VS6650 1.0 Megapixel SMIA Camera Module DATA BRIEF FEATURES ■ 1.0 Megapixel resolution (1152H x 864V) ■ SMIA1 1.0 profile 1 compliant imager ■ CCP 2.0 serial video interface ■ Two-wire control port (CCI) ■ On-chip PLL based on 13 MHz system clock ■ Up to 30 frame per second (fps) progressive scan, with smooth frame rate control ■ Horizontal downscale from 1x to 4.5x in 1/16 steps ■ Operation from 2.4 V analog power supply ■ Low EMI 1.8 V digital and I/O power supply ■ 30 µW power-down consumption ■ 10-bit on-chip ADC ■ Small size 1/3 inch lens fixed focus module ■ Integral EMC shielding DESCRIPTION The VS6650 is a 1.0 Megapixel camera module for use across a range of mobile phone platforms. The camera module, which is SMIA 1.0 profile 1 compliant, can generate 1.0 Megapixel images up to 30 fps. Based on the SMIA architectural concepts, the VS6650 can be used with or without image processor (i.e. STV0976 or STV0984). The module is suitable for performance-driven camera phones and cost-driven high volume designs. The embedded horizontal scaler typically enables the realization of power-efficient viewfinder that uses host software processing. For performance driven applications or when a different video interface is required, the STV0976 mobile imaging processor ensures state-of-the-art image reconstruction and compression at up to 15 fps. The VS6650 features allow straightforward integration into mobile phone designs: low EMI video interface and package/socket shielding, low wire count (8 total), embedded power management (30 µW power-down) and embedded PLL. A minimal list of external components is required: supply decoupling capacitors, CCI pull-ups and a chargepump capacitor. The VS6650 3-element lens design ensures high quality image capture while maintaining low module height. The overall optical stack, including lens system, IR filter and sensor optical structures is developed within ST. The VS6650 package uses the second generation of SmOP2 packaging technology. Sensor and lens are assembled in a fully automated test and focus process for high volume and low cost production. This 1.0 Megapixel sensor fits within the SMIA95 form factor (9.5 x 9.5 x 7.6 mm3). APPLICATIONS Mobile phone ■ ■ PDA ■ Wireless security camera Table 1. Order Codes 1.Standard Mobile Imaging Architecture, visit www.smia-forum.org Part Number VS6650S02F/T2 Description SmOP2 SMIA95 22” tape and reel Rev. 1 October 2004 1/3 VS6650 Figure 1. Application Diagram VS6650 1.0 Megapixel SMIA Camera Module EXTCLK STV0976 XSHUTDOWN 1.0 Megapixel SMIA Mobile CCI Imaging Processor (optional) CCP 2.0 Table 2. Technical Specifications Baseband or Application Processor Figure 2. Block Diagram Active pixels 1152H x 864V Pixel size 4.0 µm x 4.0 µm Array size 4.640 mm x 3.488 mm Color filter array RGB Bayer Exposure control +120 dB Analog gain +24 dB (max) Dynamic range 61 dB (typical) Signal-to-noise Ratio 35 dB at 100 lux Frame rate 5 to 30 Hz (1152H x 864V) Pixel format Raw Bayer 10-bit Raw Bayer 8-bit compressed Video Interface CCP 2.0 high-speed serial 390 Mbit/s D/S encoding 1.8 V LVDS Clock input 6 to 27 MHz square 13 MHz typ. (on-chip PLL) Supply voltage 2.4 to 2.9 V analog 1.8 V ± 0.1 V digital I/O voltage 1.8 V CMOS levels Power consumption Streaming @ 15 fps: 85 mW max. Power down: 15µW max. Lens 3-element 50° HFOV f#3.2 Depth of field 50 cm to infinite TV distortion <1% Relative illumination 45 % (typical) Package type SmOP2 SMIA 95 Package size 9.5 x 9.5 x 7.6 mm3 (wlh) System attach 16-pin SMD socket with EMC shield VS6650 CLKP CLKN DATAP DATAN SMIA Profile 1 Frame Formatter Figure 3. Outline Drawing Y Decoder Sensor Control Registers Readout SCL SDA Power Mgmt Power-On Reset CCI Receiver XSHUTDOWN PLL and Clock Management CCP 2.0 Transmitter EXTCLK 1160 x 872 Pixel array 1152 x 864 VDIG DGND VCAP VANA AGND Column ADC X Decoder Line SRAM Table 3. Temprature Range 2/3 Storage -40 to +85°C Functional -30 to +70°C Normal operating -25 to +55 °C Optimal operating +5 to +30°C Test 23 ± 2°C VS6650 REVISION HISTORY Table 4. Revision History Date Revision October 2004 1 Description of Changes First Issue Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 3/3