2 Pad and 3 Pad Ceramic Package, 3.4 mm x 7.4 mm and 4.1 mm x 4.7 mm Product Features: ZTTS and ZTAS Series Applications: Low Cost Compatible with Leadfree Processing Storage Media Home Appliance Microprocessors Office Automation ZTAS-MG ZTTS-MG 7.4 1.8 Frequency 1.2 1.8 MHz to 50 MHz 3.1 ESR (Equivalent Series Resistance) See Table Below Frequency Tolerance @ 25° C ±0.5% Frequency Stability over Temperature ±0.3% Aging ±0.3% Max. for 10 Years 1 2 1 2 3 3.4 0.6 1.2 ZTAS-MT / MX ZTTS-MT / MX 1.6 Temperature 1.85 4.7 Operating -40° C to +85° C Storage -40° C to +85° C Standard 1 1 2 2 3 4.1 0.8 1.0 Connection Diagrams Part ZTTS-MG Frequency ESR C1 (MHz) (Ω Max.) (pF) 1.8 to 8 100 30 C2 (pF) 1 ZTTS 2 30 ZTTS-MT 6 to 13 30 30 30 ZTTS-MX 13 to 19.9 40 30 30 ZTTS-MX 20 to 25.9 40 15 15 ZTTS-MX 26 to 50 40 5 5 ZTAS-MG 1.8 to 8 100 30* 30* ZTAS-MT 6 to 13 30 30* 30* ZTAS-MX 13 to 19.9 40 30* 30* ZTAS-MX 20 to 25.9 40 15* 15* ZTAS-MX 26 to 50 40 5* 5* 3 ZTAS 2 1 Dimension Units: mm * Recommended external capacitance, not internal to the device. The terminations of the ZTAS and ZTTS series ceramic resonator are Pb free. Pb may be contained in the ceramic resonator element of this device and is exempted via item 7 of the RoHS annex. This ceramic resonator series is considered RoHS compliant. Part Number Guide Sample Part Number: ZTTS - MX - 20.000 Part Series Package Code Frequency ZTTS - (internal capacitors) MG MT MX - 20.000 MHz ZTAS - (must supply externanl capacitance for proper circuit operation) ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/09_A Specifications subject to change without notice Page 1 2 Pad and 3 Pad Ceramic Package, 3.4 mm x 7.4 mm and 4.1 mm x 4.7 mm Pb Free Solder Reflow Profile: ZTTS and ZTAS Series Typical Circuit: *Units are backward compatible with 240C reflow processes C1 and C2 are external for ZTAS Package Information: MSL = 1 Termination = e1 (Sn / Cu / Ag). Tape and Reel Information: Quantity per Reel A B C D E F 1000 12 +/-.3 8 +/-.2 5.5 +/-.2 13 +/-1 or 12 +/-3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 06/09_A Specifications subject to change without notice Page 2