Wire Bondable Multi-tap Chip Resistors WBC Series • High resistor density • MIL inspection available • Multi-tapped chip resistor Electrical Data Physical Data Absolute Tolerance 0.032˝ ±0.001 (0.813mm ±0.025) Pad 13 Absolute TCR to ±25ppm/°C Package Power Rating (@ 70°C) 0.032˝ ±0.001 (0.813mm ±0.025) to ±5% Rated Operating Voltage (not to exceed √ P x R ) Operating Temperature 250mW 100V -55°C to +150°C Pad 1 chamfered Noise 0.004˝ min Bond Pads <-30dB Substrate Material R R R 13 R R 5R Substrate Thickness 5R 5R 5R RT = 40 R Bond Pad Metallization Backside Oxidized Silicon (10KÅ SiO2 minimum) 0.010˝ ±0.001 (0.254mm ±0.025) Aluminum 10KÅ minimum Gold 15KÅ minimum Silicon (gold available) 5R 5R 5R 1 Passivation Silicon Dioxide or Silicon Nitride General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TT electronics plc WBC Series Issue January 2009 Sheet 1 of 3 Wire Bondable Multi-tap Chip Resistors Power Derating Data TCR/Inspection Code Table Absolute TCR Commercial Code MIL Inspection Code* ±300ppm/°C 00 04 ±100ppm/°C 01 05 ±50ppm/°C 02 06 ±25ppm/°C 03 07 *Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection Environmental Data Method Max ∆R Typical ∆R MIL-STD-202 Method 107 Test condition F ±0.1% ±0.02% High Temperature Exposure MIL-STD-883 Method 1008 150°C, 1000 hours ±0.1% ±0.05% Low Temperature Storage -55°C, 1000 hours ±0.03% ±0.01% Life MIL-STD-202 Method 108 70°C, 1000 hours ±0.5% ±0.01% Life at Elevated Temperature MIL-STD-202 Method 108 125°C, 1000 hours ±0.5% ±0.05% Test Thermal Shock © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com WBC Series Issue January 2009 Sheet 2 of 3 Wire Bondable Multi-tap Chip Resistors Manufacturing Capabilities Data Resistance R Total Available Absolute Tolerances Best Absolute TCR 100Ω MK ±100ppm/°C 400Ω MKJ ±100ppm/°C 800Ω MKJ ±100ppm/°C 2.4KΩ MKJ ±50ppm/°C 8.0KΩ MKJ ±50ppm/°C 24KΩ MKJ ±25ppm/°C 80KΩ MKJ ±25ppm/°C Ordering Data Prefix WBC - M0303 A S - 01 - 2402 - J Style M0303 Bonding pads A = Aluminum; G = Gold Backside G = Gold; S = Silicon TCR/Inspection Code Reference TCR/Inspection Code Table Total Resistance = RT 4-Digit Resistance Code Ex: 8000 = 800Ω; 2402 = 24.0KΩ Reference manufacturing Capabilities Data Table for available resistances Absolute Tolerance Code M = ±20%; K = ±10%; J = ±5% Packaging Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com WBC Series Issue January 2009 Sheet 3 of 3