SCDS163A − MAY 2004 − REVISED MAY 2004 D Wide Bandwidth (BW = 300 MHz Min) D Low Differential Crosstalk D Data and Control Inputs Provide D (XTALK = −60 dB Typ) D Low Power Consumption (ICC = 3 mA Max) D Bidirectional Data Flow, With Near-Zero D Propagation Delay Low ON-State Resistance (ron = 3 W Typ) VCC Operating Range From 6 V to 6.5 V Ioff Supports Partial-Power-Down Mode Operation 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC E ID0 ID1 YD IC0 IC1 YC IA0 IA1 YA IB0 IB1 YB VCC 1 1 16 PW PACKAGE (TOP VIEW) NC S IA0 IA1 YA IB0 IB1 YB GND NC 15 E 14 ID0 2 3 13 ID1 12 YD 4 5 6 7 8 9 YC S IA0 IA1 YA IB0 IB1 YB GND RGY PACKAGE (TOP VIEW) S D OR DBQ PACKAGE (TOP VIEW) D GND D D D Undershoot Clamp Diode Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 − 2000-V Human-Body Model (A114-B, Class II) − 1000-V Charged-Device Model (C101) Suitable for Both 10 Base-T/100 Base-T Signaling 11 IC0 10 IC1 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 NC VCC E ID0 ID1 YD IC0 IC1 YC NC NC − No internal connection description/ordering information The TI TS5L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled and the I port is connected to the Y port. When E is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer. ORDERING INFORMATION QFN − RGY SOIC − D 0°C to 70°C ORDERABLE PART NUMBER PACKAGE† TA SSOP (QSOP) − DBQ TSSOP − PW Tape and reel TS5L100RGYR Tube TS5L100D Tape and reel TS5L100DR Tape and reel TS5L100DBQR Tube TS5L100PW Tape and reel TS5L100PWR TOP-SIDE MARKING TG100 TS5L100 TG100 TG100 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" #!$% &"' &! #" #" (" " ") !" && *+' &! #", &" ""%+ %!&" ", %% #""' POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCDS163A − MAY 2004 − REVISED MAY 2004 description/ordering information (continued) This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS E INPUT/OUTPUT YX S FUNCTION L L H IX0 IX1 YX = IX0 L H X Z Disconnect YX = IX1 PIN DESCRIPTIONS PIN NAME IAn−IDn S Select input E Enable input YA−YD 2 DESCRIPTION Data I/Os Data I/Os POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCDS163A − MAY 2004 − REVISED MAY 2004 logic diagram (positive logic) 2 4 IA0 YA 3 IA1 YB 7 5 IB0 6 IB1 9 11 YC 10 YD 12 14 13 S IC0 IC1 ID0 ID1 1 15 Control Logic E POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCDS163A − MAY 2004 − REVISED MAY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W (see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W (see Note 5): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W (see Note 6): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground, unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. VI and VO are used to denote specific conditions for VI/O. 4. II and IO are used to denote specific conditions for II/O. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 7) MIN MAX UNIT VCC VIH Supply voltage 6 6.5 V High-level control input voltage (E, S) 2.5 6.5 V VIL TA Low-level control input voltage (E, S) 0 0.8 V Operating free-air temperature 0 70 °C NOTE 7: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCDS163A − MAY 2004 − REVISED MAY 2004 electrical characteristics over recommended VCC = 6 V to 6.5 V (unless otherwise noted) PARAMETER VIK Vhys E, S operating free-air TEST CONDITIONS VCC = 6 V, IIN = −18 mA E = low, temperature range, TYP† MAX UNIT −1.8 V MIN E, S 150 VO IIH E, S VI = 4.5 V, VCC = 6.5 V, IIL E, S VCC = 6.5 V, RL = 100 Ω, see Figure 11 3.7 mV 4.06 VIN = VCC VIN = GND V ±1 µA ±1 µA ±1 µA IOZ‡ VCC = 6.5 V, VO = 0 to 6.5 V, VI = 0, IOS§ VCC = 6.5 V, VO = 0 to 0.5 VCC, VI = 0, Switch ON Ioff ICC VCC = 0, VCC = 6.5 V, VO = 0 to 6.5 V, II/O = 0, VI = 0 Switch ON or OFF 1 3 µA VCC = 6.5 V, One input at 3.4 V, Other inputs at VCC or GND 6 mA VCC = 6.5 V, I and Y ports open, VIN input switching 50% duty cycle 0.35 mA/ MHz ∆ICC E, S ICCD CIN E, S Y port CON M2 mA 3.5 µA pF 4.5 VI = 0, f = 1 MHz, Outputs open, Switch OFF VI = 0, f = 1 MHz, Outputs open, Switch ON VI = 4.5 V, Switch ON, RL = 100 Ω, see Figure 11 M1 ron 50 f = 1 MHz I port COFF Switch OFF pF 6.5 14 pF 7.5 11.2 19 2 3 6 1 2 VI = 4.5 V, Switch ON ∆ron VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. † All typical values are at VCC = 6.2 V (unless otherwise noted), TA = 25°C. ‡ For I/O ports, IOZ includes the input leakage current. § The IOS test is applicable to only one ON channel at a time. The duration of this test is less than one second. Ω Ω switching characteristics over recommended operating free-air temperature range, VCC = 6 V to 6.5 V, RL = 100 Ω, CL = 35 pF (unless otherwise noted) (see Figure 7) PARAMETER FROM (INPUT) TO (OUTPUT) tON S Y 7 ns tOFF S Y 4 ns MIN MAX UNIT † All typical values are at VCC = 6.2 V (unless otherwise noted), TA = 25°C. dynamic characteristics over recommended VCC = 6 V to 6.5 V (unless otherwise noted) PARAMETER operating TEST CONDITIONS free-air temperature range, MIN TYP† UNIT −40 −60 dB dB MAX XTALK(Diff) XTALK RL = 100 Ω, f = 10 MHz, see Figure 12, RL = 100 Ω, f = 30 MHz, see Figure 9 −50 OIRR RL = 100 Ω, f = 30 MHz, see Figure 10 −40 dB BW RL = 100 Ω, see Figure 8 350 MHz tr = tf = 2 ns † All typical values are at VCC = 6.2 V (unless otherwise noted), TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCDS163A − MAY 2004 − REVISED MAY 2004 OPERATING CHARACTERISTICS 6 50 45 5 25°C 70°C 40 ron − ON Resistance − Ω 4 30 25 3 VO 20 2 25°C 70°C 15 10 1 ron 5 0 0 0 1 2 3 4 VI − Input Voltage − V Figure 1. ron and VO vs VI Over Temperature (VCC = 6 V) 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 6 VO − Output Voltage − V 35 SCDS163A − MAY 2004 − REVISED MAY 2004 OPERATING CHARACTERISTICS 6 50 45 5 ron − ON Resistance − Ω 35 4 30 25 3 VO 20 VO − Output Voltage − V 40 2 15 10 ron 1 5 0 0 0 1 2 3 VI − Input Voltage − V 4 5 6 Figure 2. ron and VO vs VI (VCC = 6.2 V and TA = 255C) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SCDS163A − MAY 2004 − REVISED MAY 2004 OPERATING CHARACTERISTICS 0 0 −5 −1 Phase −10 Gain −3 −15 −20 Gain − dB −4 −25 −5 −30 −6 −35 −7 −40 −8 −45 −9 1 10 100 Frequency − MHz Gain −3 dB at 501.2 MHz Phase at −3-dB Frequency, −31.7 Degrees Figure 3. Gain/Phase vs Frequency 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 −50 600 Phase − Deg −2 SCDS163A − MAY 2004 − REVISED MAY 2004 OPERATING CHARACTERISTICS 0 250 −10 200 150 −20 100 50 −40 0 −50 −50 −60 Phase − Deg Off Isolation − dB Phase −30 −100 Off Isolation −70 −150 −80 −200 −250 −90 1 10 100 600 Frequency − MHz Off Isolation at 30 MHz, −52.1 dB Phase at 30 MHz, 77 Degrees Figure 4. Off Isolation vs Frequency 0 250 −10 200 −20 150 −40 −50 Phase Phase − Deg Crosstalk − dB −30 100 −60 Crosstalk −70 50 −80 −90 1 10 100 0 600 Frequency − MHz Crosstalk at 30 MHz, −54 dB Phase at 30 MHz, 93.2 Degrees Figure 5. Crosstalk vs Frequency POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SCDS163A − MAY 2004 − REVISED MAY 2004 OPERATING CHARACTERISTICS 3 2.5 2 1.5 VI+ VI− 1 0.5 0 Voltage − V 0.01 0.005 Differential Crosstalk 0 −0.005 −0.01 0.04 0.03 0.02 0.01 0 −0.01 −0.02 −0.03 −0.04 −0.05 23 VO+ VO− 43 63 83 Time − ns Figure 6. Differential Crosstalk 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 100 120 SCDS163A − MAY 2004 − REVISED MAY 2004 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VS 50 Ω S 50 Ω VG1 IX0 DUT VX0 D IX1 VO CL (see Note A) E RL VX1 TEST VCC RL CL VX0 VX1 tON 6.2 V 6.2 V 100 Ω 100 Ω 35 pF 35 pF GND 4.5 V 4.5 V GND tOFF 6.2 V 6.2 V 100 Ω 100 Ω 35 pF 35 pF GND 4.5 V 4.5 V GND TEST CIRCUIT 3V Output Control (VIN) 50% 50% 0V tON Analog Output Waveform (VO) tOFF 90% 90% VOH 0V VOLTAGE WAVEFORMS tON AND tOFF TIMES NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. C. The outputs are measured one at a time, with one transition per measurement. Figure 7. Test Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 SCDS163A − MAY 2004 − REVISED MAY 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC IA0 YA RL = 100 Ω S DUT VS E VE Figure 8. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VS = 0, VE = 0, and YA is the input, the output is measured at IA0. All unused analog I/O ports are left open. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCDS163A − MAY 2004 − REVISED MAY 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC YA IA0 RL = 100 Ω S 50 Ω† VS E DUT VE IB0 YB RL = 100 Ω † A 50-Ω termination resistor is needed for the network analyzer. Figure 9. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VS = 0, VE = 0, and YA is the input, the output is measured at IB0. All unused analog input (Y) ports are connected to GND, and output (A) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 SCDS163A − MAY 2004 − REVISED MAY 2004 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS Network Analyzer (HP8753ES) VBIAS P1 P2 VCC IA0 YA RL = 100 Ω S DUT VS IA1 E RL = 100 Ω 50 Ω† VE † A 50-Ω termination resistor is needed for the network analyzer. Figure 10. Test Circuit for Off Isolation (OIRR) Off isolation is measured at the output of the OFF channel. For example, when VS = VCC, VE = 0, and YA is the input, the output is measured at IA0. All unused analog input (Y) ports are left open, and output (A) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCDS163A − MAY 2004 − REVISED MAY 2004 PARAMETER MEASUREMENT INFORMATION Switch ON VI = 4.5 V VO M1 EN† RL = 100 Ω Switch ON M2 EN† † EN is the internal enable signal applied to the switch. NOTE A: ron (M1) and ron (M2) are calculated from the voltage drop and current across the two terminals of M1 and M2, respectively. Figure 11. Test Circuit for VO and ron VCC = 6.2 V 0.1 µF Oscilloscope S VO+ 16 IA0 2 15 IA1 3 14 ID0 4 13 ID1 YA 100 Ω 100 Ω VO− VCC 1 TS5L100 Z YD IB0 5 12 IB1 6 11 IC0 7 10 IC1 8 9 YB GND VI+ 100 Ω 100 Ω YC Pulse Generator VI− Figure 12. Differential Crosstalk Measurement Differential crosstalk is a measure of coupling noise between a transmit and receive pair in the LAN application. Differential crosstalk depends on the edge rate, frequency, and load. This is calculated from the equation, XTALK(Diff) db = 20 log VO(Diff)/VI(Diff), where VO(Diff) is the differential output voltage and VI(Diff) is the differential input voltage. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15 PACKAGE OPTION ADDENDUM www.ti.com 30-Aug-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS5L100D ACTIVE SOIC D 16 TS5L100DBQR ACTIVE SSOP/ QSOP DBQ TS5L100DBQRE4 ACTIVE SSOP/ QSOP TS5L100DE4 ACTIVE TS5L100DR 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SOIC D 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS5L100RGYR ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TS5L100RGYRG4 ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR 40 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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