TOSHIBA TLP3214

TLP3214
TOSHIBA PHOTOCOUPLER
PHOTO RELAY
TLP3214
Measuring Instruments
Logic IC Testers / Memory Testers
Board Testers / Scanners
Unit: mm
4.2
φ1.4
②
④
①
3.65
0.2
1.9
0.15
1.8
The TOSHIBA TLP3214 is an ultra-small photorelay suitable for
surface-mount assembly. The TLP3214 consists of a GaAs
infrared-emitting diode optically coupled to a photo-MOSFET and is
housed in a 4-pin package.
Its features include low Off-state current and low output pin capacitance,
enabling it to be used for high-frequency measuring instrument
applications.
③
3.8
0.2
1.27
0.3
2.04
(0.46)
Features
•
4-pin SSOP (SSOP4): 1.8-mm high, 1.27-mm pitch
•
1-Form-A
•
Peak Off-State Voltage: 40 V (min)
•
Trigger LED Current: 4 mA (max)
•
On-State Current: 250 mA (max)
•
On-State Resistance: 3 Ω (max), 2 Ω (typ.)
•
Output Capacitance: 7 pF (max), 5 pF (typ.)
•
Isolation Voltage: 1500 Vrms (min)
Pin Configuration (Top View)
1
4
2
3
JEDEC
−
JEITA
−
TOSHIBA
11-2B1
Weight: 0.03 g (typ.)
Schematic
1
4
2
3
1 : ANODE
2 : CATHODE
3 : DRAIN
4 : DRAIN
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TLP3214
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
IF
50
mA
ΔIF/°C
−0.5
mA/°C
VR
5
V
LED
Forward Current
Forward Current Derating (Ta ≥ 25°C)
Reverse Voltage
Tj
125
°C
VOFF
40
V
ION
250
mA
ΔION/°C
−2.5
mA/°C
Tj
125
°C
Storage Temperature Range
Tstg
−40 to 125
°C
Operating Temperature Range
Topr
−20 to 85
°C
DETECTOR
Junction Temperature
Off-State Output Terminal Voltage
On-State Current
On-State Current Derating (Ta ≥ 25°C)
Junction Temperature
Lead Soldering Temperature (10 s)
Tsol
260
°C
Isolation Voltage (AC, 1 minute, R.H. ≤ 60%) (Note 1)
BVS
1500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two-terminal device: Pins 1 and, 2 shorted together, and pins 3 and 4 shorted together.
Caution
This device is sensitive to electrostatic discharge. When using this device, please ensure that all tools and
equipment are earthed.
Recommended Operating Conditions
CHARACTERISTIC
SYMBOL
MIN
TYP.
MAX
UNIT
Supply Voltage
VDD
⎯
⎯
32
V
Forward Current
IF
⎯
⎯
30
mA
On-State Current
ION
⎯
⎯
250
mA
Operating Temperature
Topr
-20
⎯
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Individual Electrical Characteristics (Ta = 25°C)
CHARACTERISTIC
DETECTOR
LED
Forward Voltage
SYMBOL
VF
TEST CONDITION
IF = 10 mA
MIN
TYP.
MAX
UNIT
1.0
1.15
1.3
V
Reverse Current
IR
VR = 5 V
⎯
⎯
10
μA
Capacitance
CT
V = 0, f = 1 MHz
⎯
15
⎯
pF
Off-State Current
IOFF
VOFF = 30 V, Ta = 50°C
⎯
⎯
1000
pA
Capacitance
COFF
V = 0, f = 100 MHz, t < 1 s
⎯
5
7
pF
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TLP3214
Coupled Electrical Characteristics (Ta = 25°C)
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
Trigger LED Current
IFT
ION = 100 mA
⎯
⎯
4
mA
Return LED Current
IFC
IOFF = 10 μA
0.2
0.75
⎯
mA
On-State Resistance
RON
ION = 250 mA, IF = 5 mA, t < 1 s
⎯
2
3
Ω
MIN
TYP.
MAX
UNIT
⎯
0.3
⎯
pF
⎯
Ω
Isolation Characteristics (Ta = 25°C)
CHARACTERISTIC
SYMBOL
Capacitance Input to Output
TEST CONDITION
VS = 0 V, f = 1 MHz
CS
Isolation Resistance
VS = 500 V, R.H. ≤ 60%
RS
5 × 10
BVS
10
14
1500
⎯
⎯
AC, 1 second (in oil)
⎯
3000
⎯
DC, 1 minute (in oil)
⎯
3000
⎯
Vdc
MIN
TYP.
MAX
UNIT
⎯
120
500
⎯
140
500
AC, 1 minute
Isolation Voltage
10
Vrms
Switching Characteristics (Ta = 25°C)
CHARACTERISTIC
SYMBOL
Turn-on Time
tON
Turn-off Time
tOFF
TEST CONDITION
RL = 200 Ω
VDD = 10 V, IF = 5 mA
(Note)
μs
Note: SWITCHING TIME TEST CIRCUIT
IF
1
4
RL
VDD
IF
VOUT
2
VOUT
90%
3
10%
tON
3
tOFF
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TLP3214
I F ─ Ta
I ON ─ Ta
(mA)
500
80
ION
400
60
Allowable On-sate current
Allowable forward current
IF
(mA)
100
40
20
0
-20
0
20
40
60
80
Ambient temperature
100
120
300
200
100
0
-20
0
Ta (°C)
20
I F ─ VF
(mA)
5
3
On-sate current
Forward current
I ON
10
IF
(mA)
30
1
0.5
0.3
0.8
1
1.2
1.4
VF
1.6
Ta (°C)
I F = 5 mA
200
100
0
-100
-200
-300
-1
1.8
-0.5
(V)
0
On-sate voltage
RON ─ Ta
0.5
VON
1
(V)
I FT ─ Ta
5
5
I ON = 250 mA
(mA)
I ON = 100 mA
I F = 5 mA
I FT
t < 1s
3
Trigger LED current
(Ω)
120
Ta = 25 °C
Forward voltage
RON
100
I ON ─ VON
Ta = 25 °C
0.1
0.6
On-sate resistance
80
300
50
2
1
0
-20
60
Ambient temperature
100
4
40
0
20
40
Ambient temperature
60
Ta
80
t < 1s
4
3
2
1
0
-20
100
(°C)
0
20
40
Ambient temperature
4
60
Ta
80
100
(°C)
2008-03-03
TLP3214
tON,tOFF ─ I F
tON,tOFF ─ Ta
300
1000
V DD = 10 V,
RL = 200 Ω
(µs)
V DD = 10 V,
tON,tOFF
300
t OFF
100
Switching time
Switching time
tON,tOFF
(µs)
Ta = 25 °C
30
10
t ON
3
1
10
IF
RL = 200 Ω
I F = 10 mA
200
t OFF
150
100
t ON
50
0
-20
100
Forward current
250
(mA)
0
20
40
60
Ambient temperature
I OFF ─ VOFF
Ta = 25 °C
Output terminal capacitance
COFF / COFF (0V)
(pA)
I OFF
(°C)
C OFF ─ VOFF
Ta = 25 °C
Off-state current
100
1
15
10
5
0
Ta
80
10
20
30
Off-state output voltage VOFF
0.8
0.6
0.4
0.2
0
40
(V)
10
20
30
Off-state output voltage VOFF
5
40
50
(V)
2008-03-03
TLP3214
Package Dimensions
Unit: mm
Tolerance:±0.1
4.2
φ1.4
③
②
④
①
3.65
1.9
0.15
1.8
0.2
①: ANODE
②: CATHODE
③: DRAIN
④: DRAIN
3.8
0.2
1.27
0.3
2.04
(0.46)
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2008-03-03
TLP3214
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2008-03-03