VSM Series (0805, 1206, 1506, 2010, 2512) Vishay Foil Resistors High Precision Foil Wraparound Surface Mount Chip Resistor with TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01 % (100 ppm) FEATURES Any value at any tolerance within resistance range INTRODUCTION Bulk Metal® Foil (BMF) Technology out-performs all other resistor technologies available today for applications that require high precision and high stability, and allows production of customer oriented products designed to satisfy challenging and specific technical requirements. The BMF provides an inherently low and predictable Temperature Coefficient of Resistance (TCR) and excellent load life stability for high precision analog applications. Model VSM offers low TCR, excellent load life stability, tight tolerance, excellent shelf life stability, low current noise and low voltage coefficient, all in the same resistor. The VSM has a full wraparound termination which ensures safe handling during the manufacturing process, as well as providing stability during multiple thermal cyclings. Our Application Engineering Department is available to advise and make recommendations. For non-standard technical requirements and special applications, please contact us using the e-mail address in the footer below. TABLE 1 - TOLERANCE AND TCR VS. RESISTANCE VALUE1) (- 55 °C to + 125 °C, + 25 °C Ref.) RESISTANCE VALUE (Ω) 250 to 150K 100 to < 250 50 to < 100 25 to < 50 10 to < 25 TOLERANCE (%) ± 0.01 ± 0.02 ± 0.05 ± 0.1 ± 0.25 APPLICATIONS • • • • • • • • • • • TYPICAL TCR AND MAX. SPREAD (ppm/°C) ±2±2 ±2±3 ±2±3 ±2±4 ±2±6 Note 1. For tighter performances, please contact Vishay Application Engineering using the e-mail addresses in the footer below. Automatic test equipment (ATE) High precision instrumentation Laboratory, industrial and medical Audio EB applications (electron beam scanning and recording equipment, electron microscopes) Military and space Satellite Commercial aviation Airborne Down hole instrumentation Communication FIGURE 1 - POWER DERATING CURVE Percent of Rated Power Top View • Temperature coefficient of resistance (TCR): ± 2.0 ppm/°C typical (- 55 °C to + 125 °C, Pb-free + 25 °C ref.) (see table 1) Available • Tolerance: to ± 0.01 % RoHS* • Power rating: to 400 mW at + 70 °C COMPLIANT • Load life stability: to ± 0.01 % at 70 °C, 2000 h at rated power • Resistance range: 10 Ω to 150 kΩ (for higher and lower values, please contact us) • Fast thermal stabilization < 1 s • Electrostatic discharge (ESD) above 25 000 V • Short time overload: ≤ 0.01 % • Non inductive, non capacitive design • Rise time: 1 ns without ringing • Current noise: - 42 dB • Voltage coefficient < 0.1 ppm/V • Non inductive: < 0.08 µH • Non hot spot design • Terminal finishes available: lead (Pb)-free tin/lead alloy • Matched sets are available per request • Any value available within resistance range (e.g. 1K2345) • Screening per EEE-INST-002 is available for military and space • Prototype samples available from 48 h. For more information, please contact [email protected] • For better performances please review VSMP and VFCP Series datasheets + 70 °C - 55 °C 100 75 50 25 0 - 75 - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175 Ambient Temperature (°C) * Pb containing terminations are not RoHS compliant, exemptions may apply www.vishay.com 1 For any questions, contact: [email protected] Document Number: 63070 Revision: 18-Sep-08 VSM Series (0805, 1206, 1506, 2010, 2512) High Precision Foil Wraparound Surface Vishay Foil Resistors Mount Chip Resistor with TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01 % (100 ppm) FIGURE 2 - TRIMMING TO VALUES (Conceptual Illustration) FIGURE 3 -TYPICAL TCR CURVE (For more details, see Table 1) + 150 + 100 ∆R Current Path Before Trimming Interloop Capacitance Reduction in Series 0 R (ppm) - 50 Current Path After Trimming Trimming Process Removes this Material from Shorting Strip Area Changing Current Path and Increasing Resistance Mutual Inductance Reduction due to Change in Current Direction ± 2 ppm/°C (+ 25 °C reference) + 50 - 100 - 150 - 200 - 50 - 55 - 25 0 + 25 + 50 + 75 + 100 + 125 Ambient Temperature (°C) Note • The TCR values for < 100 Ω are influenced by the termination composition and result in deviation from this curve. Note: Foil shown in black, etched spaces in white TABLE 2 - DIMENSIONS AND LAND PATTERN in inches (millimeters) Top View Recommended Land Pattern L Footprint X G W T Z D CHIP SIZE 0805 1206 1506 2010 2512 L ± 0.005 (0.13) 0.080 (2.03) 0.126 (3.20) 0.150 (3.81) 0.198 (5.03) 0.249 (6.32) W ± 0.005 (0.13) 0.050 (1.27) 0.062 (1.57) 0.062 (1.57) 0.097 (2.46) 0.127 (3.23) THICKNESS MAXIMUM 0.025 (0.64) 0.025 (0.64) 0.025 (0.64) 0.025 (0.64) 0.025 (0.64) D ± 0.005 (0.13) 0.015 (0.38) 0.020 (0.51) 0.020 (0.51) 0.025 (0.64) 0.032 (0.81) Z1) MAXIMUM 0.122 (3.10) 0.175 (4.45) 0.199 (5.05) 0.247 (6.27) 0.291 (7.39) G1) MINIMUM 0.028 (0.71) 0.059 (1.50) 0.083 (2.11) 0.115 (2.92) 0.150 (3.81) X1) MAXIMUM 0.050 (1.27) 0.071 (1.80) 0.071 (1.80) 0.103 (2.62) 0.127 (3.23) Note 1. Land Pattern Dimensions are per IPC-7351A TABLE 3 - SPECIFICATIONS CHIP SIZE 0805 1206 1506 2010 2512 RATED POWER (mW) at + 70 °C 100 150 200 300 400 MAX VOLTAGE RATING (≤ P × R ) 34 V 67 V 89 V 173 V 220 V RESISTANCE RANGE (Ω) 10 to 12K 10 to 30K 10 to 40K 10 to 100K 10 to 150K MAXIMUM WEIGHT (mg) 6 11 12 27 40 TYPICAL ΔR LIMITS MAXIMUM ΔR LIMITS1) TABLE 4 - PERFORMANCES MIL-PRF-55342 CHARACTERISTIC E ΔR LIMITS ± 0.1 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm) Low Temperature Operation ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm) Short Time Overload ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm) High Temperature Exposure ± 0.1 % ± 0.01 % (100 ppm) ± 0.03 % (300 ppm) Resistance to Soldering Heat ± 0.2 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Moisture Resistance ± 0.2 % ± 0.005 % (50 ppm) ± 0.03 % (300 ppm) Load Life Stability + 70 °C for 2000 h at Rated Power ± 0.5 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) TEST OR CONDITIONS Thermal Shock Note 1. As shown + 0.01 Ω to allow for measurement errors at low values. Document Number: 63070 Revision: 18-Sep-08 For any questions, contact: [email protected] www.vishay.com 2 VSM Series (0805, 1206, 1506, 2010, 2512) Vishay Foil Resistors High Precision Foil Wraparound Surface Mount Chip Resistor with TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01 % (100 ppm) FIGURE 4 - RECOMMENDED MOUNTING1)2)3) TABLE 5 - SPACE AND MILITARY SPECIFICATIONS 25 % to 85 % of T A low profile solder fillet is recommended to avoid unnecessary stresses along top edge of metallization. IR and vapor phase reflow are best. Notes 1. Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction 2. Vacuum pick up is recommended for handling 3. Soldering iron may damage the resistor MODEL EEE-INST-002 DSCC VSM0805 √ 07024 VSM1206 √ 07025 VSM1506 √ 03010 VSM2010 √ 06001 VSM2512 √ 06002 MIL-PRF 55342 TABLE 6 - GLOBAL PART NUMBER INFORMATION NEW GLOBAL PART NUMBER: Y145512K7560T9R (preferred part number format) DENOTES PRECISION VALUE AER* Y R=Ω K = kΩ 0 = standard 9 = lead (Pb)-free 1 - 999 = custom Y 1 4 5 5 1 2 K 7 5 6 0 T 9 R PRODUCT CODE RESISTANCE TOLERANCE PACKAGING 1172 = VSM0805 1496 = VSM1206 1455 = VSM1506 1611 = VSM2010 1612 = VSM2512 T = ± 0.01 % Q = ± 0.02 % A = ± 0.05 % B = ± 0.10 % C = ± 0.25 % D = ± 0.5 % F = ± 1.0 % R = tape and reel W = waffle pack FOR EXAMPLE: ABOVE GLOBAL ORDER Y1455 12K7565 T 9 R: TYPE: VSM1506 VALUES: 12.7560 kΩ ABSOLUTE TOLERANCE: 0.01 % TERMINATION: lead (Pb)-free PACKAGING: tape and reel HISTORICAL PART NUMBER: VSM1506 12K756 TCR2 T S T (will continue to be used) VSM1506 12K756 TCR2 T S MODEL RESISTANCE VALUE TCR CHARACTERISTICS TOLERANCE TERMINATION PACKAGING S = lead (Pb)-free B = tin/lead T = tape and reel W = waffle pack VSM0805 VSM1206 VSM1506 VSM2010 VSM2512 12.756 kΩ T = ± 0.01 % Q = ± 0.02 % A = ± 0.05 % B = ± 0.10 % C = ± 0.25 % D = ± 0.5 % F = ± 1.0 % T Note * For non-standard requests, please contact application engineering. www.vishay.com 3 For any questions, contact: [email protected] Document Number: 63070 Revision: 18-Sep-08 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1