Wire Bondable Chip Capacitor WBC Capacitor Series • Silicon Dioxide/Silicon Nitride dielectric • Capacitance range from 10pF to 1000pF • Silicon substrate with gold or aluminum backing IRC’s wire-bondable chip capacitors are based on the successful TaNCAP® line of RC networks on silicon. The new chip capacitors have the advantage of excellent performance in extremely small sizes ranging from 20 to 60 mils square. Capacitors are 100% electrically tested with mil screening to MIL-STD-883 also available. For demanding hybrid circuit and/or chip and wire applications, specify IRC’s WBC capacitor series. Physical Data C0606 C0404 Top Bonding Pad Top Bonding Pad C0303 Back of chip Back of chip C0505 C0202 Manufacturing Capabilities Data Style Size Capacitance Range Voltage C0202 0.020″± 0.001 sq. (0.508mm ±0.025) 10pF to 51pF 40 C0303 0.030″± 0.001 sq. (0.762mm ±0.025) 33pF to 100pF 55 C0404 0.040″± 0.001 sq. (1.016mm ±0.025) 56pF to 220pF 50 C0505 0.055″± 0.001 sq. (1.397mm ±0.025) 160pF to 360pF 20 C0606 0.060″± 0.001 sq. (1.524mm ±0.025) 160pF to 1000pF 20 General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TT electronics plc WBC Capacitor Series Issue January 2009 Sheet 1 of 2 Wire Bondable Chip Capacitor Electrical Data Capacitance Range 10pF to 1000pF Dissipation Factor 1Khz, +25°C, 1VRMS 0.5% min Absolute Tolerance to ±5% Operating Temperature -55°C to +125°C Noise <-30dB Substrate Material Semiconductor Silicon (10KÅ SiO2 minimum) 0.010˝ ±0.001 (0.254mm ±0.025) Substrate Thickness Bond Pad Metallization Aluminum: 10KÅ minimum Backside Aluminum: 10KÅ minimum Gold: 3KÅ minimum Dielectric Silicon Dioxide and/or Silicon Nitride Passivation Silicon Dioxide or Silicon Nitride Ordering Data Environmental Data Test Thermal Shock Method MIL-STD-202 Method 107 Test condition F Max ∆C Prefix WBC - C0606 A G - 102 - K Style C0202; C0303; C0404; C0505; C0606 ±0.25% + 0.25pF max Bonding pads A = Aluminum MIL-STD-202 Method 106 ±1.0% + 0.25pF max Short Time Overload +25°C, 5 seconds 1.5 X rated voltage ±0.25% + 0.25pF mx Life at Elevated Temperature MIL-STD-202 Method 108 125°C, 1000 hours ±0.25% + 0.25pF max 100 hours @ 150°C ambient ±0.25% + 0.25pF max Moisture Resistance High Temperature Exposure A = Aluminum; G = Gold Capacitance 3-Digit Capacitance Code Ex: 102 = 1000pF; 221 = 220pF; 470 = 47pF Absolute Tolerance Code M = ±20%; K = ±10%; J = ±5% Packaging © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Backside Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. WBC Capacitor Series Issue January 2009 Sheet 2 of 2