WSF256K8-XCX 256Kx8 SRAM/ FLASH MODULE ADVANCED* FEATURES FIG. 1 ■ Access Times of 35ns (SRAM) and 70ns (FLASH) A18 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 ■ 256Kx8 SRAM VCC WE A17 A14 A13 A8 A9 A11 OE A10 CS I/O7 I/O6 I/O5 I/O4 I/O3 ■ 256Kx8 5V FLASH ■ Memory Map Flash Memory: 0H-3FFFFH SRAM: 40000H-7FFFFH ■ Low Power CMOS ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compatible Inputs and Outputs ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation FLASH MEMORY FEATURES ■ 10,000 Erase/Program Cycles PIN DESCRIPTION A0-18 Address Inputs I/O0-7 Data Input/Output ■ Sector Architecture • 8 equal size sectors of 16KBytes each • Any combination of sectors can be concurrently erased. Also supports full chip erase CS Chip Select OE Output Enable WE Write Enable ■ 5 Volt Programming; 5V ± 10% Supply VCC +5.0V Power ■ Embedded Erase and Program Algorithms VSS Ground ■ Hardware and Software Write Protection ■ Data Retention, 10 Years at 125°C ■ Page Program Operation and Internal Program Control Time * This data sheet describes a product that may or may not be under development and is subject to change or cancellation without notice. BLOCK DIAGRAM A0-16 I/O 0-7 WE OE 128K x 8 Flash 128K x 8 SRAM 128K x 8 Flash 128K x 8 SRAM A17 A18 Decoder CS January 1996 1 White Microelectronics • Phoenix, AZ • (602) 437-1520 MIXED MODULES ■ JEDEC Standard, Hermetic Ceramic Package, 32 pin DIP (Package 300) PIN CONFIGURATION TOP VIEW 11 WSF256K8-XCX PACKAGE 300: 32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED 11 MIXED MODULES 42.4 (1.670) ± 0.4 (0.016) 15.04 (0.592) ± 0.3 (0.012) 4.34 (0.171) ± 0.79 (0.031) PIN 1 IDENTIFIER 3.2 (0.125) MIN 0.25 (0.010) ± 0.05 (0.002) 0.84 (0.033) ± 0.4 (0.014) 2.5 (0.100) TYP 1.27 (0.050) ± 0.1 (0.005) 15.25 (0.600) ± 0.25 (0.010) 0.46 (0.018) ± 0.05 (0.002) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES ORDERING INFORMATION W S F 256K8 - XXX C X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: M = Military Screened I = Industrial C = Commercial -55°C to +125°C -40°C to +85°C 0°C to +70°C PACKAGE TYPE: C = 32 DIP (Package 300) ACCESS TIME (ns) 37 = 35ns SRAM and 70ns FLASH 72 = 70ns SRAM and 120ns FLASH also available ORGANIZATION, 256K x 8 Flash PROM SRAM WHITE MICROELECTRONICS White Microelectronics • Phoenix, AZ • (602) 437-1520 2