X60003B-50, X60003C-50, X60003D-50 ® Data Sheet May 2, 2006 FN8137.1 DESCRIPTION Precision 5.0V SOT-23 FGA™ Voltage Reference The X60003x-50 FGA™ voltage references are very high precision analog voltage references fabricated in Intersil’s proprietary Floating Gate Analog technology, which achieves superior levels of performance when compared to conventional band gap, buried zener, or XFET™ technologies. FEATURES • Output Voltage: 5.000V • Absolute Initial Accuracy Options: ±1.0mV, ±2.5mV, & ±5.0mV • Ultra Low Power Supply Current: 500nA • Low Temperature Coefficient Options: 10 & 20ppm/°C • 10mA Source & Sink Current Capability • 10ppm/1000hrs Long Term Stability • Very Low Dropout Voltage: 100mV @ No Load • Supply Voltage Range: 5.1V to 9.0V • 5kV ESD (Human Body Model) FGA™ voltage references feature very high initial accuracy, very low temperature coefficient, excellent long term stability, low noise and excellent line and load regulation, at the lowest power consumption currently available. These voltage references enable advanced applications for precision industrial & portable systems operating at significantly higher accuracy and lower power levels than can be achieved with conventional technologies. • Standard Package: 3 Ld SOT-23 • Temp Range: -40°C to +85°C • Pb-Free Plus Anneal Available (RoHS Compliant) APPLICATIONS • High Resolution A/Ds & D/As • Precision Current Sources • Smart sensors • Digital Meters • Precision Regulators • Strain Gage Bridges • Calibration Systems • Precision Oscillators • Threshold Detectors • V-F Converters • Battery Management Systems • Servo Systems TYPICAL APPLICATION VIN = +6.5V 0.1µF VIN 10µF VOUT 0.001µF(*) X60003x-50 GND REF IN Serial Bus Enable SCK SDAT 16 to 24-bit A/D Converter (*)Also see Figure 3 in Applications Information 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. X60003B-50, X60003C-50, X60003D-50 PACKAGE DIAGRAM X60003x-50 SOT-23 VIN 1 3 GND VOUT 2 PIN CONFIGURATIONS Pin Name GND VIN VOUT Description Ground Connection Power Supply Input Connection Voltage Reference Output Connection Ordering Information PART NUMBER PART MARKING PACKAGE (Tape and Reel) VOUT (V) GRADE TEMP. RANGE (°C) 5.00 ±1.0mV, 10ppm/°C -40 to +85 3 Ld SOT-23 X60003BIG3-50T1 AHA X60003BIG3Z-50T1 APG ±1.0mV, 10ppm/°C -40 to +85 3 Ld SOT-23 (Pb-free) X60003CIG3-50T1 AHB ±2.5mV, 20ppm/°C -40 to +85 3 Ld SOT-23 X60003CIG3Z-50T1 API ±2.5mV, 20ppm/°C -40 to +85 3 Ld SOT-23 (Pb-free) X60003DIG3-50T1 AHC ±5.0mV, 20ppm/°C -40 to +85 3 Ld SOT-23 X60003DIG3Z-50T1 APK ±5.0mV, 20ppm/°C -40 to +85 3 Ld SOT-23 (Pb-free) NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 ABSOLUTE MAXIMUM RATINGS COMMENT Storage Temperature Range............ -65°C to + 125°C Voltage on any Pin Referenced to Gnd.............................-0.5V to + 10V Lead Temperature (soldering, 10s) ................ + 225°C Absolute Maximum Ratings indicate limits beyond which permanent damage to the device and impaired reliability may occur. These are stress ratings provided for information only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification are not implied. RECOMMENDED OPERATING CONDITIONS Temperature Min. Max. Industrial -40°C +85°C For guaranteed specifications and test conditions, see Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. ELECTRICAL CHARACTERISTICS (Operating Conditions: VIN = 6.5V, IOUT = 0mA, COUT = 0.001µF, TA = -40 to +85°C unless otherwise specified.) Symbol Parameter VOUT Output Voltage VOA VOUT Accuracy X60003B-50 X60003C-50 X60003D-50 IIN Supply Current VIN Input Voltage Range TC VOUT Output Voltage Temperature Coefficient(1) ΔVOUT/ΔVIN Conditions Min Typ Max 5.000 TA = 25°C Units V mV -1.0 -2.5 -5.0 +1.0 +2.5 +5.0 900 nA 9.0 V X60003B-50 X60003C-50 X60003D-50 10 20 20 ppm/°C Line Regulation +5.5V ≤ VIN ≤ +8.0V 150 µV/V ΔVOUT/ΔIOUT Load Regulation 0mA≤ ISOURCE ≤ 10mA -10mA ≤ ISINK ≤ 0mA 10 20 50 100 µV/mA ΔVOUT/Δt Long Term Stability TA = 25°C 10 ppm/ 1000Hrs ΔVOUT/ΔTA Thermal Hysteresis(2) ΔT = -40°C to +85°C 100 ppm Dropout Voltage(3) IOUT = 5mA, ΔVOUT = -0.01% 150 300 mV TA = 25°C 50 80 mA 0.1Hz to 10Hz 30 VDO ISC Short Circuit Current(4) VN Output Voltage Noise Note: 500 5.1 µVpp 1. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the temperature range; in this case, -40°C to +85°C = 125°C. 2. Thermal Hysteresis is the change in VOUT created by package stress @ TA = 25°C after temperature cycling. VOUT is read initially at TA = 25°C; the X60003x-50 is then cycled between Hot (85°C) and Cold (-40°C) before a second VOUT measurement is taken at 25°C. The deviation between the initial VOUT reading and the second VOUT reading is then expressed in ppm. 3. Dropout voltage (VDO) is the minimum voltage (VIN) into the X60003x-50 which will produce the output voltage (ΔVOUT) drop specified in the Electrical Characteristics table. 4. Guaranteed by Device Characterization 3 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified) LINE REGULATION 150 Delta VOUT (μV) (normailized to VIN = 6.5V) 125 100 75 50 +85°C +25°C 25 0 -40°C -25 -50 5 6 7 9 8 VIN (V) LINE REGULATION (3 Representative Units) 5.0003 Delta VOUT (V) (normailized to 5V at VIN = 6.5V) Unit 3, IIN = 700nA 5.0002 Unit 1, IIN = 350nA 5.0001 5 Unit 2, IIN = 500nA 4.9999 4.9998 4.9997 5 4 5.5 6 6.5 7 VIN (V) 7.5 8 8.5 9 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified) LOAD REGULATION 1.40 1.20 +85°C 1.00 +25°C 0.60 -40°C 0.40 0.20 0.00 -0.20 -0.40 0 -20 -15 SINKING -10 -5 0 5 10 OUTPUT CURRENT (mA) 15 SOURCING 20 0.1Hz to 10Hz VOUT NOISE Band Pass Filter with 1 zero at .1Hz and 2 poles at 10 Hz 10μV/div DELTA Vout (mV) 0.80 +25°C 1 Sec/div 5 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified) VOUT vs TEMPERATURE Normalized to 25°C (3 Representative Units) 5.0025 5.002 Unit 3, IIN = 700nA Unit 1, IIN = 350nA 5.0015 5.001 Unit 2, IIN = 500nA VOUT (V) 5.0005 5 4.9995 4.999 4.9985 4.998 -40 -15 10 35 60 85 TEMPERATURE (°C) PSRR vs CAP Load 0 No Load -10 1nF Load -20 -30 PSRR (dB) 10nF Load -40 100nF Load -50 -60 -70 -80 -90 -100 1 10 100 1000 10000 100000 1000000 FREQUENCY (Hz) 6 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified) 50μA LOAD TRANSIENT RESPONSE 10mA LOAD TRANSIENT RESPONSE CL = .001μF 100mV/DIV 500mV/DIV CL = .001μF IIN = -10mA IIN = +10mA IIN = -50μA IIN = +50μA 500μSEC/DIV 2mSEC/DIV LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE 200mV/DIV CL = .001μF 200mV/DIV CL = 0 VIN = -500mV VIN = +500mV VIN = -500mV 500μSEC/DIV VIN = +500mV 500μSEC/DIV MINIMUM VIN to VOUT DIFFERENTIAL vs. OUTPUT CURRENT 0.45 +85°C VIN to VOUT DIFFERENTIAL (V) 0.4 0.35 +25°C 0.3 0.25 0.2 -40°C 0.15 0.1 0.05 0 0 2 4 6 8 10 OUTPUT CURRENT (Sourcing mA) 7 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified) ZOUT vs FREQUENCY 180 no Load 160 1nF Load 140 10nF Load ZOUT (Ω) 120 100 100nF Load 80 60 40 20 0 1 10 100 1000 10000 100000 FREQUENCY (Hz) IIN vs VIN 700 -40°C 600 25°C 85°C I IN (nA) 500 400 300 200 100 0 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 VIN (V) 8 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL PERFORMANCE CHARACTERISTIC CURVES (VIN = 6.5V, IOUT = 0mA, TA = 25°C unless otherwise specified) IIN vs VIN (3 Representative Units) 900 Unit 1 800 700 I IN (nA) 600 Unit 2 500 Unit 3 400 300 200 100 0 5.0 6.0 7.0 8.0 9.0 10.0 VIN (V) TURN-ON TIME 6 IIN = 500nA VIN & VOUT (V) 5 4 3 2 1 0 0 2 4 6 8 10 12 TIME (mSec) 9 FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 APPLICATIONS INFORMATION FGA Technology The X60003x-50 voltage reference uses the floating gate technology to create references with very low drift and supply current. Essentially the charge stored on a floating gate cell is set precisely in manufacturing. The reference voltage output itself is a buffered version of the floating gate voltage. The resulting reference device has excellent characteristics which are unique in the industry: very low temperature drift, high initial accuracy, and almost zero supply current. Also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). The process used for these reference devices is a floating gate CMOS process, and the amplifier circuitry uses CMOS transistors for amplifier and output transistor circuitry. While providing excellent accuracy, there are limitations in output noise level and load regulation due to the MOS device characteristics. These limitations are addressed with circuit techniques discussed in other sections. Nanopower Operation Reference devices achieve their highest accuracy when powered up continuously, and after initial stabilization has taken place. The X60003x-50 is the first high precision voltage reference with ultra low power consumption that makes it practical to leave power-on continuously in battery operated circuits. The X60003x-50 consumes extremely low supply current due to the proprietary FGA technology. Supply current at room temperature is typically 500nA which is 1 to 2 orders of magnitude lower than competitive devices. Application circuits using battery power will benefit greatly from having an accurate, stable reference which essentially presents no load to the battery. In particular, battery powered data converter circuits that would normally require the entire circuit to be disabled when not in use can remain powered up between conversions as shown in figure 1. Data acquisition circuits providing 12 to 24 bits of accuracy can operate with the reference device continuously biased with no power penalty, providing the highest accuracy and lowest possible long term drift. Other reference devices consuming higher supply currents will need to be disabled in between conversions to conserve battery capacity. Absolute accuracy will 10 suffer as the device is biased and requires time to settle to its final value, or, may not actually settle to a final value as power-on time may be short. Figure 1. VIN = +6-9V 10µF 0.01µF VIN VOUT X60003x-50 GND 0.001µF Serial Bus REF IN Enable SCK SDAT 12 to 24-bit A/D Converter Board mounting Considerations For applications requiring the highest accuracy, board mounting location should be reviewed. Placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to die stresses. It is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limited at that location. Obviously mounting the device on flexprint or extremely thin PC material will likewise cause loss of reference accuracy. Noise Performance and Reduction: The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically 30µVp-p. This is shown in the plot in the Typical Performance Curves. The noise measurement is made with a bandpass filter made of a 1 pole high-pass filter with a corner frequency at .1Hz and a 2-pole low-pass filter with a corner frequency at 12.6Hz to create a filter with a 9.9Hz bandwidth. Noise in the 10KHz to 1MHz bandwidth is approximately 400µVp-p with no capacitance on the output, as shown in Fig. 2 below. These noise measurements are made with a 2 decade bandpass filter made of a 1 pole high-pass filter with a corner frequency at 1/10 of the center frequency and 1-pole low-pass filter with a corner frequency at 10 times the center frequency. Figure 2 also shows the noise in the 10KHz to 1MHz band can be reduced to about 50µVpp using a .001µF capacitor on the output. Noise in the 1KHz to 100KHz band can be further reduced using a 0.1µF capacitor on the output, but noise in the 1Hz to 100Hz band increases due to instability of the very low power amplifier with a 0.1µF capacitance load. For FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 load capacitances above .001µF the noise reduction network shown in fig. 3 is recommended. This network reduces noise sig-nificantly over the full bandwidth. As shown in fig. 2, noise is reduced to less than 40µVp-p from 1Hz to 1MHz using this network with a .01µF capacitor and a 2kΩ resistor in series with a 10µF capacitor. Figure 2. X60003x-50 NOISE REDUCTION 400 CL = .001µF X60003 TURN-ON TIME (25°C) (3 Representative Units) CL = .1µF 300 CL = .01µF & 10µF + 2kΩ 7 250 6 200 VIN & VOUT (V) NOISE VOLTAGE (µVp-p) The X60003x-50 device has ultra-low supply current and thus the time to bias up internal circuitry to final values will be longer than with higher power references. Normal turn-on time is typically 7ms. This is shown in the graph, Figure 4. Since devices can vary in supply current down to 300nA, turn-on time can last up to about 12ms. Care should be taken in system design to include this delay before measurements or conversions are started. Figure 4. CL = 0 350 Turn-On Time 150 100 50 0 IIN = 500nA 5 IIN = 700nA 4 IIN = 350nA 3 2 1 1 10 100 1000 10000 100000 0 2 4 6 8 10 12 TIME (mSec) Figure 3. Temperature Coefficient VIN = 6.5V 10µF .1µF 0 VIN VO X60003x-50 GND 2kΩ .01µF 10µF 11 The limits stated for temperature coefficient (tempco) are governed by the method of measurement. The overwhelming standard for specifying the temperature drift of a reference is to measure the reference voltage at two temperatures, take the total variation, (VHIGH VLOW), and divide by the temperature extremes of measurement (THIGH - TLOW). The result is divided by the nominal reference voltage (at T = 25°C) and multiplied by 106 to yield ppm/°C. This is the “Box” method for determining temperature coefficient. FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL APPLICATION CIRCUITS Precision 5V, 50mA Reference. 6V to 9V R = 200Ω 2N2905 VIN X60003x-50 VOUT 5.0V/50mA 0.001µF GND ±5.0V Dual Output, High Accuracy Reference 5.5V to 9V 0.1µF VIN X60003x-50 VOUT 5.0V 0.001µF GND VIN R1 = X60003x-50 VOUT 0.001µF GND VIN = -5.5V to -9.0V 5.0V - | VIN | ; IOUT ≤ 10mA -(IOUT) -5.0V R1 Kelvin Sensed Load 5.5V to 9V 0.1µF VIN VOUT X60003x-50 GND 12 + – VOUT Sense Load FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 TYPICAL APPLICATION CIRCUITS Negative Voltage Reference X60003x-50 VIN VOUT GND CIN 0.001 COUT = 0.001µF -5.0V R1 = 800Ω VIN = -9V R1 Limits max load current with RI = 800Ω, ILOAD MAX = 4mA R1 = 5.0V - | VIN | -(IOUT) 5V Full Scale Low-Drift 10-bit Adjustable Voltage Source 5.5V to 9V 0.1µF VIN VOUT X60003x-50 GND 0.001µF VCC RH X9119 2-Wire Bus 13 + SDA SCL VSS VOUT – VOUT (buffered) RL FN8137.1 May 2, 2006 X60003B-50, X60003C-50, X60003D-50 PACKAGING INFORMATION 3-Lead Plastic, SOT-23, Package Code G3 0.007 (0.20) B 0.0003 (0.08) 0.093 (2.35) BSC 0.046 (1.18) BSC B 0.055 (1.40) 0.047 (1.20) CL 4X 0.35 H A-B D 0.35 C A-B D 2X N/2 TIPS 1 0.075 (1.90) BSC 2 12° REF. TYP. 0.120 (3.04) 0.110 (2.80) 0.034 (0.88) 0.047 (1.02) 0.038 (0.95) BSC Parting Line Seating Plane 0.10 R MIN. 0.20 in 0.0004 (0.01) 0.0040 (0.10) 0.10 R MIN. 0.035 (0.89) 0.044 (1.12) SEATING PLANE .024 (0.60) .016 (0.40) 0 - 8°C NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 3. DIE AND DIE PADDLE IS FACING DOWN TOWARDS SEATING PLANE 4. THIS PART IS COMPLIANT WITH JEDEC SPECIFICATION TO-236AB 5. DIMENSIONING AND TOLERANCES PER ASME, Y14.5M-1994 0.575 REF. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 14 FN8137.1 May 2, 2006