TI UCC2946PWG4

SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
FEATURES
D Fully Programmable Reset Threshold
D Fully Programmable Reset Period
D Fully Programmable Watchdog Period
D 2% Accurate Reset Threshold
D Input Voltage Down to 2 V
D Input 18-µA Maximum Input Current
D Reset Valid Down to 1 V
The UCCx946 is also resistant to glitches on the
VDD line. Once RES has been deasserted, any
drops below the threshold voltage need to be of
certain time duration and voltage magnitude to
generate a reset signal. These values are shown
in Figure 1. An I/O line of the microprocessor may
be tied to the watchdog input (WDI) for watchdog
functions. If the I/O line is not toggled within a set
watchdog period, programmable by the user,
WDO is asserted. The watchdog function is
disabled during reset conditions.
DESCRIPTION
The UCCx946 is designed to provide accurate
microprocessor supervision, including reset and
watchdog functions. During power up, the device
asserts a reset signal RES with VDD as low as 1 V.
The reset signal remains asserted until the VDD
voltage rises and remains above the reset
threshold for the reset period. Both reset threshold
and reset period are programmable by the user.
The UCCx946 is available in 8-pin SOIC(D), 8-pin
PDIP (N) and 8-pin TSSOP(PW) packages to
optimize board space.
VDD
8
POWER TO
CIRCUITRY
400 nA
RP
4
+
1.235 V
S
Q
3 RES
POWER ON RESET
+
R
Q
Q
S
Q
R
+
RTH 2
WP
8−BIT
COUNTER
400 nA
6
+
+
WATCHDOG
TIMING
WDI
7
1.235 V
S
Q
R
Q
A2
100 mV
+
A3
CLR A1
5 WDO
A0
CLK
+
EDGE DETECT
1 GND
UDG−02192
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Copyright  2007, Texas Instruments Incorporated
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1
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
ORDERING INFORMATION
PACKAGED DEVICES(3)
TA
(D)
(N)
(PW)
−40°C to 95°C
UCC2946D
UCC2946N
UCC2946PW
0°C to 70°C
UCC3946D
UCC3946N
UCC3946PW
(1) The D and PW packages are also available taped and reeled. Add an R suffix to the device type (i.e., UCC2946DR) for quantities of 3,000
devices per reel.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UCC2946
UCC3946
UNIT
10
V
Input voltage range, VIN
Junction temperature range, TJ
−55 to 150
Storage temperature, Tstg
−65 to 150
°C
C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Voltages are with respect to
GND. Currents are positive into, and negative out of the specified terminal.
D PACKAGE
(TOP VIEW)
GND
RTH
RES
RP
1
8
2
7
3
6
4
5
VDD
WDI
WP
WDO
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
GND
1
−
Ground reference for the device
RES
3
O
This pin is high only if the voltage on the RTH has risen above 1.235 V. Once RTH rises above the threshold, this
pin remains low for the reset period. This pin asserts low and remains low if the RTH voltage dips below 1.235 V for
an amount of time determined by Figure 1.
RTH
2
I
This input compares its voltage to an internal 1.25-V reference. By using external resistors, a user can program any
desired reset threshold.
RP
4
I
This pin allows the user to program the reset period by adjusting an external capacitor.
VDD
8
I
Supply voltage for the device.
WDI
7
I
This pin is the input to the watchdog timer. If this pin is not toggled or strobed within the watchdog period, WDO is
asserted.
WDO
5
O
This pin is the watchdog output. This pin is asserted low if the WDI pin is not strobed or toggled within the watchdog
period.
WP
6
I
This pin allows the user to program the watchdog period by adjusting an external capacitor.
2
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SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
ELECTRICAL CHARACTERISTICS
TA = 0°C to 70°C and 2.0 V ≤ VDD ≤ 5.5 V for the UCC3946, TA = −40°C to 95°C and 2.1 V ≤ VDD ≤ 5.5 V for the UCC2946, (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
REFERENCE
VDD
Operating voltage
IDD
Supply current
VDD(min)
Minimum operating voltage(1)
UCC2946
2.1
5.5
UCC3946
2.0
5.5
UCC2946
12
18
UCC3946
10
18
UCC2946
1.1
UCC3946
1.0
V
µA
A
V
RESET SECTION
UCC2946
Reset threshold voltage
UCC3946
VDD rising
1.170
1.235
1.260
1.190
1.235
1.260
Threshold hysteresis
ILEAK
VOH
VOL
15
Input leakage current
ISOURCE = 2 mA
ISINK = 2 mA
UCC2946
Low-level output voltage
UCC3946
VDD-to-output delay time
ISINK = 20 µA,
A,
UCC3946
CRP = 64 nF
nA
VDD−0.3
0.1
0.4
VDD = 1 V
V
0.2
VDD = −1 mV/µs
UCC2946
Reset period
mV
5
High-level output voltage
V
µs
120
140
200
320
160
200
260
ms
WATCHDOG SECTION
VIH
VIL
High-level input voltage, WDI
0.7×VDD
Low-level input voltage, WDI
UCC2946
Watchdog period
UCC3946
CRP = 64 nF
Watchdog pulse width
VOH
High-level output voltage
VOL
Low-level output voltage
(1) Minimum supply voltage where RES is considered valid.
0.96
0.3×VDD
1.60
2.56
1.12
1.60
2.08
50
ISOURCE = 2 mA
ISINK = 2 mA
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V
s
ns
VDD−0.3
0.1
V
3
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
APPLICATION INFORMATION
The UCCx946 supervisory circuit provides accurate reset and watchdog functions for a variety of
microprocessor applications. The reset circuit prevents the microprocessor from executing code during
undervoltage conditions, typically during power-up and power-down. In order to prevent erratic operation in the
presence of noise, voltage glitches where voltage amplitude and time duration are less than the values specified
in Figure 1 are ignored.
200
OVERDRIVE VOLTAGE WITH RESPECT TO
RESET THRESHOLD
vs
DELAY TO OUTPUT LOW ON RESB
180
VTH − Overdrive Voltage − mV
160
140
120
100
80
RT Senses Glitch,
RES Goes Low for Reset Period
60
40
20
0
100
Glitches
Ignored,
RESB
Remains
High
110
120 130 140 150 160
TDELAY − Delay Time − µs
170
180
Figure 1.
The watchdog circuit monitors the microprocessor’s activity, if the microprocessor does not toggle WDI during
the programmable watchdog period WDO goes low, alerting the microprocessor’s interrupt of a fault. The WDO
pin is typically connected to the non-maskable input of the microprocessor so that an error recovery routine can
be executed.
4
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SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
APPLICATION INFORMATION
PROGRAMMING THE RESET VOLTAGE AND RESET PERIOD
The UCCx946 allows the reset trip voltage to be programmed with two external resistors. In most applications
VDD is monitored by the reset circuit, however, the design allows voltages other than VDD to be monitored.
Referring to Figure 2, the voltage below which reset is asserted is determined by:
V RESET + 1.235
) R2Ǔ
ǒR1 R2
(1)
In order to keep quiescent currents low, resistor values in the megaohm range can be used for R1 and R2. A
manual reset can be easily implemented by connecting a momentary push switch in parallel with R2. RES is
ensured to be low with VDD voltages as low as 1 V.
VDD
8
POWER TO
CIRCUITRY
400 nA
RP
4
1.235 V
S
Q
+
CRP
RES
R Q
RTH
RESET
3
+
−
VDD
R1
+
−
POWER
ON RESET
Q S
2
uP
R2
I/O
8−BIT
COUNTER
Q R
400 nA
WP
6
+
CWP
−
A3
+
A2
CLR A1
100 mV
+
WDI
7
Q
R Q
WDO
5
NMI
A0
CLK
+
−
1.235 V
S
WATCHDOG
TIMING
EDGE DETECT
GND 1
UDG−98002
Figure 2. Typical Application Diagram
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5
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
APPLICATION INFORMATION
Once VDD rises above the programmed threshold, RES remains low for the reset period defined by:
T RP + 3.125
C RP
(2)
where TRP is time in milliseconds and CRP is capacitance in nanofarads. CRP is charged with a precision current
source of 400 nA, a high-quality, low-leakage capacitor (such as an NPO ceramic) should be used to maintain
timing tolerances. Figure 3 illustrates the voltage levels and timings associated with the reset circuit.
UDG−97067
t1: VDD > 1 V, RES is ensured low.
t2: VDD > programmed threshold, RES remains low for TRP.
t3: TRP expires, RES pulls high.
t4: Voltage glitch occurs, but is filtered at the RTH pin, RES remains high.
t5: Voltage glitch occurs whose magnitude and duration is greater than the RTH filter, RES is asserted for TRP.
t6: On completion of the TRP pulse the RTH voltage has returned and RES is pulled high.
t7: VDD dips below threshold (minus hysteresis), RES is asserted.
Figure 3. Reset Circuit Timings
6
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SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
APPLICATION INFORMATION
PROGRAMMING THE WATCHDOG PERIOD
The watchdog period is programmed with CWP as follows:
T WP + 25
C WP
(3)
where TWP is in milliseconds and CWP is in nanofarads. A high-quality, low-leakage capacitor should be used
for CWP. The watchdog input WDI must be toggled with a high-to-low or low-to-high transition within the
watchdog period to prevent WDO from assuming a logic level low. WDO maintains the low logic level until WDI
is toggled or RES is asserted. If at any time RES is asserted, WDO assumes a high logic state and the watchdog
period be reinitiated. Figure 4 illustrates the timings associated with the watchdog circuit.
TRP
VDD
RESET
0V
TWP
VDD
WDI
0V
VDD
WDO
0V
t1
t2
t3
t4
t5
t6
t7
t8
t9 t10 t11
t12
t13
t14
UDG−98007
t1:
t2:
t3:
t4:
t5:
t6:
t7:
t8:
t9:
t10:
t11:
t12:
t13:
t14:
Microprocessor is reset.
WDI is toggled some time after reset, but before TWP expires.
WDI is toggled before TWP expires.
WDI is toggled before TWP expires.
WDI is not toggled before TWP expires and WDO asserts low, triggering the microprocessor to enter an error recovery routine.
The microprocessor’s error recovery routine is executed and WDI is toggled, reinitiating the watchdog timer.
WDI is toggled before TWP expires.
WDI is toggled before TWP expires.
RES is momentarily triggered, RES is asserted low for TRP.
Microprocessor is reset, RES pulls high.
WDI is toggled some time after reset, but before TWP expires.
WDI is toggled before TWP expires.
WDI is toggled before TWP expires.
VDD dips below the reset threshold, RES is asserted.
Figure 4. Watchdog Circuit Timings
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7
SLUS247F − APRIL 1997 − REVISED NOVEMBER 2007
APPLICATION INFORMATION
CONNECTING WDO TO RES
In order to provide design flexibility, the reset and watchdog circuits in the UCCx946 have separate outputs.
Each output independently drives high or low, depending on circuit conditions explained previously.
In some applications, it may be desirable for either the RES or WDO to reset the microprocessor. This can be
done by connecting WDO to RES. If the pins try to drive to different output levels, the low output level dominates.
Additional current flows from VDD to GND during these states. If the application cannot support additional
current (during fault conditions), RES and WDO can be connected to the inputs of an OR gate whose output
is connected to the microprocessor’s reset pin.
LAYOUT CONSIDERATIONS
A 0.1-µF capacitor connected from VDD to GND is recommended to decouple the UCCx946 from switching
transients on the VDD supply rail.
Since RP and WP are precision current sources, capacitors CRP and CWP should be connected to these pins
with minimal trace length to reduce board capacitance. Care should be taken to route any traces with high
voltage potential or high speed digital signals away from these capacitors.
Resistors R1 and R2 generally have a high ohmic value, traces associated with these parts should be kept short
in order to prevent any transient producing signals from coupling into the high impedance RTH pin.
TYPICAL CHARACTERISTICS
INPUT CURRENT
vs
INPUT VOLTAGE
THRESHOLD RESISTANCE
vs
AMBIENT TEMPERATURE
12.0
1.26
11.5
1.25
IDD − Input Current − µA
VRTH − Threshold Resistance − V
VDD = 5 V
1.24
1.23
1.22
10.5
10.0
9.5
1.21
1.20
−55
11.0
9.0
−35
−15
5
25
45
65
85
105
125
TA − Ambient Temperature − °C
3
4
5
VDD − Input Voltage − V
Figure 6.
Figure 5.
8
2
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6
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC2946D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2946DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2946DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2946DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2946PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2946PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2946PWTR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC2946PWTRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946DTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946DTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946N
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3946NG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC3946PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946PWTR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3946PWTRG4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC2946 :
• Automotive: UCC2946-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
UCC2946DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC2946PWTR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
UCC3946DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UCC3946PWTR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UCC2946DTR
SOIC
D
8
2500
367.0
367.0
35.0
UCC2946PWTR
TSSOP
PW
8
2000
367.0
367.0
35.0
UCC3946DTR
SOIC
D
8
2500
367.0
367.0
35.0
UCC3946PWTR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
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