www.ti.com TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION SLLS826 – AUGUST 2007 FEATURES • • • • • • • • • • RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates up to 1000 kbit/s Five Drivers and Three Receivers Auto-Powerdown Plus Feature Enables Flexible Power-Down Mode Low Standby Current . . . 1 μA Typical External Capacitors . . . 4 × 0.1 μF Accept 5-V Logic Input With 3.3-V Supply Always-Active Noninverting Receiver Output (ROUT1B) ESD Protection for RS-232 Interface Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC61000-4-2, Contact Discharge – ±15-kV IEC61000-4-2, Air-Gap Discharge DB, DW, OR PW PACKAGE (TOP VIEW) C2 + GND C2− V− DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 DOUT5 FORCEON FORCEOFF Battery-Powered Systems PDAs Notebooks Subnotebooks Laptops Palmtop PCs Hand-Held Equipment Modems Printers 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 C1+ V+ VCC C1− DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DIN5 ROUT1B INVALID RHB PACKAGE (TOP VIEW) APPLICATIONS • • • • • • • • • 1 V− C2– GND C2+ C1+ V+ VCC NC • 32 31 30 29 28 27 26 25 DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 NC 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 C1– DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DOUT5 FORCEON FORCEOFF INVALID NC ROUT1B DIN5 NC 9 10 11 12 13 14 15 16 DESCRIPTION/ORDERING INFORMATION The TRSF3238E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD (HBM) protection on the driver output (DOUT) and receiver input (RIN) terminals. The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows applications using the ring indicator to transmit data while the device is powered down. The TRSF3238E operates at data signaling rates up to 1000 kbit/s. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 DESCRIPTION/ORDERING INFORMATION (CONTINUED) Flexible control options for power management are featured when the serial port and driver inputs are inactive. The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to 1 μA. By disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus occurs if there is no activity in the logic levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown plus enabled, the device activates automatically when a valid signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if all receiver input voltages are between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 5 for receiver input levels. ORDERING INFORMATION PACKAGE (1) (2) TA QFN – RHB SOIC – DW 0°C to 70°C SSOP – DB TSSOP – PW QFN – RHB SOIC – DW –40°C to 85°C SSOP – DB TSSOP – PW (1) (2) 2 ORDERABLE PART NUMBER Reel of 2000 TRSF3238ECRHBR Tube of 50 TRSF3238ECDW Reel of 2000 TRSF3238ECDWR Tube of 50 TRSF3238ECDB Reel of 2000 TRSF3238ECDBR Tube of 50 TRSF3238ECPW Reel of 2000 TRSF3238ECPWR Reel of 2000 TRSF3238EIRHBR Tube of 50 TRSF3238EIDW Reel of 2000 TRSF3238EIDWR Tube of 50 TRSF3238EIDB Reel of 2000 TRSF3238EIDBR Tube of 50 TRSF3238EIPW Reel of 2000 TRSF3238EIPWR TOP-SIDE MARKING RS38EC TRS3238EC TRS3238EC RS38EC RS38EI TRS3238EI TRS3238EI RS38EI Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Submit Documentation Feedback TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 FUNCTION TABLES abc Each Driver (1) INPUTS DIN (1) FORCEON FORCEOFF TIME ELAPSED SINCE LAST RIN OR DIN TRANSITION OUTPUT DOUT DRIVER STATUS X X L X Z Powered off L H H X H H H H X L Normal operation with auto-powerdown plus disabled L L H <30 s H H L H <30 s L L L H >30 s Z H L H >30 s Z Normal operation with auto-powerdown plus enabled Powered off by auto-powerdown plus feature H = high level, L = low level, X = irrelevant, Z = high impedance Each Receiver (1) INPUTS OUTPUTS RIN1 RIN2 AND RIN3 FORCEOFF TIME ELAPSED SINCE LAST RIN OR DIN TRANSITION ROUT1B ROUT2 AND ROUT3 RECEIVER STATUS Powered off while ROUT1B is active L X L X L Z H X L X H Z L L H <30 s L H L H H <30 s L L H L H <30 s H H H H H <30 s H L Open Open H <30 s L H (1) Normal operation with auto-powerdown plus disabled/enabled H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off Submit Documentation Feedback 3 TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 LOGIC DIAGRAM (POSITIVE LOGIC) DIN1 DIN2 DIN3 DIN4 DIN5 FORCEOFF FORCEON ROUT1B ROUT1 ROUT2 ROUT3 4 24 5 23 6 22 7 19 10 17 12 DOUT1 DOUT2 DOUT3 DOUT4 DOUT5 14 13 Auto-Powerdown Plus 15 INVALID 16 21 8 20 9 18 11 RIN1 RIN2 RIN3 Submit Documentation Feedback TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive-output supply voltage range (2) –0.3 7 V 0.3 –7 V 13 V V– Negative-output supply voltage range V+ – V– Supply voltage difference (2) VI Input voltage range VO Output voltage range θJA (2) Driver (FORCEOFF, FORCEON) –0.3 6 Receiver –25 25 Driver Receiver (INVALID) Package thermal impedance (3) (4) –13.2 13.2 –0.3 VCC + 0.3 DB package 62 DW package 46 PW package 62 RHB package TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) UNIT V V °C/W TBD –65 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) See Figure 6 MIN NOM VCC = 3.3 V Supply voltage VCC = 5 V VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON VI Receiver input voltage TA Operating free-air temperature (1) 3.3 3.6 4.5 5 5.5 VCC = 3.3 V VCC = 5 V 2 5.5 2.4 5.5 UNIT V V 0 0.8 V –25 25 V 0 70 –40 85 TRSF3238EC TRSF3238EI MAX 3 °C Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER II ICC (1) (2) Input leakage current Supply current (TA = 25°C) TEST CONDITIONS FORCEOFF, FORCEON MIN TYP (2) MAX ±0.01 ±1 μA 0.5 2 mA Auto-powerdown plus disabled No load, FORCEOFF and FORCEON at VCC, VCC at 3.3 V or 5 V Powered off No load, FORCEOFF at GND 1 10 Auto-powerdown plus enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded 1 10 UNIT μA Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback 5 TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 DRIVER SECTION xxx Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER MIN TYP (2) MAX TEST CONDITIONS VOH High-level output voltage All DOUT at RL = 3 kΩ to GND 5 5.4 VOL Low-level output voltage All DOUT at RL = 3 kΩ to GND –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND Short-circuit output current (3) VO = 0 V ro Output resistance VCC, V+, and V– = 0 V, IOZ Output leakage current FORCEOFF = GND (1) (2) (3) V V ±0.01 IOS ±1 μA μA ±0.01 ±1 VCC = 3.6 V ±35 ±60 VCC = 5.5 V ±40 ±100 VO = ±2 V 300 UNIT mA Ω 10M VO = ±12 V, VCC = 3 V to 3.6 V ±25 VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 μA Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER MIN TYP (2) MAX TEST CONDITIONS CL = 1000 pF Maximum data rate (see Figure 1) RL = 3 kΩ, One DOUT switching CL = 250 pF, VCC = 3 V to 4.5 V 1000 CL = 1000 pF, VCC = 4.5 V to 5.5 V 1000 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) CL = 150 pF to 1000 pF, RL = 3 kΩ to 7 kΩ, VCC = 3.3 V (1) (2) (3) UNIT 250 kbit/s 25 18 ns 150 V/μs Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection PARAMETER DOUT 6 TEST CONDITIONS TYP HBM ±15 IEC 61000-4-2, Air-Gap Discharge ±15 IEC 61000-4-2, Contact Discharge ±8 Submit Documentation Feedback UNIT kV TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 RECEIVER SECTION xxx Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VCC – 0.6 VCC – 0.1 MAX 1.5 2.4 VCC = 5 V 1.8 2.4 VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) IOZ Output leakage current (except ROUT1B) FORCEOFF = 0 V ri Input resistance VI = ±3 V to ±25 V VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 UNIT V VCC = 3.3 V Positive-going input threshold voltage (2) TYP (2) 0.4 VIT+ (1) MIN TEST CONDITIONS V V V 0.3 V ±0.05 ±10 μA 5 7 kΩ 3 Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF, See Figure 3 150 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 150 ns ten Output enable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tdis Output disable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tsk(p) Pulse skew (3) See Figure 3 50 ns (1) (2) (3) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection PARAMETER RIN TEST CONDITIONS TYP HBM ±15 IEC 61000-4-2, Air-Gap Discharge ±15 IEC 61000-4-2, Contact Discharge ±8 Submit Documentation Feedback UNIT kV 7 TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 AUTO-POWERDOWN PLUS SECTION xxx Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN VT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VT–(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC –2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC –0.3 VOH INVALID high-level output voltage IOH = –1 mA, FORCEON = GND, FORCEOFF = VCC VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND, FORCEOFF = VCC MAX 2.7 UNIT V V 0.3 VCC – 0.6 V V 0.4 V Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TYP (1) MAX UNIT tvalid Propagation delay time, low- to high-level output 0.1 μs tinvalid Propagation delay time, high- to low-level output 50 μs ten Supply enable time 25 tdis Receiver or driver edge to auto-powerdown plus (1) 8 MIN All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback 15 30 μs 60 s TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 Ω RL tTHL CL (see Note A) 3V FORCEOFF TEST CIRCUIT 0V 3V 3V Output SR(tr) + tTLH −3 V −3 V 6V t THL or tTLH VOH VOL VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL tPLH VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3 V or 0 V FORCEON 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) tPHL 50 Ω 3V FORCEOFF tPLH CL (see Note A) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times Submit Documentation Feedback 9 TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 PARAMETER MEASUREMENT INFORMATION (continued) 3V Input VCC 3 V or 0 V FORCEON 1.5 V 0V tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V GND S1 VOH Output 50% Output CL (see Note A) FORCEOFF Generator (see Note B) 0.3 V tPLZ (S1 at VCC) 50 Ω tPZL (S1 at VCC) 0.3 V Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. C. tPLZ and tPHZ are the same as tdis. D. tPZL and tPZH are the same as ten. Figure 4. Receiver Enable and Disable Times 10 Submit Documentation Feedback TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 PARAMETER MEASUREMENT INFORMATION (continued) ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ Valid RS-232 Level, INVALID High ROUT Generator (see Note B) 2.7 V 50 Ω Indeterminate 0.3 V 0V −0.3 V Indeterminate AutoPowerdown Plus INVALID −2.7 V CL = 30 pF (see Note A) Valid RS-232 Level, INVALID High † FORCEOFF FORCEON If Signal Remains Within This Region For More Than 30 µs, INVALID Is Low† DIN DOUT Auto-powerdown plus disables drivers and reduces supply current to 1 µA. TEST CIRCUIT NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Receiver Input 3V 2.7 V 0V 0V −2.7 V −3 V tinvalid tvalid INVALID Output Driver Input 50% VCC 50% 0V 3 V to 5 V 50% 50% 0V ≈5.5 V Driver Output ≈ −5.5 V tdis ten tdis ten V+ Supply Voltages V+ V+ −0.3 V V− +0.3 V V− V− Voltage Waveforms and Timing Diagrams Figure 5. INVALID Propagation-Delay Times and Supply-Enabling Time Submit Documentation Feedback 11 TRSF3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION www.ti.com SLLS826 – AUGUST 2007 APPLICATION INFORMATION CBYPASS = 0.1 µF + − 1 2 + C2 27 + GND − 4 + V+ 28 − 3 − C1+ C2+ C2− VCC V− C1− C4 DOUT1 DOUT2 DOUT3 RIN1 C3† + − 26 C1 25 5 24 6 23 7 22 8 21 9 20 DIN1 DIN2 DIN3 ROUT1 RS-232 Port RIN2 ROUT2 Logic I/Os 5 kΩ DOUT4 RIN3 10 19 11 18 DIN4 ROUT3 5 kΩ DOUT5 12 17 16 DIN5 ROUT1B 5 kΩ FORCEON FORCEOFF 13 14 AutoPowerdown Plus 15 INVALID VCC vs CAPACITOR VALUES VCC † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. 3.3 V ± 0.15 V 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V Figure 6. Typical Operating Circuit and Capacitor Values 12 Submit Documentation Feedback C1 0.1 µF 0.22 µF 0.047 µF 0.22 µF C2, C3, and C4 0.1 µF 0.22 µF 0.33 µF 1 µF PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TRSF3238ECDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238ECDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238ECDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238ECDWG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238ECDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDWG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TRSF3238EIDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2007 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TRSF3238ECDBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 TRSF3238ECDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 TRSF3238EIDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 TRSF3238EIDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TRSF3238ECDBR SSOP DB 28 2000 367.0 367.0 38.0 TRSF3238ECDWR SOIC DW 28 1000 367.0 367.0 55.0 TRSF3238EIDBR SSOP DB 28 2000 367.0 367.0 38.0 TRSF3238EIDWR SOIC DW 28 1000 367.0 367.0 55.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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