the INT pin is monitored to select the configuration. With RO going high in Init Mode the pull up
resistor RINT is switched on.
Figure 29 gives the electrical equivalents to the configuration function of the INT pin.
Vc c 1µC
Configuration logic
R INT
Interrupt logic
INT
Time
out
R CFG
INTERRUPT BLOCK_CONFIG.VSD
Figure 29
Config Logic Diagram
Electrical characteristics are listed in chapter Chapter 11.5
Data Sheet
59
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14
Serial Peripheral Interface
14.1
SPI Description
The 16-bit wide Control Input Word is read via the data input SDI, which is synchronized with the clock input CLK
supplied by the microcontroller. The output word appears synchronously at the data output SDO (see Figure 30).
The transmission cycle begins when the chip is selected by the input CSN (Chip Select Not), LOW active. After
the CSN input returns from LOW to HIGH, the word that has been read in becomes the new control word. The
SDO output switches to tri-state status (high impedance) at this point, thereby releasing the SDO bus for other use.
The state of SDI is shifted into the input register with every falling edge on CLK. The state of SDO is shifted out of
the output register after every rising edge on CLK. The number of received input clocks is supervised by a
modulo-16 operation and the Input / Control Word is discarded in case of a mismatch. This error is flagged in the
following SPI output by a “HIGH” at the data output (SDO pin, bit FO) before the first rising edge of the clock is
received. The SPI of the SBC is not daisy chain capable.
CSN high to low: SDO is enabled. Status information transferred to output shift register
CSN
time
CSN low to high: data from shift register is transferred to output functions
CLK
time
Actual data
SDI
FI
-
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
New data
FI
0 1
+ +
time
SDI: will accept data on the falling edge of CLK signal
Actual status
SDO
FO
-
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
New status
FO
0
+
1
+
time
SDO: will change state on the rising edge of CLK signal
Figure 30
SPI Data Transfer Timing
14.2
Corrupted data in the SPI data input
When the microcontroller send a wrong SPI command to the SBC, the SBC ignores the information. Wrong SPI
command can be either a number of bits different of 16, the mode selection (MS2..0) = 000 or requesting to go to
an SBC mode which is not allowed by the state machine, for example from SBC Stop Mode to SBC SW Flash
Mode. In that case, an interrupt is generated (if not inhibited) and the bit SPI Fail is set. Since the SPI data is
corrupted, the next SPI output data will remain the former one (the information is then repeated).
Data Sheet
60
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.3
SPI Input Data
MSB
Input
Data
LSB
15 14 13 12 11 10
9
8
7
6
WD
refresh
Configuration Registers
Res.
Res.
Wrong
Reset
WD set
INTERRUPT
MASK
Res.
Res.
Res.
REGISTER
CAN
1
UV
Vcc3
UV
VCC2
OT
VCC2
HS CAN
Res.
Res.
Res.
Res.
CAN
Bus
Ti.
CHK
WD
Out /
SUM On/Off
Win .
Set to
1
OT
RT1
RT0
Res.
Res.
Window /Time out Watchdog
Timing Bit Position: 10 .. 6
LH Reserved
2 LH 1 LH 0
MS2
010
ICC3 >
ICC3max
Res.
CS0
CAN CAN
failure failure
1
0
Fail
SPI
Res.
CS1
001
Res.
Res.
CS2
OTP
Vcc1µC
Res.
Res.
2
000
WK 1 WK 0
Res.
WK pin WK pin
CAN
0
3
WK
CAN
Res.
Cyclic
L.H.
VCC2 WK PIN VCC3 Reset
WK
On/off On/Off On/off On/off Delay
On/off
4
Configuration Select
Reserved
WD to
LH
5
Test 2 Test 1 Test 0
1
MS1
0
MS0
Mode Selection
Bits
not valid
Restart
SW Flash
011
Normal
100
Sleep
101
Stop
110
Fail safe
111
Read Only
000
001
010
011
100
101
110
111
SPI data input TLE8261.vsd
Figure 31
Data Sheet
16-Bit SPI Input Data / Control Word
61
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.4
SPI Output Data
MSB
LSB
Output 15 14 13 12 11 10
Data
WK
state
8
7
6
Configuration Registers
INT
Status or
INTERRUPT
event
9
Res.
Cyclic WK 1 WK 0
Res.
WK WK pin WK pin
Wrong
Reset
WD set
Res.
Res.
UV
VCC2
OT
VCC2
Res.
Res.
Res.
Res.
CAN
Bus
Cyclic
L.H.
VCC2 WK PIN VCC3 Reset
WK
On/off On/Off On /off On/off Delay
On/off
CAN
1
MS2
010
RT1
RT0
Res.
Res.
Res.
CHK
WD
SUM On/Off
Ti.
Out /
Win.
Set to
1
Window /Time out Watchdog
Timing Bit Position: 10 .. 6
Res.
RM0
LH 2
Res.
CS0
CAN CAN
failure failure
1
0
Res.
Res.
CS1
001
CAN
0
Res.
CS2
OTP
Vcc1µC
OT
Reserved
WD to
LH
2
000
HS CAN
UV
Vcc3
3
WK
CAN
Res.
ICC3 >
ICC3max
4
Configuration Select
Res.
Fail
SPI
5
1
MS1
0
MS0
Mode Selection
Bits
Init
Restart
SW Flash
011
Normal
100
Sleep
101
Stop
110
Fail Safe
111
Reserved
000
001
010
011
100
101
REGISTER
RM1
LH 1
LH 0 Test 2 Test 1 Test 0
110
111
SPI_Settings_out_TLE8261.vsd
Figure 32
16-bit SPI Output Data / Control Word
14.5
SPI Data Encoding
14.5.1
WD Refresh bit / WK state
The WD Refresh bit is used to trigger the Watchdog. The first trigger should be a 1, and then a 0. For more details,
please refer to Chapter 10.2.
The WK state bit gives the voltage level at the WK pin. A 1 indicates a high level, a 0 a low level.
Data Sheet
62
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.5.2
SBC Configuration Setting and Read Out
14.5.2.1
Mode selection bits and configuration select
Table 12 lists the encoding of the possible SBC mode. Except SBC Restart and Init Mode which are most of time
entered automatically, all others SBC mode are accessible on request of the microcontroller. The microcontroller
should send the correct mode selection bits to set the SBC in the respective mode. The output indicates the SBC
mode where the SBC currently is or was, depending on the situation.
Table 12
Mode Selection Bits
MS2
MS1 MS0
Data Input
Data Output
0
0
0
Not valid (the complete SPI word is ignored) Show the device was in Init previous SPI data
0
0
1
Set the SBC to SBC Restart Mode.
(In SW Flash mode only)
0
1
0
Set the SBC to Software Flash Mode
Show the device is SBC Software Flash Mode
0
1
1
Set the SBC to SBC Normal Mode
Show the device is in SBC Normal Mode
1
0
0
Set the SBC to SBC Sleep Mode
Show the device was in SBC Sleep Mode
1
0
1
Set the SBC to SBC Stop Mode
Show the device is in SBC Stop Mode
1
1
0
Set the SBC to SBC Fail-Safe Mode
Show the device was in SBC Fail-Safe Mode
(In SBC Software Development mode only)
1
1
1
Set the SBC to Read Only SPI access. The Reserved
configuration register needs to be selected.
The SPI information on SDO is provided in
the same SPI frame. No write access is
done in this mode.
Bit 15 (Watchdog) has to be served
correctly.
Show the device was in Restart previous SPI
data
Table 13 lists the eight possible configuration selection. Some are related to event or state of the different part of
the SBC, others are used to configure the SBC in the application specific set up.
Table 13
Configuration Select Encoder (for Data Input and Output)
CS2
CS1
CS0
Configuration Register Select
0
0
0
Wake Register Interrupt
0
0
1
SBC Failure Interrupt
0
1
0
Communication Failure Interrupt
0
1
1
Reserved
1
0
0
SBC Configuration Register
1
0
1
Communication Setup Register
1
1
0
Watchdog Configuration Register
1
1
1
Limp Home / Diagnosis Register
Data Sheet
63
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.5.2.2
Interrupt Register Encoder
Table 14 lists all interrupts the SBC can generates. The microcontroller should read the correct register to release
the INT pin. By default, all interrupt sources are enabled. The microcontroller can decide to inhibit a specific
interrupt source.
Table 14
CS
Interrupt Register encoder 1)
Bit Name
Default
Value
(INPUT)
Default
Value
Data Input
Data Output
(OUT)
Configuration select 000 (Wake register interrupt)
000
WK CAN
1
0
Interrupt enabled (1) disabled
(0) for wake event on CAN
Wake on CAN (1)
WK 1 WK pin
WK 0 WK pin
11
00
Interrupt enabled (1) disabled
(0) for wake pin event.
00 No interrupt
10 Interrupt for a LOW to HIGH
transition on WK
01 Interrupt for HIGH to LOW
transition on WK
11 Interrupt for both HIGH to
LOW and LOW to HIGH on WK
Wake on WK pin
00 No wake
10 Interrupt for a LOW to HIGH
transition on WK
01 Interrupt for HIGH to LOW
transition on WK
11 Interrupt for both HIGH to
LOW and LOW to HIGH on WK
Cyclic WK
n.a
0
n.a
Cyclic WK (1)
INT
n.a
0
n.a
Indicates that there is a status
bit or uncleared event in
configuration select 001 and/or
010. If set read the two register
Data Sheet
64
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
Table 14
CS
Interrupt Register encoder (cont’d)1)
Bit Name
Default
Value
(INPUT)
Default
Value
Data Input
Data Output
(OUT)
Configuration select 001 (SBC Failure interrupt)
001
OTP_Vcc1µC
1
0
Interrupt enabled (1) disabled Vcc1µC temperature pre warning
(0) for temperature pre-warning (1)
OT_HSCAN
1
0
Interrupt enabled (1) disabled
(0) for temperature shutdown
HS CAN temperature shutdown
(1)
OT_Vcc2
1
0
Interrupt enabled (1) disabled
(0) for temperature shutdown
Vcc2 temperature shutdown (1)
UV_Vcc3
1
0
Interrupt enabled (1) disabled Undervoltage detection on Vcc3
(0) for undervoltage detection (1)
or due to back to normal voltage
SPI Fail
1
0
Interrupt enabled (1) disabled
(0) for SPI corrupted data.
SPI input corrupted data (1)
Reset
1
0
Interrupt enabled (1) disabled
(0) for reset information
(only in SBC Software
Development Mode)
Reset (1)
(only in SBC Software
Development Mode)
Wrong WD set
1
0
Interrupt enabled (1) disabled
(0) for incorrect Watchdog
setting
Incorrect WD programming for
data output
UV Vcc2
1
0
Interrupt enabled (1) disabled Under voltage detected at Vcc2
(0) for undervoltage detection at
Vcc2
ICC3 > ICC3max
1
0
Interrupt enable (1) disabled (0) Over current detected at Vcc3
for over current at Vcc3
Configuration select 010 (Communication failure interrupt)
010
CAN failure 1
CAN failure 0
n.a
1
0
0
Interrupt enabled (1) disabled
(0) for CAN failure
CAN failure Refer to Table 15
CAN Bus
1
0
Interrupt enabled (1) disabled
(0) for CAN bus failure
CAN bus failure detected (1)
1) A value of 0 will set the SBC into the opposite state.
Data Sheet
65
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.5.2.3
CAN failure encoder
Table 15 describes the encoding of the possible internal CAN failures.
Table 15
CAN Failure Encoder
CAN 1 Failure
CAN 0 Failure
Fault
0
0
No failure
0
1
TxD shorted to GND or bus dominant clamped
1
0
RxD shorted to Vcc
1
1
TxD shorted to RxD
14.5.2.4
Configuration encoder
Table 16 lists the configuration register of the SBC. The microcontroller can change the settings. If no settings are
changed the default values are used. The current value can be read on the SPI Data Out.
Table 16
Configuration Encoder
Configuration Bit Name
Select
Default Default
Value
Value
(INPUT) (OUT)
State
Configuration select 100 (SBC Configuration Register)
100
Data Sheet
RT10
01
01
Reset threshold setting. Please refer to Table 17
Reset delay
1
1
Long reset window
Vcc3 ON /OFF
0
0
Vcc3 is activated (1)
WK pin ON / OFF 1
1
The wake pin will wake the SBC
Vcc2 On / Off
0
0
Vcc2 is activated (1)
LH ON / OFF
0
0
Limp Home output state. Activated (1) when entry
condition is met.
Cyclic WK On /
Off
0
0
Activation (1) of the cyclic wake
WD to LH
1
1
Watchdog failure to Limp Home active.
0 = only one Watchdog failure brings to Limp Home
activated.
1 = two consecutive Watchdog failures bring to Limp
Home activated.
66
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
Table 16
Configuration Encoder
Configuration Bit Name
Select
Default Default
Value
Value
(INPUT) (OUT)
State
Configuration select 101 (SBC communication set up register)
CAN 1.0
00
00
The CAN cell is in:
00 = CAN OFF
01 = CAN is Wake Capable
10 = CAN Receive Only Mode
11 = CAN Normal Mode
Configuration select 110 (SBC Watchdog register)
110
Ti. Out / Win.
1
1
Time-out Watchdog is activated
Set to 1
1
1
Bit is reserved and fix set to “1”. Set to 1 in SW.
WD ON / OFF
1
1
Watchdog is activated
CHK SUM
1
1
Check sum of the bit 13...6
In case the CHK SUM is wrong, the device remains in
previous valid state.
CHKSUM = Bit13 ⊕ … ⊕ Bit6
Configuration select 111 (Limp Home / Diagnosis register)
111
-
14.5.2.5
Reserved for input
For output, refer to Table 19, Table 20 and Table 21
Reset encoder
Table 17 lists the three possible reset thresholds. Please also refer to Chapter 10.3 to get the exact voltage
threshold.
Table 17
Reset Encoder
RT1
RT0
Threshold Selected
0
0
Not Valid. Device remains at previous threshold
0
1
VRT1 (default setting at SBC Init),
1
0
VRT2
1
1
VRT3
14.5.2.6
SBC Watchdog encoder
Table 18 list the 32 possible watchdog timer.
Table 18
Watchdog Encoder
Bit 10...6
Decimal calculation (ms)
00000
0
00001
1
00010
2
...
...
...
01111
15
256 (default setting)
Data Sheet
(n+1) × 16
n = decimal value of
setting
Timer (ms)
16
32
48
67
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
Table 18
Watchdog Encoder
Bit 10...6
Decimal calculation (ms)
10000
16
10001
17
352
...
...
...
11110
30
976
11111
31
1024
14.5.3
n × 48 - 464
Timer (ms)
304
SBC Diagnostic encoder
The SBC offers diagnostics information. The encoding of the different possible failures are listed in the following
table. The description apply only to data output.
14.5.3.1
Reason for restart and reset
Reason for reset, without activation of the Limp Home and the way it is encoded are summed up in Table 19. The
bits are cleared by reading the register with Read-Only command. When coming from Sleep Mode or Fail Safe
Mode the bits are cleared.
Table 19
RM1
Reason to Enter SBC Restart Mode without Limp HomeLimp Home activation
RM0
Cause for entering SBC Restart Mode
0
0
No reset has occurred or Limp Home activated
0
1
Undervoltage on Vcc1µC
1
0
First Watchdog failure (config 3 and 4) or no acknowledge of the Cyclic Wake-up
1
1
SPI command in SBC Software Flash Mode or reset low from outside
Data Sheet
68
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.5.3.2
Limp Home failure encoder
Table 20 describes the encoding of all possible reason to activate automatically the Limp Home output. Bits are
set back to “000” when switching Limp Home off via SPI.
Table 20
LH2
Limp Home Failure Diagnosis
LH1
LH0
Failure1)
0
0
0
No failure
0
0
1
Vcc1µC undervoltage Time-out
0
1
0
One Watchdog failure (config 1 and 2)
0
1
1
Two consecutive Watchdog failures (config 3 and 4)
1
0
0
INIT Mode Time-out
1
0
1
Temperature shutdown at Vcc1µC
1
1
0
Reset clamped
1
1
1
Reserved
14.5.3.3
Test pin and failure to Limp Home configuration read out
The SBC allows to read the hardware setting of the configuration that is done via the INT pin, as well as the test
pin and the WD to LH bit. Table 21 describes the encoding of these informations.
Table 21
Test pin and SBC Configuration
Test1
Test0
Test Read Out1)
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
Vcc1µC remains ON in SBC Restart Mode after one Watchdog failure (config 1)
Vcc1µC is OFF in SBC Fail-Safe Mode after one Watchdog failure (config 2)
Vcc1µC remains ON in SBC Restart Mode after two Watchdog failures (config 3)
Vcc1µC is OFF in SBC Fail-Safe Mode after two Watchdog failures (config 4)
Software Development Mode. In case of watchdog failure Vcc1µC remains ON, no
Test2
reset is generated and Restart Mode or Fail-Safe Mode are not entered.
1
0
1
Software Development Mode. In case of watchdog failure Vcc1µC remains ON, no
reset is generated and Restart Mode or Fail-Safe Mode are not entered.
1
1
0
Software Development Mode. In case of watchdog failure Vcc1µC remains ON, no
reset is generated and Restart Mode or Fail-Safe Mode are not entered.
1
1
1
Software Development Mode. In case of watchdog failure Vcc1µC remains ON, no
reset is generated and Restart Mode or Fail-Safe Mode are not entered.
1) Refer also to Chapter 4.2.1
Data Sheet
69
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.6
SPI Output Data
14.6.1
First SPI output data
Since the SPI output data is sent when the SBC is receiving data, the output data are dependent of the previous
SPI command, if no Read Only command is used. Under some conditions there is no “previous command”.
Table 22 gives the first SPI output data that is sent to the microcontroller when entering SBC Normal Mode,
depending on the mode where the SBC was before receiving the first SPI command.
.
Table 22
First SPI output data frame
Previous SBC mode
Mode selection bits (MS2...0) Configuration select (CS 2..0)
Sleep mode
Sleep mode
Wake Register interrupt1)
Fail-Safe mode
Fail-Safe mode
Limp Home register1)
Restart mode when failure and config 1 / 3
Restart mode
Limp Home register1)
Restart mode when microcontroller has sent
to Restart mode
Restart mode
SBC Configuration Register
SBC Init mode
Init mode
SBC Configuration Register
1) This does not clear the bits. It will be reset when the microcontroller requests the read out
Data Sheet
70
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.6.2
Read Only command
In the Mode Selection Bits a Read Only can be selected. The Read Only access clears the INT bits that are
selected in the Configuration Select (some interrupt bits show a state, and can not be cleared with a SPI read).
With this SPI command no write access is done to the SBC, and the mode of the SBC is not changed. The
watchdog can also be triggered with a Read Only command.
The Read Only command delivers the information requested with the Configuration Select in the same SPI
command on the SDO pin. As all other SPI commands deliver the requested information with the next SPI
command.
Figure 33 shows an example of a Read Only access. The bits are shown with LSB first, on the left side in
difference to the register description.
DI
0
1
2
3
4
5
MS0
MS1
MS2
CS0
CS1
CS2
Mode Selection
Bits
1
DO
1
1
0
0
x
x
6
7
8
9
10 11 12 13 14 15
2
3
4
5
CS0
CS1
CS2
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
1
2
3
4
5
MS1
MS2
CS0
CS1
CS2
1
DO
1
0
x
6
7
1
x
x
1
1
x
x
x
6
7
8
9
10 11 12 13 14 15
x
x
0
1
2
3
4
5
MS1
MS2
CS0
CS1
CS2
1
1
0
0
0
9
10 11 12 13 14 15
x
x
WD
refresh
x
x
x
x
x
x
x
x
WK
state
Configuration Registers
Configuration Select
1
8
Configuration Registers
Configuration Select
MS0
Mode Selection
Bits
WK
state
Configuration Registers
Configuration Select
0
x
0
MS0
Mode Selection
Bits
WD
refresh
Configuration Registers
x
MS2
DI
10 11 12 13 14 15
x
1
0
9
x
MS1
1
8
0
0
1
7
Configuration Select
MS0
Mode Selection
Bits
6
x
x
x
TIME
Figure 33
Read Only Command
Figure 34 shows an example of an SPI write access in normal mode for comparison. The requested information
is sent out with the next SPI command.
DI
0
1
2
3
4
5
MS0
MS1
MS2
CS0
CS1
CS2
Mode Selection
Bits
1
DO
1
0
0
0
x
x
6
7
8
9
10 11 12 13 14 15
2
3
4
5
CS0
CS1
CS2
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
1
2
3
4
5
MS1
MS2
CS0
CS1
CS2
1
DO
1
0
x
1
1
WD
refresh
Configuration Registers
x
x
6
7
8
9
10 11 12 13 14 15
2
3
4
5
CS0
CS1
CS2
0
x
x
x
x
x
x
x
x
x
x
x
x
WK
state
Configuration Registers
Configuration Select
0
10 11 12 13 14 15
x
MS2
0
9
x
1
0
8
x
MS1
1
7
1
0
1
6
Configuration Select
MS0
Mode Selection
Bits
WK
state
Configuration Registers
Configuration Select
1
x
0
MS0
Mode Selection
Bits
WD
refresh
Configuration Registers
x
MS2
DI
10 11 12 13 14 15
x
1
0
9
x
MS1
1
8
0
0
1
7
Configuration Select
MS0
Mode Selection
Bits
6
x
x
x
TIME
Figure 34
Data Sheet
Write Command
71
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.7
Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
–
0.7 x
Unit
Test Condition
V
–
V
–
V
–1)
SPI Interface; Logic Inputs SDI, CLK and CSN
14.7.1
14.7.2
H-input Voltage Threshold VIH
–
L-input Voltage Threshold VIL
0.3 x
VCC1µC
–
–
VCC1µC
Hysteresis of input
Voltage
VIHY
14.7.4
Pull-up Resistance at pin
CSN
RICSN
20
40
80
kΩ
VCSN = 0.7 × VCC1µC
14.7.5
Pull-down Resistance at
pin SDI and CLK
RICLK/SDI 20
40
80
kΩ
VSDI/CLK = 0.2 × VCC1µC
14.7.6
Input Capacitance
at pin CSN, SDI or CLK
CI
–
10
-
pF
-1)
VSDOH
VCC1µC - VCC1µC - –
V
IDOH = -1.6 mA
14.7.3
0.12 x
VCC1µC
Logic Output SDO
14.7.7
H-output Voltage Level
0.4
0.2
–
0.2
0.4
V
IDOL = 1.6 mA
-10
–
10
µA
VCSN = VCC1µC;
0 V < VDO < VCC1
CSDO
–
10
15
pF
1)
VSDOL
14.7.8
L-output Voltage Level
14.7.9
Tri-state Leakage Current ISDOLK
14.7.10
Tri-state Input
Capacitance
Data Input Timing1)
14.7.11
Clock Period
tpCLK
250
–
–
ns
–
14.7.12
Clock High Time
tCLKH
125
–
–
ns
–
14.7.13
Clock Low Time
tCLKL
125
–
–
ns
–
14.7.14
Clock Low before CSN
Low
tbef
125
–
–
ns
–
14.7.15
CSN Setup Time
tlead
250
–
–
ns
–
14.7.16
CLK Setup Time
tlag
250
–
–
ns
–
14.7.17
Clock Low after CSN High tbeh
125
–
–
ns
–
14.7.18
SDI Set-up Time
tDISU
100
–
–
ns
–
14.7.19
SDI Hold Time
tDIHO
50
–
–
ns
–
Data Sheet
72
Rev. 1.0, 2009-03-31
TLE8261E
Serial Peripheral Interface
14.7
Electrical Characteristics (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit
Test Condition
14.7.20
Input Signal Rise Time
at pin SDI, CLK and CSN
trIN
–
–
50
ns
–
14.7.21
Input Signal Fall Time
at pin SDI, CLK and CSN
tfIN
–
–
50
ns
–
14.7.22
Delay Time for Mode
Change from Normal
Mode to Sleep Mode
tfIN
–
–
10
µs
–
14.7.23
CSN High Time
tCSN(high) 10
–
–
µs
-
trSDO
tfSDO
tENSDO
tDISSDO
tVASDO
–
30
80
ns
CL = 100 pF
–
30
80
ns
CL = 100 pF
–
–
50
ns
low impedance
–
–
50
ns
high impedance
–
–
60
ns
CL = 100 pF
Data Output Timing 1)
14.7.24
SDO Rise Time
14.7.25
SDO Fall Time
14.7.26
SDO Enable Time
14.7.27
SDO Disable Time
14.7.28
SDO Valid Time
1) Not subject to production test; specified by design
23
CSN
14
15
12
16
13
17
CLK
18
DI
26
DO
Figure 35
19
LSB
not defined
MSB
27
28
Flag
LSB
MSB
SPI Timing Diagram
Note: Numbers in drawing correlate to the last 2 digits of the Pos. number in the Electrical Characteristics table.
Data Sheet
73
Rev. 1.0, 2009-03-31
TLE8261E
Application Information
15
Application Information
Note: The following information is given only as a hint for the implementation of the device and should not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
V DD
VBAT
VS
D1
T1
R1
IC2
V IO
V CC
VBAT
C1
C3
C2
C12
GND
VCC IC3
C 13
VS
V CC3shunt
V CC3base
GND
VCC3ref
VS
VDD
V cc1µC
C9
TEST
TLE8261
C 10
R12
S2
CSN VDD
CLK
SDI
µC
SDO
CSN
CLK
SDO
SDI
LOGIC
State
Machine
TxD CAN
RxD CAN
VBAT
TxD CAN
RxD CAN
INT
INT
Reset VSS
RO
S1
VS
WK
V DD
VCC2
WK
R9
R5
C14
CAN cell
VCCHSCAN
VDD VBB
C 11
CANH
CANH
VS
R7
SPLIT
C8
R8
CANL
VBAT
R 10
C7
CANL
Limp home
T2
CS
SCLK
SI
SO
LHI
IN0
IN1
IN2
IN3
IN4
IN5
GND
DEVICE GROUND
GND
Application _information _TLE8261 E.vsd
Figure 36
Data Sheet
IC1
D5
Application Example for a Body Controller Module
74
Rev. 1.0, 2009-03-31
TLE8261E
Application Information
Note: This is a very simplified example of an application circuit and bill of material. The function must be verified
in the actual application.
Table 23
Ref.
Bills of material
Option Vendor
Value
Purpose
68µF optional depending on
application
Cut off battery spike
100nF
EMC
10µF ceramic cap low ESR
Stability of the VCC3
Capacitance
C1
Y
C2
Y
C3
N
C7
Y
22nF 50V
EMC
C8
Y
47nF OEM dependent
Improve SPLIT pin stability
C9
Y
10µF
Buffer of the VCC1µC depending on load.
(µC)
C10
N
100nF
Stability of the VCC1µC
C11
N
10µF CAN transceiver dependent
Buffering of the VCC2 for CAN Transceiver
C12
Y
100nF
Improve stability of the logic
C13
Y
100nF
Improve stability of the logic
C14
Y
100nF
Improve stability of the logic
220mΩ
VCC3 current measurement for ICC3
Kemet
Murata
Resistance
R1
N
400mA max
R5
Y
1kΩ
Wetting current of the switch
R7
Y
60Ω / OEM dependent
CAN bus termination
R8
Y
60Ω / OEM dependent
CAN bus termination
R9
Y
10kΩ
Limit the WK pin current in ISO pulses
R10
Y
500Ω
Insulation of the VDD supply
R12
Y
47kΩ
Set config 1/3. If not connected config 2/4
is selected
Data Sheet
75
Rev. 1.0, 2009-03-31
TLE8261E
Application Information
Table 23
Ref.
Bills of material
Option Vendor
Value
Purpose
ON Semi
MJD253
Power element of VCC3
Infineon
BCP52-16
Alternative power element of VCC3, current
limit to be adapted R1 to be changed.
Active components
T1
N
T2
N
Infineon
BCR191W
High active Limp Home
D1
N
Infineon
BAS 3010A
Reverse polarity protection
µC
N
Infineon
XC2xxx
micro-controller
IC1
Y
Infineon
SPOC - BTS5672E
high side switches
IC2
Y
Infineon
TLE 6254-3G
Low speed CAN
IC3
Y
Infineon
TLE 6251DS
High speed CAN
Data Sheet
76
Rev. 1.0, 2009-03-31
TLE8261E
Application Information
15.1
ZthJA Curve
60
Zth-JA(Ch4; 600)
50
Zth-JA(Ch4; 300)
Zth-JA(Ch4; 100)
Zth-JA [K/W]
40
Zth-JA(Ch4; footprint)
30
20
10
0
0,00001
0,0001
0,001
0,01
0,1
1
10
100
1000
10000
tim e (s)
Zthja curves.vsd
Figure 37
ZthJA Curve, Function of Cooling Area
600mm² cooling area
300mm² cooling area
100mm² cooling area
minimum footprint
PCB set up.vsd
Figure 38
Board Set-up
Board set-up is done according to JESD 51-3, single layer FR4 PCB 70 µm.
Data Sheet
77
Rev. 1.0, 2009-03-31
TLE8261E
Application Information
15.2
Hints for SBC Factory Flash Mode
The mode is used during production of the module to flash the µC. The idea is that the µC is not supplied from the
SBC but from an external 5V power supply. The reset of the µC that is connected to the RO pin of the SBC can
be driven from an external source and the SBC does not give a reset signal. Also no interrupt at the pin INT and
no signal on the SPI SDO pin is generated by the SBC. The SPI pins can be driven externally.
The mode is reached by applying 5V to the VCC1µC pin and no voltage to the Vs pin. The Vs pin will show a voltage
of about 4.5V because of the internal diode from VCC1µC to Vs. The current drawn at Vs must not exceed the
maximum rating of Ivs,max = -500mA. The function is designed for ambient temperature.
In case the Vs was supplied before going to FF Mode, the voltage on pin Vs must be set below 3 V before applying
5V to VCC1µC (discharging the C)
Not
supplied
Not
supplied
5V
Vs
VBAT
C
Reset
signal
VCC1µC
IVS
Internal
supply
The current
flowing to other
devices from
Vs should be
limited to not
exceed the
maximum
ratings.
Other
Devices
CSN
CLK
SDO
SDI
TxD LIN1
RxD LIN1
TxD LIN2
RxD LIN2
TxD LIN3
RxD LIN3
TxD CAN
RxD CAN
CSN V DD
CLK
SDI
µC
SDO
TxD LIN1
RxD LIN1
TxD LIN2
RxD LIN2
TxD LIN3
RxD LIN3
TxD CAN
RxD CAN
INT
INT
RO
Reset V SS
Application_ FF_Mode _2.vsd
Figure 39
Data Sheet
Application Hint for Factor Flash Mode
78
Rev. 1.0, 2009-03-31
TLE8261E
Application Information
Table 24
PIN in Factory Flash Mode
Pin
Level
Comment
Vs
typ. 4.5V
Voltage output from SBC. No voltage applied from
external.
Vcc1µC
5V ± 2%
To be applied from external
RO
Pull-up resistor
Can be driven from external
INT
Pull-up resistor
Can be driven from external if required
LH
High impedance
Can be driven from external if required
SDO
High impedance
Can be driven from external if required
CLK, SDI
Pull-down resistor
Can be driven from external if required
CSN
Pull-up resistor
Can be driven from external if required
TxDCAN, TxDLIN1,
TxDLIN2, TxDLIN3
Pull-up resistor
Can be driven from external if required
RxDCAN, RxDLIN1,
RxDLIN2, RxDLIN3
High impedance
Can be driven from external if required
15.3
ESD Tests
Tests for ESD robustness according to IEC61000-4-2 “gun test” (150pF, 330Ω) have been performed. The results
and test condition is available in a test report. The values for the test are listed in Table 25 below.
Table 25
ESD “Gun test”
Performed Test
Result
Unit
Remarks
ESD at pin CANH, CANL,
BUSx, Vs versus GND
>8
kV
positive pulse1)
ESD at pin CANH, CANL,
BUSx, Vs versus GND
< -8
kV
negative pulse
1) ESD susceptibility “ESD GUN” contact discharge (R=330Ohm C=150pF) (DIN EN 61000-4-2) tested according LIN EMC
1.3 Test Specification and ICT EMC Evaluation of CAN Transceiver. Tested by external test house (IBEE Zwickau, EMC
Test report Nr. 06-02-09a)
Data Sheet
79
Rev. 1.0, 2009-03-31
TLE8261E
Package Outline
Package Outline
8˚ MAX.
1.1
7.6 -0.2 1)
0.65
0.7 ±0.2
C
17 x 0.65 = 11.05
0.33 ±0.08 2)
0.23 +0.09
0.35 x 45˚
2.55 MAX.
3)
0...0.10
STAND OFF
2.45 -0.2
16
0.1 C 36x
SEATING PLANE
10.3 ±0.3
0.17 M A-B C D 36x
D
Bottom View
A
19
19
Ejector Mark
Cavity ID
36
Exposed Diepad
Y
36
18
1
18
B
X
1
Index Marking
12.8 -0.21)
Index Marking
Ejector Mark
Polish Finish
Exposed Diepad Dimensions 4)
Leadframe
X
Y
Package
PG-DSO-36-24, -41, -42 A6901-C001 7 5.1
A6901-C003 7 5.1
PG-DSO-36-38
A6901-C007 5.2 4.6
PG-DSO-36-38
PG-DSO-36-24
A6901-C008 6.0 5.4
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
4) Exclunding the mold flash allowance of 0.3mm MAX per side
PG-DSO-36-24, -38, -41, -42-PO V08
Figure 40
PG-DSO-36-38 (Leadframe A6901-003);)
Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used.
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations, the Universal System Basis Chip is available as a green product. Green products are
RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD020).
For information about packages and types of packing, refer to the
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
80
Dimensions in mm
Rev. 1.0, 2009-03-31
TLE8261E
Revision History
17
Version
1.0
Data Sheet
Revision History
Date
Parameter
Changes
First Rev. after Preliminary Data Sheet
81
Rev. 1.0, 2009-03-31
Edition 2009-03-31
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
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