application INFO available UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 Economy Primary Side Controller FEATURES DESCRIPTION • User Programmable Soft Start With Active Low Shutdown The UCC3809 family of BCDMOS economy low power integrated circuits contains all the control and drive circuitry required for off-line and isolated DC-to-DC fixed frequency current mode switching power supplies with minimal external parts count. Internally implemented circuits include undervoltage lockout featuring startup current less than 100µA, a user accessible voltage reference, logic to ensure latched operation, a PWM comparator, and a totem pole output stage to sink or source peak current. The output stage, suitable for driving N-Channel MOSFETs, is low in the off state. • User Programmable Maximum Duty Cycle • Accessible 5V Reference • Undervoltage Lockout • Operation to 1MHz • 0.4A Source/0.8A Sink FET Driver Oscillator frequency and maximum duty cycle are programmed with two resistors and a capacitor. The UCC3809 family also features full cycle soft start. • Low 100µA Startup Current The family has UVLO thresholds and hysteresis levels for off-line and DC-to-DC systems as shown in the table to the left. PART TURN ON TURN OFF NUMBER THRESHOLD THRESHOLD UCCX809-1 10V 8V UCCX809-2 15V 8V The UCC3809 and the UCC2809 are offered in the 8 pin SOIC (D), PDIP (N), TSSOP (PW), and MSOP (P) packages. The small TSSOP and MSOP packages make the device ideal for applications where board space and height are at a premium. TYPICAL APPLICATION DIAGRAM R S TART VIN 1V FB 1 NOIS E FILTER FEEDBACK CURRENT S ENS E 1V + – +5V REF 5V REF 8 C REF 6µA SS 2 S LOP E COMP – + 0.5V CS S – + DIS ABLE UVLO RT1 OS C 4 – + 15/8V 10/8V 7 17.5V C VDD P WM LATCH 3 RT2 VOUT VDD CLK OUT R Q 6 S CT GND 5 – + VREF UDG-99036 SLUS166B - NOVEMBER 1999 - REVISED NOVEMBER 2004 UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 CONNECTION DIAGRAM ABSOLUTE MAXIMUM RATINGS* VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19V IVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25mA IOUT (tpw < 1µs and Duty Cycle < 10%) . . . . . . . . –0.4A to 0.8A RT1, RT2, SS . . . . . . . . . . . . . . . . . . . . . . –0.3V to REF + 0.3V IREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –15mA Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . –55°C to +150°C Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C SOIC-8, DIL-8 (Top View) D, N and J Packages * Values beyond which damage may occur. All voltages are with respect to ground unless otherwise stated. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. TSSOP-8 (Top View) PW Package MSOP-8 (Top View) P Package 1 FB REF 8 1 FB REF 8 2 SS VDD 7 2 SS VDD 7 3 RT1 OUT 6 3 RT1 OUT 6 4 RT2 GND 5 4 RT2 GND 5 ORDERING INFORMATION UCC1809-X UCC2809-X UCC3809-X Temperature Range –55°C to +125°C –40°C to +85°C 0°C to +70°C UCC Available Packages J N, D, P, PW N, D, P, PW 809 – UVLO OPTION PACKAGE TEMPERATURE RANGE ELECTRICAL CHARACTERISTICS: Unless otherwise specified, CVREF = 0.47 mF, VDD = 12V. TA = TJ. PARAMETER Supply Section VDD Clamp IVDD IVDD Starting IVDD Standby Undervoltage Lockout Section Start Threshold (UCCx809-1) UVLO Hysteresis (UCCx809-1) Start Threshold (UCCx809-2) UVLO Hysteresis (UCCx809-2) Voltage Reference Section Output Voltage Line Regulation Load Regulation Comparator Section IFB Comparator Threshold OUT Propagation Delay (No Load) TEST CONDITIONS IVDD = 10mA No Load (Note 1) UCCx809-1, VDD = Start Threshold - 300mV UCCx809-2, VDD = Start Threshold - 300mV MIN TYP MAX UNIT 16 17.5 600 110 110 130 19 900 V µA µA µA µA 9.4 1.65 14.0 6.2 IREF = 0mA VDD = 10V to 15V IREF = 0mA to 5mA 4.75 Output Off 0.9 VFB = 0.8V to 1.2V at TR = 10ns 2 125 170 10.4 15.6 5 2 2 –100 0.95 50 5.25 1 100 V V V V V mV mV nA V ns UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 ELECTRICAL CHARACTERISTICS: Unless otherwise specified, CVREF = 0.47 mF, VDD = 12V. TA = TJ. PARAMETER Soft Start Section ISS TEST CONDITIONS VDD = 16V, VSS = 0V; –40°C to +85°C VDD = 16V, VSS = 0V; < –40°C; >+85°C VDD = 7.5V, ISS = 200mA VSS Low Shutdown Threshold Oscillator Section Frequency RT1 = 10k, RT2 = 4.32k, CT = 820pF Frequency Change with Voltage VDD = 10V to 15V CT Peak Voltage CT Valley Voltage CT Peak to Peak Voltage Output Section IOUT = 80mA (dc) Output VSAT Low IOUT = –40mA (dc), VDD – OUT Output VSAT High Output Low Voltage During UVLO IOUT = 20mA (dc) Minimum Duty Cycle VFB = 2V Maximum Duty Cycle Rise Time COUT = 1nF Fall Time COUT = 1nF Note 1. Ensured by design. Not 100% production tested. MIN TYP MAX UNIT –4.9 –4.0 –7.0 –7.0 0.44 0.48 –9.1 –10.0 0.2 0.52 mA mA V V 90 100 0.1 3.33 1.67 1.67 110 kHz %/V V V V 1.54 0.8 0.8 0 70 35 18 1.80 1.5 1.5 1.5 V V V % % ns ns PIN DESCRIPTIONS FB: This pin is the summing node for current sense feedback, voltage sense feedback (by optocoupler) and slope compensation. Slope compensation is derived from the rising voltage at the timing capacitor and can be buffered with an external small signal NPN transistor. External high frequency filter capacitance applied from this node to GND is discharged by an internal 250W on resistance NMOS FET during PWM off time and offers effective leading edge blanking set by the RC time constant of the feedback resistance from current sense resistor to FB input and the high frequency filter capacitor capacitance at this node to GND. RT2: This pin connects to timing resistor RT2 and controls the negative ramp time of the internal oscillator (Tf = 0.74 · (CT + 27pF) · RT2). The negative threshold of the internal oscillator is sensed through inactive timing resistor RT1 which connects to pin RT1 and timing capacitor CT. SS: This pin serves two functions. The soft start timing capacitor connects to SS and is charged by an internal 6µA current source. Under normal soft start SS is discharged to at least 0.4V and then ramps positive to 1V during which time the output driver is held low. As SS charges from 1V to 2V soft start is implemented by an increasing output duty cycle. If SS is taken below 0.5V, the output driver is inhibited and held low. The user accessible 5V voltage reference also goes low and IVDD < 100mA. GND: Reference ground and power ground for all functions. OUT: This pin is the high current power driver output. A minimum series gate resistor of 3.9W is recommended to limit the gate drive current when operating with high bias voltages. VDD: The power input connection for this device. This pin is shunt regulated at 17.5V which is sufficiently below the voltage rating of the DMOS output driver stage. VDD should be bypassed with a 1mF ceramic capacitor. REF: The internal 5V reference output. This reference is buffered and is available on the REF pin. REF should be bypassed with a 0.47mF ceramic capacitor. RT1: This pin connects to timing resistor RT1 and controls the positive ramp time of the internal oscillator (Tr = 0.74 · (CT + 27pF) · RT1). The positive threshold of the internal oscillator is sensed through inactive timing resistor RT2 which connects to pin RT2 and timing capacitor CT. 3 C1 150 µF –VIN ON/OFF +VIN PGND1 R2 1.1K R1 5.1k C2 150 µF Q1 2N2222A C4 0.01 µF C5 1nF R3 12.1K TP1 PGND1 C3 1µF R4 6.19K R5 470 5 GND RT2 4 R18 3.01K Q4 2N2222A C22 0.1 µF R20 5.62K 6 OUT RT1 3 U1 VDD 7 SS 2 8 REF UCC3809 FB 1 C6 330pF C8 1µF D1 5231B C9 0.1 µF C7 0.47 µF R12 27K D4 1N5240 R9 2K 3W R6 1K R10 10 D2 1N5245 R11 680 Q2 2N2907A R13 1.1K 2 4 R7 15K C15 0.015 µF D3 SF24 R8 0.15 3W Q3 IRF640 5:1 R19 5.1K 3W C10 0.22 µF T1 80 µH U3 1 5 H11AV1 1 2 3 R15 10K C14 470pF C16 330 µF 6.3V C13 0.1 µF U2 MBR2535CTL U4 TL431 R14 750 C17 330 µF 6.3V R16 12.1K 1% R17 12.1K 1% C18 330 µF 6.3V –VOUT C19 330 µF 6.3V +VOUT UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 APPLICATION INFORMATION UDG-99179 Figure 1. Isolated 50W flyback converter utilizing the UCC3809. The switching frequency is 70kHz, Vin = -32V to -72V, Vout = +5V, Iout = 0A to 10A 4 UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 APPLICATION INFORMATION (cont.) The Typical Application Diagram shows an isolated flyback converter utilizing the UCC3809. Note that the capacitors CREF and CVDD are local decoupling capacitors for the reference and IC input voltage, respectively. Both capacitors should be low ESR and ESL ceramic, placed as close to the IC pins as possible, and returned directly to the ground pin of the chip for best stability. REF provides the internal bias to many of the IC functions and CREF should be at least 0.47µF to prevent REF from drooping. reference) sensed through RT1. The R input to the oscillator latch, R(OSC), is also level sensitive and resets the CLK signal low when CT crosses the 1.67V threshold, turning off Q2 and turning on Q1, initiating another charging cycle. Figure 3 shows the waveforms associated with the oscillator latch and the PWM latch (shown in the Typical Application Diagram). A high CLK signal not only initiates a discharge cycle for CT, it also turns on the internal NMOS FET on the FB pin causing any external capacitance used for leading edge blanking connected to this pin to be discharged to ground. By discharging any external capacitor completely to ground during the external switch’s off-time, the noise immunity of the converter is enhanced allowing the user to design in smaller RC components for leading edge blanking. A high CLK signal also sets the level sensitive S input of the PWM latch, S(PWM), high, resulting in a high output, Q(PWM), as shown in Figure 3. This Q(PWM) signal will remain high until a reset signal, R(PWM) is received. A high R(PWM) signal results from the FB signal crossing the 1V threshold, or during soft start or if the SS pin is disabled. FB Pin The basic premise of the UCC3809 is that the voltage sense feedback signal originates from an optocoupler that is modulated by an external error amplifier located on the secondary side. This signal is summed with the current sense signal and any slope compensation at the FB pin and compared to a 1V threshold, as shown in the Typical Application Diagram. Crossing this 1V threshold resets the PWM latch and modulates the output driver on-time much like the current sense comparator used in the UC3842. In the absence of a FB signal, the output will follow the programmed maximum on-time of the oscillator. Assuming the UVLO threshold is satisfied, the OUT signal of the IC will be high as long as Q(PWM) is high and S(PWM), also referred to as CLK, is low. The OUT signal will be dominated by the FB signal as long as the FB signal trips the 1V threshold while CLK is low. If the FB signal does not cross the 1V threshold while CLK is low, the OUT signal will be dominated by the maximum duty cycle programmed by the user. Figure 3 illustrates the various waveforms for a design set up for a maximum duty cycle of 70%. When adding slope compensation, it is important to use a small capacitor to AC couple the oscillator waveform before summing this signal into the FB pin. By correctly selecting the emitter resistor of the optocoupler, the voltage sense signal can force the FB node to exceed the 1V threshold when the output that is being compared exceeds a desired level. Doing so drives the UCC3809 to zero percent duty cycle. Oscillator The following equation sets the oscillator frequency: FOS C = [ 0.74 • (CT + 27pF ) • (R T 1+ R T 2)] −1 VREF DMAX = 0.74 • R T 1• (CT + 27pF ) • FOS C Q1 Referring to Figure 2 and the waveforms in Figure 3, when Q1is on, CT charges via the RDS(on) of Q1 and RT1. During this charging process, the voltage of CT is sensed through RT2. The S input of the oscillator latch, S(OSC), is level sensitive, so crossing the upper threshold (set at 2/3 VREF or 3.33V for a typical 5.0V reference) sets the Q output (CLK signal) of the oscillator latch high. A high CLK signal results in turning off Q1 and turning on Q2. CT now discharges through RT2 and the RDS(on) of Q2. CT discharges from 3.33V to the lower threshold (set at 1/3 VREF or 1.67V for a typical 5.0V 3 3.33V + – S 1.67V + – R RT1 4 RT2 CT Q CLK OS CILLATOR LATCH Q2 OS C UDG-97195 Figure 2. UCC3809 oscillator. 5 UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 APPLICATION INFORMATION (cont.) CT CT CHARGING DIS CHARGING 3.33V 1.67V CT S (OS C) R(OS C) Q(OS C)=CLK =S (P WM) 1V FB R(P WM) Q(P WM) 70% ON OUT FB S IGNAL DOMINANT 30% OFF MAX. DUTY CYCLE DOMINANT UDG-99037 Figure 3. Waveforms associated with the oscillator latch and the PWM latch. The recommended value for CT is 1nF for frequencies in the 100 kHz or less range and smaller CT for higher frequencies. The minimum recommended values of RT1 and RT2 are 10kΩ and 4.32kΩ, respectively. Using these values maintains a ratio of at least 20:1 between the RDS(on) of the internal FETs and the external timing resistors, resulting in minimal change in frequency over temperature. Because of the oscillator's susceptibility to capacitive coupling, examine the oscillator frequency by looking at the common RT1-RT2-CT node on the circuit board as opposed to looking at pins 3 and 4 directly. For good noise immunity, RT1 and RT2 should be placed as close to pins 3 and 4 of the IC as possible. CT should be returned directly to the ground pin of the IC with minimal stray inductance and capacitance. FREQUENCY [kHz] 1000 100 10 100 1000 CT [pF] Figure 4. Oscillator frequency vs. CT (RT1 = 10k, RT2 = 4.32k) 6 10000 UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 APPLICATION INFORMATION (cont.) Synchronization changed. Both of the synchronization schemes shown in Figure 5 can be successfully implemented with the internal oscillator of the UCC3809. Both schemes allow access to the timing ramp needed for slope compensation and have minimal impact on the programmed maximum duty cycle. In the absence of a sync pulse, the PWM controller will run independently at the frequency set by RT1, RT2, and CT. This free running frequency must be approximately 15 to 20% lower than the sync pulse frequency to insure the free running oscillator does not cross the comparator threshold before the desired sync pulse. Option II uses the synchronization pulse to superimpose the sync voltage onto the peak of the CT waveform. This triggers the internal 3.33V comparator, initiating a discharge cycle. The sync pulse is summed with the free running oscillator waveform at the CT node, resulting in a spike on top of the CT peak voltage. ADDITIONAL INFORMATION Please refer to the following Unitrode application topics for additional information. [1] Application Note U-165, Design Review: Isolated 50W Flyback Converter with the UCC3809 Primary Side Controller by Lisa Dinwoodie. Option I uses the synchronization pulse to pull pin 3 low, triggering the internal 1.67V comparator to reset the RS latch and initiate a charging cycle. The valley voltage of the CT waveform is higher when synchronized using this configuration, decreasing the ramp charge and discharge times, thereby increasing the operating frequency; otherwise the overall shape of the CT voltage waveform is un- [2] Design Note DN-89, Comparing the UC3842, UCC3802, and UCC3809 Primary Side PWM Controllers by Lisa Dinwoodie. 1k 3 S YNC P ULS E 2N2222A RT1 4 +5V UCC3809 OS CILLATOR S YNC P ULS E RT2 3 2N2222A RT1 4 UCC3809 OS CILLATOR RT2 424 CT 0.1µF 424 OP TION I CT 24 OP TION II Figure 5. UCC3809 synchronization options. 7 UDG-99006 UCC1809-1/-2 UCC2809-1/-2 UCC3809-1/-2 TYPICAL CHARACTERISTICS CURVES 16 160 UCC2809-2 140 UCC2809-1 14 12 120 UVLO (V) Idd standby (uA) 180 100 80 60 10 8 6 40 4 20 2 0 -50 -25 0 25 50 75 100 2809-2 UVLO on 2809-1UVLO on UVLO off 0 125 -50 -25 0 Temperature (deg C) 25 50 Temperature (deg C) Figure 6. IDD (standby) vs. temperature. Figure 7. UVLO vs. temperature. Oscillator frequency (kHz) 110 105 100 95 90 -50 -25 0 25 50 75 100 125 temperature (deg C) Figure 8. Oscillator frequency vs. temperature. REVISION HISTORY REV. B 11/04 Added Ivdd Stand-by Current specifications in the Electrical Characteristics table. Modified Ivdd Starting specifications in the Electrical Characteristics table. Added Typical Characteristics Curves for Idd(Standby), UVLO thresholds, and Oscillator Frequency. 8 75 100 125 PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC2809D-1 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2809D-1G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2809D-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809D-2G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809DTR-1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2809DTR-1G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UCC2809DTR-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809DTR-2G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809P-1 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809P-1G4 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809P-2 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809P-2G4 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PTR-1 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PTR-1G4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PTR-2 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PTR-2G4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PW-1 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PW-1G4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PW-2 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PW-2G4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PWTR-1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PWTR-1G4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PWTR-2 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC2809PWTR-2G4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809D-1 ACTIVE SOIC D 8 CU NIPDAU Level-2-260C-1 YEAR 75 Addendum-Page 1 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCC3809D-1G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809D-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809D-2G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809DTR-1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809DTR-1G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809DTR-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809DTR-2G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809N-1 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3809N-2 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3809N-2G4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UCC3809P-1 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809P-1G4 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809P-2 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809P-2G4 ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PTR-1 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PTR-1G4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PTR-2 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PTR-2G4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PW-1 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PW-1G4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PW-2 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PW-2G4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PWTR-1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC3809PWTR-1G4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 2 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2007 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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