Features • • • • • • • • • • • Contactless Power Supply and Communication Interface Up to 10 kbaud Data Rate (R/O) Power Management for Contactless and Battery Power Supply Frequency Range 100 kHz to 150 kHz 32 x 16-bit EEPROM Two-wire Serial Interface Shift Register Supported Bi-phase and Manchester Modulator Stage Reset I/O Line Field Clock Extractor Field and Gap Detection Output for Wake-up and Data Reception Field Modulator with Energy-saving Damping Stage Applications • Main Areas – Access Control – Telemetry – Wireless Sensors • Examples: – Wireless Passive Access and Active Alarm Control for Protection of Valuables – Contactless Position Sensors for Alignments of Machines – Contactless Status Verification and/or Data Readout from Sensors Transponder Interface for Microcontroller U3280M Description The U3280M is a transponder interface for use in contactless ID systems, remote control systems, tag and sensor applications. It supplies the microcontroller with power from an RF field via an LC-resonant circuit and it enables contactless bi-directional data communication via this RF field. It includes power management that handles switching between the magnetic field and a battery power supply. To store permanent data like an identifier code and configuration data, the U3280M includes a 512-bit EEPROM with a serial interface. Figure 1. Block Diagram U3280M Transponder Interface Energy VField regulator Sensors, keys, displays, actuators NRST Damping stage VDD Coil 1 512-bit EEPROM memory Rectifier Coil 2 Data VBatt Power management Low power microcontroller SDA Field/gap detect Serial interface Clock extractor Bi-phase modulator FC > _1 NGAP MOD SCL VSS Transmit data Receive data/field detected Field clock Rev. 4688B–RFID–12/04 Pin Configuration Figure 2. Pinning VBatt VDD SCL NRST SDA VSS NC FC 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 Coil 2 Coil 1 NC NC NC NC NGAP MOD Pin Description 2 Pin Symbol Function 1 VBatt Power supply voltage input to connect a battery 2 VDD Power supply voltage for the microcontroller and EEPROM. At this pin a buffer capacitor (0.5 to 10 µF) must be connected to buffer the voltage during field supply and to block the VDD of the microcontroller. 3 SCL Serial clock line 4 NRST 5 SDA Serial data line 6 VSS Circuit ground 7 NC Not connected 8 FC Field clock output of the front-end clock extractor 9 MOD Modulation input 10 NGAP Gap and field detect output 11 NC Not connected 12 NC Not connected 13 NC Not connected Reset line bi-directional 14 NC 15 Coil 1 Coil input 1. Use pin to connect a resonant circuitry for communication and field supply Not connected 16 Coil 2 Coil input 2. Use pin to connect a resonant circuitry for communication and field supply U3280M 4688B–RFID–12/04 U3280M Functional Description Transponder Interface The U3280M is a transponder interface IC that can operate microcontrollers using wireless technology and battery independently. Wireless data communication and the power supply are handled via an electromagnetic field and the coil antenna of the transponder interface. The U3280M consists of a rectifier stage for the antenna, power management to handle field and battery power supplies, a damping modulator, and a field-gap detection stage for contactless data communication. Furthermore, a field clock extraction and an EEPROM are on-chip. The internal rectifier stage rectifies the AC from the LC-resonant circuit at the coil inputs and supplies the U3280M device and an additional microcontroller device with power. It is also possible to supply the device via the VBatt input with DC from a battery. The power management handles switching between battery supply (VBatt pin) and field supply automatically. It switches to field supply if a field is applied at the coil, and it switches back to battery if the field is removed. The voltage from the coil or the VBatt pin is output at the VDD pin to supply the microcontroller or any other suited device. At the VDD pin a capacitor must be connected to smooth and buffer the supply voltage. This capacitor is also necessary to buffer the supply voltage during communication (damping and gaps in the field). For communication, the chip contains a damping stage and gap-detect circuitry. By means of the damping stage the coil voltage can be modulated to transmit data via the field. It can be controlled with the modulator input (MOD pin) via the microcontroller. The gap-detection circuitry detects gaps in the field and outputs the gap/field signal at the gap-detect output (Pin NGAP). To store data like keycodes, identifiers and configuration bits, a 512-bit EEPROM is available on-chip. It can be read and written by the microcontroller via a two-wire serial interface. The serial interface, the EEPROM and the microcontroller are supplied with the voltage at the VDD pin. That means the microcontroller can read and write the EEPROM if the supply voltage at VDD is in the operating range of the IC. The U3280M has built-in operating modes to support a wide range of applications. These modes can be activated via the serial interface with special mode control bytes. To support applications with battery supply only, power management can be switched off by software to disable the automatic switching to field supply. An on-chip Bi-phase and Manchester modulator can be activated and controlled by the serial interface. If this modulator is used, it modulates the serial data stream at the serial inputs SDA and SCL into a Bi-phase or Manchester-coded signal for the damping stage. Modulation The transponder interface can modulate the magnetic field by its damping stage to transmit data to a base station. It modulates the coil voltage by varying the coil’s load. The modulator can be controlled via the MOD pin. A high level (“1”) increases the current into the coil and damps the coil voltage. A low level (“0”) decreases the current and increases the coil voltage. The modulator generates a voltage stroke of about 2 Vpp at the coil. A high level at the MOD pin makes the maximum of the field energy available at VDD. During reset mode, a high level at the MOD pin causes optimum conditions for starting the device and charging the capacitor at VDD after the field has been applied at the coil. 3 4688B–RFID–12/04 Digital Input to Control the Damping Stage (MOD) MOD = 0: coil not damped V coil-peak = V DD × 2 + V CMS = V CU MOD = 1: coil damped V coil-peak = V DD × 2 = V CD VCMS = VCID: modulation voltage stroke at coil inputs Note: If the automatic power management is disabled, the internal front-end VDD is limited at VDDC. In this case the value VDDC must be used in the above formula. Field Clock The field clock extractor of the interface makes the field clock available for the microcontroller. It can be used to supply timer inputs to synchronize modulation and demodulation with the field clock. Gap Detect The transponder interface can also receive data. The base station modulates the data with short gaps in the field. The gap-detection circuit detects these gaps in the magnetic field and outputs the NGAP/field signal at the NGAP pin. A high level indicates that a field is applied at the coil and a low level indicates a gap or that the field is off. The microcontroller must demodulate the incoming data stream at one of its inputs. U3280M Signals and Timing Figure 3. Modulation MOD VCU VCMS VCD Coil inputs Figure 4. GAP and Modulation Timing Gap detection and battery to field switching t FGAP1 t FGAP0 V FDON V FDOFF Coil inputs 1. edge used as wakeup signal NGAP Field clock FC Power management Battery supply t BFS 4 Battery supply Coil supply if automatically power management is enabled tFBS U3280M 4688B–RFID–12/04 U3280M Digital Output of the Gap-detection Stage (NGAP) NGAP = 0: gap detected/no field Vcoil-peak = VFDoff NGAP = 1: field detected Vcoil-peak = VFDon Wake-up Signal If a field is applied at the coil of the transponder interface, the microcontroller can be woken up with the wake-up signal at the NGAP pin. For that purpose, the NGAP pin must be connected to an interrupt input of the microcontroller. A high level at the NGAP output indicates an applied field and can be used as a wake-up signal for the microcontroller via an interrupt. The wake-up signal is generated if power management switches to field supply. The field-detection stage of the power management has lowpass characteristics to avoid generating wake-up signals and unnecessary switching between battery and field supply in case of interferences at the coil inputs. Power Supply The U3280M has a power management that handles two power supply sources. Normally, the IC is supplied by a battery at the VBatt pin. If a magnetic field is applied at the LC-resonant circuit of the device, the field detection circuit switches automatically from VBatt to field supply. Note: No amplifier is used in the gap-detection stage. A digital Schmitt trigger evaluates the rectified and smoothed coil voltage. The VDD pin is used to connect a capacitor to smooth the voltage from the rectifier and to buffer the power while the field is modulated by gaps and damping. The EEPROM and the connected controller always operate with the voltage at the VDD pin. Note: Automatic Power Management During field supply the maximum energy from the field is used if a high level is applied at the MOD input. There are different conditions that cause a switch from the battery to field and back from field to the battery. The power management switches from battery to field if the rectified voltage (Vcoil) from the coil inputs becomes higher than the field-on-detection voltage (VFDon), even if no battery voltage is available (0 < VBatt < 1.8 V). It switches back to battery if the coil voltage becomes lower than the field-off-detection voltage (VFDoff). The field detection stage of the power management has low pass characteristics to suppress noise. An applied field needs a time delay tBFS (battery-to-field switch delay) to change the power supply. If the field is removed from the coil, the power management will generate a reset that can be connected to the microcontroller. Figure 5. Switch Conditions for Power Management VCoil > VFDon for t > tBFS Battery supply (VBatt) Field supply VCoil < VFDon for t > tBFS Note: The rectified supply voltage from the coil is limited to VDDC (2.9 V). During field supply, the battery is switched off and VDD changes to VDDC. 5 4688B–RFID–12/04 Controlling Power Management via the Serial Interface The automatic mode of the power management can be switched off and on by a command from the microcontroller. If the automatic mode is switched off, the IC is always supplied by the battery up to the next power-on reset or to a switch-on command. The power management’s on and off command must be transferred via the serial interface. If the power management is switched off and the device is supplied from the battery, it can communicate via the field without loading the field. This mode can be used to realize applications with battery supply if the field is too weak to supply the IC with power. Buffer Capacitor CB The buffer capacitor connected at VDD is used to buffer the supply voltage for the microcontroller and the EEPROM during field supply. It smoothes the rectified AC from the coil and buffers the supply voltage during modulation and gaps in the field. The size of this capacitor depends on the application. It must be of a dimension so that during modulation and gaps the ripple on the supply voltage is in the range of 100 mV to 300 mV. During gaps and damping the capacitor is used to supply the device, which means the size of the capacitor depends on the length of the gaps and damping cycles. Table 1. Example for a 350 µA Supply Current, 200 mV Ripple at VDD No Field Supply During Serial Interface Necessary CB 250 µs 470 nF 500 µs 1000 nF The transponder interface has a serial interface to the microcontroller for read and write access to the EEPROM. In a special mode, the serial interface can also be used to control the Bi-phase/Manchester modulator or the power management of the U3280M. The serial interface of the U3280M device must be controlled by a master device (normally the microcontroller) which generates the serial clock and controls the access via the SCL and SDA lines. SCL is used to clock the data in and out of the device. SDA is a bi-directional line and used to transfer data into and out of the device. The following protocol is used for the data transfers. Serial Protocol 6 • Data states on the SDA line change only when SCL is low. • Changes in the SDA line while SCL is high will be interpreted as a START or STOP condition. • A STOP condition is defined as a high-to-low transition on the SDA line while the SCL line is high. • Each data transfer must be initialized with a START condition and terminated with a STOP condition. The START condition awakens the device from standby mode, and the STOP condition returns the device to standby mode. • A receiving device generates an acknowledge (A) after the reception of each byte. For that purpose the master device must generate an extra clock pulse. If the reception was successful, the receiving master or slave device pulls down the SDA line during that clock cycle. If an acknowledge has not been detected (N) by the interface in transmit mode, it will terminate further data transmissions and switch to receive mode. A master device must finish its read operation by a not acknowledge and then issue a STOP condition to switch the device to a known state. U3280M 4688B–RFID–12/04 U3280M Figure 6. Serial Protocol SCL SDA Stand- START by condition Data/ Data change acknowledge valid Data valid STOP Standcondition by Control Byte Format EEPROM address START A4 A3 A2 A1 A0 Mode control bits Read/ NWrite C1 R/NW C0 Ackn The control byte follows the START condition and consists of the 5-bit row address, 2 mode control bits and the read/not-write bit. Data Transfer Sequence START Control byte Ackn Data byte Ackn Data byte Ackn STOP • After the STOP condition and before the START condition the device is in standby mode and the SDA line is switched to an input with the pull-up resistor. • The START condition follows a control byte that determines the following operation. Bit 0 of the control byte is used to control the following transfer direction. A “0” defines a write access and a “1” defines a read access. EEPROM The EEPROM has a size of 512 bits and is organized as a 32 × 16-bit matrix. To read and write data to and from the EEPROM, the serial interface must be used. The interface supports one and two-byte write access and one to n-byte read access to the EEPROM. EEPROM Operating Modes The operating modes of the EEPROM are defined by the control byte. The control byte contains the row address, the mode control bits and the read/not-write bit that is used to control the direction of the following transfer. A “0” defines the write access and a “1” defines a read access. The five address bits select one of the 32 rows of EEPROM memory to be accessed. For complete access the complete 16-bit word of the selected row is loaded into a buffer. The buffer must be read or overwritten via the serial interface. The two mode control bits C1 and C2 define in which order the access to the buffer is performed: high byte – low byte or low byte – high byte. The EEPROM also supports auto-increment and auto-decrement read operations. After sending the START address with the corresponding mode, consecutive memory cells can be read row by row without transmission of the row addresses. Two special control bytes allow the initialization of the complete EEPROM with “0” or with “1”. 7 4688B–RFID–12/04 Write Operations The EEPROM allows for 8-bit and 16-bit write operations. A write access starts with the START condition followed by writing a write control byte and one or two data bytes from the master. It is completed with the STOP condition from the master after the acknowledge cycle. When the EEPROM receives the control byte, it loads the addressed memory cell into a 16-bit read/write buffer. The following data bytes overwrite the buffer. The internal EEPROM programming cycle is started by a STOP condition after the first or second data byte. During the programming cycle, the addressed EEPROM cells are cleared and the contents of the buffer is written back to the EEPROM cells. The complete erasewrite cycle takes about 10 ms. Acknowledge Polling If the EEPROM is busy with an internal write cycle, all inputs are disabled and the EEPROM will not acknowledge until the write cycle is finished. This can be used to determine when the write cycle is complete. The master must perform acknowledge polling by sending a START condition followed by the control byte. If the device is still busy with the write cycle, it will not return an acknowledge and the master has to generate a STOP condition or perform further acknowledge polling sequences. If the cycle is complete, the device returns an acknowledge and the master can proceed with the next read or write cycle. Write One Data Byte START Control byte A Data byte 1 START Control byte A START Control byte A STOP A STOP Write Two Data Bytes Data byte 1 A Data byte 2 A STOP Write Control Byte Only A →acknowledge Write Control Bytes Write Low Byte First MSB A4 LSB A3 A2 A1 A0 Row address Byte Order LB(R) C1 C0 R/NW 0 1 0 HB(R) Write High Byte First MSB A4 LSB A3 A2 A1 Row address Byte Order HB(R) A0 C1 C0 R/NW 1 0 0 LB(R) HB: high byte; LB: low byte; R: row address 8 U3280M 4688B–RFID–12/04 U3280M Read Operations The EEPROM allows byte-, word- and current address read operations. The read operations are initiated in the same way as write operations. Each read access is initiated by sending the START condition followed by the control byte which contains the address and the read mode. When the device has received a read command, it returns an acknowledge, loads the addressed word into the read/write buffer and sends the selected data byte to the master. The master has to acknowledge the received byte to proceed with the read operation. If two bytes are read out from the buffer, the device automatically increments or decrements the word address and loads the buffer with the next word. The read mode bit determines if the low or high byte is read first from the buffer and if the word address is incremented or decremented for the next read access. When the memory address limit has been reached, the data word address will “roll over” and the sequential read will continue. The master can terminate the read operation after every byte by not responding with an acknowledge (N) and by issuing a STOP condition. Read One Data Byte START Control byte A Data byte 1 N STOP START Control byte A Data byte 1 A Data byte 2 Read Two Data Bytes N STOP Read n Data Bytes START Control byte A Data byte 1 A Data byte 2 A ------ Data byte n N STOP A →acknowledge, N →no acknowledge Read Control Bytes Read Low Byte First, Address Increment MSB A4 LSB A3 A2 A1 A0 C1 C0 R/NW 0 1 1 Row address Byte Order LB(R) HB(R) LB(R+1) HB(R+1) ---- LB(R+n) HB(R+n) Read High Byte First, Address Decrement MSB A4 LSB A3 A2 A1 A0 Row address C1 C0 R/NW 1 0 1 Byte Order HB(R) LB(R) HB(R-1) LB(R-1) ---- HB(R-n) LB(R-n) HB: high byte; LB: low byte; R: row address 9 4688B–RFID–12/04 Initialization after a Reset Condition The EEPROM with the serial interface has reset circuitry on-chip. In systems with microcontrollers that have their own reset circuitry for power-on reset, watchdog reset or brown-out reset, it may be necessary to bring the U3280M into a known state independently of the internal reset. This is performed by reading one byte without acknowledging and then generating a STOP condition. Special Modes Table 2. Control Byte Description Control Byte Description 1100x111b Bi-phase modulation 1101x111b Manchester modulation 11xx0111b Switch power management off →disables switching from battery to field supply 11xx1111b Switch power management on →enables automatic switching between battery and field supply xxxxx110b Reserved Data Transfer Sequence for Bi-phase and Manchester Modulation START Control byte Ackn Bit 1 Bit 2 Bit 3 ----------- Bit n STOP By using special control bytes, the serial interface can control the modulator stage or the power management. The EEPROM access and the serial interface are disabled in these modes until the next STOP condition. If no START or STOP condition is generated, the SCL and SDA lines can be used for the modulator stage. SCL is used for the modulator clock and SDA is used for the data. In this mode, the same conditions for clock and data changing, as in normal mode, are valid. The SCL and SDA lines can be used for continuous bit transfers, an acknowledge cycle after 8 bits must not be generated. Note: Power-on Reset, NRST After a reset of the microcontroller it is not assured that the transponder interface has been reset as well. It could still be in a receive or transmit cycle. To switch the device’s serial interface to a known state, the microcontroller should read one byte from the device without acknowledge and then generate a STOP condition. The U3280M transponder front end starts working with the applied field. For the digital circuits like the EEPROM serial interface and registers there is reset circuitry. A reset is generated by a power-on condition at VDD, by switching back from field to battery supply and if a low signal is applied at the NRST-pin. The NRST-pin is a bi-directional pin and can also be used as a reset output to generate a reset for the microcontroller if the circuit switches over from field to battery supply. This sets the microcontroller in a well-defined state after the uncertain power supply condition during switching. Antenna For the transponder interface a coil must be used as an antenna. Air and ferrite cored coils can be used. The achievable working distance (passive mode, not battery assisted) depends on the minimum coupling factor of an application, the power consumption, and the size of the antennas of the IC and the base station. With a power consumption of 150 µA, a minimum magnetic coupling factor below 0.5% is within reach. For applications with a higher power consumption, the coupling factor must be increased. The Q-factor of the antenna coil should be in a range between 30 and 80 for read only applications and below 40 for bi-directional read-write applications. 10 U3280M 4688B–RFID–12/04 U3280M The antenna coil must be connected with a capacitor as a parallel LC resonant circuit to the Coil 1 and Coil 2 pins of the IC. The resonance frequency f0 of the antenna circuit should be in the range of 100 kHz to 150 kHz. The correct LC combination can be calculated with the following formula: 1 L A = -----------------------------------------------2 CA × ( 2 × π × f0 ) Figure 7. Antenna Circuit Connection Coil 1 LA CA Coil 2 Example: Antenna frequency: f0 = 125 kHz, capacitor: CA = 2.2 nF 1 L A = --------------------------------------------------------------------------- = 737 µH 2.2 nF × ( 2 × π × 125 kHz ) 2 Absolute Maximum Ratings Voltages are given relative to VSS Parameter Symbol Value Supply voltage Unit VDD, VBatt 0 V to +7.0 V with reverse protection V Maximum current out of VSS pin ISS 15 mA Maximum current into VBatt pin IBatt 15 mA Input voltage (on any pin) VIN VSS -0.6 ≤VIN ≤VDD +0.6 V IIK/IOK ±15 mA ±2 kV Input/output clamp current (VSS > Vi/Vo > VDD) Min. ESD protection (100 pF through 1.5 kΩ) Operating temperature range Tamb -40 to +85 °C Storage temperature range TSTG -40 to +125 °C Soldering temperature (t ≤10 s) TSD 260 °C Note: Stresses greater than those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at any condition beyond those indicated in the operational section of these specification is not implied. Exposure to absolute maximum rating conditions for an extended period may affect device reliability. All inputs and outputs are protected against high electrostatic voltages or electric fields. However, precautions to minimize build-up of electrostatic charges during handling are recommended. Reliability of operation is enhanced if unused inputs are connected to an appropriate logic voltage level (for example, VDD). Thermal Resistance Parameter Junction ambient Symbol Value Unit RthJA 180 K/W 11 4688B–RFID–12/04 DC Characteristics Supply voltage VDD = 1.8 V to 6.5 V, VSS = 0 V, Tamb = -40° C to 85° C unless otherwise specified Parameters Test Conditions Pin Symbol Min. VBatt 2.0 Typ. Max. Unit 6.5 V Power Supply Operating voltage at VBatt Operating voltage at VDD during battery supply VDDB VDD-limiter voltage during coil supply VDDC Operating current during field supply VDD > 2.0 V Sleep current VBatt– VSD 2.6 IFi V 2.9 3.2 V 40 80 µA 0.4 µA 500 1200 µA µA 300 350 µA µA 2.9 V ISl EEPROM Operating current during erase/write cycle VDD = 2.0 V VDD = 6.5 V IWR IWR Operating current during read cycle VDD = 2.0 V VDD = 6.5 V Peak current during 1/4 of read cycle IRdp IRdp 400 Power Management Field-on detection voltage VDD > 1.8 V VFDon Field-off detection voltage VDD > 1.8 V VFDoff Voltage drop at power-supply switch IS = 0.5 mA, VBatt = 2 V VSD 150 mV Coil input current ICI 20 mA Input capacitance CIN 30 VCMS 1.8 VIL VIH 2.3 2.5 0.8 V Coil Inputs: Coil 1 and Coil 2 Coil voltage stroke during modulation VCU > 5V Icoil = 3 to 20 mA pF 2.3 4.0 V VIH 0.2 × VDD V 0.8 × VDD VDD V Pin MOD Input LOW voltage Input LOW voltage Input leakage current IIleakage 10 nA Pin NGAP/FC Output LOW current VDD = 2.0 V VOL = 0.2 × VDD IOL 0.08 0.2 0.3 mA Output HIGH current VDD = 2.0 V VOH = 0.8 × VDD IOH -0.06 -0.15 -0.25 mA 12 U3280M 4688B–RFID–12/04 U3280M DC Characteristics (Continued) Supply voltage VDD = 1.8 V to 6.5 V, VSS = 0 V, Tamb = -40° C to 85° C unless otherwise specified Parameters Test Conditions Pin Symbol Min. Input LOW voltage VIL Input HIGH voltage VIH Typ. Max. Unit VIH 0.3 × VDD V 0.7 × VDD VDD V Serial Interface I/O Pins SCL and SDA Input leakage current Output LOW current Output HIGH current IIleakage VDD = 2.0 V VOL = 0.2 VDD VDD = 6.0 V IOL VDD = 2.0 V VOH = 0.8 VDD VDD = 6.0 V IOH 10 nA 0.7 0.9 1.1 mA 2.8 3.5 4.2 mA -0.5 -0.6 -0.7 mA -1.8 -2.2 -2.6 mA Typ. Max. Unit 100 kHz AC Characteristics Supply voltage VDD = 1.8 V to 6.5 V, VSS = 0 V, Tamb = -40° C to 85° C unless otherwise specified Parameters Test Conditions Pin Symbol Min. fSCL 0 Clock low time tLOW 4.7 µs Clock high time tHIGH 4.0 µs Serial Interface Timing SCL clock frequency SDA and SCL rise time tR 1000 ns SDA and SCL fall time tF 300 ns START condition setup time tSUSTA 4.7 µs START condition hold time tHDSTA 4.0 µs Data input setup time tSUDAT 250 ns Data input hold time tHDDAT 0 ns STOP condition setup time tSUSTO 4.7 µs tBUF 4.7 µs Bus free time Input filter time tI Data output hold time tDH 300 fCOIL 100 100 ns 1000 ns 150 kHz Coil Inputs Coil frequency 125 Gap Detection Delay field off to GAP = 0 VcoilGap < 0.7 VDC TFGAP0 10 50 µs Delay field on to GAP = 1 VcoilGap > 3 VDC TFGAP1 1 50 µs 1000 µs 30 ms Power Management Battery to field switch delay Field to battery switch delay tBFS VBatt = 6.5 V tFBS 5 10 13 4688B–RFID–12/04 AC Characteristics (Continued) Supply voltage VDD = 1.8 V to 6.5 V, VSS = 0 V, Tamb = -40° C to 85° C unless otherwise specified Parameters Test Conditions Pin Symbol Min. 500000 Typ. Max. 9 12 Unit EEPROM Endurance Erase/write cycles ED Data erase/write cycle time For 16-bit access tDEW Data retention time Tamb = 25° C tDR Cycles 10 ms years Power up to read operation tPUR 0.2 ms Power up to write operation tPUw 0.2 ms 10 ms Reset Power-on reset VDDrise = 0 to 2 V trise NRST VIl < 0.2 VDD tres 1 µs Figure 8. Typical Reset Delay After Switching VDD On 600 500 tRESDEL (µs) VDD NRST 400 tRESDEL 300 200 100 0 1.0 2.0 3.0 4.0 5.0 6.0 VDD (V) Figure 9. Typical Reset Delay After Switching VDD On 5.5 5 ms 5.0 VDD NRST tRESDEL (ms) 4.5 tRESDEL 4.0 3.5 3.0 2.5 1.0 2.0 3.0 4.0 5.0 6.0 VDD (V) 14 U3280M 4688B–RFID–12/04 U3280M Figure 10. VDD Rise Time to Ensure Power-on Reset 6 5 VDD (V) 4 3 2 Not allowed 1 0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 t rise (ms) 15 4688B–RFID–12/04 Ordering Information Extended Type Number Package Remarks U3280M-NFB SSO16 Tube U3280M-NFBG3 SSO16 Taped and reeled Package Information 16 U3280M 4688B–RFID–12/04 U3280M Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Changes from Rev. 4688A-RFID-03/03 to Rev. 4688B-RFID-12/04 1. Page 10: Data Transfer Sequence: Text changed 2. Page 13: Antanna: Text changed 3. Page 16: Ordering Information table changed 4. 17 4688B–RFID–12/04 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. 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