TI UCC2813-2

SGLS245 − MAY 2004
D Qualification in Accordance With
D
D
D
D
D
D
D
D
D
AEC-Q100†
Qualified for Automotive Applications
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
ESD Protection Exceeds 200 V Using
Machine Model (C = 200 pF, R = 0)
100 µA Typical Starting Supply Current
500 µA Typical Operating Supply Current
D
D
D
D
† Contact Texas Instruments for details. Q100 qualification data
available on request.
Operation to 1 MHz
Internal Soft Start
Internal Fault Soft Start
Internal Leading-Edge Blanking of the
Current Sense Signal
1-A Totem-Pole Output
70 ns Typical Response from
Current-Sense to Gate Drive Output
1.5% Tolerance Voltage Reference
Same Pinout as UC3802, UC3842, and
UC3842A
description
The UCC2813-0/-1/-2/-3/-4/-5 family of high-speed, low-power integrated circuits contain all of the control and
drive components required for off-line and dc-to-dc fixed frequency current-mode switching power supplies with
minimal parts count.
These devices have the same pin configuration as the UC2842/3/4/5 family and also offer the added features
of internal full-cycle soft start and internal leading-edge blanking of the current-sense input.
The UCC2813-0/-1/-2/-3/-4/-5 family offers choice of maximum duty cycle and critical voltage levels. Lower
reference parts such as the UCC2813-3 and UCC2813-5 fit best into battery operated systems, while the higher
reference and the higher UVLO hysteresis of the UCC2813-2 and UCC2813-4 make these ideal choices for use
in off-line power supplies.
The UCC2813-xQ-Q1 series is specified for the automotive temperature range of −40_C to 125_C and qualified
in accordance with AEC-Q100 stress test qualification for integrated circuits.
PART NUMBER
MAXIMUM DUTY CYCLE
REFERENCE VOLTAGE
TURN-ON THRESHOLD
TURN-OFF THRESHOLD
UCC2813-0
100%
5V
7.2 V
6.9 V
UCC2813-1
50%
5V
9.4 V
7.4 V
UCC2813-2
100%
5V
12.5 V
8.3 V
UCC2813-3
100%
4V
4.1 V
3.6 V
UCC2813-4
50%
5V
12.5 V
8.3 V
UCC2813-5
50%
4V
4.1 V
3.6 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004 Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
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1
SGLS245 − MAY 2004
block diagram
−
−
−
AVAILABLE OPTIONS
TA
D PACKAGE
(TOP VIEW)
SOIC-8
SMALL OUTLINE (D)
UCC2813-0QDRQ1
UCC2813-1QDRQ1
UCC2813-2QDRQ1
−40_C to 125_C
COMP
FB
CS
RC
UCC2813-3QDRQ1
UCC2813-4QDRQ1
UCC2813-5QDRQ1
† The UCC2813-x-Q1 is only available taped
and reeled in quantities of 2500 devices per
reel.
2
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1
8
2
7
3
6
4
5
REF
VCC
OUT
GND
SGLS245 − MAY 2004
Ordering Information
UCC 2 813-
0
Q
D
R
Q1
Q100 INDICATOR
TAPE and REEL INDICATOR
PACKAGE
D = Plastic SOIC
AUTOMOTIVE TEMPERATURE RANGE INDICATOR
PRODUCT OPTION
0 through 5
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†‡
VCC voltage w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 V
VCC current w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 A
Output energy, (Capacitive Load) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 µJ
Analog Inputs (FB, CS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6.3 V
Power Dissipation at TA < +25_C (D package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.65 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65_C to 150_C
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . 300_C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals.
w In normal operation VCC is powered through a current limiting resistor. Absolute maximum of 12 V applies when VCC is driven from a low
impedance source such that ICC does not exceed 30 mA (which includes gate drive current requirement).
electrical characteristics TA = −40_C to 125_C, VCC = 10 V (see Note 1), RT = 100 kΩ from REF to
RC, CT = 330 pF from RC to GND, 0.1-F capacitor from VCC to GND, 0.1-F capacitor from VREF to
GND and TA = TJ (unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Reference Section
Output voltage
TJ = 25_C, I = 0.2 mA
Load regulation voltage
I = 0.2 mA to 5 mA
UCC2813-0/1/2/4
4.925
5
5.075
UCC2813-3/5
3.94
4
4.06
10
30
UCC2813-0/1/2/4
4.84
5
5.1
UCC2813-3/5
3.84
4
4.08
Total variation voltage
See Note 5
Output noise voltage
f = 10 Hz to 10 kHz,
See Note 7
TJ = 25_C
Long term stability
1000 hours,
See Note 7
TA = 125_C
Output short-circuit current
−5
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V
mV
V
70
µV
5
mV
−35
mA
3
SGLS245 − MAY 2004
electrical characteristics TA = −40_C to 125_C, VCC = 10 V (see Note 1), RT = 100 kΩ from REF to
RC, CT = 330 pF from RC to GND, 0.1 F capacitor from VCC to GND, 0.1 F capacitor from VREF to GND
and TA = TJ (unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Oscillator Section
Oscillator frequency
See Note 2
Temperature stability
See Note 7
UCC2813-0/1/2/4
40
46
52
UCC2813-3/5
26
31
36
2.5
Amplitude peak-to-peak
2.25
Oscillator peak voltage
2.4
kHz
%
2.55
2.45
V
V
Error Amplifier Section
Input voltage
COMP = 2.5 V
UCC2813-0/1/2/4
2.42
2.5
2.56
COMP = 2.0 V
UCC2813-3/5
1.92
2
2.05
Input bias current
−2
Open loop voltage gain
60
COMP sink current
FB = 2.7 V,
COMP = 1.1 V
COMP source current
FB = 1.8 V,
COMP = REF − 1.2 V
Gain bandwidth product
See Note 7
−0.2
2
µA
3.5
mA
−0.8
mA
80
0.3
−0.5
V
dB
2
MHz
PWM Section
Maximum duty cycle
Minimum duty cycle
UCC2813-0/2/3
97
99
100
UCC2813-1/4/5
48
49
50
COMP = 0 V
0
%
%
Current Sense Section
Gain
See Note 3
Maximum input signal
COMP = 5 V,
See Note 4
Input bias current
1.65
1.8
V/V
0.9
1
1.1
V
−200
CS blank time
Over-current threshold voltage
COMP to CS offset voltage
1.1
CS = 0 V
200
nA
50
100
150
ns
1.32
1.55
1.7
V
0.45
0.9
1.35
V
Output Section (OUT)
Low-level output voltage
High-level output voltage VSAT (VCC - OUT)
IOUT = 20 mA
All parts
0.1
0.4
IOUT = 200 mA
All parts
0.35
0.9
IOUT = 50 mA, VCC = 5 V
UCC2813-3/5
0.15
0.4
IOUT = 20 mA, VCC = 0 V
All parts
0.7
1.2
IOUT = −20 mA
All parts
0.15
0.4
IOUT = −200 mA
All parts
1
1.9
IOUT = −50 mA, VCC = 5 V
UCC2813-3/5
V
V
0.4
0.9
Rise time
CL = 1 nF
41
70
ns
Fall time
CL = 1 nF
44
75
ns
4
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• DALLAS, TEXAS 75265
SGLS245 − MAY 2004
electrical characteristics TA = −40_C to 125_C, VCC = 10 V (see Note 1), RT = 100 kΩ from REF to
RC, CT = 330 pF from RC to GND, 0.1 F capacitor from VCC to GND, 0.1 F capacitor from VREF to GND
and TA = TJ (unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Undervoltage Lockout Section
UCC2813-0
UCC2813-1
Start threshold
Stop threshold
See Note 6
See Note 6
Start to stop hysteresis
6.6
7.2
7.8
8.6
9.4
10.2
UCC2813-2/4
11.5
12.5
13.5
UCC2813-3/5
3.7
4.1
4.5
UCC2813-0
6.3
6.9
7.5
UCC2813-1
6.8
7.4
8
UCC2813-2/4
7.6
8.3
9
UCC2813-3/5
3.2
3.6
4
UCC2813-0
0.12
0.3
0.48
UCC2813-1
1.6
2
2.4
UCC2813-2/4
3.5
4.2
5.1
UCC2813-3/5
0.2
0.5
0.8
4
10
ms
0.1
0.23
mA
0.5
1.2
mA
12
13.5
15
V
0.5
1.0
V
V
V
Soft Start Section
COMP rise time
FB = 1.8 V,
Rise from 0.5 V to REF − 1 V
Overall Section
Start-up current
VCC < Start Threshold
Operating supply current
FB = 0 V,
CS = 0 V,
VCC internal zener voltage
ICC = 10 mA,
See Notes 6 and 8
VCC internal zener voltage minus start
threshold voltage
See Note 6
RC = 0 V
UCC2813-2/4
V
NOTES: 1. Adjust VCC above the start threshold before setting at 10 V.
2. Oscillator frequency for the UCC2813-0, UCC2813-2, and UCC2813-3 is the output frequency.
Oscillator frequency for the UCC2813-1, UCC2813-4, and UCC2813-5 is twice the output frequency.
3. Gain is defined by:
DVCOMP 0 v VCS v 0.8 V.
A=
DVCS
4. Parameter measured at trip point of latch with pin 2 at 0 V.
5. Total variation includes temperature stability and load regulation.
6. Start threshold, stop threshold, and Zener shunt thresholds track one another.
7. Not production tested.
8. The device is fully operating in clamp mode as the forcing current is higher than the normal operating supply current.
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5
SGLS245 − MAY 2004
detailed terminal descriptions
COMP
COMP is the output of the error amplifier and the input of the PWM comparator.
Unlike other devices, the error amplifier in the UCC2813 family is a true, low output-impedance, 2-MHz
operational amplifier. As such, the COMP terminal can both source and sink current. However, the error
amplifier is internally current limited, so that one can command zero duty cycle by externally forcing COMP to
GND.
The UCC2813 family features built-in full cycle soft start. Soft start is implemented as a clamp on the maximum
COMP voltage.
CS
CS is the input to the current sense comparators. The UCC2813 family has two different current sense
comparators: the PWM comparator and an overcurrent comparator.
The UCC2813 family contains digital current sense filtering, which disconnects the CS terminal from the current
sense comparator during the 100 ns interval immediately following the rising edge of the OUT pin. This digital
filtering, also called leading-edge blanking, means that in most applications, no analog filtering (RC filter) is
required on CS. Compared to an external RC filter technique, the leading-edge blanking provides a smaller
effective CS to OUT propagation delay. Note, however, that the minimum non-zero on-time of the OUT signal
is directly affected by the leading-edge-blanking and the CS to OUT propagation delay.
The overcurrent comparator is only intended for fault sensing, and exceeding the overcurrent threshold causes
a soft start cycle.
FB
FB is the inverting input of the error amplifier. For best stability, keep FB lead length as short as possible and
FB stray capacitance as small as possible.
ground (GND)
GND is reference ground and power ground for all functions on this part.
OUT
OUT is the output of a high-current power driver capable of driving the gate of a power MOSFET with peak
currents exceeding "750 mA. OUT is actively held low when VCC is below the UVLO threshold.
The high-current power driver consists of FET output devices, which can switch all of the way to GND and all
of the way to VCC. The output stage also provides a low impedance to overshoot and undershoot. This means
that in many cases external Schottky clamp diodes are not required.
6
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SGLS245 − MAY 2004
detailed descriptions (continued)
RC
RC is the oscillator timing pin. For fixed frequency operation, set timing capacitor charging current by connecting
a resistor from REF to RC. Set frequency by connecting timing capacitor from RC to GND. For best perfomance,
keep the timing capacitor lead to GND as short and direct as possible. If possible, use separate ground traces
for the timing capacitor and all other functions.
The frequency of oscillation can be estimated with the following equations:
UCC2813−0ń1ń2ń4 : F +
1.5
R
C
UCC2813−3ńUCC2813−5 : F +
1.0
R
C
(1)
where frequency is in Hz, resistance is in ohms, and capacitance is in farads. The recommended range of the
timing resistors is between 10 kΩ and 200 kΩ and the timing capacitor is 100 pF to 1000 pF. Never use a timing
resistor less than 10 k.
To prevent noise problems, bypass VCC to GND with a ceramic capacitor as close to the VCC pin as possible.
An electrolytic capacitor may also be used in addition to the ceramic capacitor.
voltage reference (REF)
REF is the voltage reference for the error amplifier and also for many other functions on the IC. REF is also used
as the logic power supply for high-speed switching logic on the IC.
When VCC is greater than 1 V and less than the UVLO threshold, REF is pulled to ground through a 5-kΩ resistor.
This means that REF can be used as a logic output indicating power system status. It is important for reference
stability that REF is bypassed to GND with a ceramic capacitor as close to the pin as possible. An electrolytic
capacitor may also be used in addition to the ceramic capacitor. A minimum of 0.1-µF ceramic capacitor is
required. Additional REF bypassing is required for external loads greater than 2.5 mA on the reference.
To prevent noise problems with high-speed switching transients, bypass REF to ground with a ceramic capacitor
close to the IC package.
power (VCC)
VCC is the power input connection for this device. In normal operation, VCC is powered through a current limiting
resistor. Although quiescent VCC current is low, total supply current will be higher, depending on OUT current.
Total VCC current is the sum of quiescent VCC current and the average OUT current. Knowing the operating
frequency and the MOSFET gate charge (Qg), average OUT current can be calculated from:
I OUT + Q g
F.
(2)
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7
SGLS245 − MAY 2004
PARAMETER MEASUREMENT INFORMATION
Error Amplifier
Gain/Phase Response
Oscillator
REF
8
0.2 V
R
Q
RT
S
RC
2.5 V
4
CT
The UCC2813-0/1/2/3/4/5 oscillator generates a sawtooth
waveform on RC. The rise time is set by the time constant of RT and
CT. The fall time is set by CT and an internal transistor
on-resistance of approximately 125. During the fall time, the output
is off and the maximum duty cycle is reduced below 50% or 100%
depending on the part number. Larger timing capacitors increase
the discharge time and reduce the maximum duty cycle and
frequency.
Figure 1
Figure 2
UCC2813-3/5 VREF
vs
VCC
UCC2813-0/1/2/4 Oscillator Frequency
vs
RT and CT
ILOAD = 0.5 mA
Figure 3
8
Figure 4
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SGLS245 − MAY 2004
UCC2813-3/5 Oscillator Frequency
vs
RT and CT
UCC2813-0/2/3 Maximum Duty Cycle
vs
Oscillator Frequency
Figure 5
Figure 6
UCC2813-1/4/5 Maximum Duty Cycle
vs
Oscillator Frequency
UCC2813-0 ICC
vs
Oscillator Frequency
Figure 7
Figure 8
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• DALLAS, TEXAS 75265
9
SGLS245 − MAY 2004
UCC2813-5 ICC
vs
Oscillator Frequency
Dead Time
vs
CT
RT = 100 kW
Figure 9
Figure 10
COMP to CS Offset
vs
Temperature
CS = 0 V
Figure 11
10
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• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC2813QDR-0Q1
ACTIVE
SOIC
D
8
2500
None
CU NIPDAU
Level-1-260C-UNLIM
UCC2813QDR-1Q1
ACTIVE
SOIC
D
8
2500
None
CU NIPDAU
Level-1-260C-UNLIM
UCC2813QDR-2Q1
ACTIVE
SOIC
D
8
75
None
CU NIPDAU
Level-1-260C-UNLIM
UCC2813QDR-3Q1
ACTIVE
SOIC
D
8
2500
None
CU NIPDAU
Level-1-260C-UNLIM
UCC2813QDR-4Q1
ACTIVE
SOIC
D
8
2500
None
CU NIPDAU
Level-1-260C-UNLIM
UCC2813QDR-5Q1
ACTIVE
SOIC
D
8
2500
None
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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