SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
D Controlled Baseline
D
D
D
D
D
D
D
D
D
D
D
− One Assembly
− One Test Site
− One Fabrication Site
Extended Temperature Performance of
−55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree†
ESD Protection Exceeds 200 V Using
Machine Model (C = 200 pF, R = 0)
100 µA Typical Starting Supply Current
500 µA Typical Operating Supply Current
D
D
D
D
Operation to 1 MHz
Internal Soft Start
Internal Fault Soft Start
Internal Leading-Edge Blanking of the
Current Sense Signal
1 Amp Totem-Pole Output
70 ns Typical Response from
Current-Sense to Gate Drive Output
1.5% Tolerance Voltage Reference
Same Pinout as UC3842 and UC3842A
D PACKAGE
(TOP VIEW)
COMP
FB
CS
RC
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
1
8
2
7
3
6
4
5
REF
VCC
OUT
GND
description
The UCC2800/1/2/3/4/5 family of high-speed, low-power integrated circuits contain all of the control and drive
components required for off-line and dc-to-dc fixed frequency current-mode switching power supplies with
minimal parts count.
These devices have the same pin configuration as the UC2842/3/4/5 family and also offer the added features
of internal full-cycle soft start and internal leading-edge blanking of the current-sense input.
The UCC2800/1/2/3/4/5 family offers choice of maximum duty cycle and critical voltage levels. Lower reference
parts such as the UCC2803 and UCC2805 fit best into battery operated systems, while the higher reference
and the higher UVLO hysteresis of the UCC2802 and UCC2804 make these ideal choices for use in off-line
power supplies.
PART NUMBER
MAXIMUM DUTY CYCLE
REFERENCE VOLTAGE
TURN-ON THRESHOLD
TURN-OFF THRESHOLD
UCC2800
100%
5V
7.2 V
6.9 V
UCC2801
50%
5V
9.4 V
7.4 V
UCC2802
100%
5V
12.5 V
8.3 V
UCC2803
100%
4V
4.1 V
3.6 V
UCC2804
50%
5V
12.5 V
8.3 V
UCC2805
50%
4V
4.1 V
3.6 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2007, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
ORDERING INFORMATION†
TA
−40°C to 125°C
−55°C
125°C
−55
C to 125
C
ORDERABLE
PART NUMBER
PACKAGE‡
SOP − D
SOP − D
Tape and reel
Tape and reel
TOP-SIDE
MARKING
UCC2800QDREP
2800EP
UCC2801QDREP
2801EP
UCC2802QDREP
2802EP
UCC2803QDREP
2803EP
UCC2804QDREP
2804EP
UCC2805QDREP
2805EP
UCC2800MDREP
2800EP
UCC2801MDREP
2801EP
UCC2803MDREP
2803EP
† For the most current package and ordering information, see the Package Option Addendum at the
end of this document, or see the TI website at www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
block diagram
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
Ordering Information
UCC2 80 0 Q or M
D
R
EP
ENHANCED PLASTIC INDICATOR
TAPE and REEL INDICATOR
PACKAGE
D = Plastic SOIC
TEMPERATURE RANGE INDICATOR
PRODUCT OPTION
0 through 5
UCC280XXD−EP Operating Life Derating Chart
Years estimated life
1000
100
Wirebond Voiding
Fail Mode
10
1
100
110
120
130
140
150
160
Continuous Tj (5C)
NOTES: A. See datasheet for Absolute Maximum and Minimum Recommended Operating Conditions
B. Silicon operating life design Goal is 10 @ 105°C junction temperature (does not include package interconnect life).
C. Enhanced plastic product disclaimer applies.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†‡
VCC voltage w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 V
VCC current w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 A
Output energy (capacitive load) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 µJ
Analog inputs (FB, CS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6.3 V
Power dissipation at TA < +25_C (D package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.65 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65_C to 150_C
Lead temperature soldering 1,6 mm (1/16 in) from case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300_C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals.
w In normal operation, VCC is powered through a current limiting resistor. Absolute maximum of 12 V applies when VCC is driven from a low
impedance source such that ICC does not exceed 30 mA (which includes gate drive current requirement).
electrical characteristics, TA = −40_C to 125_C for Q temp and TA= −55_C to 125_C for M temp, VCC
= 10 V (see Note 1), RT = 100 kΩ from REF to RC, CT = 330 pF from RC to GND, 0.1 F capacitor from
VCC to GND, 0.1 F capacitor from VREF to GND and TA = TJ (unless otherwise stated)
PARAMETER
TEST CONDITIONS
UCC280XQ,
UCC280XM
UNIT
MIN
TYP
MAX
4.925
5
5.075
3.94
4
4.06
Reference Section
Output voltage
TJ = 25_C, I = 0.2 mA
Load regulation voltage
I = 0.2 mA to 5 mA
UCC2800/01/02/04
UCC2803/05
10
1.9
TJ = −40_C to 125_C and
TJ = −55_C to 125_C
2.5
Line regulation voltage
VCC = 10 V to clamp
Total variation voltage
See Note 5
Output noise voltage
f = 10 Hz to 10 kHz, See Note 7
TJ = 25_C
Long term stability
1000 hours, See Note 7
TA = 125_C
UCC2800/01/02/04
UCC2803/05
Output short-circuit current
4
30
TJ = 25_C
4.88
5
5.1
3.9
4
4.08
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
mV
mV/V
V
µV
130
5
−5
V
mV
−35
mA
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
electrical characteristics, TA = −40_C to 125_C for Q temp and TA= −55_C to 125_C for M temp, VCC
= 10 V (see Note 1), RT = 100 kΩ from REF to RC, CT = 330 pF from RC to GND, 0.1 F capacitor from
VCC to GND, 0.1 F capacitor from VREF to GND and TA = TJ (unless otherwise stated)
PARAMETER
UCC280XQ,
UCC280XM
TEST CONDITIONS
MIN
TYP
UNIT
MAX
Oscillator Section
Oscillator frequency
See Note 2
Temperature stability
See Note 7
UCC2800/01/02/04
40
46
52
UCC2803/05
26
31
36
kHz
2.5%
Amplitude peak-to-peak
2.25
Oscillator peak voltage
2.4
2.55
2.45
V
V
Error Amplifier Section
Input voltage
COMP = 2.5 V
UCC2800/01/02/04
2.44
2.5
2.56
COMP = 2 V
UCC2803/05
1.95
2
2.05
Input bias current
−1
Open loop voltage gain
60
COMP sink current
FB = 2.7 V, COMP = 1.1 V
COMP source current
FB = 1.8 V, COMP = REF − 1.2 V
Gain bandwidth product
See Note 7
1
80
0.3
−0.2
−0.5
V
µA
db
3.5
mA
−0.8
mA
2
MHz
PWM Section
Maximum duty cycle
Minimum duty cycle
UCC2800/02/03
97%
99%
100%
UCC2801/04/05
48%
49%
50%
COMP = 0 V
0
Current Sense Section
Gain
See Note 3
1.1
1.65
1.8
V/V
Maximum input signal
COMP = 5 V, See Note 4
0.9
1
1.1
V
200
nA
Input bias current
−200
CS blank time
Overcurrent threshold voltage
COMP to CS offset voltage
CS = 0 V
50
100
150
ns
1.42
1.55
1.68
V
0.45
0.9
1.35
V
Output Section (OUT)
Low-level output voltage
High-level output voltage VSAT (VCC − OUT)
IOUT = 20 mA
All parts
0.1
0.4
IOUT = 200 mA
All parts
0.35
0.9
IOUT = 50 mA, VCC = 5 V
UCC2803/05
0.15
0.4
IOUT = 20 mA, VCC = 0 V
All parts
0.7
1.2
IOUT = −20 mA
All parts
0.15
0.4
IOUT = −200 mA
All parts
1
1.9
IOUT = −50 mA, VCC = 5 V
UCC2803/05
V
V
0.4
0.9
Rise time
CL = 1 nF
41
70
ns
Fall time
CL = 1 nF
44
75
ns
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
electrical characteristics, TA = −40_C to 125_C for Q temp and TA= −55_C to 125_C for M temp, VCC
= 10 V (see Note 1), RT = 100 kΩ from REF to RC, CT = 330 pF from RC to GND, 0.1 F capacitor from
VCC to GND, 0.1 F capacitor from VREF to GND and TA = TJ (unless otherwise stated)
PARAMETER
UCC280XQ,
UCC280XM
TEST CONDITIONS
MIN
TYP
UNIT
MAX
Undervoltage Lockout Section
Start threshold
Stop threshold
See Note 6
See Note 6
UCC2800
6.6
7.2
7.8
UCC2801
8.6
9.4
10.2
UCC2802/04
11.5
12.5
13.5
UCC2803/05
3.7
4.1
4.5
UCC2800
6.3
6.9
7.5
UCC2801
6.8
7.4
8
UCC2802/04
7.6
8.3
9
UCC2803/05
Start to stop hysteresis
V
V
3.2
3.6
4
UCC2800
0.12
0.3
0.48
UCC2801
1.6
2
2.4
UCC2802/04
3.5
4.2
5.1
UCC2803/05
0.2
0.5
0.8
4
10
ms
V
Soft Start Section
COMP rise time
FB = 1.8 V, Rise from 0.5 V to REF − 1 V
Overall Section
Start-up current
VCC < Start threshold
0.1
0.2
mA
Operating supply current
FB = 0 V, CS = 0 V
0.5
1
mA
VCC internal zener voltage
ICC = 10 mA, See Note 6 and Note 8
13.5
15
V
12
VCC internal zener voltage minus start threshold voltage
See Note 6
UCC2802/04
0.5
1
NOTES: 1. Adjust VCC above the start threshold before setting at 10 V.
2. Oscillator frequency for the UCC2800, UCC2802, and UCC2803 is the output frequency.
Oscillator frequency for the UCC2801, UCC2804, and UCC2805 is twice the output frequency.
DVCOMP
A=
DVCS
3. Gain is defined by:
0 v VCS v 0.8 V
4. Parameter measured at trip point of latch with Pin 2 at 0 V
5. Total variation includes temperature stability and load regulation.
6. Start threshold, stop threshold, and zener shunt thresholds track one another.
7. Not production tested
8. The device is fully operating in clamp mode as the forcing current is higher than the normal operating supply current.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
detailed terminal descriptions
COMP
COMP is the output of the error amplifier and the input of the PWM comparator.
Unlike other devices, the error amplifier in the UCC2800 family is a true, low output-impedance, 2 MHz
operational amplifier. As such, the COMP terminal can both source and sink current. However, the error
amplifier is internally current limited, so that one can command zero duty cycle by externally forcing COMP to
GND.
The UCC2800 family features built-in full cycle soft start. Soft start is implemented as a clamp on the maximum
COMP voltage.
CS
CS is the input to the current sense comparators. The UCC2800 family has two different current sense
comparators - the PWM comparator and an overcurrent comparator.
The UCC2800 family contains digital current sense filtering, which disconnects the CS terminal from the current
sense comparator during the 100 ns interval immediately following the rising edge of the OUT pin. This digital
filtering, also called leading-edge blanking, means that in most applications, no analog filtering (RC filter) is
required on CS. Compared to an external RC filter technique, the leading-edge blanking provides a smaller
effective CS to OUT propagation delay. Note, however, that the minimum non-zero on-time of the OUT signal
is directly affected by the leading-edge-blanking and the CS to OUT propagation delay.
The overcurrent comparator is only intended for fault sensing, and exceeding the over-current threshold will
cause a soft start cycle.
FB
FB is the inverting input of the error amplifier. For best stability, keep FB lead length as short as possible and
FB stray capacitance as small as possible.
ground (GND)
GND is reference ground and power ground for all functions on this part.
OUT
OUT is the output of a high-current power driver capable of driving the gate of a power MOSFET with peak
currents exceeding 750 mA. OUT is actively held low when VCC is below the UVLO threshold.
The high-current power driver consists of FET output devices, which can switch all of the way to GND and all
of the way to VCC. The output stage also provides a low impedance to overshoot and undershoot. This means
that in many cases, external schottky clamp diodes are not required.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
detailed descriptions (continued)
RC
RC is the oscillator timing pin. For fixed frequency operation, set timing capacitor charging current by connecting
a resistor from REF to RC. Set frequency by connecting timing capacitor from RC to GND. For the best
perfomance, keep the timing capacitor lead to GND as short and direct as possible. If possible, use separate
ground traces for the timing capacitor and all other functions.
The frequency of oscillation can be estimated with the following equations:
1.5
R C
UCC2803ńUCC2805 : F + 1.0
R C
UCC2800ń01ń02ń04 : F +
(1)
where frequency is in Hz, resistance is in ohms, and capacitance is in farads. The recommended range of timing
resistors is between 10k and 200k and timing capacitor is 100 pF to 1000 pF. Never use a timing resistor less
than 10k.
To prevent noise problems, bypass VCC to GND with a ceramic capacitor as close to the VCC pin as possible.
An electrolytic capacitor may also be used in addition to the ceramic capacitor.
voltage reference (REF)
REF is the voltage reference for the error amplifier and also for many other functions on the IC. REF is also used
as the logic power supply for high speed switching logic on the IC.
When VCC is greater than 1 V and less than the UVLO threshold, REF is pulled to ground through a 5 kΩ resistor.
This means that REF can be used as a logic output indicating power system status. It is important for reference
stability that REF is bypassed to GND with a ceramic capacitor as close to the pin as possible. An electrolytic
capacitor may also be used in addition to the ceramic capacitor. A minimum of 0.1 µF ceramic is required.
Additional REF bypassing is required for external loads greater than 2.5 mA on the reference.
To prevent noise problems with high speed switching transients, bypass REF to ground with a ceramic capacitor
close to the IC package.
power (VCC)
VCC is the power input connection for this device. In normal operation, VCC is powered through a current limiting
resistor. Although quiescent VCC current is very low, total supply current will be higher, depending on the OUT
current. Total VCC current is the sum of quiescent VCC current and the average OUT current. Knowing the
operating frequency and the MOSFET gate charge (Qg), average OUT current can be calculated from:
I OUT + Q g
F
(2)
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
PARAMETER MEASUREMENT INFORMATION
Error Amplifier
Gain/Phase Response
Oscillator
The UCC3800/1/2/3/4/5 oscillator generates a sawtooth waveform
on RC. The rise time is set by the time constant of RT and CT. The
fall time is set by CT and an internal transistor on-resistance of
approximately 125. During the fall time, the output is off and the
maximum duty cycle is reduced below 50% or 100% depending on
the part number. Larger timing capacitors increase the discharge
time and reduce the maximum duty cycle and frequency.
Figure 1
Figure 2
UCC1803/05 VREF vs VCC; ILOAD = 0.5 mA
UCC1800/01/02/04 Oscillator Frequency
vs RT and CT
Figure 3
Figure 4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
PARAMETER MEASUREMENT INFORMATION
UCC1803/05 Oscillator Frequency
vs
RT and CT
UCC1800/02/03 Maximum Duty Cycle
vs
Oscillator Frequency
Figure 5
Figure 6
UCC1801/04/05 Maximum Duty Cycle
vs
Oscillator Frequency
UCC1800 ICC
vs
Oscillator Frequency
Figure 8
Figure 7
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
PARAMETER MEASUREMENT INFORMATION
UCC1805 ICC
vs
Oscillator Frequency
Dead Time
vs
CT, RT = 100 kW
Figure 9
Figure 10
COMP to CS Offset
vs
Temperature, CS = 0 V
Figure 11
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
SGLS135E − SEPTEMBER 2002 − REVISED DECEMBER 2007
MECHANICAL DATA
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
0.050 (1,27)
8
0.010 (0,25)
5
0.008 (0,20) NOM
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
1
4
0.010 (0,25)
0°− 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
0.004 (0,10)
0.069 (1,75) MAX
PINS **
0.004 (0,10)
8
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047/E 09/01
NOTES: A.
B.
C.
D.
12
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
Falls within JEDEC MS-012
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jan-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
UCC2800MDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2800QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2801MDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2801QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2802QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2803MDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2803QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2804QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
UCC2805QDREP
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-01XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-02XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-03XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-04XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-05XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-06XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-07XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-08XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03624-09XE
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jan-2008
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2008, Texas Instruments Incorporated