www.ti.com TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION SLLS825 – AUGUST 2007 FEATURES • • • • • • • D, DB, DW, OR PW PACKAGE (TOP VIEW) Operates With 3-V to 5.5-V VCC Supply Operates up to 1 Mbit/s Low Supply Current . . . 300 μA Typ External Capacitors . . . 4 × 0.1 μF Accept 5-V Logic Input With 3.3-V Supply Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection for RS-232 Pins – ±15-kV Human-Body Model (HBM) – ±15-kV IEC 61000-4-2 Air-Gap Discharge – ±8-kV IEC 61000-4-2 Contact Discharge C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 APPLICATIONS • • • • • • Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment DESCRIPTION/ORDERING INFORMATION The TRSF3232E consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). This device provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232E operates at data signaling rates up to 1 Mbit/s and a driver output slew rate of 14 V/μs to 150 V/μs. ORDERING INFORMATION PACKAGE (1) (2) TA SOIC – D 0°C to 70°C SOIC – DW SSOP – DB TSSOP – PW SOIC – D –40°C to 85°C SOIC – DW SSOP – DB TSSOP – PW (1) (2) ORDERABLE PART NUMBER Tube of 40 TRSF3232ECD Reel of 2500 TRSF3232ECDR Tube of 40 TRSF3232ECDW Reel of 2000 TRSF3232ECDWR Reel of 2000 TRSF3232ECDBR Tube of 90 TRSF3232ECPW Reel of 2000 TRSF3232ECPWR Tube of 40 TRSF3232EID SOIC – DW TRSF3232EIDR Tube of 40 TRSF3232EIDW TSSOP – PW TRSF3232EIDWR Reel of 2000 TRSF3232EIDBR Tube of 90 TRSF3232EIPW Reel of 2000 TRSF3232EIPWR TOP-SIDE MARKING TRSF3232EC TRSF3232EC RT32EC RT32EC TRSF3232EI TRSF3232EI RT32EI RT32EI Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS825 – AUGUST 2007 Table 1. 1-Mbit/s RS-232 Parts TEMPERATURE RANGE 0°C to 70°C –40°C to 85°C 2 NO. OF DRIVERS NO. OF RECEIVERS ESD SUPPLY VCC (V) FEATURE PIN/ PACKAGE TRSF3221E 1 1 ±15-kV Air-Gap Discharge, ±8-kV Contact Discharge, ±15-kV HBM 3.3 or 5 Auto-powerdown 16-pin SOIC, SSOP, TSSOP TRSF3232E 2 2 ±15-kV Air-Gap Discharge, ±8-kV Contact Discharge, ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP TRS3227 1 1 ±8-kV Air-Gap Discharge, ±8-kV Contact Discharge, ±15-kV HBM 3.3 or 5 Auto-powerdown plus, ready signal 16-pin SSOP TRSF3221 1 1 ±15-kV HBM 3.3 or 5 Auto-powerdown 16-pin SOIC, SSOP, TSSOP TRSF3222 2 2 ±15-kV HBM 3.3 or 5 Enable, powerdown signal 20-pin SOIC, SSOP, TSSOP TRSF3223 2 2 ±15-kV HBM 3.5 or 5 TRSF3232 2 2 ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP TRSF3238 5 3 ±15-kV HBM 3.3 or 5 Auto-powerdown plus 28-pin SOIC, SSOP, TSSOP TRSF3243 3 5 ±15-kV HBM 3.3 or 5 Auto-powerdown 28-pin SOIC, SSOP, TSSOP TRSF3221E 1 1 ±15-kV Air-Gap Discharge, ±8-kV Contact Discharge, ±15-kV HBM 3.3 or 5 Auto-powerdown 16-pin SOIC, SSOP, TSSOP TRSF3232E 2 2 ±15-kV Air-Gap Discharge, ±8-kV Contact Discharge, ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP TRS3227 1 1 ±8-kV Air-Gap Discharge, ±8-kV Contact Discharge, ±15-kV HBM 3.3 or 5 Auto-powerdown plus, ready signal 16-pin SSOP TRSF3221 1 1 ±15-kV HBM 3.3 or 5 Auto-powerdown 16-pin SOIC, SSOP, TSSOP TRSF3222 2 2 ±15-kV HBM 3.3 or 5 Enable, powerdown signal 20-pin SOIC, SSOP, TSSOP TRSF3223 2 2 ±15-kV HBM 3.3 or 5 TRSF3232 2 2 ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP TRSF3238 5 3 ±15-kV HBM 3.3 or 5 Auto-powerdown plus 28-pin SOIC, SSOP, TSSOP TRSF3243 3 5 ±15-kV HBM 3.3 or 5 Auto-powerdown 28-pin SOIC, SSOP, TSSOP PART NO. Submit Documentation Feedback 20-pin Auto-powerdown, SOIC, SSOP, enable signal TSSOP 20-pin Auto-powerdown, SOIC, SSOP, enable signal TSSOP www.ti.com TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION SLLS825 – AUGUST 2007 FUNCTION TABLES xxx Each Driver (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level Each Receiver (1) (1) INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 5 kW 9 8 ROUT2 RIN2 5 kW Submit Documentation Feedback 3 TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS825 – AUGUST 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive-output supply voltage range (2) –0.3 7 V 0.3 –7 V 13 V V– Negative-output supply voltage range V+ – V– Supply voltage difference (2) VI Input voltage range VO Output voltage range θJA (2) Package thermal impedance (3) (4) Operating virtual junction temperature Storage temperature range (4) 6 Receivers –25 25 Receivers Tstg (2) (3) –0.3 Drivers TJ (1) Drivers –13.2 13.2 –0.3 VCC + 0.3 D package 82 DB package 46 DW package 57 PW package 108 –65 UNIT V V °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC = 3.3 V Supply voltage VCC = 5 V Driver high-level input voltage VIL Driver low-level input voltage DIN Driver input voltage DIN VI TA (1) DIN VCC = 3.3 V VIH NOM MAX 3 3.3 3.6 4.5 5 5.5 UNIT V 2 VCC = 5 V V 2.4 0.8 Receiver input voltage TRSF3232EI Operating free-air temperature MIN TRSF3232EC 0 5.5 –25 25 –40 85 0 70 V V °C Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4). Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER ICC (1) (2) 4 Supply current TEST CONDITIONS No load, VCC = 3.3 V or 5 V MIN TYP (2) MAX 0.3 1 UNIT mA Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS825 – AUGUST 2007 DRIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.5 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS (3) Short-circuit output current ro Output resistance (1) (2) (3) MAX V V ±0.01 ±1 μA μA ±0.01 ±1 VCC = 3.6 V, VO = 0 V ±35 ±60 VCC = 5.5 V, VO = 0 V ±35 ±90 VCC, V+, and V– = 0 V, VO = ±2 V 300 UNIT mA Ω 10M Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER MIN TYP (2) MAX UNIT TEST CONDITIONS CL = 250 pF, VCC = 3 V to 4.5 V 1000 CL = 1000 pF, VCC = 3.5 V to 5.5 V 1000 Maximum data rate (see Figure 1) RL = 3 kΩ, One DOUT switching tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF, VCC = 3.3 V (1) (2) (3) kbit/s 300 14 ns 150 V/μs Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection TERMINAL NAME NO. DOUT 7, 14 TEST CONDITIONS TYP HBM ±15 IEC 61000-4-2 Air-Gap Discharge ±15 IEC 61000-4-2 Contact Discharge ±8 Submit Documentation Feedback UNIT kV 5 TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS825 – AUGUST 2007 RECEIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) MIN TYP (2) VCC – 0.6 VCC – 0.1 MAX V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 3 5 V V V 0.3 VI = ±3 V to ±25 V UNIT V 7 kΩ Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF 300 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF 300 ns tsk(p) Pulse skew (3) 300 ns (1) (2) (3) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4). All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection TERMINAL 6 NAME NO. RIN 8, 13 TEST CONDITIONS TYP HBM ±15 IEC 61000-4-2 Air-Gap Discharge ±15 IEC 61000-4-2 Contact Discharge ±8 Submit Documentation Feedback UNIT kV TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS825 – AUGUST 2007 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) Output tTLH 3V −3 V TEST CIRCUIT SR(tr) + t THL 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS TLH NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times Submit Documentation Feedback 7 TRSF3232E 3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION SLLS825 – AUGUST 2007 APPLICATION INFORMATION 1 − 16 + CBYPASS = 0.1 µF − + C1 VCC C1+ 2 V+ + C3 GND 15 − 14 3 DOUT1 C1− 13 4 C2+ + C2 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 V− − 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ VCC vs CAPACITOR VALUES A. VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF C3 can be connected to VCC or GND. Figure 4. Typical Operating Circuit and Capacitor Values 8 Submit Documentation Feedback www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TRSF3232ECD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDG4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232ECPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDG4 ACTIVE SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIDW ACTIVE SOIC DW 16 CU NIPDAU Level-1-260C-UNLIM 40 40 40 Addendum-Page 1 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TRSF3232EIDWG4 ACTIVE SOIC DW 16 TRSF3232EIDWR ACTIVE SOIC DW TRSF3232EIDWRG4 ACTIVE SOIC TRSF3232EIPW ACTIVE TRSF3232EIPWG4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3232EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TRSF3232ECDBR SSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) DB 16 2000 330.0 16.4 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.2 6.6 2.5 12.0 16.0 Q1 TRSF3232ECDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TRSF3232ECDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 TRSF3232ECPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 TRSF3232EIDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TRSF3232EIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TRSF3232EIDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 TRSF3232EIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3232ECDBR SSOP DB 16 2000 346.0 346.0 33.0 TRSF3232ECDR SOIC D 16 2500 346.0 346.0 33.0 TRSF3232ECDWR SOIC DW 16 2000 346.0 346.0 33.0 TRSF3232ECPWR TSSOP PW 16 2000 346.0 346.0 29.0 TRSF3232EIDBR SSOP DB 16 2000 346.0 346.0 33.0 TRSF3232EIDR SOIC D 16 2500 346.0 346.0 33.0 TRSF3232EIDWR SOIC DW 16 2000 346.0 346.0 33.0 TRSF3232EIPWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated