TL(BE,GTE,EGE)1100B(T11) TLBE1100B(T11), TLGTE1100B(T11), TLEGE1100B(T11) Panel Circuit Indicator Unit: mm • Surface-mount devices • 3.2 (L) × 2.8 (W) × 1.9 (H) mm • Flat-top type • InGaN LEDs • High luminous intensity • Low drive current, high-intensity light emission • Colors: λd=470nm(typ) Blue Bluish Green λd=505nm(typ) λd=528nm(typ) Green • Pb free reflow soldering is possible • Applications: automotive use, message signboards, backlighting etc. • Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel Color and Material Product Name Color TLBE1100B Blue TLGTE1100B Bluish green TLEGE1100B Green Material JEDEC ― JEITA ― TOSHIBA 4-3R1 Weight: 0.035 g (typ.) InGaN Maximum Ratings (Ta = 25°C) Forward Current IF (mA) Please see Note 1 Product Name Reverse Voltage VR (V) Power Dissipation PD (mW) TLBE1100B Operation Temperature Topr (°C) Storage Temperature Tstg (°C) −40~100 −40~100 129 30 TLGTE1100B 4 135 TLEGE1100B 132 Note 1: Forward current derating TLBE1100B TLGTE1100B,TLEGE1100B IF – Ta IF – Ta 40 (mA) IF 30 Allowable forward current Allowable forward current IF (mA) 40 20 10 0 0 20 40 60 Ambient temperature 80 Ta 30 20 10 0 0 100 (°C) 20 40 60 Ambient temperature 80 Ta 100 (°C) For part availability and ordering information please call Toll Free: 800.984.5337 Website: www.marktechopto.com | Email: [email protected] 1 2006-06-01 TL(BE,GTE,EGE)1100B(T11) Electrical Characteristics (Ta = 25°C) Reverse Current IR Forward Voltage VF Product Name Min Typ. Max TLBE1100B 2.8 3.2 4.3 TLGTE1100B 3.0 3.3 4.5 TLEGE1100B 2.9 3.4 4.4 Unit V IF Max VR 20 10 4 mA µA V Optical Characteristics–1 (Ta = 25°C) Product Name Luminous Intensity IV Available Iv rank Min Typ. Max IF Please see Note 2 TLBE1100B 63 100 320 20 QA / RA / SA TLGTE1100B 160 300 800 20 SA / TA / UA RA / SA / TA / UA TLEGE1100B 100 350 800 20 Unit mcd mcd mcd mA Note 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Iv rank Rank symbol Min Max QA 63 125 RA 100 200 SA 160 320 TA 250 500 UA 400 800 Unit mcd mcd Optical Characteristics–2 (Ta = 25°C) Emission Spectrum Peak Emission Wavelength λp Product Name Min Typ. ∆λ Max Typ. Dominant Wavelength λd Min Typ. Max TLBE1100B ⎯ 468 ⎯ 25 463 470 477 TLGTE1100B ⎯ 496 ⎯ 30 496 505 514 TLEGE1100B ⎯ 523 ⎯ 35 518 528 537 Unit nm nm nm IF 20 mA Note 3: Caution ESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000V When handling this LED, take the following measures to prevent the LED from being damaged or otherwise adversely affected. 1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor. 2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is good for this purpose. 3) Ground all tools including soldering irons. 2 2006-06-01 TL(BE,GTE,EGE)1100B(T11) TLBE1100B IF – V F IV – IF (typ.) 100 (typ.) 300 IV (mcd) 50 30 Ta = 25°C 100 50 Luminous intensity Forward current IF (mA) Ta = 25°C 10 5 3 1 2.4 2.6 3.0 3.4 Forward voltage 3.8 4.2 VF 10 5 3 1 4.6 (V) 3 5 10 50 30 Forward current IV – Tc 10 30 IF 100 (mA) Relative Iv - λ (typ.) (typ.) 1.0 IF = 20 mA Ta = 25°C 5 0.8 Relative luminosity Relative luminosity IV 3 1 0.5 0.3 0.1 −20 0 20 40 Case temperature 60 Tc 80 0.6 0.4 0.2 0 360 100 (°C) 400 440 480 Wavelength 520 λ 560 600 (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 80° 90° 0 0.2 0.4 0.6 0.8 90° 1.0 3 2006-06-01 TL(BE,GTE,EGE)1100B(T11) TLGTE1100B IF – V F IV – IF (typ.) 100 1000 IV (mcd) 50 30 Luminous intensity Forward current IF (mA) Ta = 25°C 10 5 3 1 2.4 2.6 3.0 3.4 3.8 Forward voltage VF 4.2 500 300 100 50 30 (V) 3 5 10 30 Forward current IV – Tc 10 Ta = 25°C 10 1 4.6 (typ.) IF 50 (mA) Relative Iv - λ (typ.) 100 (typ.) 1.0 IF = 20 mA Ta = 25°C 5 Relative luminosity Relative luminosity IV 0.8 3 1 0.5 0.3 0.1 0.6 0.4 0.2 −20 0 20 40 60 Case temperature Tc 0 400 100 80 (°C) 440 480 560 520 Wavelength λ 600 640 (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 4 2006-06-01 TL(BE,GTE,EGE)1100B(T11) TLEGE1100B IF – V F IV – IF (typ.) 1000 100 IV (mcd) 30 Luminous intensity Forward current IF (mA) Ta = 25°C 50 10 5 3 1 2.4 2.6 3.4 3.0 3.8 Forward voltage VF 500 300 100 50 30 10 1 4.6 4.2 (V) 3 5 10 30 Forward current IV – Tc (typ.) Ta = 25°C IF 100 (mA) Relative Iv - λ (typ.) 10 (typ.) 1.0 IF = 20 mA Ta = 25°C 5 0.8 IV 3 Relative luminosity Relative luminosity 50 1 0.5 0.6 0.4 0.3 0.2 0.1 −20 0 20 40 60 Case temperature Tc 0 400 100 80 (°C) 440 480 520 Wavelength 560 λ 600 640 (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 80° 90° 0 0.2 0.4 0.6 0.8 90° 1.0 5 2006-06-01 TL(BE,GTE,EGE)1100B(T11) Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5°C~30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering • Reflow soldering (example) Temperature profile for Pb soldering (example) Temperature profile for Pb-free soldering (example) 5 s max(*) 10 s max (*) (*) (*) 140~160°C max(*) (*) 4°C/s max(*) 4°C/s max 60~120 s max(*) Time • • • • • 260°C max Package surface temperature (°C) Package surface temperature (°C) 240°C max 4°C/s max(*) max(*) 150~180°C 230°C 4°C/s max(*) max(*) 60~120 s Time (s) 30~50s max(*) (s) The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH (max) Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300°C or less Time : within 3 s If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales representative. Recommended soldering pattern 1.65 1.15 Unit: mm 1.65 2.41 6 2006-06-01 TL(BE,GTE,EGE)1100B(T11) Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES KAO CLEAN TROUGH 750H PINE ALPHA ST-100S TOSHIBA TECHNOCARE (FRW-17, FRW-1, FRV-100) : (made by ASAHI GLASS) : (made by KAO) : (made by ARAKAWA CHEMICAL) : (made by GE TOSHIBA SILICONES) Precautions when Mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T14 (4-mm pitch) (2) Example TLBE1100B (T11) Tape type Toshiba product No. 2. Tape dimensions Unit: mm Symbol Dimension Tolerance Symbol Dimension Tolerance D 1.5 +0.1/−0 P2 2.0 ±0.05 E 1.75 ±0.1 W 8.0 ±0.3 P0 4.0 ±0.1 P 4.0 ±0.1 t 0.3 ±0.05 A0 2.9 ±0.1 F 3.5 ±0.05 B0 3.7 ±0.1 D1 1.5 ±0.1 K0 2.3 ±0.1 K0 P0 D t P2 E F W B0 P D1 Polarity A0 7 2006-06-01 TL(BE,GTE,EGE)1100B(T11) 3. Reel dimensions Unit: mm 9 ± 0.3 φ60 2 ± 0.5 φ13 φ44 +0 180 −4 11.4 ± 1.0 4. Leader and trailer sections of tape 40 mm or more 40 mm or more (Note 1) (Note 2) Leading part: 190 mm (min) Note1: Empty trailer section Note2: Empty leader section 8 2006-06-01 TL(BE,GTE,EGE)1100B(T11) 5. Packing display (1) Packing quantity Reel 2,000 pcs Carton 10,000 pcs (2) Packing form: Each reel is sealed in an aluminum pack with silica gel. 6. Label format (1) Example: TLBE1100B (T11) P/N: TOSHIBA TYPE TLBE1100B ADDC (T11) Q’TY Lot Number Key code for TSB (RANK SYMBOL) 32C 2,000 pcs 2000 Use under 5-30degC/6-%RH within 168h SEAL DATE: DIFFUSED IN ***** ASSEMBLED IN ***** [[G]]/RoHS COMPATIBLE *Y3804xxxxxxxxxxxxxxxxx* (2) Label location • Reel • Carton Tape feel direction Label position Label position • The aluminum package in which the reel is supplied also has the label attached to center of one side. 9 2006-06-01 TL(BE,GTE,EGE)1100B(T11) RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 10 2006-06-01