TI SN74HCT04IDRQ1

SCLS535A − AUGUST 2003 − REVISED APRIL 2008
D Qualified for Automotive Applications
D ESD Protection Exceeds 2000 V Per
D
D
D
D
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Operating Voltage Range of 4.5 V to 5.5 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 20-µA Max ICC
Typical tpd = 13 ns
D ±4-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
D Inputs Are TTL-Voltage Compatible
D PACKAGE
(TOP VIEW)
1A
1Y
2A
2Y
3A
3Y
GND
description/ordering information
This device contains six independent inverters. It
performs the Boolean function Y = A in positive logic.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
ORDERING INFORMATION{
TA
ORDERABLE
PART NUMBER
PACKAGE‡
TOP-SIDE
MARKING
−40°C to 85°C
SOIC − D
Reel of 2500
SN74HCT04IDRQ1
HCT04IQ1
† For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
logic diagram (positive logic)
A
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2008, Texas Instruments Incorporated
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS535A − AUGUST 2003 − REVISED APRIL 2008
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
NOM
MAX
4.5
5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
∆t/∆v
Output voltage
0
High-level input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2
UNIT
V
V
Input transition rise/fall time
0.8
V
VCC
VCC
V
500
ns
V
TA
Operating free-air temperature
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
VI = VIH or VIL
IOH = −20 µA
IOH = −4 mA
4.5 V
VOL
VI = VIH or VIL
IOL = 20 µA
IOL = 4 mA
4.5 V
II
ICC
VI = VCC or 0
VI = VCC or 0,
∆ICC‡
One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC
5.5 V
IO = 0
TA = 25°C
TYP
MAX
5.5 V
MIN
4.4
4.499
4.4
3.98
4.3
3.84
MAX
V
0.1
0.1
0.17
0.26
0.33
±0.1
±100
±1000
nA
2
20
µA
1.4
2.4
2.9
mA
3
10
10
pF
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
0.001
5.5 V
4.5 V
to 5.5 V
Ci
MIN
V
SCLS535A − AUGUST 2003 − REVISED APRIL 2008
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
tt
VCC
Y
MIN
TA = 25°C
TYP
MAX
MIN
MAX
4.5 V
14
20
25
5.5 V
13
18
23
4.5 V
9
15
19
5.5 V
8
14
17
UNIT
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per inverter
No load
TYP
UNIT
20
pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
3V
Test
Point
Input
1.3 V
1.3 V
0V
CL = 50 pF
(see Note A)
tPLH
In-Phase
Output
LOAD CIRCUIT
1.3 V
10%
tPHL
90%
90%
tr
Input 1.3 V
0.3 V
2.7 V
2.7 V
tr
tPHL
3V
1.3 V
0.3 V 0 V
Out-of-Phase
Output
90%
tf
VOH
1.3 V
10% V
OL
tf
tPLH
1.3 V
10%
tf
1.3 V
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jul-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74HCT04IDRQ1
ACTIVE
SOIC
D
Pins Package Eco Plan (2)
Qty
14
2500 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74HCT04-Q1 :
SN74HCT04
• Catalog:
Product: SN74HCT04-EP
• Enhanced
• Military: SN54HCT04
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
Product - Supports Defense, Aerospace and Medical Applications
• Enhanced
• Military - QML certified for Military and Defense Applications
Addendum-Page 1
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