application INFO available UC1825 UC2825 UC3825 High Speed PWM Controller FEATURES • • • • • • • • • • DESCRIPTION Compatible with Voltage or Current Mode Topologies The UC1825 family of PWM control ICs is optimized for high frequency switched mode power supply applications. Particular care was given to minimizing propagation delays through the comparators Practical Operation Switching Frequencies and logic circuitry while maximizing bandwidth and slew rate of the to 1MHz error amplifier. This controller is designed for use in either cur50ns Propagation Delay to Output rent-mode or voltage mode systems with the capability for input voltage feed-forward. High Current Dual Totem Pole Outputs (1.5A Peak) Protection circuitry includes a current limit comparator with a 1V threshold, a TTL compatible shutdown port, and a soft start pin Wide Bandwidth Error Amplifier which will double as a maximum duty cycle clamp. The logic is fully Fully Latched Logic with Double Pulse latched to provide jitter free operation and prohibit multiple pulses at Suppression an output. An under-voltage lockout section with 800mV of hysteresis assures low start up current. During under-voltage lockout, the outPulse-by-Pulse Current Limiting puts are high impedance. Soft Start / Max. Duty Cycle Control These devices feature totem pole outputs designed to source and sink high peak currents from capacitive loads, such as the gate of a Under-Voltage Lockout with Hysteresis power MOSFET. The on state is designed as a high level. Low Start Up Current (1.1mA) BLOCK DIAGRAM UDG-92030-2 SLUS235A - MARCH 1997 - REVISED MARCH 2004 UC1825 UC2825 UC3825 CONNECTION DIAGRAMS ABSOLUTE MAXIMUM RATINGS (Note 1) Supply Voltage (Pins 13, 15) . . . . . . . . . . . . . . . . . . . . . . . . 30V Output Current, Source or Sink (Pins 11, 14) DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A Pulse (0.5 s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0A Analog Inputs (Pins 1, 2, 7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V (Pin 8, 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V Clock Output Current (Pin 4) . . . . . . . . . . . . . . . . . . . . . . . -5mA Error Amplifier Output Current (Pin 3) . . . . . . . . . . . . . . . . 5mA Soft Start Sink Current (Pin 8) . . . . . . . . . . . . . . . . . . . . . 20mA Oscillator Charging Current (Pin 5) . . . . . . . . . . . . . . . . . . -5mA Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W Storage Temperature Range . . . . . . . . . . . . . . -65°C to +150°C Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . 300°C DIL-16 (Top View) J or N Package PLCC-20 & LCC-20 (Top View) Q & L Packages SOIC-16 (Top View) DW Package PACKAGE PIN FUNCTION FUNCTION PIN N/C INV NI E/A Out Clock N/C RT CT Ramp Soft Start N/C ILIM/SD Gnd Out A Pwr Gnd N/C VC Out B VCC VREF 5.1V THERMAL RATINGS TABLE Package DIL-16J DIL-16N PLCC-20 LCC-20 SOIC-16 QJA 80-120 90(1) 43-75(1) 70-80 50-120(1) QJC 28(2) 45 34 20(2) 35 Q Q 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 UC1825 UC2825 UC3825 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for , RT = 3.65k, CT = 1nF, VCC = 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TO. PARAMETERS Reference Section Output Voltage Line Regulation Load Regulation Temperature Stability* Total Output Variation* Output Noise Voltage* Long Term Stability* Short Circuit Current Oscillator Section Initial Accuracy* Voltage Stability* Temperature Stability* Total Variation* Oscillator Section (cont.) Clock Out High Clock Out Low Ramp Peak* Ramp Valley* Ramp Valley to Peak* Error Amplifier Section Input Offset Voltage Input Bias Current Input Offset Current Open Loop Gain CMRR PSRR Output Sink Current Output Source Current Output High Voltage Output Low Voltage Unity Gain Bandwidth* Slew Rate* UC1825 UC2825 MIN TOP MAX MIN TOP MAX UNITS TO = 25°C, IO = 1mA 10V < VCC < 30V 1mA < IO < 10mA TMIN < TA < TMAX Line, Load, Temperature 10Hz < f < 10kHz TJ = 125°C, 1000hrs. VREF = 0V 5.05 5.00 5.10 2 5 0.2 5.20 20 20 0.4 5.25 TJ = 2°C 10V < VCC < 30V TMIN < TA < TMAX Line, Temperature 360 TEST CONDITIONS 5.10 2 5 0.2 5.00 -15 50 5 -50 400 0.2 5 340 3.9 1V < VO < 4V 1.5V < VCM < 5.5V 10V < VCC < 30V VPIN 3 = 1V VPIN 3 = 4V IPIN 3 = -0.5mA IPIN 3 = 1mA 3 2.6 0.7 1.6 4.5 2.3 2.8 1.0 1.8 60 75 85 1 -0.5 4.0 0 3 6 0.6 0.1 95 95 110 2.5 -1.3 4.7 0 .5 5.5 12 5.15 20 20 0.4 5.20 25 -100 UC3825 4.95 -15 440 2 360 460 340 3.9 2.9 3.0 1.25 2.0 400 0.2 5 2.6 0.7 1.6 4.5 2.3 2.8 1.0 1.8 60 75 85 1 -0.5 4.0 0 3 6 0.6 0.1 95 95 110 2.5 -1.3 4.7 0.5 5.5 12 10 3 1 5.0 1.0 50 5 -50 25 -100 440 2 V mV mV mV/°C V µV mV mA 460 kHz % % kHz 2.9 3.0 1.25 2.0 V V V V V 15 3 1 5.0 1.0 mV µA µA dB dB dB mA mA V V MHz V/µs UC1825 UC2825 UC3825 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for , RT = 3.65k, CT = 1nF, VCC = 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TJ. PARAMETERS UC1825 UC2825 MIN TOP MAX TEST CONDITIONS PWM Comparator Section Pin 7 Bias Current VPIN 7 = 0V Duty Cycle Range Pin 3 Zero DC Threshold VPIN 7 = 0V Delay to Output* Soft-Start Section Charge Current VPIN 8 = 0.5V Discharge Current VPIN 8 = 1V Current Limit / Shutdown Section Pin 9 Bias Current 0 < VPIN 9 < 4V Current Limit Threshold Shutdown Threshold Delay to Output Output Section Output Low Level IOUT = 20mA IOUT = 200mA Output High Level IOUT = -20mA IOUT = -200mA Collector Leakage VC = 30V Rise/Fall Time* CL = 1nF Under-Voltage Lockout Section Start Threshold UVLO Hysteresis Supply Current Section Start Up Current VCC = 8V ICC VPIN 1, VPIN 7, VPIN 9 = 0V; VPIN 2 = 1V 4 -1 0 1.1 -5 80 1.25 50 80 3 1 9 20 0.9 1.25 1.0 1.40 50 15 1.1 1.55 80 13.0 12.0 8.8 0.4 0.25 1.2 13.5 13.0 100 30 0.40 2.2 9.2 0.8 9.6 1.2 1.1 22 2.5 33 UC3825 MIN TOP -1 0 1.1 MAX UNITS -5 85 µA % V ns 1.25 50 80 3 1 9 20 µA mA 0.9 1.25 1.0 1.40 50 10 1.1 1.55 80 µA V V ns 0.25 1.2 13.5 13.0 10 30 0.40 2.2 500 60 V V V V µA ns 9.2 0.8 9.6 1.2 V V 1.1 22 2.5 33 mA mA 13.0 12.0 500 60 8.8 0.4 UC1825 UC2825 UC3825 Printed Circuit Board Layout Considerations High speed circuits demand careful attention to layout and component placement. To assure proper performance of the UC1825 follow these rules: 1) Use a ground plane. 2) Damp or clamp parasitic inductive kick energy from the gate of driven MOSFETs. Do not allow the output pins to ring below ground. A series gate resistor or a shunt 1 Amp Schottky diode at the output pin will serve this purpose. 3) Bypass VCC, VC, and VREF. Use 0.1µF monolithic ceramic capacitors with low equivalent series inductance. Allow less than 1 cm of total lead length for each capacitor between the bypassed pin and the ground plane. 4) Treat the timing capacitor, CT, like a bypass capacitor. Error Amplifier Circuit Simplified Schematic Open Loop Frequency Response Unity Gain Slew Rate PWM Applications Current-Mode Conventional (Voltage Mode) 5 UC1825 UC2825 UC3825 Oscillator Circuit µ Deadtime vs CT (3k RT 100k) Deadtime vs Frequency Timing Resistance vs Frequency 160 1.0nF TD (ns) 140 120 100 470pF 80 10k 100k FREQ (Hz) Synchronized Operation Two Units in Close Proximity Generalized Synchronization 6 1M UC1825 UC2825 UC3825 Forward Technique for Off-Line Voltage Mode Application Constant Volt-Second Clamp Circuit The circuit shown here will achieve a constant volt-second product clamp over varying input voltages. The ramp generator components, RT and CR are chosen so that the ramp at Pin 9 crosses the 1V threshold at the same time the desired maximum volt-second product is reached. The delay through the functional nor block must be such that the ramp capacitor can be completely discharged during the minimum deadtime. Output Section Simplified Schematic Rise/Fall Time (CL=1nF) Saturation Curves Rise/Fall Time (CL=10nF) 7 UC1825 UC2825 UC3825 Open Loop Laboratory Test Fixture UDG-92032-2 This test fixture is useful for exercising many of the As with any wideband circuit, careful grounding and byUC1825’s functions and measuring their specifications. pass procedures should be followed. The use of a ground plane is highly recommended. Design Example: 50W, 48V to 5V DC to DC Converter - 1.5MHz Clock Frequency UDG-92033-3 8 PACKAGE OPTION ADDENDUM www.ti.com 29-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-87681012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 596287681012A UC1825L/ 883B 5962-8768101EA ACTIVE CDIP J 16 1 TBD Call TI Call TI -55 to 125 5962-8768101EA UC1825J/883B 5962-8768101QFA ACTIVE CFP W 16 1 TBD Call TI Call TI -55 to 125 5962-8768101QF A UC1825W/883B UC1825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1825J UC1825J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8768101EA UC1825J/883B UC1825L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1825L UC1825L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287681012A UC1825L/ 883B UC1825W883B ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8768101QF A UC1825W/883B UC2825DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825DW UC2825DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825DW UC2825DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825DW UC2825DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825DW UC2825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2825J UC2825N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2825N UC2825NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2825N Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-May-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) UC2825Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2825Q UC2825QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2825Q UC2825QTR OBSOLETE PLCC FN 20 TBD Call TI Call TI -40 to 85 UC2825Q UC2825QTRG3 ACTIVE PLCC FN 20 TBD Call TI Call TI -40 to 85 UC3825DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825DW UC3825DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825DW UC3825DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825DW UC3825DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825DW UC3825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 0 to 70 UC3825J UC3825N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3825N UC3825NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3825N UC3825Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3825Q UC3825QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3825Q UC3825QTR ACTIVE PLCC FN 20 1000 TBD Call TI Call TI 0 to 70 UC3825Q UC3825QTRG3 ACTIVE PLCC FN 20 1000 TBD Call TI Call TI 0 to 70 UC3825Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-May-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1825, UC2825, UC2825M, UC3825, UC3825M : • Catalog: UC3825, UC2825, UC3825M, UC3825 • Military: UC2825M, UC1825 • Space: UC1825-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 MECHANICAL DATA MPLC004A – OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated