TXS0302 SCES835 – NOVEMBER 2011 www.ti.com 2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION SENSING Check for Samples: TXS0302 • • • • • • • • • Fully Symmetric Supply Voltages. 0.9-V to 3.6-V on A Port and B Port Max Open Drain Data Rate: 8Mbps Internal Pull-up Resistors: 4.7-kΩ VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State OE Input Circuit Referenced to VCCA Low Power Consumption, 4-µA Max ICCA + ICCB Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114) – 500-V Machine Model (C101) DQE OR DQM PACKAGE (TOP VIEW) VCCA A1 A2 GND 1 8 2 7 3 6 4 5 VCCB B1 B2 OE DESCRIPTION/ORDERING INFORMATION This 2-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 0.9 V to 3.6 V. This allows for low-voltage bidirectional translation between 1-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V and 3.3-V voltage nodes. For the TXS0302, when the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The TXS0302 is designed so that the OE input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. For typical application circuitry, refer to Figure 1. Functional Table Inputs Output OE VCCA/VCCB An/Bn Bn/An H H L L H H H H H L X 3-State L X X 3-State 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2011, Texas Instruments Incorporated PRODUCT PREVIEW FEATURES 1 TXS0302 SCES835 – NOVEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PACKAGE (2) TA Reel of 5000 TXS0302DQER PREVIEW DQM – MicroQFN Reel of 3000 TXS0302DQMR PREVIEW Reel of 3000 TXS0302YFPR PREVIEW Reel of 3000 TXS0302YZPR PREVIEW YFP - NanoStar (DSBGA) ) TM YZP - NanoStar (DSBGA (1) (2) (3) TOP-SIDE MARKING (3) DQE – MicroQFN TM –40°C to 85°C ORDERABLE PART NUMBER – WCSP – WCSP For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free). TERMINAL FUNCTIONS PIN NO. NAME DESCRIPTION PRODUCT PREVIEW YFP/YZP DQE/DQM TXS0302 A1 1 VCCA B1 2 A1 Input/output 1. Referenced to VCCA. C1 3 A2 Input/output 2. Referenced to VCCA. D1 4 GND D2 5 OE 3-state output-mode enable; Pull OE low to place all outputs in 3-state mode. C2 6 B2 Input/output 2. Referenced to VCCB. B2 7 B1 Input/output 1. Referenced to VCCB. A2 8 VCCB A-port supply voltage 0.9 V ≤ VCCA ≤ 3.6 V Ground B-port supply voltage 0.9 V ≤ VCCB ≤ 3.6 V. TYPICAL OPERATING CIRCUIT 1.8 V 3.3 V 0.1 μF 0.1 μF 1.8 V System Controller Data VCCA VCCB OE A1 A2 B1 B2 1 μF 3.3 V System Data Figure 1. 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TXS0302 PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TXS0302DQER PREVIEW X2SON DQE 8 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS0302DQMR PREVIEW X2SON DQM 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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