MIMIX XM1001

12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
Features
Chip Device Layout
Fundamental Image Reject Mixer
8.0 dB Conversion Loss
20.0 dB Image Rejection
+25.0 dBm Input Third Order Intercept (IIP3)
100% On-Wafer RF Testing
100% Visual Inspection to MIL-STD-883
Method 2010
General Description
Mimix Broadband’s 12.0-40.0 GHz GaAs MMIC
fundamental image reject mixer can be used as an up- or
down-converter. The device has a conversion loss of 8.0
dB with a 20.0 dB image rejection across the band. I and
Q mixer outputs are provided and an external 90 degree
hybrid is required to select the desired sideband. This
MMIC uses Mimix Broadband’s 0.15 µm GaAs PHEMT
device model technology, and is based upon electron
beam lithography to ensure high repeatability and
uniformity. The chip has surface passivation to protect
and provide a rugged part with backside via holes and
gold metallization to allow either a conductive epoxy or
eutectic solder die attach process. This device is well
suited for Millimeter-wave Point-to-Point Radio, LMDS,
SATCOM and VSAT applications.
Absolute Maximum Ratings
Gate Bias Voltage (Vg)
Input Power (RF Pin)
Input Power (IF Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
+0.3 VDC
+20.0 dBm
+20.0 dBm
-65 to +165 OC
-55 to +125 OC
Electrical Characteristics (Ambient Temperature T = 25o C)
Parameter
Frequency Range (RF) Upper Side Band
Frequency Range (RF) Lower Side Band
Frequency Range (LO)
Frequency Range (IF)
RF Return Loss (S11)
IF Return Loss (S22)
LO Return Loss (S33)
Conversion Loss (S21)
LO Input Drive (PLO)
Image Rejection
Isolation LO/RF
Isolation LO/IF
Isolation RF/IF
Input Third Order Intercept (IIP3)
Gate Bias Voltage (Vg1)
Units
GHz
GHz
GHz
GHz
dB
dB
dB
dB
dBm
dBc
dB
dB
dB
dBm
VDC
Min.
12.0
12.0
8.0
DC
-2.0
Typ.
10.0
TBD
TBD
8.0
+12.0
20.0
16.0
TBD
TBD
+25.0
-0.5
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Max.
40.0
38.0
42.0
4.0
+0.1
Page 1 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
Mixer Measurements
XM1001 Vg=-0.5 VDC, LSB
LO=+12.0 dBm, IF=2.0 GHz, RF=-20.0 dBm, ~4840 Devices
Conversion Loss (dB)
Conversion Loss (dB)
XM1001 Vg=-0.5 VDC, USB
LO=+12.0 dBm, IF=2.0 GHz, RF=-20.0 dBm, ~4840 Devices
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
-11
-12
-13
-14
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
36.0
38.0
40.0
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
-11
-12
-13
-14
10.0
12.0
14.0
16.0
18.0
20.0
RF Frequency (GHz)
Max
Median
Mean
-3sigma
Max
Image Rejection (dBc)
Image Rejection (dBc)
-5
-10
-15
-20
-25
-30
-35
-40
-45
14.0
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
36.0
38.0
40.0
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
-60
10.0
12.0
14.0
16.0
18.0
20.0
RF Frequency (GHz)
Max
Median
Mean
26.0
28.0
30.0
32.0
34.0
36.0
38.0
40.0
Median
Mean
36.0
38.0
40.0
-3sigma
XM1001 Vg=-0.5 VDC, LSB
LO=+12.0 dBm, IF=2.0 GHz, RF=-20.0 dBm, ~4840 Devices
XM1001 Vg=-0.5 VDC, USB
LO=+12.0 dBm, IF=2.0 GHz, RF=-20.0 dBm, ~4840 Devices
12.0
24.0
RF Frequency (GHz)
0
-50
10.0
22.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
RF Frequency (GHz)
-3sigma
Max
Median
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Mean
-3sigma
Page 2 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
Mixer Measurements (cont.)
XM1001 Vg=-0.5 VDC, LSB
LO=+12.0 dBm, IF=2.0 GHz, RF=-20.0 dBm, ~140 Devices
Noise Figure (dB)
Noise Figure (dB)
XM1001 Vg=-0.5 VDC, USB
LO=+12.0 dBm, IF=2.0 GHz, RF=-20.0 dBm, ~140 Devices
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
36.0
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
8.0
10.0
12.0
14.0
16.0
RF Frequency (GHz)
Max
Median
Mean
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
RF Frequency (GHz)
-3sigma
Max
Median
Mean
-3sigma
RF Return Loss (dB)
XM1001 Vg=-0.5 VDC, USB/LSB
LO=+12.0 dBm, IF=2.0 GHz, RF=-20.0 dBm, ~130 Devices
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
-55
8.0
10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0 42.0
RF Frequency (GHz)
Max
Median
Mean
-3sigma
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
Mixer Measurements (cont.)
0374 (Vg=-0.5V, PRF=-10dBm IF=2GHz): LSB PLO=+12dBm
Image Rejection (dBc) & Conversion Gain(dB) vs. LO freq (GHz) & RF freq (GHz)
0374 (Vg=-0.5V, PRF=-10dBm IF=2GHz): USB PLO=+12dBm
Image Rejection (dBc) &Conversion Gain (dB) vs. LO freq (GHz) & RF freq (GHz)
LO freq (GHz)
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
RF freq (GHz)
44
8
12
16
20
10
14
18
22
24
28
32
36
40
26
30
34
38
42
0
0
-2.5
-2.5
-5
-5
-7.5
Conversion Gain (dB) Image Rejection (dBc)
Conversion Gain (dB) Image Rejection (dBc)
-7.5
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
-30
-32.5
-35
-37.5
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
-30
-32.5
-35
-37.5
-40
-40
-42.5
-42.5
-45
-45
-47.5
-47.5
-50
-50
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
LO freq (GHz)
RF freq (GHz)
0374 (USB, Vg=-0.5V, PRF=-10dBm, IF=2GHz): 1 device and different powers
Image Rejection (dBc) &Conversion Gain (dB) vs. LO freq (GHz) & RF freq (GHz)
0374 (LSB, Vg=-0.5V, PRF=-10dBm, IF=2GHz): 1 device and different powers
Image Rejection (dBc) &Conversion Gain (dB) vs. LO freq (GHz) & RF freq (GHz)
LO freq (GHz)
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
LO freq (GHz)
44
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
0
0
-8
-8
-5
-5
-10
-10
-10
-10
-25
-16
-12
-20
-25
-14
-30
Conv Loss, PLO (dBm)=6, =R11C5
Conv Loss, PLO (dBm)=9, =R11C5
Conv Loss, PLO (dBm)=12, =R11C5
Conv Loss, PLO (dBm)=15, =R11C5
Im. Rej., PLO (dBm)=6, =R11C5
Im. Rej., PLO (dBm)=9, =R11C5
Im. Rej., PLO (dBm)=12, =R11C5
Im. Rej., PLO (dBm)=15, =R11C5
-16
-30
-18
-18
-35
-20
-40
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
-35
-40
-45
-20
46
Image Rejection (dBc)
-14
-20
Conversion Gain (dB)
Conv Loss, =R11C5, PLO (dBm)=6
Conv Loss, =R11C5, PLO (dBm)=9
Conv Loss, =R11C5, PLO (dBm)=12
Conv Loss, =R11C5, PLO (dBm)=15
Im. Rej., =R11C5, PLO (dBm)=6
Im. Rej., =R11C5, PLO (dBm)=9
Im. Rej., =R11C5, PLO (dBm)=12
Im. Rej., =R11C5, PLO (dBm)=15
Image Rejection (dBc)
Conversion Gain (dB)
-15
-15
-12
-50
8
10
12
14
16
18
RF freq (GHz)
20
22
24
26
28
30
32
34
36
38
40
42
RF freq (GHz)
374: LSB Conversion Gain vs Frequency and for differents Vg bias (-2.1V to 0.1V with 0.2V steps)
PLO=+12dBm
374: USB Conversion Gain/Image Rejection vs Frequency and for differents Vg bias (-2.1V to 0.1V
with 0.2V steps) PLO=+12dBm
0
0
Conv Loss Vg=-2.1
-2
Conv Loss Vg=-1.9
-4
Conv Loss Vg=-1.9
-6
Conv Loss Vg=-1.7
Conv Loss Vg=-2.1
Conv Loss Vg=-1.7
-10
Conv Loss Vg=-1.5
Conv Loss Vg=-1.5
-8
Conv Loss Vg=-1.3
Conv Loss Vg=-1.3
Conv Loss Vg=-1.1
-20
Conv Loss Vg=-0.9
Conv Loss Vg=-0.7
Conv Loss Vg=-0.5
-30
Conv Loss Vg=-0.3
Conv Loss Vg=-0.1
Conv Loss Vg=0.1
-40
Image Rejection Vg=-2.1
Image Rejection Vg=-1.9
Image Rejection Vg=-1.7
-50
Image Rejection Vg=-1.5
Image Rejection Vg=-1.3
Image Rejection Vg=-1.1
-60
Conversion Loss (dB)/Image Rejection (dBc)
Conversion Loss (dB)/Image Rejection (dBc)
-10
Conv Loss Vg=-1.1
-12
Conv Loss Vg=-0.9
-14
Conv Loss Vg=-0.7
Conv Loss Vg=-0.5
-16
Conv Loss Vg=-0.3
-18
Conv Loss Vg=-0.1
-20
Conv Loss Vg=0.1
-22
Image Rejection Vg=-2.1
Image Rejection Vg=-1.9
-24
Image Rejection Vg=-1.7
-26
Image Rejection Vg=-1.5
-28
Image Rejection Vg=-1.3
Image Rejection Vg=-1.1
-30
Image Rejection Vg=-0.9
-32
Image Rejection Vg=-0.7
-34
Image Rejection Vg=-0.5
-36
Image Rejection Vg=-0.3
Image Rejection Vg=-0.9
Image Rejection Vg=-0.7
Image Rejection Vg=-0.5
Image Rejection Vg=-0.1
-38
Image Rejection Vg=-0.3
-70
Image Rejection Vg=0.1
Image Rejection Vg=-0.1
-40
Image Rejection Vg=0.1
-42
-44
-80
20
21
22
23 RF freq (GHz) 24
25
26
27
16
17
18
19 RF freq (GHz) 20
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
21
22
23
Page 4 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
Mixer Measurements (cont.)
0374 (Vg=-0.5V, IF=2GHz, LSB, PLO=+6dBm): IP1 & OP1 (dBm) vs. RF & LO
freq (GHz)
0374 (Vg=-0.5V, IF=2GHz, USB, PLO=+6dBm): IP1 & OP1 (dBm) vs. RF & LO
freq (GHz)
10
15
20
LO freq (GHz)
25
30
35
14
18
22
26
12
16
20
24
LO freq (GHz)
30
34
38
28
32
36
25
25
20
20
15
IP1/OP1 (dBm)
IP1/OP1 (dBm)
15
10
10
5
5
0
0
-5
-5
-10
-10
12
17
22
RF freq (GHz)
27
32
0374 (Vg=-0.5V, IF=2GHz, LSB, PLO=+9dBm): IP1 & OP1 (dBm) vs. RF & LO
freq (GHz)
0374 (Vg=-0.5V, IF=2GHz, USB, PLO=+9dBm): IP1 & OP1 (dBm) vs. RF & LO
freq (GHz)
10
15
20
LO freq (GHz)
25
30
RF freq (GHz)
37
14
18
22
26
12
16
20
24
14
18
22
26
12
16
20
24
35
25
25
20
20
LO freq (GHz)
30
34
38
28
32
36
30
34
38
28
32
36
15
IP1/OP1 (dBm)
IP1/OP1 (dBm)
15
10
10
5
5
0
0
-5
-5
-10
-10
12
17
22
RF freq (GHz)
27
32
0374 (Vg=-0.5V, IF=2GHz, LSB, PLO=+12dBm):
IP1 & OP1 (dBm) vs. RF & LO freq (GHz)
0374 (Vg=-0.5V, IF=2GHz, USB, PLO=+12dBm):
IP1 & OP1 (dBm) vs. RF & LO freq (GHz)
10
15
20
LO freq (GHz)
25
RF freq (GHz)
37
30
35
LO freq (GHz)
25
25
20
20
15
IP1/OP1 (dBm)
IP1/OP1 (dBm)
15
10
10
5
5
0
0
-5
-5
-10
-10
12
17
22
RF freq (GHz)
27
32
RF freq (GHz)
37
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
Mixer Measurements (cont.)
0374 (Vg=-0.5V, IF=2GHz, USB, PLO=+15dBm):
IP1 & OP1 (dBm) vs. RF & LO freq (GHz)
10
15
LO freq (GHz)
20
25
0374 (Vg=-0.5V, IF=2GHz, LSB, PLO=+15dBm):
IP1 & OP1 (dBm) vs. RF & LO freq (GHz)
30
35
25
14
18
22
26
12
16
20
24
LO freq (GHz)
30
34
38
28
32
36
25
20
20
15
IP1/OP1 (dBm)
IP1/OP1 (dBm)
15
10
10
5
5
0
0
-5
-5
-10
-10
12
17
RF freq (GHz)
22
27
32
37
0374 (Vg=-0.5V, IF=2GHz, LO=+12dBm, IF1-IF2=100MHz, USB, Down Conversion):
IM3 avg vs RF freq f1
LO freq (GHz)
12.00
0.00
14.00
16.00
18.00
20.00
22.00
RF freq (GHz)
0374 (Vg=-0.5V, IF=2GHz, LO=+12dBm, IF1-IF2=100MHz, LSB, Down Conversion):
IM3 avg vs RF freq f1
LO freq (GHz)
24.00
16.00
0.00
17.00
18.00
19.00
20.00
21.00
22.00
23.00
24.00
25.00
26.00
27.00
28.00
15.00
16.00
17.00
18.00
19.00
20.00
21.00
22.00
23.00
24.00
25.00
26.00
-10.00
IM3 avg (dBm)/ Tone1 (dBm)
IM3 avg (dBm)/ Tone1 (dBm)
-10.00
-20.00
-30.00
-40.00
-20.00
-30.00
-40.00
-50.00
-50.00
-60.00
15.00
16.00
17.00
18.00
19.00
20.00
21.00
22.00
23.00
24.00
25.00
-60.00
14.00
26.00
RF freq f1 (GHz)
RF freq f1 (GHz)
0374 (Vg=-0.5V, IF=2GHz, LO=+12dBm, IF1-IF2=100MHz, LSB, Down Conversion):
OIP3 avg vs RF freq f1, IIP3 vs RF freq f1
0374 (Vg=-0.5V, IF=2GHz, LO=+12dBm, IF1-IF2=100MHz, USB, Down Conversion):
OIP3 avg vs RF freq f1, IIP3 vs RF freq f1
LO freq (GHz)
LO freq (GHz)
13.00
14.00
15.00
16.00
17.00
18.00
19.00
20.00
21.00
22.00
23.00
16.00
30.00
24.00
30.00
18.00
20.00
22.00
24.00
26.00
28.00
30.00
25.00
25.00
25.00
20.00
20.00
20.00
20.00
15.00
15.00
15.00
15.00
10.00
10.00
10.00
10.00
5.00
5.00
5.00
5.00
0.00
14.00
15.00
16.00
17.00
18.00
19.00
20.00
RF freq f1 (GHz)
21.00
22.00
23.00
24.00
25.00
0.00
26.00
IIP3/OIP3 (dBm)
25.00
OIP3 (dBm)
IIP3/OIP3 (dBm)
12.00
30.00
0.00
14.00
15.00
16.00
17.00
18.00
19.00
20.00
21.00
22.00
23.00
24.00
25.00
0.00
26.00
RF freq f1 (GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 6 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
OIP3 (dBm)
-70.00
14.00
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
0.831
(0.033)
Mechanical Drawing
1.945
(0.077)
2
0.364
(0.014)
3
1.567
(0.062)
4
0.968
(0.038)
1
5
0.0
0.0
0.831
(0.033)
1.320
(0.052)
(Note: Engineering designator is 20IRRFM0374)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.592 mg.
Bond Pad #1 (RF)
Bond Pad #2 (IF1)
Bond Pad #3 (Vg)
Bond Pad #4 (LO)
Bond Pad #5 (IF2)
Bias Arrangement
IF1
2
Bypass Capacitors - See App Note [2]
3
Vg
4
RF
1
5
IF2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 7 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
App Note [1] Biasing - As shown in the bonding diagram, the pHEMT mixer devices are operated using a
separate gate voltage Vg1. Set Vg1=-0.5V for optimum conversion loss performance.
App Note [2] Bias Arrangement - Each DC pad (Vg1) needs to have DC bypass capacitance (~100-200 pF) as
close to the device as possible. Additional DC bypass capacitance (~0.01 uF) is also recommended.
App Note [3] USB/LSB Selection -
LSB
For Upper Side Band Operation (USB):
With IF1 and IF2 connected to the
direct port (0º) and coupled port (90º)
respectively as shown in the diagram,
the USB signal will reside on the
isolated port. The input port must be
loaded with 50 ohms.
USB
For Lower Side Band Operation (LSB):
With IF1 and IF2 connected to the
direct port (0º) and coupled port (90º)
respectively as shown in the diagram,
the LSB signal will reside on the input
port. The isolated port must be loaded
with 50 ohms.
IF2
IF1
Note:
The coupled port can be used as an alternate
input but the port location of the Coupled and
Direct ports reverse.
An alternate method of Selection of USB or LSB:
USB
LSB
In Phase Combiner
In Phase Combiner
-90o
-90o
IF2
IF1
IF2
IF1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 8 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
12.0-40.0 GHz GaAs MMIC
Image Reject Mixer
M1001
November 2005 - Rev 21-Nov-05
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the
human body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix
Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for
surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user. (2) A critical component is any component of a life support device or system whose
failure to perform can be reasonably expected to cause the failure of the life support device or system, or to
affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied
in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care,
sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the
backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as
possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are
Ablestick 84-1LMI or 84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy
sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total
die periphery. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001 2
thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated
collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere
is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold
Germanium should be avoided). The work station temperature should be 310 C +- 10 C. Exposure to these
extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid
excessive thermal shock. Avoidance of air bridges and force impact are critical during placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to
the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x
0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm
(0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be
avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing
the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters.
Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short
as possible.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 9 of 9
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.