PRELIMINARY PRODUCT SPECIFICATION Z86C34/C35/C36 Z86C44/C45/C46 CMOS Z8® MCUS WITH ASCI UART OFFER EFFICIENT, COST-EFFECTIVE DESIGN FLEXIBILITY FEATURES Device ROM (KB) RAM* (Bytes) Speed (MHz) Z86C34 Z86C35 Z86C36 Z86C44 Z86C45 Z86C46 16 32 64 16 32 64 237 237 237 236 236 236 16 16 16 16 16 16 Note: *General-Purpose. • 28-Pin DIP, 28-Pin SOIC and PLCC Packages (C34, C35, C36) • 40-Pin DIP, 44-Pin PLCC and QFP Packages (C44, C45, C46) • • • 3.0- to 5.5-Volt Operating Range Clock Free Watch-Dog Timer (WDT) Reset • • • • Expanded Register File (ERF) Full-Duplex UART (ASCI) Dedicated 16-Bit Baud Rate Generator 32 Input/Output Lines (C44/C45/C46) 24 Input/Output Lines (C34/C35/C36) • Vectored, Prioritized Interrupts with Programmable Polarity • • Two Analog Comparators Two Programmable 8-Bit Counter/Timers, Each with Two 6-Bit Programmable Prescaler • • Watch-Dog Timer (WDT)/Power-On Reset (POR) • • RAM and ROM Protect On-Chip Oscillator that Accepts a Crystal, Ceramic Resonator, LC, RC, or External Clock Optional 32-kHz Oscillator Operating Temperature Ranges: Standard: 0 °C to 70 °C Extended: –40 °C to +105 °C GENERAL DESCRIPTION ZiLOG’s Z8® MCU single-chip family now includes the Z86C34/C35/C36/C44/C45/C46 product line, featuring enhanced wake-up circuitry, programmable Watch-Dog Timers (WDT), and low-noise/EMI options. Each of the new enhancements to the Z8 offer a more efficient, cost-effective design and provide the user with increased design flexibility over the standard Z8 microcontroller core. The low-power consumption CMOS microcontroller offers fast execution, efficient use of memory, sophisticated interrupts, input/output bit manipulation capabilities, and easy hardware/software system expansion. DS007601-Z8X0499 The Z8 subfamily features an Expanded Register File (ERF) to allow access to register-mapped peripheral and I/O circuits. Four basic address spaces are available to support this wide range of configurations: Program Memory, Register File, Data Memory, and ERF. The Register File is composed of 236/237 bytes of general-purpose registers, four I/O port registers, and 15 control and status registers. The ERF consists of twelve control registers. For applications demanding powerful I/O capabilities, the Z86C34/C35/C36 offers 24 pins, and the Z86C44/C45/C46 offers 32 pins dedicated to input and output. These lines are 1 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG GENERAL DESCRIPTION (Continued) configurable under software control to provide timing, status signals, parallel I/O with or without handshake, and address/data bus for interfacing external memory. Note: All signals with an overline are active Low. For example, B/W, for which WORD is active Low, and B/W, for which BYTE is active Low. To unburden the system from coping with real-time tasks such as counting/timing and data communication, the Z8 offer two on-chip counter/timers with a large number of user-selectable modes. Power connections follow these conventional descriptions: With ROM/ROMless selectivity, the Z86C44/C45/C46 provide both external memory and preprogrammed ROM, which enables this Z8® MCU to be used in high-volume applications, or where code flexibility is required. Connection Circuit Device Power VCC VDD Ground GND VSS (C44/C45/C46 Only) Output Input VCC GND XTAL AS DS R/W RESET Port 3 Machine Timing & Inst. Control Counter/ Timers (2) RESET WDT, POR ALU Interrupt Control Two Analog Comparators Full-Duplex UART FLAG Program Memory Register Pointer Register File Program Counter Port 0 Port 1 16-Bit Baud Rate Generator Port 2 4 I/O (Bit Programmable) 4 Address or I/O (Nibble Programmable) 8 Address/Data or I/O (Byte Programmable) (C44/C45/C46 Only) Figure 1. Functional Block Diagram 2 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PIN DESCRIPTION 28 Z86C34/C35/C36 14 15 P24 P23 P22 P21 P20 P03 GND P02 P01 P00 P30 P36 P37 P35 P04 P27 P26 P25 P24 P23 P22 1 4 P05 P06 P07 VCC XTAL2 XTAL1 P31 5 1 26 25 Z86C34/C35/C36 11 12 19 18 P21 P20 P03 GND P02 P01 P00 P32 P33 P34 P35 P37 P36 P30 P25 P26 P27 P04 P05 P06 P07 VCC XTAL2 XTAL1 P31 P32 P33 P34 Figure 2. 28-Pin DIP/SOIC Pin Configuration Figure 3. 28-Pin PLCC Pin Configuration Table 1. 28-Pin DIP/SOIC/PLCC Pin Identification Pin # Symbol Function Direction 1–3 4–7 8 P25–27 P04–07 VCC Port 2, Bits 5,6,7 Port 0, Bits 4,5,6,7 Power Supply In/Output In/Output 9 10 11–13 14–15 16 17 18 19–21 22 23 24–28 XTAL2 XTAL1 P31–33 P34–35 P37 P36 P30 P00–02 GND P03 P20–24 Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bits 4,5 Port 3, Bit 7 Port 3, Bit 6 Port 3, Bit 0 Port 0, Bits 0,1,2 Ground Port 0, Bit 3 Port 2, Bits 0,1,2,3,4 Output Input Fixed Input Fixed Output Fixed Output Fixed Output Fixed Input In/Output DS007601-Z8X0499 PRELIMINARY In/Output In/Output 3 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PIN DESCRIPTION (Continued) R/W P25 P26 P27 P04 P05 P06 P14 P15 P07 VCC P16 P17 XTAL2 XTAL1 P31 P32 P33 P34 AS 1 40 Z86C44/C45/C46 20 21 DS P24 P23 P22 P21 P20 P03 P13 P12 GND P02 P11 P10 P01 P00 P30 P36 P37 P35 RESET Figure 4. 40-Pin DIP Configuration Table 2. 40-Pin Dual-In-Line Package Pin Identification Table 2. 40-Pin Dual-In-Line Package Pin Identification Pin # Symbol Function Direction Pin # Symbol Function Direction 1 2–4 5–7 8–9 10 11 R/W P25–27 P04–06 P14–15 P07 VCC READ/WRITE Port 2, Bits 5,6,7 Port 0, Bits 4,5,6 Port 1, Bits 4,5 Port 0, Bit 7 Power Supply Output In/Output In/Output In/Output In/Output 12–13 14 15 16–18 19 20 P16–17 XTAL2 XTAL1 P31–33 P34 AS Port 1, Bits 6,7 Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bit 4 Address Strobe In/Output Output Input Input Output Output 21 22 23 24 25 26–27 28–29 30 31 32–33 34 35–39 40 RESET P35 P37 P36 P30 P00–01 P10–11 P02 GND P12–13 P03 P20–24 DS Reset Port 3, Bit 5 Port 3, Bit 7 Port 3, Bit 6 Port 3, Bit 0 Port 0, Bit 0,1 Port 1, Bit 0,1 Port 0, Bit 2 Ground Port 1, Bit 2,3 Port 0, Bit 3 Port 2, Bit 0,1,2,3,4 Data Strobe Input Output Output Output Input In/Output In/Output In/Output 4 PRELIMINARY In/Output In/Output In/Output Output DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART P20 P03 P13 P12 GND GND P02 P11 P10 P01 P00 ZiLOG 6 1 40 39 7 Z86C44/C45/C46 17 29 28 18 P30 P36 P37 P35 RESET R/RL AS P34 P33 P32 P31 P05 P06 P14 P15 P07 VCC VCC P16 P17 XTAL2 XTAL1 P21 P22 P23 P24 DS NC R/W P25 P26 P27 P04 Figure 5. 44-Pin PLCC Pin Configuration Table 3. 44-Pin PLCC Pin Identification Pin # Symbol Function 1–2 3–4 5 6–10 11 12 13 14–16 17–19 20–21 22 23–24 GND P12–13 P03 P20–24 DS NC R/W P25–27 P04–06 P14–15 P07 VCC Ground Port 1, Bits 2,3 Port 0, Bit 3 Port 2, Bits 0,1,2,3,4 Data Strobe Not Connected READ/WRITE Port 2, Bits 5,6,7 Port 0, Bits 4,5,6 Port 1, Bits 4,5 Port 0, Bit 7 Power Supply 25–26 P16–17 Port 1, Bits 6,7 DS007601-Z8X0499 Direction In/Output In/Output In/Output Output Output In/Output In/Output In/Output In/Output In/Output Table 3. 44-Pin PLCC Pin Identification Pin # Symbol Function Direction 27 28 29–31 32 33 34 35 36 37 38 39 40–41 42–43 44 XTAL2 XTAL1 P31–33 P34 AS R/RL RESET P35 P37 P36 P30 P00–01 P10–11 P02 Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bit 4 Address Strobe ROM/ROMless Control Reset Port 3, Bit 5 Port 3, Bit 7 Port 3, Bit 6 Port 3, Bit 0 Port 0, Bits 0,1 Port 1, Bits 0,1 Port 0, Bit 2 Output Input Input Output Output Input Input Output Output Output Input In/Output In/Output In/Output PRELIMINARY 5 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG P20 P03 P13 P12 GND GND P02 P11 P10 P01 P00 PIN DESCRIPTION (Continued) 33 34 23 22 Z86C44/C45/C46 44 1 12 11 P30 P36 P37 P35 RESET R/RL AS P34 P33 P32 P31 P05 P06 P14 P15 P07 VCC VCC P16 P17 XTAL2 XTAL1 P21 P22 P23 P24 DS NC R/W P25 P26 P27 P04 Figure 6. 44-Pin QFP Pin Configuration Table 4. 44-Pin QFP Pin Identification Table 4. 44-Pin QFP Pin Identification Pin # Symbol Function Direction Pin # Symbol Function Direction 1–2 3–4 5 6–7 P05–06 P14–15 P07 VCC Port 0, Bits 5,6 Port 1, Bits 4,5 Port 0, Bit 7 Power Supply In/Output In/Output In/Output 8–9 10 11 12–14 15 16 17 18 19 20 P16–17 XTAL2 XTAL1 P31–33 P34 AS R/RL RESET P35 P37 Port 1 Bits 6,7 Crystal Oscillator Crystal Oscillator Port 3, Bits 1,2,3 Port 3, Bit 4 Address Strobe ROM/ROMless Control Reset Port 3, Bit 5 Port 3, Bit 7 In/Output Output Input Input Output Output Input Input Output Output 21 22 23–24 25–26 27 28–29 30–31 32 33–37 38 39 40 P36 P30 P00–01 P10–11 P02 GND P12–13 P03 P20–24 DS NC R/W Port 3, Bit 6 Port 3, Bit 0 Port 0, Bits 0,1 Port 1, Bits 0,1 Port 0, Bit 2 Ground Port 1, Bits 2,3 Port 0, Bit 3 Port 2, Bits 0,1,2,3,4 Data Strobe Not Connected READ/WRITE Output Input In/Output In/Output In/Output 6 PRELIMINARY In/Output In/Output In/Output Output Output DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ABSOLUTE MAXIMUM RATINGS Parameter Min Max Units Notes Ambient Temperature under Bias Storage Temperature Voltage on any Pin with Respect to VSS –40 –65 –0.6 +105 +150 +7 C C V 1 Voltage on VDD Pin with Respect to VSS –0.3 +7 V Voltage on XTAL1 and RESET Pins with Respect to VSS –0.6 VDD+1 V Total Power Dissipation Maximum Allowable Current out of VSS 1.21 220 W mA Maximum Allowable Current into VDD 180 mA +600 +600 25 25 µA µA mA mA Maximum Allowable Current into an Input Pin Maximum Allowable Current into an Open-Drain Pin Maximum Allowable Output Current Sunk by Any I/O Pin Maximum Allowable Output Current Sourced by Any I/O Pin –600 –600 2 3 4 Notes: 1. Applies to all pins except XTAL pins and where otherwise noted. 2. There is no input protection diode from pin to VDD and current into pin is limited to ±600 µA. 3. Excludes XTAL pins. 4. Device pin is not at an output Low state. Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This rating is a stress rating only. Functional operation of the device at any condition above those indicated in the operational sections of these specifications is not implied. Exposure to absolute maximum rating conditions for an extended period may affect device reliability. DS007601-Z8X0499 Total power dissipation should not exceed 1.21 W for the package. Power dissipation is calculated as follows: Total Power Dissipation = VDD x [IDD – (sum of IOH), PRELIMINARY + sum of [(VDD – VOH) x IOH] + sum of (VOL x IOL) 7 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG STANDARD TEST CONDITIONS The characteristics listed in following pages apply for standard test conditions as noted. All voltages are referenced to GND. Positive current flows into the referenced pin (see Figure 7.) From Output Under Test 150 pF Figure 7. Test Load Diagram CAPACITANCE TA = 25ºC, VCC = GND = 0V, f = 1.0 MHz, unmeasured pins to GND Parameter Input capacitance Output capacitance I/O capacitance 8 Min Max 0 0 0 12 pF 12 pF 12 pF PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG DC ELECTRICAL CHARACTERISTICS Table 5. DC Characteristics TA = 0°C to +70°C Min Max Min Max Typical2 @25°C 3.0V 0.7 VCC VCC+0.3 0.7 VCC VCC+0.3 1.8 V 5.5V 0.7 VCC VCC+0.3 0.7 VCC VCC+0.3 2.6 V 3.0V GND–0.3 0.2 VCC GND–0.3 0.2 VCC 1.2 V 5.5V GND–0.3 0.2 VCC GND–0.3 0.2 VCC 2.1 V Input High Voltage 3.0V 0.7 VCC VCC+0.3 0.7 VCC VCC+0.3 1.8 V 5.5V 0.7 VCC VCC+0.3 0.7 VCC VCC+0.3 2.6 V Input Low Voltage 3.0V GND–0.3 0.2 VCC GND–0.3 0.2 VCC 1.1 V 5.5V GND–0.3 0.2 VCC GND–0.3 0.2 VCC 1.6 V Output High Voltage (Low-EMI Mode) Output High Voltage Output Low Voltage (Low-EMI Mode) Output Low Voltage 3.0V VCC–0.4 VCC–0.4 3.1 V IOH = –0.5 mA 5.0V VCC–0.4 VCC–0.4 4.8 V IOH = –0.5 mA 3.0V VCC–0.4 VCC–0.4 3.1 V IOH = –2.0 mA 3 5.5V VCC–0.4 VCC–0.4 4.8 V IOH = –2.0 mA 3 Sym Parameter VCC VCH Clock Input High Voltage VCL VIH VIL VOH VOH1 VOL VOL1 TA = –40°C to +105°C Clock Input Low Voltage 1 Units Conditions Notes Driven by External Clock Generator Driven by External Clock Generator Driven by External Clock Generator Driven by External Clock Generator 3.0V 0.6 0.6 0.2 V IOL = 1.0 mA 5.0V 0.4 0.4 0.1 V IOL = 1.0 mA 3.0V 0.6 0.6 0.2 V IOL = +4.0 mA 3 5.5V 0.4 0.4 0.1 V IOL = +4.0 mA 3 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ±0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ±0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0ºC to 70ºC (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. –40˚C to 150˚C (extended temperature). DS007601-Z8X0499 PRELIMINARY 9 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG DC ELECTRICAL CHARACTERISTICS (Continued) Table 5. DC Characteristics (Continued) TA = 0°C to +70°C 1 Max Typical2 @25°C 1.2 1.2 0.3 V IOL = +6 mA 3 1.2 1.2 0.4 V IOL = +12 mA 3 .8 VCC VCC 1.8 V 4 VCC .8 VCC VCC 2.6 V 4 GND–0.3 0.2 VCC GND–0.3 0.2 VCC 1.1 V 4 GND–0.3 0.2 VCC GND–0.3 0.2 VCC 1.6 V 4 Sym Parameter VCC VOL2 Output Low Voltage 3.0V 5.5V Reset Input High Voltage Reset Input Low Voltage Reset Output Low Voltage Comparator Input Offset Voltage Input Leakage 3.0V .8 VCC VCC 5.5V .8 VCC 3.0V 5.5V VRH VRl VOLR VOFFSET IIL TA = –40°C to +105°C Min Max Min Units Conditions 3.0V 0.6 0.6 0.3 V IOL = +1.0 mA 4 5.5V 0.6 0.6 0.3 V IOL = +1.0 mA 4 3.0V 5.5V 25 25 25 25 10 10 mV mV 5 5 3.0V –1 2 –1 2 0.004 µA VIN = 0V, VCC 5.5V –1 2 –1 2 0.004 µA VIN = 0V, VCC Output Leakage 3.0V –1 1 –1 2 0.004 µA VIN = 0V, VCC 5.5V –1 1 –1 2 0.004 µA VIN = 0V, VCC IIR Reset Input Current –20 –20 Supply Current –130 –180 20 25 15 20 –18 –18 ICC 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V –130 –180 20 25 15 20 –60 –85 7 20 5 15 µA µA mA mA mA mA @ 16 MHz @ 16 MHz @ 12 MHz @ 12 MHz IOL Notes 6 6 6 6 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ±0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ±0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0ºC to 70ºC (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. –40˚C to 150˚C (extended temperature). 10 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Table 5. DC Characteristics (Continued) TA = 0°C to +70°C Max Typical2 @25°C 4.5 4.5 2.0 5.5V 8 8 3.7 3.0V 3.4 3.4 1.5 5.5V 7.0 7.0 2.9 3.0V 8 8 2 5.5V 10 10 4 3.0V 500 600 310 5.5V 800 1000 600 Sym Parameter VCC1 ICC1 Standby Current (HALT Mode) 3.0V ICC2 VICR IALL IALH Standby Current (STOP Mode) Input Common Mode Voltage Range Auto Latch Low Current Auto Latch High Current TA = –40°C to +105°C Min Max Min Units Conditions mA VIN = 0V, VCC @ 16 MHz mA VIN = 0V, VCC @ 16 MHz mA Clock Divideby-16 @ 16 MHz mA Clock Divideby-16 @ 16 MHz µA VIN = 0V, VCC WDT is not Running µA VIN = 0V, VCC WDT is not Running µA VIN = 0V, VCC WDT is Running µA VIN = 0V, VCC WDT is Running Notes 6 6 6 6 7,8 7,8 7,8,9 7,8,9 3.0V 0 VCC–1.0V 0 VCC–1.5V V 5 5.5V 0 VCC–1.0V 0 VCC–1.5V V 5 3.0V 0.7 8 0.7 10 3 µA 0V < VIN < VCC 10 5.5V 1.4 15 1.4 20 5 µA 0V < VIN < VCC 10 3.0V –0.6 –5 –0.6 –7 –3 µA 0V < VIN < VCC 10 5.5V –1.0 –8 –1.0 –10 –6 µA 0V < VIN < VCC 10 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ±0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ±0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0ºC to 70ºC (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. –40˚C to 150˚C (extended temperature). DS007601-Z8X0499 PRELIMINARY 11 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG DC ELECTRICAL CHARACTERISTICS (Continued) Table 5. DC Characteristics (Continued) TA = 0°C to +70°C Sym Parameter VLV VCC Low Voltage Protection Voltage VCC 1 Min 2.2 Max TA = –40°C to +105°C Min Max Typical2 @25°C 2.0 3.3 2.8 3.1 2.8 Units Conditions V 4 MHz max Int. CLK Freq. 6 MHz max Int. CLK Freq. Notes 11,12 9,11 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ±0.3V with typicals at VCC = 3.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ±0.5V with typicals at VCC = 5.0V. 2. Typicals are at VCC = 5.0V and 3.3V. 3. Standard Mode (not Low EMI). 4. Not applicable to devices in 28-pin packages. 5. For analog comparator, inputs when analog comparators are enabled. 6. All outputs unloaded, I/O pins floating, inputs at rail. 7. Same as note 6, except inputs at VCC. 8. Clock must be forced Low, when XTAL 1 is clock-driven and XTAL2 is floating. 9. 0ºC to 70ºC (standard temperature). 10. Auto Latch (Mask Option) selected. 11. The VLV voltage increases as the temperature decreases and overlaps lower VCC operating region. 12. –40˚C to 150˚C (extended temperature). 12 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG AC ELECTRICAL CHARACTERISTICS External I/O or Memory READ and WRITE Timing R/W 13 12 19 Port 0, DM 16 Port 1 20 3 18 D7–D0 IN A7–A0 2 1 9 AS 8 11 4 5 DS (Read) 6 17 10 Port1 D7–D0 OUT A7–A0 14 15 7 DS (Write) Figure 8. External I/O or Memory READ and WRITE Timing DS007601-Z8X0499 PRELIMINARY 13 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG AC ELECTRICAL CHARACTERISTICS (Continued) Table 6. External I/O or Memory READ and WRITE Timing (C44/C45/C46 Only) (SCLK/TCLK = XTAL/2) TA = –0ºC to 70ºC 12 MHz No Symbol Parameter 1 TdA(AS) Address Valid to AS Rise Delay 2 TdAS(A) AS Rise to Address Float Delay 3 TdAS(DR) AS Rise to Read Data Req’d Valid 4 TwAS AS Low Width 5 TdAS(DS) Address Float to DS Fall 6 TwDSR DS (Read) Low Width 7 TwDSW DS (WRITE) Low Width 8 TdDSR(DR) DS Fall to Read Data Req’d Valid 9 ThDR(DS) Read Data to DS Rise Hold Time 10 TdDS(A) DS Rise to Address Active Delay 11 TdDS(AS) DS Rise to AS Fall Delay 12 TdR/W(AS) R/W Valid to AS Rise Delay 13 TdDS(R/W) DS Rise to R/W Not Valid 14 TdDW(DSW) WRITE Data Valid to DS Fall (WRITE) Delay TdDS(DW) DS Rise to WRITE Data Not Valid Delay 15 16 TdA(DR) Address Valid to Read Data Req’d Valid VCC 1 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 Min Max 35 35 45 45 16 MHz Min Max 25 25 35 35 250 250 55 55 0 0 200 200 110 110 TA = –40ºC to +105ºC 12 MHz Min 35 35 45 45 180 180 40 40 0 0 135 135 80 80 150 150 Max 16 MHz Min 25 25 35 35 250 250 55 55 0 0 200 200 110 110 75 75 180 180 40 40 0 0 135 135 80 80 150 150 75 75 0 0 45 55 30 45 45 45 45 45 55 55 0 0 50 50 35 35 25 25 35 35 25 25 0 0 45 55 30 45 45 45 45 45 55 55 0 0 50 50 35 55 25 25 35 35 25 25 45 45 35 35 45 45 35 35 310 310 230 230 Max Units Notes 310 310 230 230 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 2 2 2 2 2,3 2 2 2 2,3 2,3 2,3 2,3 2,3 2,3 2 2 2 2 2 2 2 2 2 2 2 2 ns ns ns ns 2 2 2,3 2,3 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ± 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ± 0.5V. 2. Timing numbers provided are for minimum TpC. 3. When using extended memory timing add 2 TpC. 14 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Table 6. External I/O or Memory READ and WRITE Timing (C44/C45/C46 Only) (SCLK/TCLK = XTAL/2) (Continued) TA = –0ºC to 70ºC 12 MHz No Symbol Parameter 17 TdAS(DS) AS Rise to DS Fall Delay 18 TdDM(AS) DM Valid to AS Fall Delay 19 TdDs(DM) DS Rise to DM Valid Delay 20 ThDS(AS) DS Valid to Address Valid Hold Time VCC1 Min 3.0 5.5 3.0 5.5 3.0 5.5 3.0 5.5 65 65 35 35 45 45 45 45 Max 16 MHz Min 45 45 30 30 35 35 35 35 Max TA = –40ºC to +105ºC 12 MHz Min 65 65 35 35 45 45 45 45 Max 16 MHz Min 45 45 30 30 35 35 35 35 Max Units Notes ns ns ns ns ns ns ns ns 2 2 2 2 2 2 2 2 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ± 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ± 0.5V. 2. Timing numbers provided are for minimum TpC. 3. When using extended memory timing add 2 TpC. DS007601-Z8X0499 PRELIMINARY 15 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG AC ELECTRICAL CHARACTERISTICS (Continued) Additional Timing Diagram 3 1 Clock 2 7 2 3 7 TIN 4 5 6 IRQN 8 9 Clock Setup 11 Stop Mode Recovery Source 10 Figure 9. Additional Timing 16 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Table 7. Additional Timing (SCLK/TCLK = XTAL/2) TA = 0ºC to +70ºC 12 MHz No Symbol Parameter 1 TpC Input Clock Period 2 TrC,TfC 3 TwC Clock Input Rise & Fall Times Input Clock Width 4 TwTinL Timer Input Low Width 5 TwTinH Timer Input High Width 6 TpTin Timer Input Period 7 TrTin, TfTin Timer Input Rise & Fall Timer Int. Request Low Time 8A TwIL 8B TwIL Int. Request Low Time 9 Int. Request Input High Time Stop-Mode Recovery Width Spec Oscillator Startup Time TwIH 10 Twsm 11 Tost 1 VCC 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V TA = –40ºC to +105ºC 16 MHz 12 MHz 16 MHz Min Max Min Max Min Max Min 83 83 250 250 DC DC DC DC 15 15 62.5 62.5 250 250 DC DC DC DC 15 15 83 83 250 250 DC DC DC DC 15 15 62.5 62.5 250 250 2,3,4 2,3,4 2,3 2,3 2,3 2,3 ns ns ns ns ns ns 2,3,4 2,3,4 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 100 70 5TpC 5TpC 5TpC 5TpC 100 70 5TpC 5TpC 5TpC 5TpC 100 70 5TpC 5TpC 5TpC 5TpC 100 70 5TpC 5TpC 5TpC 5TpC ns ns 2,3,5 2,3,5 2,3,6 2,3,6 2,3,5 2,3,5 3.0V 5.5V 12 12 12 12 12 12 12 12 ns ns 7 7 5TpC 5TpC 100 100 31 31 125 125 100 70 5TpC 5TpC 8TpC 8TpC ns ns ns ns ns ns 41 41 125 125 100 70 5TpC 5TpC 8TpC 8TpC 100 100 41 41 125 125 100 70 5TpC 5TpC 8TpC 8TpC DC DC DC DC 15 15 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 31 31 125 125 100 70 5TpC 5TpC 8TpC 8TpC Max Units Notes D1,D0 100 100 5TpC 5TpC 5TpC 5TpC 100 100 5TpC 5TpC ns ns 7,8 7,8 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ± 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ± 0.5V. 2. Timing Reference uses 0.7 VCC for a logic 1 and 0.2 VCC for a logic 0. 3. SMR D1 = 0. 4. Maximum frequency for external XTAL clock is 4 MHz when using low-EMI Oscillator mode PCON Reg.D7 = 0. 5. Interrupt request via Port 3 (P31–P33). 6. Interrupt request via Port 3 (P30). 7. SMR–D5 = 1, POR STOP Mode Delay is on. 8. For RC and LC oscillator, and for oscillator driven by clock driver. 9. Register WDTMR. DS007601-Z8X0499 PRELIMINARY 17 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG AC ELECTRICAL CHARACTERISTICS (Continued) Table 7. Additional Timing (SCLK/TCLK = XTAL/2) (Continued) TA = 0ºC to +70ºC 12 MHz No Symbol Parameter 12 Twdt Watch-Dog Timer Delay Timer before time-out 13 TPOR Power-On Reset Delay 1 VCC 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V Min 7 3.5 14 7 28 14 112 56 3 1.5 TA = –40ºC to +105ºC 16 MHz Max Min 24 13 7 3.5 14 7 28 14 112 56 3 1.5 12 MHz Max Min 24 13 7 3.5 14 7 28 14 112 56 3 1 16 MHz Max Min 25 14 7 3.5 14 7 28 14 112 56 3 1 Max Units Notes D1,D0 25 14 ms ms ms ms ms ms ms ms ms ms 9 9 9 9 9 9 9 9 0,0 0,0 0,1 0,1 1,0 1,0 1,1 1,1 Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ± 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ± 0.5V. 2. Timing Reference uses 0.7 VCC for a logic 1 and 0.2 VCC for a logic 0. 3. SMR D1 = 0. 4. Maximum frequency for external XTAL clock is 4 MHz when using low-EMI Oscillator mode PCON Reg.D7 = 0. 5. Interrupt request via Port 3 (P31–P33). 6. Interrupt request via Port 3 (P30). 7. SMR–D5 = 1, POR STOP Mode Delay is on. 8. For RC and LC oscillator, and for oscillator driven by clock driver. 9. Register WDTMR. 18 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Table 8. Additional Timing (Divide-By-One Mode, SCLK/TCLK = XTAL) VCC1 No Symbol Parameter 1 TpC Input Clock Period 2 TrC,TfC Clock Input Rise & Fall Times 3 TwC Input Clock Width 4 TwTinL Timer Input Low Width 5 TwTinH Timer Input High Width 6 TpTin Timer Input Period 7 TrTin, TfTin Timer Input Rise & Fall Timer 8A TwIL Int. Request Low Time 8B TwIL Int. Request Low Time 9 TwIH Int. Request Input High Time 10 Twsm Stop-Mode Recovery Width Spec 11 Tost Oscillator Startup Time 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V TA = 0ºC to +70ºC TA = 40ºC to +105ºC 8 MHz Min Max 8 MHz Min Max 250 250 125 125 250 250 125 125 DC DC DC DC 25 25 125 125 62 62 100 70 3TpC 3TpC 4TpC 4TpC Units Notes DC DC DC DC 25 25 ns ns ns ns ns ns ns ns ns ns ns ns 100 100 ns ns ns ns 2,3,4 2,3,4 2,3 2,3 2,3 2,3 2,3,4 2,3,4 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3 2,3,5 2,3,5 2,3,6 2,3,6 2,3,5 2,3,5 7 7 7,8 7,8 125 125 62 62 100 70 3TpC 3TpC 4TpC 4TpC 100 100 100 70 3TpC 3TpC 3TpC 3TpC 12 12 100 70 3TpC 3TpC 3TpC 2TpC 12 12 5TpC 5TpC ns ns 5TpC 5TpC Notes: 1. The VCC voltage specification of 3.0V guarantees 3.3V ± 0.3V, and the VCC voltage specification of 5.5V guarantees 5.0V ± 0.5V. 2. Timing Reference uses 0.7 VCC for a logic “1” and 0.2 VCC for a logic “0”. 3. SMR D1 = 0. 4. Maximum frequency for external XTAL clock is 4 MHz when using low-EMI Oscillator mode PCON Reg.D7 = 0. 5. Interrupt request via Port 3 (P31–P33). 6. Interrupt request via Port 3 (P30). 7. SMR–D5 = 1, POR STOP Mode Delay is on. 8. For RC and LC oscillator, and for oscillator driven by clock driver. DS007601-Z8X0499 PRELIMINARY 19 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG AC ELECTRICAL CHARACTERISTICS (Continued) Handshake Timing Diagrams Data In Valid Data In Next Data In Valid 2 1 3 Delayed DAV DAV (Input) 6 5 4 RDY (Output) Delayed RDY Figure 10. Input Handshake Timing Data Out Data Out Valid Next Data Out Valid 7 DAV (Output) Delayed DAV 8 9 11 10 RDY (Input) Delayed RDY Figure 11. Output Handshake Timing 20 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Table 9. Handshake Timing1 TA = 0°C to +70°C 12 MHz 2 No Symbol Parameter VCC 1 TsDI(DAV) Data In Setup Time 2 ThDI(RDY) Data In Hold Time 3 TwDAV Data Available Width 4 TdDAVI(RDY) DAV Fall to RDY Fall Delay 5 TdDAVId(RDY) DAV Out to DAV Fall Delay 6 RDY0d(DAV) RDY Rise to DAV Fall Delay 7 TdD0(DAV) Data Out to DAV Fall Delay 8 TdDAV0(RDY) DAV Fall to RDY Fall Delay 9 TdRDY0(DAV) RDY Fall to DAV Rise Delay 10 TwRDY RDY Width 11 TdRDY0d(DAV) RDY Rise to DAV Fall Delay 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 3.0V 5.5V 16 MHz TA = –40°C to +105°C 12 MHz 16 MHz Min Max Min Max Min Max Min Max 0 0 0 0 155 110 0 0 0 0 155 110 0 0 120 80 0 0 0 0 155 110 0 0 120 80 0 0 42 42 0 0 0 0 31 31 0 0 160 115 110 80 0 0 120 80 0 0 42 42 0 0 160 115 110 80 110 80 0 0 0 0 155 110 0 0 31 31 0 0 160 115 110 80 110 80 0 0 120 80 160 115 110 80 110 80 110 80 Data Direction IN IN IN IN IN IN IN IN IN IN IN IN OUT OUT OUT OUT OUT OUT OUT OUT OUT OUT Note: 1. Timing Reference uses 0.7 VCC for a logic 1 and 0.2 VCC for a logic 0. 2. The VCC voltage specification of 3.0V guarantees 3.3V ±0.3V. The VCC voltage specification of 5.5V guarantees 5.0V ±0.5V. DS007601-Z8X0499 PRELIMINARY 21 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PIN FUNCTIONS R/RL (input, active Low). The ROM/ROMless pin, when connected to GND, disables the internal ROM and forces the device to function as a ROMless Z8. (Not available for devices in the 28-pin package.) Notes: When left unconnected or pulled High to VCC, the device functions normally as a Z8 ROM version. When using in ROM Mode in a high-EMI (noisy) environment, the ROMless pins should be connected directly to VCC. DS (output, active Low). Data Strobe is activated one time for each external memory transfer. For a READ operation, data must be available prior to the trailing edge of DS. For WRITE operations, the falling edge of DS indicates that output data is valid. (Not available for devices in the 28pin package.) 22 AS (output, active Low). Address Strobe is pulsed one time at the beginning of each machine cycle for external memory transfer. Address output is from Port 0/Port 1 for all external programs. Memory address transfers are valid at the trailing edge of AS. Under program control, AS is placed in the high-impedance state along with Ports 0 and 1, Data Strobe, and READ/WRITE. (Not available for devices in the 28-pin package.) XTAL1 Crystal 1 (time-based input). This pin connects a parallel-resonant crystal, ceramic resonator, LC, or RC net- work, or an external single-phase clock to the on-chip oscillator input. XTAL2 Crystal 2 (time-based output). This pin connects a parallel-resonant crystal, ceramic resonant, LC, or RC network to the on-chip oscillator output. R/W (output, WRITE Low). The READ/WRITE signal is Low when the Z8 is writing to the external program or data memory. (Not available for devices in the 28-pin package.) PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Port 0 (P00–P07). Port 0 is an 8-bit, bidirectional, CMOScompatible port. These eight I/O lines are configured under software control as a nibble I/O port (P03–P00 input/output and P07–P04 input/output), or as an address port for interfacing external memory. The input buffers are Schmitt-triggered and nibble-programmed as outputs and can be globally programmed as either push-pull or open-drain. LowEMI output buffers can be globally programmed by the software. Port 0 is placed under handshake control. In this configuration, Port 3, lines P32 and P35 are used as the handshake control DAV0 and RDY0. Handshake signal direction is dictated by the I/O direction (input or output) of Port 0 of the upper nibble P04–P07. The lower nibble must indicate the same direction as the upper nibble. For external memory references, Port 0 provides address bits A11–A8 (lower nibble) or A15–A8 (lower and upper nibble) depending on the required address space. If the address range requires 12 bits or less, the upper nibble of Port 0 can be programmed independently as I/O while the lower nibble is used for addressing. If one or both nibbles are required for I/O operation, they are configured by writing to the Port 0 mode register. In ROMless mode, after a hardware RESET, Port 0 is configured as address lines A15–A8, and extended timing is set to accommodate slow memory access. The initialization routine can include reconfiguration to eliminate this extended timing mode. (In ROM mode, Port 0 is defined as input after RESET.) Port 0 can be placed in a high-impedance state along with Port 1, AS, DS and R/W, allowing the Z8 to share common resources in multiprocessor and DMA applications (Figure 12). 4 Port 0 (I/O or A15–A8) Z8 4 Handshake Controls DAV0 and RDY0 (P32 and P35) Open-Drain Pull-Up Transistor Enable (Mask Option) OE PAD Out 1.5 2.3 Hysteresis @ VCC = 5.0V In Auto Latch (mask option) R ≈ 500KΩ Figure 12. Port 0 Configuration DS007601-Z8X0499 PRELIMINARY 23 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PIN FUNCTIONS (Continued) Port 1 (P17–P10). Port 1 is an 8-bit, bidirectional, CMOS- compatible port (Figure 13), with multiplexed Address (A7–A0) and Data (D7–D0) ports. For the ROM device, these eight I/O lines are programmed as inputs or outputs, or can be configured under software control as an Address/Data port for interfacing external memory. The input buffers are Schmitt-triggered and byte-programmed as outputs and can be globally programmed as either push-pull or open-drain. Low-EMI output buffers can be globally programmed by the software. Note: Port 1 is not available on the devices in the 28-pin package, and P01M Register must set Bit D4,D3 as 00. LowEMI mode is not supported on the emulator for Port1. PCON register D4 must be 1. 8 Port 1 may be placed under handshake control. In this configuration, Port 3, lines P33 and P34 are used as the handshake controls RDY1 and DAV1 (Ready and Data Available). Memory locations greater than the internal ROM address are referenced through Port 1, except for Z86C46. To interface external memory, Port 1 must be programmed for the multiplexed Address/Data mode. If more than 256 external locations are required, Port 0 outputs the additional lines. Port 1 can be placed in the high-impedance state along with Port 0, AS, DS, and R/W, allowing the Z8 to share common resources in multiprocessor and DMA applications. Port 1 (I/O or AD7–AD0) Z8 Handshake Controls DAV1 and RDY1 (P33 and P34) Pull-Up Transistor Enable (Mask Option) Open Drain OE PAD Out 1.5 2.3 Hysteresis @ VCC = 5.0V In Auto Latch (mask option) R ≈ 500 KΩ Figure 13. Port 1 Configuration 24 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Port 2 (P27–P20). Port 2 is an 8-bit, bidirectional, CMOScompatible I/O port. These eight I/O lines are configured under software control as an input or output, independently. Port 2 is always available for I/O operation. The input buffers are Schmitt-triggered. Bits programmed as outputs may be globally programmed as either push-pull or open-drain. Low-EMI output buffers can be globally programmed by the software. Port 2 may be placed under handshake control. In this Handshake Mode, Port 3 lines P31 and P36 are used as the handshake controls lines DAV2 and RDY2. The handshake signal assignment for Port 3 lines P31 and P36 is dictated by the direction (input or output) assigned to Bit 7, Port 2 (Figure 14). Port 2 (I/O) Z8 Handshake Controls DAV2 and RDY2 (P31 and P36) Open Drain Pull-Up Transistor Enable (Mask Option) OE PAD Out 1.5 2.3 Hysteresis @ VCC = 5.0V. In Auto Latch (mask option) R ≈ 500 KΩ Figure 14. Port 2 Configuration DS007601-Z8X0499 PRELIMINARY 25 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PIN FUNCTIONS (Continued) Port 3 (P37–P30). Port 3 is an 8-bit, CMOS-compatible port, with four fixed inputs (P33–P30) and four fixed outputs (P34–P37). It is configured under software control for Input/Output, Counter/Timers, interrupt, port handshake, and Data Memory functions. Port 3, bit 0 input is Schmitttriggered, and pins P31, P32, and P33 are standard CMOS inputs (no Auto Latches). Pins P34, P35, P36, P37 are pushpull output lines. Low-EMI output buffers can be globally programmed by the software. Two onboard comparators can process analog signals on P31 and P32 with reference to the voltage on P33. The analog function is enabled by programming Port 3 Mode Register (P3M bit 1). For Interrupt functions, Port 3, bit 0 and pin 3 are falling edge interrupt inputs. P31 and P32 are programmable as rising, falling, or both edge triggered interrupts (IRQ register Bits 6 and 7). P33 is the comparator reference voltage input when in Analog mode. Access to Counter/Timers 1 is made through P31 (TIN) and P36 (TOUT). Handshake lines for Ports 0, 1, and 2 are available on P31 through P36. Port 3 also provides the following control functions: handshake for Ports 0, 1, and 2 (DAV and RDY); four external interrupt request signals (IRQ3–IRQ0); timer input and output signals (TIN and TOUT); Data Memory Select (DM, see Table 10 and Figure 15). P34 output can be software-programmed to function as a Data Memory Select (DM). The Port 3 mode register (P3M) Bit D3,D4 selects this function. When accessing external Data Memory, the P34 goes active Low; when accessing external Program Memory, the P34 goes High. An onboard UART (ASCI) can be enabled by software by setting the RE and TE bits of the ASCI Control Register A (CNTLA). When enabled, P30 is the receive input and P37 is the transmit output. Table 10. Port 3 Pin Assignments Pin I/O P30 P31 IN IN P32 P33 P34 P35 P36 IN IN OUT OUT OUT P37 OUT CTC1 TIN Analog Int. AN1 IRQ3 IRQ2 AN2 REF AN1–OUT IRQ0 IRQ1 P0 HS P1 HS P2 HS Ext UART RX D/R D/R D/R R/D DM R/D TOUT R/D AN2–OUT TX Notes: HS = Handshake Signals D = DAV R = RDY Comparator Inputs and Outputs. Port 3, pins P31 and P32 each feature a comparator front end. The comparator reference voltage, pin P33, is common to both comparators. In analog mode, the P31 and P32 are the positive inputs to the comparators and P33 is the reference voltage supplied to both comparators. In digital mode, pin P33 can be used as a P33 register input or IRQ1 source. P34 and P37 outputs Note: The user must add a two-NOP delay after selecting the P3M bit D1 to 1 before the comparator output is valid. IRQ0, IRQ1, and IRQ2 should be cleared in the IRQ register when the comparator is enabled or disabled. the comparator outputs by software-programming the PCON Register Bit D0 to 1 (see Figure 16). 26 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG P30 P31 P32 P33 Z8 P34 Port 3 (I/O or Control) P35 P36 P37 Auto Latch (mask option) R ≈ 500KΩ P30 Data Latch IRQ3 P30 R247 = P3M D1 1 = Analog 0 = Digital DIG. P31 (AN1) IRQ2,TIN, P31 Data Latch + AN. – P32 (AN2) IRQ0, P32 Data Latch + P33 (REF) – IRQ1, P33 Data Latch From Stop-Mode Recovery Source Figure 15. Port 3 Configuration DS007601-Z8X0499 PRELIMINARY 27 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PIN FUNCTIONS (Continued) P34 P34 OUT P31 PAD + – REF (P33) P37 P37 OUT P32 PAD + – REF (P33) PCON D0 0 P34, P37 Standard Output 1 P34, P37 Comparator Output Figure 16. Port 3 Configuration Auto Latch. The Auto Latch places valid CMOS levels on all CMOS inputs (except P33–P31) that are not externally driven. Whether this level is 0 or 1 cannot be determined. A valid CMOS level, rather than a floating node, reduces excessive supply current flow in the input buffer. Auto Latches are available on Port 0, Port 1, Port 2, and P30. There are no Auto Latches on P31, P32, and P33. Note: Deletion of all Port Auto Latches is available as a ROM Mask option. The Auto Latch Delete option is selected by the customer when the ROM code is submitted. RESET (input, active Low). Initializes the MCU. Reset is accomplished either through Power-On Reset, Watch-Dog Timer reset, Stop-Mode Recovery, or external reset. During Power-On Reset and Watch-Dog Reset, the internally-generated reset is driving the RESET pin Low for the POR time. Any devices driving the RESET line must be open-drain to avoid damage from a possible conflict during RESET con- 28 ditions. RESET depends on oscillator operation to achieve full reset conditions, except for conditions wherein a WDT reset is permanently enabled. Pull-up is provided internally. Note: The RESET pin is not available on devices in the 28-pin package. After the POR time, RESET is a Schmitt-triggered input. During the RESET cycle, DS is held active Low while AS cycles at a rate of TPC/2. Program execution begins at location 000Ch, after the RESET is released. For Power-On Reset, the reset output time is TPOR ms. When program execution begins, AS and DS toggles only for external memory accesses. The Z8 does not reset WDTMR, SMR, P2M, PCON, and P3M registers on a StopMode Recovery operation or from a WDT reset out of STOP mode. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION The Z8 MCU incorporates the following special functions to enhance the standard Z8® architecture to provide the user with increased design flexibility. RESET. The device is reset in one of the following condi- tions: • • • • • Power-On Reset 65535 16383/32767 16382/32766 Location of First Byte of Instruction Executed After RESET 12 Watch-Dog Timer Stop-Mode Recovery Source External/Internal ROM and RAM External Reset On-Chip ROM 11 IRQ5 10 IRQ5 9 IRQ4 8 IRQ4 7 IRQ3 6 IRQ3 5 IRQ2 4 IRQ2 3 IRQ1 2 IRQ1 1 IRQ0 0 IRQ0 Low Voltage Recovery Auto Power-On Reset circuitry is built into the Z8, eliminating the requirement for an external reset circuit to reset upon power-up. The internal pull-up resistor is on the Reset pin, so a pull-up resistor is not required; however, in a highEMI (noisy) environment, it is recommended that a small value pull-up resistor be used. Interrupt Vector (Lower Byte) Note: The RESET pin is not available on devices in the 28-pin package. Program Memory. The first 12 bytes of program memory are reserved for the interrupt vectors. These locations contain six 16-bit vectors that correspond to the six available interrupts. For ROM mode, address 12 to address 65535 (C36/C46)/32767 (C35/C45)/16383 (C34/C44) consists of on-chip mask-programmed ROM. The Z86C44/C45 can access external program and data memory from addresses 16384/32768 to 65535. The 65535 (C36/C46)/ 32767 (C35/C45)/ 16383 (C34/C44) program memory is mask programmable. A ROM protect feature prevents dumping of the ROM contents by inhibiting execution of LDC, LDCI, LDE, and LDEI instructions to Program Memory in external program mode. ROM look-up tables can be used with this feature. The ROM Protect option is mask-programmable, to be selected by the customer when the ROM code is submitted. DS007601-Z8X0499 Interrupt Vector (Upper Byte) Figure 17. Program Memory Map for Z86C34/35/44/45 Data Memory (DM). The ROMless version can address up to 64 KB of external data memory. External data memory may be included with, or separated from, the external program memory space. DM, an optional I/O function that can be programmed to appear on pin P34, is used to distinguish between data and program memory space (Figure 18). The state of the DM signal is controlled by the type of instruction being executed. An LDC Op Code references PROGRAM (DM inactive) memory, and an LDE instruction references data (DM active Low) memory. The user must configure Port 3 Mode Register (P3M) bits D3 and D4 for this mode. This feature is not usable for devices in 28-pin package. When used in ROM mode, the Z86C46 cannot access any external data memory. The Z86C44/C45 can access exter- PRELIMINARY 29 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION (Continued) nal program and data memory from addresses 16384/32768 to 65535. Expanded Register File (ERF). The Z8 register file is ex- panded to allow for additional system control registers, and for mapping of additional peripheral devices along with I/O ports into the register address area. The Z8 register address space R0 through R15 is implemented as 16 groups of 16 registers per group (Figure 19). These register groups are 65535 known as the Expanded Register File (ERF). Bits 7–4 of register RP select the working register group. Bits 3–0 of register RP select the expanded register group. Three system configuration registers reside in the Expanded Register File at Bank F (PCON, SMR, WDTMR). The rest of the Expanded Register is not physically implemented, and is open for future expansion. 65535 External Data Memory External Data Memory 16384/32768 16383/32767 NotAddressable 0 0 ROM Mode ROMless Mode Figure 18. Data Memory Map 30 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Z8® STANDARD CONTROL REGISTERS RESET CONDITION D7 D6 D5 D4 D3 D2 D1 D0 REGISTER % FF SPL 0 0 0 0 0 0 0 % FE SPH 0 0 0 0 0 0 0 0 % FD RP 0 0 0 0 0 0 0 0 % FC FLAGS U U U U U U U U % FB IMR 0 U U U U U U U % FA IRQ 0 0 0 0 0 0 0 0 % F9 IPR U U U U U U U U † % F8 P01M 0 1 0 0 1 1 0 1 * * % F7 P3M 0 0 0 0 0 0 0 0 % F6 P2M 1 1 1 1 1 1 1 1 REGISTER POINTER 7 6 5 4 3 2 WorkingRegister Group Pointer 1 0 Expanded Register Group Pointer Z8 Reg. File %FF %FO % F5 PRE0 U U U U U U U 0 % F4 T0 U U U U U U U U % F3 PRE1 U U U U U U 0 0 % F2 T1 U U U U U U U U % F1 TMR 0 0 0 0 0 0 0 0 % F0 Reserved EXPANDED REG. GROUP (F) REGISTER * * %7F ** Reserved %0F %00 * % (F) 0F WDTMR % (F) 0E Reserved % (F) 0D SMR2 % (F) 0C Reserved % (F) 0B SMR % (F) 0A Reserved % (F) 09 Reserved % (F) 08 Reserved % (F) 07 Reserved % (F) 06 Reserved % (F) 05 Reserved % (F) 04 Reserved % (F) 03 Reserved % (F) 02 Reserved % (F) 01 Reserved % (F) 00 PCON EXPANDED REG. GROUP(0) REGISTER Notes: U = Unknown † For ROMless Reset condition: “10110110”. *Will not be reset with a STOP-Mode Recovery. **Will not be reset with a STOP-Mode Recovery, except bit D0. X Not available on 28-pin packages. 0 * * X RESET CONDITION U U U 0 1 1 0 1 U U U U U U 0 0 0 0 1 0 0 0 0 0 1 1 1 1 1 1 1 0 RESET CONDITION % (0) 03 P3 1 1 1 1 U U U U % (0) 02 P2 U U U U U U U U % (0) 01 P1 U U U U U U U U % (0) 00 P0 U U U U U U U U Figure 19. Expanded Register File Architecture Register File. The register file consists of four I/O port registers, 236 general-purpose registers and 15 control and status registers (R0–R3, R4–R239 and R240–R255, respectively), plus three system configuration registers in the expanded register group. The instructions access registers DS007601-Z8X0499 directly or indirectly through an 8-bit address field. As a result, a short, 4-bit register address can use the Register Pointer (Figure 20). In the 4-bit mode, the register file is divided into 16 working register groups, each occupying 16 PRELIMINARY 31 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION (Continued) continuous locations. The Register Pointer addresses the starting location of the active working register group. R253 RP D7 D6 D5 D4 D3 D2 D1 D0 Expanded Register Group Working Register Group Default setting after RESET = 00000000 Figure 20. Register Pointer r7 r6 r5 r4 r3 r2 r1 r0 R253 (Register Pointer) The upper nibble of the register file address provided by the register pointer specifies the active working-register group. FF Register Group F R15 to R0 F0 7F 70 6F 60 5F 50 4F 40 3F 30 2F Specified Working Register Group The lower nibble of the register file address provided by the instruction points to the specified register 20 1F 10 0F Register Group 1 R15 to R0 Register Group 0 R15 to R4 I/O Ports R3 to R0 00 Figure 21. Register Pointer—Detail 32 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG General-Purpose Registers (GPR). These registers are undefined after the device is powered up. The registers keep their most recent value after any RESET, as long as the RESET occurs in the VCC voltage-specified operating range. These do not keep their most recent state from a Low Voltage Protection (VLV) RESET if the VCC drops below 1.8V. Note: Register Bank E0–EF is only accessed through working register and indirect addressing modes. RAM Protect. The upper portion of the RAM’s address spaces %80F to %EF (excluding the control registers) are protected from writing. The RAM Protect bit option is mask-programmable and is selected by the customer when the ROM code is submitted. After the mask option is selected, the user activates this feature from the internal ROM code to turn off/on the RAM Protect by loading either a 0 or 1 into the IMR register, bit D6. A 1 in D6 enables RAM Protect. Stack. The Z8 internal register file is used for the stack. The 16-bit Stack Pointer (R254–R255) is used for the external stack, which can reside anywhere in the data memory for ROMless mode. An 8-bit Stack Pointer (R255) is used for the internal stack that resides within the 236 general-purpose registers (R4–R239). Stack Pointer High (SPH) is used as a general-purpose register when using internal stack only. The devices in 28-pin packages use the 8-bit stack pointer (R255) for internal stack only. DS007601-Z8X0499 Note: R254 and R255 are set to 00h after any RESET or StopMode Recovery. Counter/Timers. There are two 8-bit programmable counter/timers (T0–T1), each driven by its own 6-bit programmable prescaler. The T1 prescaler is driven by internal or external clock sources; however, the T0 prescaler is driv- en by the internal clock only (Figure 22). The 6-bit prescalers can divide the input frequency of the clock source by any integer number from 1 to 64. Each prescaler drives its counter, which decrements the value (1 to 256) that is loaded into the counter. When the counter reaches the end of the count, a timer interrupt request, IRQ4 (T0) or IRQ5 (T1), is generated. The counters can be programmed to START, STOP, restart to CONTINUE, or restart from the initial value. The counters can also be programmed to STOP upon reaching 0 (single pass mode) or to automatically reload the initial value and continue counting (modulo–n continuous mode). The counters, but not the prescalers, are read at any time without disturbing their value or count mode. The clock source for T1 is user-definable and is either the internal microprocessor clock divide-by-four, or an external signal input through Port 3. The Timer Mode register configures the external timer input (P31) as an external clock, a trigger input that can be retriggerable or nonretriggerable, or as a gate input for the internal clock. The counter/timers can be cascaded by connecting the T0 output to the input of T1. TIN Mode is enabled by setting R243 PRE1 bit D1 to 0. PRELIMINARY 33 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION (Continued) OSC Internal Data Bus D1 (SMR) Write Write Read 2 PRE0 Initial Value Register T0 Initial Value Register 6-Bit Down Counter 8-bit Down Counter T0 Current Value Register D0 (SMR) 16 ÷4 IRQ4 Internal Clock ÷2 TOUT P36 External Clock Clock Logic 6-Bit Down Counter 8-Bit Down Counter PRE1 Initial Value Register T1 Initial Value Register ÷4 Internal Clock Gated Clock Triggered Clock TIN P31 Write Write IRQ5 T1 Current Value Register Read Internal Data Bus Figure 22. Counter/Timer Block Diagram Interrupts. The Z8 features six different interrupts from six different sources. These interrupts are maskable, prioritized (Figure 23) and the six sources are divided as follows: four sources are claimed by Port 3 lines P33–P30, and two in 34 counter/timers (Table 11). The Interrupt Mask Register globally or individually enables or disables the six interrupt requests. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG IRQ0 IRQ2 IRQ1, 3, 4, 5 Interrupt Edge Select IRQ (D6, D7) IRQ IMR 6 IPR Global Interrupt Enable Interrupt Request PRIORITY LOGIC Vector Select Figure 23. Interrupt Block Diagram Table 11. Interrupt Types, Sources, and Vectors Name Source Vector Location Comments IRQ0 IRQ1, IRQ2 DAV0, IRQ0 IRQ1 DAV2, IRQ2, TIN 0, 1 2, 3 4, 5 External (P32), Rise Fall Edge Triggered External (P33), Fall Edge Triggered External (P31), Rise Fall Edge Triggered IRQ3 IRQ4 IRQ5 UART (ASCI) T0 T1 6, 7 8, 9 10, 11 External (P30), Fall Edge Triggered Internal Internal When more than one interrupt is pending, priorities are resolved by a programmable priority encoder that is controlled by the Interrupt Priority register. An interrupt machine cycle activates when an interrupt request is granted. This action disables all subsequent interrupts, saves the Program Counter and Status Flags, and then branches to the program memory vector location reserved for that interrupt. DS007601-Z8X0499 All Z8 interrupts are vectored through locations in the program memory. This memory location and the next byte contain the 16-bit address of the interrupt service routine for that particular interrupt request. To accommodate polled interrupt systems, interrupt inputs are masked and the Interrupt Request register is polled to determine which of the interrupt requests require service. PRELIMINARY 35 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION (Continued) An interrupt resulting from AN1 maps to IRQ2, and an interrupt from AN2 maps to IRQ0. Interrupts IRQ2 and IRQ0 may be rising, falling, or both edge-triggered, and are programmable by the user. The software may poll to identify the state of the pin. When in analog mode, the IRQ1 generates by the Stop-Mode Recovery source selected by SMR Reg. bits D4, D3, D2, or SMR2 D1 or D0. Programming bits for the Interrupt Edge Select are located in the IRQ register (R250), bits D7 and D6. The configuration is indicated in Table 12. Table 12. IRQ Register IRQ D7 0 0 1 1 Notes: F = Falling Edge R = Rising Edge 36 Interrupt Edge D6 0 1 0 1 P31 F F R R/F P32 F R F R/F Clock. The Z8 on-chip oscillator features a high-gain, parallel-resonant amplifier for connection to a crystal, LC, RC, ceramic resonator, or any suitable external clock source (XTAL1 = INPUT, XTAL2 = OUTPUT). The crystal should be AT-cut, 16 MHz maximum, with a series resistance (RS) of less than or equal to 100 Ohms when counting from 1 MHz to 16 MHz. The crystal should be connected across XTAL1 and XTAL2 using the vendor’s recommended capacitor values from each pin directly to the device Ground pin to reduce groundnoise injection into the oscillator. The RC oscillator option is mask-programmable on the Z8 and is selected by the customer at the time when the ROM code is submitted. Notes: The RC option is available up to 8 MHz. The RC oscillator configuration must be an external resistor connected from XTAL1 to XTAL2, with a frequencysetting capacitor from XTAL1 to Ground (Figure 24). For better noise immunity, the capacitors should be tied directly to the device Ground pin (VSS). PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG XTAL1 C1 XTAL1 C1 VSS** VSS** C2 VSS** L XTAL2 VSS** XTAL1 XTAL1 XTAL2 XTAL2 C1 R XTAL2 C2 VSS** Ceramic Resonator or Crystal C1, C2 = 47 pF TYP * f = 8 MHz LC C1, C2 = 22 pF RC @ 5V VCC (TYP) L = 130 uH * f = 3 MHz * C1 = 33 pF * R = 1K * f = 6 MHz * External Clock *Preliminary value including pin parasitics **Device ground pin Figure 24. Oscillator Configuration Power-On-Reset (POR). A timer circuit clocked by a ded- icated on-board RC oscillator is used for the Power-On Reset (POR) timer function. The POR time allows VCC and the oscillator circuit to stabilize before instruction execution begins. The POR timer circuit is a one-shot timer triggered by one of three conditions: 1. Power fail to Power OK status. a NOP (Op Code = FFH) immediately before the appropriate sleep instruction. For example: FF 6F NOP STOP FF 7F NOP HALT ; clear the pipeline ; enter STOP mode or ; clear the pipeline ; enter HALT Mode 2. Stop-Mode Recovery (if D5 of SMR = 1). 3. WDT time-out. The POR time is specified as TPOR. Bit 5 of the Stop-Mode Register determines whether the POR timer is bypassed after Stop-Mode Recovery (typical for external clock, RC/LC oscillators). HALT. HALT turns off the internal CPU clock, but not the XTAL oscillation. The counter/timers and external interrupts IRQ0, IRQ1, IRQ2, and IRQ3 remain active. The de- vices are recovered by interrupts and are either externally or internally generated. An interrupt request must be enabled and executed to exit HALT mode. After the interrupt service routine, the program continues from the instruction after the HALT. In order to enter STOP (or HALT) mode, it is necessary to first flush the instruction pipeline to avoid suspending execution in mid-instruction. Therefore, the user must execute DS007601-Z8X0499 STOP. This instruction turns off the internal clock and external crystal oscillation. It also reduces the standby current to 10 µA or less. The STOP mode is terminated by a RESET only, either by WDT time-out, POR, SMR recovery, or external reset. As a result, the processor restarts the application program at address 000Ch. A WDT time-out in STOP mode affects all registers the same as if a Stop-Mode Recovery occurred via a selected Stop-Mode Recovery source except that the POR delay is enabled even if the delay is selected for disable. Note: If a permanent WDT is selected, the WDT runs in all modes and cannot be stopped or disabled if the onboard RC oscillator is selected to drive the WDT. Port Configuration Register (PCON). The PCON regis- ter configures the ports individually; comparator output on Port 3, open-drain on Port 0 and Port 1, low EMI on Ports PRELIMINARY 37 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION (Continued) 0, 1, 2, and 3, and low-EMI oscillator. The PCON register is located in the expanded register file at Bank F, location 00h (Figure 25). Note: For emulator, this bit must be set to 1. Low-EMI Port 2 (D5). Port 2 can be configured as a lowEMI port by resetting this bit (D5 = 0) or configured as a Standard Port by setting this bit (D5 = 1). The default value is 1. PCON (FH) 00H D7 D6 D5 D4 D3 D2 D1 D0 Comparator Output Port 3 0 P34, P37 Standard Output* 1 P34, P37 Comparator Output 0 Port 1 Open Drain 1 Port 1 Push-pull Active*† 0 Port 0 Open Drain 1 Port 0 Push-pull Active* 0 Port 0 Low EMI 1 Port 0 Standard*† 0 Port 1 Low EMI 1 Port 1 Standard* Low-EMI Port 3 (D6). Port 3 can be configured as a lowEMI port by resetting this bit (D6 = 0) or configured as a Standard Port by setting this bit (D6 = 1). The default value is 1. Low-EMI OSC (D7). This bit of the PCON Register controls the low-EMI noise oscillator. A 1 in this location configures the oscillator, DS, AS and R/W with standard drive, while a 0 configures the oscillator, DS, AS and R/W with low noise drive. The low-EMI mode reduces the drive of the oscillator (OSC). The default value is 1. 0 Port 2 Low EMI 1 Port 2 Standard* 0 Port 3 Low EMI 1 Port 3 Standard* *Default Setting After Reset † Must be set to one for devices in 28-pin packages Note: Maximum external clock frequency of 4 MHz when running in the low-EMI oscillator mode. Low EMI Oscillator 0 Low EMI 1 Standard* Figure 25. Port Configuration Register (PCON) (WRITE ONLY) Comparator Output Port 3 (D0). Bit 0 controls the comparator use in Port 3. A 1 in this location brings the comparator outputs to P34 and P37, and a 0 releases the Port to its standard I/O configuration. The default value is 0. Port 1 Open-Drain (D1). Port 1 can be configured as an open-drain by resetting this bit (D1 = 0) or configured as push-pull active by setting this bit (D1 = 1). The default value is 1. The user must set D1 = 1 for devices in 28-pin pack- ages. Port 0 Open-Drain (D2). Port 0 can be configured as an open-drain by resetting this bit (D2 = 0) or configured as push-pull active by setting this bit (D2 = 1). The default value is 1. Low-EMI Port 0 (D3). Port 0 can be configured as a lowEMI port by resetting this bit (D3 = 0) or configured as a Standard Port by setting this bit (D3 = 1). The default value is 1. Low-EMI Port 1 (D4). Port 1 can be configured as a lowEMI port by resetting this bit (D4 = 0) or configured as a Standard Port by setting this bit (D4 = 1). The default value is 1. The user must set D4 = 1 for devices in 28-pin packages. 38 Low-EMI Emission. The Z8 can be programmed to operate in a low-EMI emission mode in the PCON register. The oscillator and all I/O ports can be programmed as low-EMI emission mode independently. Use of this feature results in: • • The pre-drivers slew rate reduced to 10 ns (typical) • • Low-EMI Oscillator Low-EMI output drivers exhibit resistance of 200 Ohms (typical) Internal SCLK/TCLK = XTAL operation limited to a maximum of 4 MHz–250 ns cycle time, when LOW EMI OSCILLATOR is selected and system clock (SCLK = XTAL, SMR REGISTER BIT D1 = 1) Stop-Mode Recovery Register (SMR). This register se- lects the clock divide value and determines the mode of Stop-Mode Recovery (Figures 26 and 27). All bits are WRITE ONLY, except bit 7, which is READ ONLY. Bit 7 is a flag bit that is hardware set on the condition of STOP recovery and RESET by a power-on cycle. Bit 6 controls whether a low level or a high level is required from the recovery source. Bit 5 controls the reset delay after recovery. Bits 2, 3, and 4, or the SMR register, specify the source of the Stop-Mode Recovery signal. Bits 0 and 1 determine the time-out period of the WDT. The SMR is located in Bank F of the Expanded Register Group at address 0BH. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG SCLK/TCLK Divide-by-16 Select (D0). D0 of the SMR controls a divide-by-16 prescaler of SCLK/TCLK. The pur- SMR (FH) 0B pose of this control is to selectively reduce device power consumption during normal processor execution ( SCLK control) and/or HALT mode (where TCLK sources counter/timers and interrupt logic). This bit is reset to D0 = 0 after a Stop-Mode Recovery. D7 D6 D5 D4 D3 D2 D1 D0 SCLK/TCLK Divide-by-16 0 OFF * * 1 ON External Clock Divide by 2 0 SCLK/TCLK =XTAL/2* 1 SCLK/TCLK =XTAL STOP-Mode Recovery Source 000 POR Only and/or External Reset* 001 P30 010 P31 011 P32 100 P33 101 P27 110 P2 NOR 0-3 111 P2 NOR 0-7 Stop Delay 0 OFF 1 ON* Stop Recovery Level 0 Low* 1 High Stop Flag (Read only) 0 POR* 1 Stop Recovery External Clock Divide-by-Two (D1). This bit can eliminate the oscillator divide-by-two circuitry. When this bit is 0, the System Clock (SCLK) and Timer Clock (TCLK) are equal to the external clock frequency divided by 2. The SCLK/TCLK is equal to the external clock frequency when this bit is set (D1 = 1). Using this bit together with D7 of PCON further helps lower EMI (that is, D7 (PCON) = 0, D1 (SMR) = 1). The default setting is 0. Maximum external clock frequency is 4 MHz when SMR BIT D1 = 1 where SCLK/TCLK = XTAL. Stop-Mode Recovery Source (D2, D3, and D4). T h e s e three bits of the SMR specify the wake-up source of the STOP recovery (Figure 28 and Table 13). When the Stop- Note: Not used in conjunction with SMR2 Source * Default setting after RESET. * * Default setting after RESET and STOP-Mode Recovery. Figure 26. Stop-Mode Recovery Register (WRITE ONLY Except Bit D7, Which Is READ ONLY) Mode Recovery Sources are selected in this register, then SMR2 register bits D0,D1 must be set to 0. Note: If the Port 2 pin is configured as an output, this output level is read by the SMR circuitry. SMR2 (0F) DH D7 D6 D5 D4 D3 D2 D1 D0 Stop-Mode Recovery Source 2 00 POR only* 01 AND P20,P21,P22,P23 10 AND P20,P21,P22,P23,P24, P25,P26,P27 Reserved (Must be 0) Note: Not used in conjunction with SMR Source Figure 27. Stop-Mode Recovery Register 2 (0F) DH: WRITE ONLY DS007601-Z8X0499 PRELIMINARY 39 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION (Continued) SMR2 D1 D0 0 0 VDD SMR D4 D3 D2 0 0 0 VDD P30 P31 P32 SMR D4 0 0 0 D3 0 1 1 D2 SMR D4 D3 D2 1 1 0 0 0 1 P33 SMR2 D1 D0 1 1 P20 P20 P23 P27 SMR D4 D3 D2 1 0 1 SMR D4 D3 D2 1 1 0 P20 P20 P23 P27 SMR2 D1 D0 1 1 SMR D4 D3 D2 1 1 1 P27 To POR RESET Stop-Mode Recovery Edge Select (SMR) To P33 Data Latch and IRQ1 MUX P33 From Pads Digital/Analog Mode Select (P3M) Figure 28. Stop-Mode Recovery Source Table 13. Stop-Mode Recovery Source SMR:432 D4 D3 D2 Operation Description of Action wake up is selected, the Stop-Mode Recovery source must be kept active for at least 5 TpC. Stop-Mode Recovery Edge Select (D6). A 1 in this bit POR and/or external reset recovery P30 transition P31 transition (not in Analog Mode) P32 transition (not in Analog Mode) P33 transition (not in Analog Mode) P27 transition Logical NOR of P20 through P23 Logical NOR of P20 through P27 position indicates that a high level on any one of the recovery sources wakes the Z8 from STOP mode. A 0 indicates low-level recovery. The default is 0 on POR (Figure 28). This bit is used for either SMR or SMR2. Stop-Mode Recovery Delay Select (D5). T h i s b i t , i f High, enables the TPOR RESET delay after Stop-Mode Recovery. The default configuration of this bit is 1. If the fast Note: If the Port 2 pin is configured as an output, this output level is read by the SMR2 circuitry. 0 0 0 0 1 1 1 1 40 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Cold or Warm Start (D7). This bit is set by the device upon entering STOP mode. A 0 in this bit (cold) indicates that the device resets by POR/WDT RESET. A 1 in this bit (warm) indicates that the device awakens by a Stop-Mode Recovery source. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Stop-Mode Recovery Register 2 (SMR2). This register contains additional Stop-Mode Recovery sources. When the Stop-Mode Recovery sources are selected in this register then SMR Register. Bits D2, D3, and D4 must be 0. Table 14. Stop-Mode Recovery Source SMR:10 D1 D0 0 0 1 0 1 0 Operation Description of Action POR and/or external reset recovery Logical AND of P20 through P23 Logical AND of P20 through P27 Watch-Dog Timer Mode Register (WDTMR). The WDT is a retriggerable one-shot timer that resets the Z8 if it reach- es its terminal count. The WDT is initially enabled by executing the WDT instruction and refreshed on subsequent executions of the WDT instruction. The WDT circuit is driven by an onboard RC oscillator or external oscillator from the XTAL1 pin. The POR clock source is selected with bit 4 of the WDT register (Figure 29). WDT instruction affects the Z (Zero), S (Sign), and V (Overflow) flags. The WDTMR must be written to within 64 internal system clocks. After that, the WDTMR is WRITE-pro- tected. Note: WDT time-out while in STOP mode does not reset SMR, PCON, WDTMR, P2M, P3M, Ports 2 & 3 Data Registers, but the POR delay counter is still enabled even though the SMR stop delay is disabled. WDTMR (F) 0F D7 D6 D5 D4 D3 D2 D1 D0 WDT TAP INT RC OSC External Clock 00 3.5 ms 128 TpC 7 ms 256 TpC 01* 10 14 ms 512 TpC 11 56 ms 2048 TpC WDT During HALT 0 OFF 1 ON* WDT During STOP 0 OFF 1 ON* XTAL1/INT RC Select for WDT 0 On-Board RC* 1 XTAL Reserved (must be 0) * Default setting after RESET Figure 29. Watch-Dog Timer Mode Register (WRITE ONLY) Table 15. WDT Time Select WDT Time Select. (D0,D1). Selects the WDT time period and is configured as indicated in Table 15. D1 D0 Timeout of Internal RC OSC Timeout of System Clock 0 0 1 1 0 1 0 1 3.5 ms min 7 ms min 14 ms min 56 ms min 128 SCLK 256 SCLK 512 SCLK 2048 SCLK Notes: SCLK = system bus clock cycle. The default on RESET is 7 ms. Values provided are for VCC = 5.0V. DS007601-Z8X0499 PRELIMINARY 41 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG FUNCTIONAL DESCRIPTION (Continued) WDTMR During HALT (D2). This bit determines whether or not the WDT is active during HALT mode. A 1 indicates active during HALT. The default is 1. WDTMR During STOP (D3). This bit determines whether or not the WDT is active during STOP mode. Because XTAL clock is stopped during STOP mode, the on-board RC must be selected as the clock source to the POR counter. A 1 indicates active during STOP. The default is 1. Note: If permanent WDT is selected, the WDT runs in all modes and can not be stopped or disabled if the on board RC oscillator is selected as the clock source for WDT. Clock Source for WDT (D4). This bit determines which oscillator source is used to clock the internal POR and WDT counter chain. If the bit is a 1, the internal RC oscillator is bypassed and the POR and WDT clock source is driven from the external pin, XTAL1. The default configuration of this bit is 0 which selects the internal RC oscillator. 42 WDTMR Register Accessibility. The WDTMR register is accessible only during the first 60 internal system clock cycles from the execution of the first instruction after PowerOn Reset, Watch-Dog Reset, or Stop-Mode Recovery. After this point, the register cannot be modified by any means, intentional or otherwise. The WDTMR cannot be read and is located in bank F of the Expanded Register Group at address location 0FH (Figure 30). Note: The WDT can be permanently enabled (automatically enabled after RESET) through a mask programming option. The option is selected by the customer at the time of ROM code submission. In this mode, WDT is always activated when the device comes out of RESET. Execution of the WDT instruction serves to refresh the WDT time-out period. WDT operation in the HALT and STOP Modes is controlled by WDTMR programming. If this mask option is not selected at the time of ROM code submission, the WDT must be activated by the user through the WDT instruction and is always disabled by any reset to the device. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Reset 4 Clock Filter Clear CLK 18 Clock RESET Generator RESET Internal RESET WDT Select (WDTMR) WDT TAP SELECT CLK Source Select (WDTMR) XTAL Internal RC OSC. VDD + VLV – 5ms POR CK CLR M U X 5ms 15ms 25ms 100ms WDT/POR Counter Chain 2V Operating Voltage Det. WDT From Stop Mode Recovery Source Stop Delay Select (SMR) Figure 30. Resets and WDT Low Voltage Protection. An onboard Voltage Comparator checks that VCC is at the required level to ensure correct operation of the device. RESET is globally driven if VCC is below the specified voltage (Low Voltage Protection). The minimum operating voltage is varying with the temperature and operating frequency, while the Low Voltage Protection (VLV) varies with temperature only. The Low Voltage Protection trip voltage (VLV) is less than 3V and more than 1.4V under the following conditions. Table 16. Maximum (VLV) Conditions: Case 1: TA = –40ºC, +105ºC, Internal Clock Case 2: Frequency equal or less than 4 MHz TA = –40ºC, +85ºC, Internal Clock Note: The internal clock frequency relationship to the XTAL clock is dependent on SMR BIT 0 1 setting. The device functions normally at or above 3.0V under all conditions. Below 3.0V, the device functions normally until the Low Voltage Protection trip point (VLV) is reached, for the temperatures and operating frequencies in Case 1 and Case 2, above. The device is guaranteed to function normally at supply voltages above the Low Voltage Protection trip point. The actual Low Voltage Protection trip point is a function of temperature and process parameters (Figure 36). Frequency equal or less than 6 MHz DS007601-Z8X0499 PRELIMINARY 43 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ASYNCHRONOUS SERIAL COMMUNICATIONS INTERFACE (ASCI) Key features of the ASCI include: Programmable data format ceive Data Register Full Flag also goes active during this time. If there is no space in the FIFO at the time that the RSR attempts to transfer the received data into it, an overrun error occurs. 7 or 8 data bits with optional ninth bit for multiprocessor communication Receive Data FIFO. When a complete incoming data byte is assembled in the RSR, it is automatically transferred to • • • Full-duplex operation • P30 and P37 can be used as general-purpose I/O as long as the ASCI channels are disabled • • • • • • One or two STOP bits Odd, even or no parity Programmable interrupt conditions Four level data/status FIFOs for the receiver Receive parity, framing and overrun error detection Break detection and generation Transmit Data Register. Data written to the ASCI Transmit Data Register (TDR) is transferred to the Transmit Shift Register(TSR) as soon as the TSR is empty. Data can be written while the TSR is shifting out the previous byte of data, providing double buffering for the transmit data. The TDR is READ- and WRITE-accessible. Reading from the TDR does not affect the ASCI data transmit operation currently in progress. Transmit Shift Register. When the ASCI Transmit Shift Register (TSR) receives data from the ASCI Transmit Data Register, the data is shifted out to the TX (P37) pin. When transmission is completed, the next byte (if available) is automatically loaded from the TDR into the TSR and the next transmission starts. If no data is available for transmission, the TSR idles at a continuous High level. This register is not program-accessible. Receive Shift Register. When the RE bit is set in the CNTLA register, the RX (P30) pin is monitored for a Low. One-half bit-time after a Low is sensed at RX, the ASCI samples RX again. If RX goes back to High, the ASCI ignores the previous Low and resumes looking for a new Low, but if RX is still Low, it considers RX a START bit and proceeds to clock in the data based upon the selected baud rate. The number of data bits, parity, multiprocessor and STOP bits are selected by the MOD2, MOD1, MOD0 and multiprocessor mode ( MP) bits in the CNTLA and CNTLB registers. After the data is received, the appropriate MP, parity and one STOP bit are checked. Data and any errors are clocked into the receive data and status FIFO during the STOP bit if there is an empty position available. Interrupts and Re44 the 4-byte FIFO, which serves to reduce the incidence of overrun errors. The top (oldest) character in the FIFO (if any) can be read via the Receive Data Register (RDR). The next incoming data byte can be shifted into the RSR while the FIFO is full, thus providing an additional level of buffering. However, an overrun occurs if the receive FIFO is still full when the receiver completes assembly of that character and is ready to transfer it to the FIFO. If this situation occurs, the overrun error bit associated with the previous byte in the FIFO is set. The latest data byte is not transferred from the shift register to the FIFO in this case, and is lost. When an overrun occurs, the receiver does not place any further data in the FIFO until the most recent good byte received arrives at the top of the FIFO and sets the Overrun latch, and software then clears the Overrun latch by a WRITE of 0 to the EFR bit. Assembly of bytes continues in the shift register, but this data is ignored until the byte with the overrun error reaches the top of the FIFO and the status is cleared. When a break occurs (defined as a framing error with the data equal to all zeros), the all-zero byte with its associated error bits are transferred to the FIFO if it is not full and the Break Detect bit in the ASEXT register is set. If the FIFO is full, an overrun is generated, but the break, framing error and data are not transferred to the FIFO. Any time a break is detected, the receiver does not receive any more data until the RX pin returns to a high state. If the channel is set in multiprocessor mode and the MPE bit of the CNTLA register is set to 1,then break, errors and data are ignored unless the MP bit in the received character is a 1. The two conditions listed above could cause the missing of a break condition if the FIFO is full and the break occurs or if the MP bit in the transmission is not a one with the conditions specified above. ASCI Status FIFO/Registers. This FIFO contains Parity Error, Framing Error, RX Overrun, and Break status bits as- sociated with each character in the receive data FIFO. The status of the oldest character (if any) can be read from the ASCI status register, which also provides several other, non-FIFOed status conditions. The outputs of the error FIFO go to the set inputs of software-accessible error latches in the status register. Writing PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG a 0 to the EFR bit in CNTLA is the only way to clear these latches. In other words, when an error bit reaches the top of the FIFO, it sets an error latch. If the FIFO contains more data and the software reads the next byte out of the FIFO, the error latch remains set until the software writes a 0 to the EFR bit. The error bits are cumulative, so if additional errors are in the FIFO they set any unset error latches as they reach the top. Baud Rate Generator. The baud rate generator features two modes. The first provides a dual set of fixed clock divide ratios as defined in CNTLB. In the second mode, the BRG is configured as a sixteen-bit down counter that divides the processor clock by the value in a software accessible, sixteen-bit, time-constant register. As a result, virtually any frequency can be created by appropriately selecting the main processor clock frequency. The BRG can also be disabled in favor of the SCLK. The Receiver and Transmitter subsequently divide the output of the Baud rate Generator (or the signal from the CLK pin) by 1, 16 or 64 under the control of the DR bit in the CNTLB register and the X1 bit in the ASCI Extension Control Register (ASEXT). RESET. During RESET, the ASCI is forced to the following conditions: • • • • FIFO Empty All Error Bits Cleared (including those in the FIFO) Receive Enable Cleared (CNTLA BIT 6 = 0) Transmit Enable Cleared (CNTLA BIT 5 = 0) Internal Address/Data Bus ASCI Transmit Data Register TDR (Bank:Ah,Addr :01h) ** (P37) TX IRQ3 Interrupt Request ASCI Transmit Shift Register TSR ASCI Receive Data FIFO RDR (Bank:Ah,Addr:02h) ** (P30) RX ASCI Receive Shift Register RSR ASCI ASCI Control Register A CNTLA (Bank:Ah,Addr:03h) Accessible Control ASCI Control Register B CNTLB (Bank:Ah,Addr:04h) ASCI Status FIFO/Register STAT (Bank:Ah,Addr:08h) ASCI Extension Control Reg. ASEXT (Bank:Ah,Addr:05h) ASCI Time Constant High ASTCH (Bank:Ah,Addr:07h) ASCI Time Constant Low ASTCL (Bank:Ah,Add:06h)r SCLK Baud Rate Generator Note: **Not Program Figure 31. ASCI Interface Diagram DS007601-Z8X0499 PRELIMINARY 45 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG INTERRUPTS The ASCI channel generates one interrupt (IRQ3) from two sources of interrupts: a receiver and a transmitter. In addition, there are several conditions that may cause these in- terrupts to trigger. Figure 32 illustrates the different conditions for each interrupt source enabled under program control. FIFO full Overrun error Framing Error Receiver Interrupt Sources Parity Error ASCI Interrupt (IRQ3) Start Bit Buffer Empty Transmitter Interrupt Sources Figure 32. ASCI Interrupt Conditions and Sources 46 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG EXPANDED REGISTER GROUP (A) %(A)0F RESERVED %(A)0E RESERVED %(A)0D RESERVED %(A)0C RESERVED %(A)0B RESERVED %(A)0A RESERVED %(A)09 GEN PURPOSE B7 B6 B5 B4 B3 B2 B1 B0 u u u u u u u u * %(A)08 STAT 0 0 0 0 0 0 1 0 * %(A)07 ASTCH 1 1 1 1 1 1 1 1 * %(A)06 ASTCL 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 * %(A)05 ASEXT %(A)04 CNTLB 0 0 0 0 0 1 1 1 * %(A)03 CNTLA 0 0 0 1 0 0 0 0 * %(A)02 RDR u u u u u u u u * %(A)01 TDR u u u u u u u u %(A)00 RESERVED * * Not reset with a STOP-Mode Recovery. Figure 33. Expanded Register Group (A) Registers DS007601-Z8X0499 PRELIMINARY 47 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ASCI TRANSMIT DATA REGISTER (TDR) (%(A)01H: READ/WRITE) Table 17. TDR Register Bit Functions Bit 7 6 5 4 3 2 1 0 U U U R Transmit Data W Reset U U U U U written to the TDR while the TSR is shifting out the previous byte. Data can be written into and read out of the TDR. When the TDR is read, the data transmit operation is not affected. Data written to the ASCI Transmit Data Register (TDR) is transferred to the Transmit Shift Register (TSR) as soon as the TSR is empty. The TSR is not not software-accessible. The ASCI transmitter is double-buffered so data can be ASCI RECEIVE DATA REGISTER (RDR) (%(A)02H: READ/WRITE) Table 18. RDR Register Bit Functions Bit 7 6 5 4 3 2 1 0 U U U R Receive Data W Reset U U U U When a complete incoming data byte is assembled in the Receive Shift Register (RSR), it is automatically transferred to the highest available location in the Receive Data FIFO. The Receive Data Register (RDR) is the highest location in the Receive Data FIFO. The RDRF bit in the STAT register U is set when one or more bytes is available from the FIFO. The FIFO status for the character in the RDR is available in the STAT register via bits 6, 5 and 4. STAT should be read before reading the RDR. The data in both FIFO locations is popped when the character is read from the RDR. ASCI CONTROL REGISTER A (CNTLA) (%(A)03H: READ/WRITE) Table 19. CNTLA Register Bit Functions Bit 7 6 5 4 Multiprocessor Enable (MPE) Receiver Enable (RE) Transmitter Enable (TE) Reserved 1 0 0 0 0 1 Mode Select Error Flag Receive (EFR) W 48 2 Multiprocessor MOD2 MOD1 MOD0 Bit Received (MPBR) R Reset 3 PRELIMINARY 0 0 0 0 DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Bit 7 is the Multiprocessor Enable Bit 4 is Reserved The ASCI features a multiprocessor communication mode that utilizes an extra data bit for selective communication when a number of processors share a common serial bus. Multiprocessor data format is selected when the MP bit in the corresponding register is set to 1. If multiprocessor mode is not selected (MP bit in CNTLB = 0), multiprocessor enable (MPE) has no effect. If multiprocessor mode is selected (MP bit in CNTLB = 1), MPE enables or disables the wake-up feature as follows. If MPE is set to 1, only received bytes in which the multiprocessor bit (MPB) = 1 are treated as valid data characters and loaded into the receiver FIFO with corresponding error flags in the status FIFO. Bytes with MPB = 0 are ignored by the ASCI. If MPE is reset to 0, all bytes are received by the ASCI, regardless of the state of the MPB data bit. Bit 3 is the Multiprocessor Bit Receive (Read only) When multiprocessor mode is enabled (MP in CNTLB = 1), this bit, when read, contains the value of the MPB bit for the data byte currently available at the Receive Data Register (the top of the receiver FIFO). Bit 3 is the Error Flag Reset (WRITE ONLY) When written to 0, the error flags (OVRN, FE; PE in STAT and BRK in ASEXT) are cleared to 0. This command selfresets, and as a result, writing EFR to a 1 is not required. Bits 2–0 are the ASCI Data Format Mode 2,1,0 These bits program the ASCI data format. Bit 6 is the Receiver Enable Table 20. Format Mode Control Bits When Receiver Enable(RE) is set to 1,the ASCI receiver is enabled. When RE is reset to 0, the receiver is disabled and any receive operation in progress is aborted. However, the previous contents of the receiver data and status FIFO are not affected. Bit Name Function Bit = 0 Bit = 1 2 1 MOD2 Number of Data Bits MOD1 Parity Enabled Bit 5 is the Transmitter Enable 0 MOD0 Number of Stop Bits 7 No Parity 1 8 With Parity 2 When Transmitter Enable(TE) is set to 1,the ASCI transmitter is enabled. When TE is reset to 0, the transmitter is disabled and any transmit operation in progress is aborted. However, the previous contents of the transmitter data register and the TDRE flag are not affected. If MOD1 = 1, parity is checked on received data and a parity bit is appended to the data bits in the transmitted data. Parity Even/Odd (PEO) in CNTLB selects even or odd parity. The ASCI serial data format is illustrated in Figure 34. 7 or 8 bits Data Field 1 or 2 Stop Bit(s) Start Bit it Parity Bit Figure 34. ASCI Serial Data Format DS007601-Z8X0499 PRELIMINARY 49 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ASCI CONTROL REGISTER B (CNTLB) (%(A)04H: READ/WRITE) Table 21. CNTLB Register Bit Functions Bit 7 6 R Multiprocessor Bit Transmitter (MPBT) Multiprocessor Mode (MP) 0 0 W Reset 5 Prescale (PR) 0 BIT 7 is the Multiprocessor Bit Transmit When multiprocessor format is selected (MP BIT = 1), Multiprocessor Bit Transmit (MPBT) is used to specify the MPB data bit for transmission. If MPBT = 1, then a 1 is transmitted in the MPB bit position. If MPBT = 0, a 0 is transmitted. BIT 6 is the Multiprocessor Mode 4 3 2 SS2 Parity Even/Odd (PEO) Divide Ratio (DR) 0 0 1 SS1 0 SS0 Clock Source and Speed 1 1 1 position whose value is specified in MPBT immediately after the specified number of data bits and preceding the specified number of STOP bits. Note: The multiprocessor format does not provide parity. The serial data format while in MP mode is illustrated in Figure 35. When Multiprocessor Mode (MP) is set to 1, the serial data format is configured for multiprocessor mode, adding a bit 7 or 8 bits Data Field Start Bit MPB 1 or 2 Stop Bit(s) Figure 35. MP Mode Serial Data Format If MP = 0, the data format is based on MOD2–0 in CNTLA and may include parity. Bit 5 is the BRG Prescaler The Prescale bit specifies the baud rate generator prescale factor when using the SS2–0 bits to define the ASCI baud rate (BRG MODE = 0). Writing a 0 to this bit sets the BRG Prescaler to divide by 10. Setting this bit to a 1 sets the BRG Prescaler to divide by 30. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate. 50 Bit 4 is the Parity Even/Odd Parity Even/Odd (PEO) controls the parity bit transmitted on the serial output and the parity check on the serial input. If PEO is cleared to 0, even parity is transmitted and checked If PEO is set to 1, odd parity is transmitted and checked. Bit 3 is the Divide Ratio The Divide Ratio bit specifies the divider used to obtain the baud rate from the data sampling clock when using the SS2–0 bits to define the ASCI baud rate (BRG MODE = 0). If DR is 0, then DIVIDE-BY-16 is used. If DR is set to a 1, then DIVIDE-BY-64 is used. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG DR Sampling Clock 0 1 Divide by 16 Divide by 64 Table 22. Clock Source and Speed Bits Bit 2,1 are the Clock Source and Speed Select When the BRG mode bit in the ASEXT register is set to 0, these 3 bits, along with DR and PR in this register define the ASCI baud rate. Bits 2, 1 and 0 specify a power-of-two divider of the SCLK as defined in Table 22. These bits should never be set to all 1s or erratic results may occur. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate. DS007601-Z8X0499 SS2 SS1 SS0 Divider (DIV) 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 ÷1 ÷2 ÷4 ÷8 ÷16 ÷32 ÷64 Reserved PRELIMINARY 51 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ASCI EXTENSION CONTROL REGISTER (ASEXT) (%(A)05H: READ/WRITE) Table 23. ASEXT Register Bit Functions Bit 7 R RX State (RX) 6 Reserved W Reset P30 5 4 3 2 RX Reserved BRG Mode Interrupt on Reserved (must be 0) (BRGM) Start Bit (RIS) 0 0 0 BIT 7 is the RX State (READ ONLY) 0 0 1 Break Detect (BD) 0 Send Break (SB) 0 0 Bit 5 is Reserved on RX. Such a receive interrupt is always followed by the setting of RDRF in the middle of the STOP bit. This interrupt request must be cleared by writing this bit back to a 0. Writing a 1 to this bit has no effect. One function of this feature is to wake the part from Sleep mode when a character arrives, so that the ASCI receives clocking with which to process the character. Another function is to ensure that the associated interrupt service routine is activated in time to sense the setting of RDRF in the status register, and to start a timer for baud rate measurement at that time. When read, this bit reflects the default value 0. When WRITE, this bit is ignored. Bit 1 is the Break Detect (READ ONLY) Provides the real time state of RX, the channel’s receive data input pin—P30. BIT 6 is Reserved When read, this bit reflects the default value 0. When WRITE, this bit is ignored. Bit 4 is the X1 Bit Clock Reserved—must be set to 0 or erratic results may occur. Bit 3 is the BRG Mode When this bit is set to a 1, the ASCI’s baud rate is set by the 16-bit programmable divider programmed in ASCI Time Constant High (ASTH) and ASCI Time Constant Low (ASTL). If this bit is set to a 0, the baud rate is defined by the PR bit, the DR bit, and the SS2–0 bits in the CNTLB register. In either case, the source for the baud rate generator is the SCLK. See the Baud Rate Generation Summary for more information on setting the ASCI baud rate. Bit 2 is the Rx Interrupt on Start If software sets this bit to 1,a receive interrupt is requested (in a combinatorial fashion) when a START bit is detected 52 This status bit is set to a 1 when a Break is detected, defined as a framing error with the data bits all equal to 0. The allzero byte with its associated error bits are transferred to the FIFO if it is not full. If the FIFO is full, an overrun is generated, but the break, framing error and data are not transferred to the FIFO. Any time a break is detected, the receiver do not receive any more data until the RX pin returns to a High state. When set, this bit remains set until it is cleared by writing a 0 to the EFR bit in the CNTLA register. Bit 0 is the Send Break Setting this bit to a 1 forces the channel’s transmitter data output pin, TX, to a Low for as long as it remains set. Before starting the break, any character(s) in the TSR and in the TDR are completely transmitted. If a character is loaded into the TDR while a break is being generated, that character is held until the break is terminated and transmitted. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ASCI TIME CONSTANT REGISTER (ASTL) (%(A)06H: READ/WRITE) Table 24. ASTL Register Bit Functions Bit 7 6 5 4 3 2 1 0 1 1 1 2 1 0 1 1 1 R ASCI Time Constant Low W Reset 1 1 1 1 1 ASCI TIME CONSTANT REGISTER (ASTH) (%(A)07H: READ/WRITE) Table 25. ASTH Register Bit Functions Bit 7 6 5 4 3 R ASCI Time Constant High W Reset 1 1 1 1 1 The ASTL and ASTH registers are only used when the BRG mode bit in the ASEXT register is set to a 1. These two 8bit registers form a 16-bit counter with a flip-flop logic circuit (DIVIDE-BY-2) on the output so that the final BRG output is symmetrical. The values written to these registers determine the time constant from which the baud rate is generated. DS007601-Z8X0499 PRELIMINARY 53 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ASCI STATUS REGISTER (STAT) (%(A)08H: READ/WRITE) Table 26. ASCI Status Register (STAT) Bit R 7 Receive Data Register Full (RDRF) 6 5 4 3 Overrun Error (OE) Parity Error (PE) Framing Error (FE) 2 Receiver Interrupt Enable (RIE) Reserved 0 0 1 Transmit Data Register Empty TDRE) 0 Transmitter Interrupt Enable (TIE) W Reset 0 0 0 0 0 0 BIT 7 is the Receive Data Register Full Bit 5 is the Parity Error RDRF is set to 1 when the receiver transfers a character from the RSR into an empty Rx FIFO. A parity error is detected when parity generation and checking is enabled by the MOD1 bit in the CNTLA register and a character has been assembled in which the parity does not match that specified by the PEO bit in CNTLB. Note: If a framing or parity error occurs, RDRF is still set and the receive data (which generated the error) is still loaded into the FIFO. When there is more than one character in the FIFO, and software reads a character, RDRF either remains set or is cleared and immediately set again. RDRF is cleared to 0 when the FIFO becomes empty after reading the RDR and during Power-On Reset. Note: PE is FIFOed and the error bit is not actually set until the associated data becomes available for reading in the RDR. When set, the bit remains set until it is cleared by writing a 0 to the EFT bit in the CNTLA register. The bit is cleared at Power-On Reset. Bit 6 is the Overrun Error Bit 4 is the Framing Error An overrun occurs if the receive FIFO is still full when the receiver completes assembly of a character and is ready to transfer it to the FIFO. If this situation occurs, the overrun error bit associated with the previous byte in the FIFO is set. In this case, the latest data byte is not transferred from the shift register to the FIFO and is lost. A framing error is detected when the STOP bit of a character is sampled as a 0 (space). Like PE, FE is FIFOed and the error bit is not actually set until the associated data becomes available for reading in the RDR. When set, the bit remains set until it is cleared by writing a 0 to the EFR bit in the CNTLA register. The bit is cleared at Power-On Reset. When an overrun occurs, the receiver does not place any further data in the FIFO until the most recent good byte received (the byte with the associated overrun error bit set) moves to the top of the FIFO and sets the Overrun latch, and software then clears the Overrun latch. Assembly of bytes continues in the shift register, but this data is ignored until the byte with the overrun error reaches the top of the FIFO and the status is cleared. When set, the bit remains set until it is cleared by writing a 0 to the EFR bit in the CNTLA register. The bit is also cleared during Power-On Reset. Bit 3 is the Receiver Interrupt Enable 54 RIE should be set to a 1 to enable ASCI receive interrupt requests. An interrupt (IRQ3) is generated when RDRF (bit 7 of the STAT register) is a 1. A receive interrupt is also generated if this bit is set to a 1, bit 2 of the ASEXT register (RX interrupt on the START bit) is set to a 1, and a START bit is detected by the receiver. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Bit 2 is Reserved Baud Rate = When read, this bit reflects the default value 0. When WRITE, this bit is ignored. SCLK (10 + 20 x PS) x DIV x Divide Ratio Bit 1 is the Transmit Data Register Empty Where: TDRE = 1 indicates that the Transmit Data Register (TDR) 1. SCLK is the system clock. is empty and that the next data byte to be transmitted can be written into the TDR. TDRE is cleared to 0 after the byte is written to TDR, until the ASCI transfers the byte from the TDR to the Transmit Shift Register (TSR), and then TDRE is again set to 1. TDRE is set to 1 at Power-On Reset. Bit 0 is the Transmit Interrupt Enable TIE should be set to a 1 to enable ASCI transmit interrupt requests. An interrupt (IRQ3) is generated when TDRE (bit 1 of the STAT register) is a 1. TIE is cleared to 0 at Power- 2. PS = 1 or 0 and is bit 5 of CNTLB. 3. DIV = 1, 2, 4, 8, 16, 32 or 64 as reflected by SS2–0 in CNTLB. 4. DIVIDE RATIO = 16 or 64, as defined by DR in CNTLB. If BRG mode = 1: Baud Rate = On Reset. An anomaly exists that requires setting of the RIE bit to allow the generation of transmit interrupts. If RIE is not set, transmit interrupts are not generated, even if TIE is set. See Precautions. SCLK (2 x (TC + 2) x Divide Ratio or TC = SCLK 2 x Baud Rate x Divide Ratio –2 Baud Rate Generation Summary The application can select between one of two baud rate generators for the ASCI. If the BRG Mode bit in the ASEXT register is set to a 0, the SS2,1,0 bits, the DR, bit and the PR bit in CNTLB are used to select the baud rate. If the BRG Mode bit is set to a 1, the ASTL and ASTH registers are used to select the baud rate. The following formulas are used to calculate the baud rate from the two baud rate generators: Where: 1. SCLK is the system clock. 2. TC is the 16-bit value programmed into ASTL and ASTH. 3. DIVIDE RATIO = 16 or 64, as defined by DR in CNTLB. 4. Baud Rate is the desired baud rate. If BRG mode = 0: DS007601-Z8X0499 PRELIMINARY 55 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ASCI STATUS REGISTER (STAT) (Continued) Table 27. Baud Rate List (BRG Mode = 0) Prescaler PS 0 1 56 Divide Ratio Sampling Rate DR Rate 0 16 1 64 SCLK ÷ 10 0 16 1 64 SCLK ÷ 30 Baud Rate Example Baud Rate (bps) SS2 SS1 SS0 Divide Ratio 0 0 0 0 1 1 1 0 0 0 0 1 1 1 0 0 0 0 1 1 1 0 0 0 0 1 1 1 0 0 1 1 0 0 1 0 0 1 1 0 0 1 0 0 1 1 0 0 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 0 1 0 1 0 1 0 0 1 0 1 0 1 0 0 1 0 1 0 1 0 ÷1 ÷2 ÷4 ÷8 ÷16 ÷32 ÷64 ÷1 ÷2 ÷4 ÷8 ÷16 ÷32 ÷64 ÷1 ÷2 ÷4 ÷8 ÷16 ÷32 ÷64 ÷1 ÷2 ÷4 ÷8 ÷16 ÷32 ÷64 PRELIMINARY General Divide Ratio SCLK ÷ 160 SCLK ÷ 320 SCLK ÷ 640 SCLK ÷ 1280 SCLK ÷ 2560 SCLK ÷ 5120 SCLK ÷ 10240 SCLK ÷ 640 SCLK ÷ 1280 SCLK ÷ 2560 SCLK ÷ 5120 SCLK ÷ 10240 SCLK ÷ 20480 SCLK ÷ 40960 SCLK ÷ 480 SCLK ÷ 960 SCLK ÷ 1920 SCLK ÷ 3840 SCLK ÷ 7680 SCLK ÷ 15360 SCLK ÷ 30720 SCLK ÷ 1920 SCLK ÷ 3840 SCLK ÷ 7680 SCLK ÷ 15360 SCLK ÷ 30720 SCLK ÷ 61440 SCLK ÷ 122880 SCLK = SCLK = SCLK = 6.144 4.608 3.072 MHz MHz MHz 38400 19200 9600 4800 2400 1200 600 9600 4800 2400 1200 600 300 150 19200 9600 4800 2400 1200 600 300 4800 2400 1200 600 300 150 75 4800 2400 1200 600 300 150 75 2400 1200 600 300 150 75 37.5 DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG LOW VOLTAGE PROTECTION VCC (Volts) 3.80 3.60 3.40 A RUN/HALT Mode VLV (Typical) B STOP Mode 3.20 B 3.00 A 2.80 2.60 2.40 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (ºC) Figure 36. Typical Low Voltage Protection vs. Temperature DS007601-Z8X0499 PRELIMINARY 57 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG MASK OPTIONS Below is an example of the ROM mask bit option selection for this product. Options ROM Protect RAM Protect System Clock Source Oscillator Operational Mode Option Selections WDT Mode Disable ROM Protect Disable RAM Protect RC Oscillator Enable Normal High-Frequency Operation Enabled WDT Enabled by Software Only Auto Latch Mode Port 0 Pull-Ups Port 1 Pull-Ups Port 2 Pull-Ups Disable Auto Latches Disable Pull-Ups Disable Pull-Ups Disable Pull-Ups ROM Protect. Selecting the DISABLE ROM PROTECT option READs the software program that is in the program memory using ZiLOG’s internal factory test mode. However, none of the standard methods for reading or verifying the code in the microcontroller uses an EPROM programmer. With this option disabled, ZiLOG is able to fully test the ROM memory and provides its standard warranty for the part. Selecting the ENABLE ROM PROTECT option negates the possibility of reading the code out of the part using a tester, programmer, or any other standard method. ZiLOG will be unable to test the ROM memory at any time prior to customer delivery. The ROM PROTECT option bit only affects the ability to read the code and does not affect the operation of the part in an application. If the ROM PROTECT option is disabled, ZiLOG tests the part for ROM fallout and parts which fail are not shipped to the customer. When the ROM PROTECT option is enabled, ZiLOG cannot perform these tests on the ROM. When ROM PROTECT is enabled, except for the improper transfer of the code by ZiLOG, all ROM memory software errors shall be the responsibility of the Buyer and ZiLOG shall have no obligation to repair or replace product containing software errors. Selecting the ENABLE ROM PROTECT option waives all warranties of ZiLOG, expressed or implied, on microcontrollers containing ROM failures including, but not limited to, the implied warranty of merchantability and fitness for a particular purpose. RAM Protect. Selecting the DISABLE RAM PROTECT option does not affect the RAM memory. RAM memory operates as defined in this Product Specification for all address locations. Selecting the ENABLE RAM PROTECT option, 58 Enable ROM Protect Enable RAM Protect Crystal/Other Clock Source 32-kHz Crystal Operation Enabled (Limits High-Frequency Operation) WDT Enabled Automatically After RESET Enable Auto Latches Enable Pull-Ups Enable Pull-Ups Enable Pull-Ups allows protection (under software control) of a portion of the RAM’s address space from being read or written. System Clock Source. Selecting the RC OSCILLATOR ENABLE option, configures the oscillator circuit on the mi- crocontroller to work with an external RC circuit. Selecting the CRYSTAL/OTHER CLOCK SOURCE option configures the oscillator circuit to work with an external crystal, ceramic resonator, or LC oscillator. Oscillator Operational Mode. Selecting the NORMAL HIGH FREQUENCY OPERATION ENABLED option en- ables the part to operate using a standard crystal or resonator, but it does not operate using a 32-kHz crystal. Selecting the 32-KHZ OPERATION ENABLED option enables the microcontroller to work with a 32-kHz crystal and an external feedback resistor—these must be supplied between the XTAL1 and XTAL2 pins. (If RC OSCILLATOR ENABLED is selected in the SYSTEM CLOCK SOURCE option, this option defaults to the NORMAL HIGH FREQUENCY OPERATION ENABLED bit.) WDT Mode. Selecting the WDT ENABLED BY SOFTWARE ONLY option operates the Watch Dog Timer (WDT) when turned on under software control. Selecting the WDT ENABLED AUTOMATICALLY AFTER RESET option starts the WDT automatically at RESET.There is no way to dis- able or stop this mode, making it necessary in the code to periodically clear the WDT to prevent it from resetting the microcontroller. If the WDT ENABLED AUTOMATICALLY AFTER RESET option and the WDT DRIVEN BY SYSTEM CLOCK option (if offered) are selected, the WDT nev- PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG er operates in STOP mode, and cannot be enabled, by any means, to operate in STOP mode. Port 0 pins. This option bit does not affect any of the other port pins on the part. Auto Latch Mode. Selecting the DISABLE AUTOLATCHES option disables the autolatches on the Port pins. These Port 1 Pull-Ups. Selecting DISABLE PULL-UPS disables the input pull-up circuitry on all Port 1 pins. Selecting ENABLE PULL-UPS enables the input pull-up circuitry on all Port 1 pins. This option bit does not affect any of the other port pins on the part. pins will float rather than be pulled to a valid CMOS level when they are inputs and not connected to an external signal. Selecting the ENABLE AUTOLATCHES option enables the autolatches on the Port pins and pulls the pins to a valid CMOS level when they are not connected to an external signal. Port 0 Pull-Ups. Selecting DISABLE PULL-UPS disables the input pull-up circuitry on all Port 0 pins. Selecting ENABLE PULL-UPS enables the input pull-up circuitry on all DS007601-Z8X0499 Port 2 Pull-Ups. Selecting DISABLE PULL-UPS disables the input pull-up circuitry on all Port 2 pins. Selecting ENABLE PULL-UPS enables the input pull-up circuitry on all Port 2 pins. This option bit does not affect any of the other port pins on the part. PRELIMINARY 59 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG EXPANDED REGISTER FILE CONTROL REGISTERS WDTMR (F) 0F SMR (FH) 0B D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK/TCLK Divide-by-16 0 OFF * * 1 ON WDT TAP 00 01 * 10 11 External Clock Divide by 2 0 SCLK/TCLK =XTAL/2* 1 SCLK/TCLK =XTAL WDT During HALT 0 OFF 1 ON * STOP-Mode Recovery Source 000 POR Only and/or External Reset* 001 P30 010 P31 011 P32 100 P33 101 P27 110 P2 NOR 0-3 111 P2 NOR 0-7 Stop Delay 0 OFF 1 ON* Stop Recovery Level 0 Low* 1 High INT RC OSC System Clock 3.5 ms 128 SCLK 10 ms 256 SCLK 14 ms 512 SCLK 56 ms 2048 SCLK WDT During STOP 0 OFF 1 ON * XTAL1/INT RC Select for WDT 0 On-Board RC * 1 XTAL Reserved (Must be 0) * Default setting after RESET Figure 39. Watch-Dog Timer Mode Register (WRITE ONLY) Stop Flag (Read only) 0 POR* 1 Stop Recovery Note: Not used in conjunction with SMR2 Source * Default setting after RESET. * * Default setting after RESET and STOP-Mode Recovery. Figure 37. Stop-Mode Recovery Register (WRITE ONLY, except Bit D7, which is READ ONLY) SMR2 (0F) DH D7 D6 D5 D4 D3 D2 D1 D0 Stop-Mode Recovery Source 2 00 POR only* 01 AND P20,P21,P22,P23 10 AND P20,P21,P22,P23,P24, P25,P26,P27 Reserved (Must be 0) Note: Not used in conjunction with SMR Source Figure 38. Stop-Mode Recovery Register2 60 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Z8 CONTROL REGISTERS R242 T1 PCON (FH) 00H D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Comparator Output Port 3 0 P34, P37 Standard Output* 1 P34, P37 Comparator Output T1 Initial Value (When Written) (Range: 1-256 Decimal 01-00 HEX) T1 Current Value (When Read) 0 Port 1 Open Drain 1 Port 1 Push-pull Active*† 0 Port 0 Open Drain 1 Port 0 Push-pull Active* 0 Port 0 Low EMI 1 Port 0 Standard*† Figure 42. Counter/Timer 1 Register (F2H: READ/WRITE) 0 Port 1 Low EMI 1 Port 1 Standard* 0 Port 2 Low EMI 1 Port 2 Standard* 0 Port 3 Low EMI 1 Port 3 Standard* *Default Setting After Reset † Must be set to one for devices in 28-pin packages R243 PRE1 D7 D6 D5 D4 D3 D2 D1 D0 Low EMI Oscillator 0 Low EMI 1 Standard* Count Mode 0 T1 Single Pass 1 T1 Modulo N Figure 40. Port Configuration Register (PCON) (WRITE ONLY) Clock Source 1 T1Internal 0 T1External Timing Input (TIN) Mode Prescaler Modulo (Range: 1-64 Decimal 01-00 HEX) R241 TMR Figure 43. Prescaler 1 Register (F3H: WRITE ONLY) D7 D6 D5 D4 D3 D2 D1 D0 0 No Function 1 Load T0 0 Disable T0 Count 1 Enable T0 Count 0 No Function 1 Load T1 R244 T0 D7 D6 D5 D4 D3 D2 D1 D0 0 Disable T1 Count 1 Enable T1 Count TIN Modes 00 External Clock Input 01 Gate Input 10 Trigger Input (Non-retriggerable) 11 Trigger Input (Retriggerable) TOUT Modes 00 Not Used 01 T0 Out 10 T1 Out 11 Internal Clock Out T0 Initial Value (When Written) (Range: 1-256 Decimal 01-00 HEX) T0 Current Value (When Read) Figure 44. Counter/Timer 0 Register (F4H: READ/WRITE) Figure 41. Timer Mode Register (F1H: READ/WRITE) DS007601-Z8X0499 PRELIMINARY 61 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Z8 CONTROL REGISTERS (Continued) R245 PRE0 R248 P01M D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 P00–P03 Mode 00 Output 01 Input 1X A11–A8 Count Mode 0 T0 Single Pass 1 T0 Modulo N Stack Selection 0 External 1 Internal† Reserved (Must be 0) Prescaler Modulo (Range: 1-64 Decimal 01-00 HEX) P10 - P17 Mode 00 Byte Output† 01 Byte Input 10 AD7 - AD0 11 High-Impedance AD7–AD0, AS, DS, R/W, A11–A8, A15–A12, If Selected Figure 45. Prescaler 0 Register (F5H: WRITE ONLY) External Memory Timing 0 Normal 1 Extended R246 P2M † For 28 pin device, the user must set: D2=1 D3=0 D4=0 D7 D6 D5 D4 D3 D2 D1 D0 P20 - P27 I/O Definition 0 Defines Bit as Output 1 Defines Bit as Input P04–P07 Mode 00 Output 01 Input 1X A15–A12 Figure 48. Port 0 and 1 Mode Register (F8H: WRITE ONLY) Figure 46. Port 2 Mode Register (F6H: WRITE ONLY) R249 IPR D7 D6 D5 D4 D3 D2 D1 D0 R247 P3M D7 D6 D5 D4 D3 D2 D1 D0 0 Port 2 Pull-Ups Open Drain 1 Port 2 Push-Pull Active 0 P31, P32 Digital Mode 1 P31, P32 Analog Mode 0 P32 = Input P35 = Output 1 P32 = DAV0/RDY0 P35 = RDY0/DAV0 00 P33 = Input P34 = Output 01 P33 = Input 10 P34 = DM 11 P33 = DAV0/RDY0 P34 = RDY1/DAV1 0 P31 P36 1 P31 P36 0 P30 ¬ P37 = = = = = = Input (TIN) OutputOUT (T ) DAV2/RDY2 RDY2/DAV2 Input Output Reserved (must be 0) Interrupt Group Priority 000 Reserved 001 C > A > B 010 A > B > C 011 A > C > B 100 B > C > A 101 C > B > A 110 B > A > C 111 Reserved IRQ1, IRQ4 Priority (Group C) 0 IRQ1 > IRQ4 1 IRQ4 > IRQ1 IRQ0, IRQ2 Priority (Group B) 0 IRQ2 > IRQ0 1 IRQ0 > IRQ2 IRQ3, IRQ5 Priority (Group A) 0 IRQ5 > IRQ3 1 IRQ3 > IRQ5 Reserved (Must be 0) Figure 49. Interrupt Priority Register (F9H: WRITE ONLY) Figure 47. Port 3 Mode Register (F7H: WRITE ONLY) 62 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG R250 IRQ R253 RP D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 IRQ0 = P32 Input IRQ1 = P33 Input IRQ2 = P31 Input IRQ3 = P30 Input IRQ4 = T0 IRQ5 = T1 Expanded Register File Working Register Pointer Figure 53. Register Pointer (FDH: READ/WRITE) Inter Edge P31 ↓ P32 ↓ = 00 P31 ↓ P32 ↑ = 01 P31 ↑ P32 ↓ = 10 P31 ↑↓ P32 ↑↓ = 11 Figure 50. Interrupt Request Register (FAH: READ/WRITE) R254 SPH D7 D6 D5 D4 D3 D2 D1 D0 Stack Pointer Upper Byte (SP8 - SP15) R251 IMR Figure 54. Stack Pointer High (FEH: READ/WRITE) D7 D6 D5 D4 D3 D2 D1 D0 1 Enables IRQ0-IRQ5 (D0 = IRQ0) 1 Enables RAM Protect * 1 Enables Interrupts * This option must be selected when ROM code is submitted for ROM Masking, otherwise this control bit is disabled permanently. R255 SPL D7 D6 D5 D4 D3 D2 D1 D0 Figure 51. Interrupt Mask Register (FBH: READ/WRITE) Stack Pointer Lower Byte (SP0 - SP7) Figure 55. Stack Pointer Low (FFH: READ/WRITE) R252 FLAGS D7 D6 D5 D4 D3 D2 D1 D0 User Flag F1 * User Flag F2 * Half Carry Flag Decimal Adjust Flag Overflow Flag Sign Flag Zero Flag Carry Flag * Not affected by reset Figure 52. Flag Register (FCH: READ/WRITE) DS007601-Z8X0499 PRELIMINARY 63 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PACKAGE INFORMATION Figure 56. 28-Pin DIP Package Diagram Figure 57. 28-Pin SOIC Package Diagram 64 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Figure 58. 28-Pin PLCC Package Diagram Figure 59. 40-Pin DIP Package Diagram DS007601-Z8X0499 PRELIMINARY 65 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG Figure 60. 44-Pin PLCC Package Diagram Figure 61. 44-Pin QFP Package Diagram 66 PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG ORDERING INFORMATION Z86C34 Standard Temperature 28-Pin DIP 28-Pin SOIC Z86C3416PSC Z86C3416SSC 28-Pin PLCC Z86C3416VSC Extended Temperature 28-Pin DIP 28-Pin SOIC Z86C3416PEC Z86C3416SEC 28-Pin PLCC Z86C3416VEC 28-Pin PLCC Z86C3516VSC Extended Temperature 28-Pin DIP 28-Pin SOIC Z86C3516PEC Z86C3516SEC 28-Pin PLCC Z86C3516VEC 28-Pin PLCC Z86C3616VSC Extended Temperature 28-Pin DIP 28-Pin SOIC Z86C3616PEC Z86C3616SEC 28-Pin PLCC Z86C3616VEC 44-Pin QFP Z86C4416FSC Extended Temperature 40-Pin DIP 44-Pin PLCC Z86C4416PEC Z86C4416VEC 44-Pin QFP Z86C4416FEC 44-Pin QFP Z86C4516FSC Extended Temperature 40-Pin DIP 44-Pin PLCC Z86C4516PEC Z86C4516VEC 44-Pin QFP Z86C4516FEC 44-Pin QFP Z86C4616FSC Extended Temperature 40-Pin DIP 44-Pin PLCC Z86C4616PEC Z86C4616VEC 44-Pin QFP Z86C4616FEC Z86C35 Standard Temperature 28-Pin DIP 28-Pin SOIC Z86C3516PSC Z86C3516SSC Z86C36 Standard Temperature 28-Pin DIP 28-Pin SOIC Z86C3616PSC Z86C3616SSC Z86C44 Standard Temperature 40-Pin DIP 44-Pin PLCC Z86C4416PSC Z86C4416VSC Z86C45 Standard Temperature 40-Pin DIP 44-Pin PLCC Z86C4516PSC Z86C4516VSC Z86C46 Standard Temperature 40-Pin DIP 44-Pin PLCC Z86C4616PSC Z86C4616VSC For fast results, contact your local ZiLOG sales office for assistance in ordering the part required. DS007601-Z8X0499 PRELIMINARY 67 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG PRECAUTIONS (Continued) PRECAUTIONS 1. Enabling the transmit interrupt (bit 0 in the ASCI STAT register) does not make the device ready for transmitter-related interrupts. The receiver interrupt (bit 3 in the ASCI STAT register) must also be enabled. Workaround: For transmit interrupts to be generated, the RIE bit must also be set. When IRQ3 is generated, the software should check the STAT register for details on the interrupt source. 2. When using the device in full-duplex mode under interrupts (both transmit and receive interrupts enabled), a small window exists where a transmit or receive in- 68 terrupt may be lost. This situation occurs when an interrupt is generated by one side (either the transmitter or receiver) and, before the interrupt is serviced, another interrupt is generated by the other side. The second interrupt may be lost. Workaround: The only workaround is not to use transmitter interrupts when using the ASCI in fullduplex mode. Use the transmitter in polled mode and the receiver in interrupt mode for full duplex operation. In half-duplex operation, this anomaly does not create a problem. PRELIMINARY DS007601-Z8X0499 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART ZiLOG CODES For fast results, contact your local ZiLOG sales office for assistance in ordering the part required. Preferred Package Longer Lead Time Preferred Temperature Longer Lead Time Speed Environmental P = Plastic DIP V = Plastic Chip Carrier F = Plastic Quad Flat Pack S = Small Outline Integrated Chip S = 0°C to +70°C E = –40°C to +105°C 16 = 16 MHz C = Plastic Standard Example: The Z86C36 is a 16-MHz PLCC, 0ºC to 70ºC, with Plastic Standard Flow. Z 86C36 16 P S C ZiLOG Prefix Product Number Speed Package Temperature Environmental Flow Pre-Characterization Product The product represented by this document is newly introduced and ZiLOG has not completed the full characterization of the product. The document states what ZiLOG knows about this product at this time, but additional features or nonconformance ©1999 by ZiLOG, Inc. All rights reserved. Information in this publication concerning the devices, applications, or technology described is intended to suggest possible uses and may be superseded. ZiLOG, INC. DOES NOT ASSUME LIABILITY FOR OR PROVIDE A REPRESENTATION OF ACCURACY OF THE INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED IN THIS DOCUMENT. ZiLOG ALSO DOES NOT ASSUME LIABILITY FOR INTELLECTUAL PROPERTY INFRINGEMENT RELATED IN ANY MANNER TO USE OF INFORMATION, DEVICES, OR TECHNOLOGY DESCRIBED HEREIN OR OTHERWISE. DS007601-Z8X0499 with some aspects of the document may be found, either by ZiLOG or its customers in the course of further application and characterization work. In addition, ZiLOG cautions that delivery may be uncertain at times, due to start-up yield issues. Except with the express written approval of ZiLOG, use of information, devices, or technology as critical components of life support systems is not authorized. No licenses are conveyed, implicitly or otherwise, by this document under any intellectual property rights. ZiLOG, Inc. 910 East Hamilton Avenue, Suite 110 Campbell, CA 95008 Telephone (408) 558-8500 FAX (408) 558-8300 Internet: http://www.zilog.com PRELIMINARY 69 Z86C34/C35/C36/C44/C45/C46 CMOS Z8® MCUs with ASCI UART 70 ZiLOG PRELIMINARY DS007601-Z8X0499