TI UCC2807-3

application
INFO
available
UCC1807-1/-2/-3
UCC2807-1/-2/-3
UCC3807-1/-2/-3
Programmable Maximum Duty Cycle PWM Controller
FEATURES
User Programmable Maximum PWM
Duty Cycle
100m A Startup Current
Operation to 1MHz
Internal Full Cycle Soft Start
Internal Leading Edge Blanking of
Current Sense Signal
1A Totem Pole Output
DESCRIPTION
The UCC3807 family of high speed, low power integrated circuits contains
all of the control and drive circuitry required for off-line and DC-to-DC fixed
frequency current mode switching power supplies with minimal external
parts count.
These devices are similar to the UCC3800 family, but with the added feature of a user programmable maximum duty cycle. Oscillator frequency and
maximum duty cycle are programmed with two resistors and a capacitor.
The UCC3807 family also features internal full cycle soft start and internal
leading edge blanking of the current sense input.
The UCC3807 family offers a variety of package options, temperature
range options, and choice of critical voltage levels. The family has UVLO
thresholds and hysteresis levels for off-line and battery powered systems.
Thresholds are shown in the table below.
Part Number
UCCx807-1
UCCx807-2
UCCx807-3
Turn-on Threshold
7.2V
12.5V
4.3V
Turn-off Threshold
6.9V
8.3V
4.1V
Packages
J
N, D
N, D, PW
BLOCK DIAGRAM
UDG-95001-1
SLUS163 - JUNE 1997
1
UCC1807-1/-2/-3
UCC2807-1/-2/-3
UCC3807-1/-2/-3
CONNECTION DIAGRAMS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (IDD 10mA). . . . . . . . . . . . . . . . . . . . . . . 13.5V
Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
OUT Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1A
Analog Inputs (FB, CS) . . . . . . . . . . . . . –0.3V to (VDD + 0.3V)
Power Dissipation at TA +25°C (N or J packages) . . . . . . . . 1W
Power Dissipation at TA +25°C (D package) . . . . . . . . . . 0.65W
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C
DIL-8, SOIC-8, TSSOP-8 (Top View)
J, N, D or PW Packages
All currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages.
ORDERING INFORMATION
UCC
807
–
UVLO Threshold
Package
Temperature Range
ELECTRICAL CHARACTERISTICS:Unless otherwise stated these specifications apply for TA = –55°C to +125°C for
UCC1807-1/-2/-3; –40°C to +85°C for UCC2807-1/-2/-3; and 0°C to +70°C for UCC3807-1/-2/-3; VDD = 10V (Note 6), RA = 12kW ,
RB = 4.7kW , CT = 330pF, 1.0m F capacitor from VDD to GND, TA = TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
175
202
228
kHz
Oscillator Section Section
Frequency
Temperature Stability
(Note 5)
2.5
%
Amplitude
(Note 1)
1/3VDD
V
Error Amplifier Section
Input Voltage
COMP = 2.0V
1.95
Input Bias Current
–1
Open Loop Voltage Gain
60
2.00
2.05
V
1
m A
80
dB
COMP Sink Current
FB = 2.2V, COMP = 1.0V
0.3
2.5
mA
COMP Source Current
FB = 1.3V, COMP = 4.0V
–0.2
–0.5
mA
75
78
PWM Section
Maximum Duty Cycle
Minimum Duty Cycle
COMP = 0V
81
%
0
%
1.8
V/V
Current Sense Section
Gain
(Note 2)
Maximum Input Signal
COMP = 5.0V (Note 3)
Input Bias Current
1.65
0.9
1.0
–200
CS Blank Time
Overcurrent Threshold
COMP to CS Offset
1.1
CS = 0V
1.1
V
200
nA
150
ns
50
100
1.4
1.5
1.6
V
0.55
1.1
1.65
V
1
V
Output Section
OUT Low Level
I = 100mA
0.4
OUT High Level
I = –100mA, VDD - OUT
0.4
1
V
Rise/Fall Time
CL = 1nF (Note 5)
20
100
ns
Undervoltage Lockout Section
2
UCC1807-1/-2/-3
UCC2807-1/-2/-3
UCC3807-1/-2/-3
ELECTRICAL CHARACTERISTICS:Unless otherwise stated these specifications apply for TA = –55°C to +125°C for
UCC1807-1/-2/-3; –40°C to +85°C for UCC2807-1/-2/-3; and 0°C to +70°C for UCC3807-1/-2/-3; VDD = 10V (Note 6), RA = 12kW ,
RB = 4.7kW , CT = 330pF, 1.0m F capacitor from VDD to GND, TA = TJ.
PARAMETER
Start Threshold
Minimum Operating Voltage After Start
Hysteresis
MIN
TYP
MAX
UNITS
UCCx807-1 (Note 4)
TEST CONDITIONS
6.6
7.2
7.8
V
UCCx807-2
11.5
12.5
13.5
V
UCCx807-3
4.1
4.3
4.5
V
UCCx807-1 (Note 4)
6.3
6.9
7.5
V
UCCx807-2
7.6
8.3
9.0
V
UCCx807-3
3.9
4.1
4.3
V
UCCx807-1
0.1
0.3
0.5
V
UCCx807-2
3.5
4.2
5.1
V
UCCx807-3
0.1
0.2
0.3
V
Soft Start Section
COMP Rise Time
FB = 1.8V, From 0.5V to 4.0V
4
ms
Overall Section
Startup Current
VDD < Start Threshold (UCCx807-1,-3)
0.1
0.2
mA
VDD < Start Threshold (UCCx807-2)
0.15
0.25
mA
Operating Supply Current
FB = 0V, CS = 0V, No Load (Note 7)
1.3
2.1
mA
VDD Zener Shunt Voltage
IDD = 10mA
12.0
13.5
15.0
0.5
1.0
Shunt to Start Difference
V
V
Note 1: Measured at TRIG; signal minimum = 1/3 VDD, maximum = 2/3 VDD.
VCOMP
Note 2: Gain is defined by: A
, 0 VCS 0.8V
VCS
Note 3: Parameter measured at trip point of latch with FB at 0V.
Note 4: Start Threshold and Zener Shunt thresholds track one another.
Note 5: Ensured by design. Not 100% tested in production.
Note 6: Adjust VDD above the start threshold before setting at 10V for UCC3807-2.
Note 7: Does not include current in external timing RC network.
PIN DESCRIPTIONS
COMP: COMP is the output of the error amplifier and the
input of the PWM comparator. The error amplifier in the
UCC3807 is a low output impedance, 2MHz operational
amplifier. COMP can both source and sink current. The
error amplifier is internally current limited, which allows
zero duty cycle by externally forcing COMP to GND.
affected by the leading edge blanking and the CS to
OUT propagation delay.
The overcurrent comparator is only intended for fault
sensing. Exceeding the overcurrent threshold causes a
soft start cycle.
FB: The inverting input to the error amplifier. For best
stability, keep connections to FB as short as possible and
stray capacitance as small as possible.
The UCC3807 family features built-in full cycle soft start.
Soft start is implemented as a clamp on the maximum
COMP voltage.
GND: Reference ground and power ground for all functions of the part.
CS: Current sense input. There are two current sense
comparators on the chip, the PWM comparator and an
overcurrent comparator.
OUT: The output of a high current power driver capable
of driving the gate of a power MOSFET with peak currents exceeding 1A. OUT is actively held low when VDD
is below the UVLO threshold.
The UCC3807 also contains a leading edge blanking circuit, which disconnects the external CS signal from the
current sense comparator during the 100ns interval immediately following the rising edge of the signal at the
OUT pin. In most applications, no analog filtering is required on CS. Compared to an external RC filtering technique, leading edge blanking provides a smaller effective
CS to OUT propagation delay. Note, however, that the
minimum non-zero on-time of the OUT signal is directly
The high current power driver consists of MOSFET output devices in a totem pole configuration. This allows the
output to switch from VDD to GND. The output stage
also provides a very low impedance which minimizes
overshoot and undershoot. In most cases, external
Schottky clamp diodes are not required.
3
UCC1807-1/-2/-3
UCC2807-1/-2/-3
UCC3807-1/-2/-3
PIN DESCRIPTIONS (cont.)
TRIG/DISCH: Oscillator control pins. Trig is the oscillator
timing input, which has an RC-type charge/discharge signal controlling the chip’s internal oscillator. DISCH is the
pin which provides the low impedance discharge path for
the external RC network during normal operation. Oscillator frequency and maximum duty cycle are computed
as follows:
fre que ncy
duty cycle
For best performance, keep the lead from CT to GND as
short as possible. A separate ground connection for CT is
desirable. The minimum value of RA is 10kW , the minimum value of RB is 2.2kW , and the minimum value of CT
is 47pF.
VDD: The power input connection for this device. Total
VDD current is the sum of quiescent current and the average OUT current. Knowing the operating frequency
and the MOSFET gate charge (Qg), average OUT current can be calculated from
1.4
RA
2 R B CT
RA RB
R A 2R B
IOUT = Qg
F, where F is frequency.
To prevent noise problems, bypass VDD to GND with a
ceramic capacitor as close to the chip as possible in parallel with an electrolytic capacitor.
as shown in Figure 1.
UDG-95002-1
Figure 1. Oscillator Block Diagram
APPLICATIONS INFORMATION
The circuit shown in Fig. 2 illustrates the use of the
UCC3807 in a typical off-line application. The 100W,
200kHz, universal input forward converter produces a
regulated 12VDC at 8 Amps. The programmable maximum duty cycle of the UCC3807 allows operation down
to 80VRMS and up to 265VRMS with a simple RCD
clamp to limit the MOSFET voltage and provide core reset. In this application the maximum duty cycle is set to
about 65%. Another feature of the design is the use of a
flyback winding on the output filter choke for both bootstrapping and voltage regulation. This method of loop closure eliminates the optocoupler and secondary side
regulator, common to most off-line designs, while providing good line and load regulation.
T1:
Core
Primary:
Secondary:
L1:
Core:
Magnetics Inc. #P-42625-UG (ungapped)
28 turns of 2x #26AWG
6 turns of 50x0.2mm Litz wire
Magnetics Inc. #P-42625-SG-37 (0.020”
gap)
13 turns of 2x #18AWG
11 turns of #26AWG
Main Winding:
Second Winding:
Magnetics Inc.
900 E. Butler Road
P.O. Box 391
Butler, PA 16003
Tel: (412) 282-8282
Fax: (412) 282-6955
4
UCC1807-1/-2/-3
UCC2807-1/-2/-3
UCC3807-1/-2/-3
APPLICATIONS INFORMATION (cont.)
UDG-96174
Figure 2. Typical Off-line Application Using UCC3807-2
5
PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC2807D-1
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807D-2
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807D-3
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807DTR-1
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807DTR-1G4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807DTR-2
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807DTR-2G4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807DTR-3
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807DTR-3G4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807N-1
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-NC-NC-NC
UCC2807N-2
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-NC-NC-NC
UCC2807PW-3
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2807PWTR-3
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807D-1
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807D-2
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807D-2G4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807D-3
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807DTR-1
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807DTR-2
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807DTR-2G4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807DTR-3
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807DTR-3G4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3807N-1
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-NC-NC-NC
UCC3807N-2
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-NC-NC-NC
UCC3807N-3
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-NC-NC-NC
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
4-Nov-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC3807N-3G4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
UCC3807PWTR-3
PREVIEW
TSSOP
PW
14
2000
TBD
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
Level-NC-NC-NC
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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