ZXFV302 4:1 HIGH SPEED MULTIPLEXER DEVICE DESCRIPTION FEATURES AND BENEFITS The ZXFV302 is a 4:1 high speed analog switch designed for use as a buffered video multiplexer and other high-speed applications. • 3dB Bandwidth 300MHz It features low different gain and phase distortion. The high speed high output current capability provides 75⍀ cable drive for use in high performance video applications. • Differential phase 0.04⬚ • Slew rate 450V/ s • Differential gain 0.01% • Output current 40mA • Stable up to 100pF load • ⫾5 Volt supply The input channel is selected by means of two logic lines using an internal decoder. An output enable line allows expansion to eight channels using two devices ZXFV302 as shown in the example application figure 1. • Supply current 17mA • 16 pin SO package APPLICATIONS An alternative device, ZXFV301 provides the same functionality and pin-out as the ZXFV302 but with four separate logic lines controlling the switch channels directly. • Video routing and switching • CCTV switching • Video distribution selection • RGB multiplexing Connection Diagram • High frequency instrumentation Data acquisition • Data acquisition IN 1 1 16 V+ 0V 2 15 OUT IN 2 3 14 0V 0V 4 13 EN IN3 5 12 A0 0V 6 11 A1 IN 4 7 10 NC V- 8 9 NC ZXFV302 Ordering information Part Number Container Increment ZXFV302N16TA Reel 7″ 500 ZXFV302N16TC Reel 13″ 2500 Fig.1:Typical Application for 8 channel CCTV ISSUE 4 - NOVEMBER 2002 1 ZXFV302 ABSOLUTE MAXIMUM RATINGS Supply voltage VCC Supply voltage VEE Analog inputs to ground Digital inputs to ground Outputs to ground* Output current, max continous -0.5V to +6V -6V to +0.5V VEE -0.5V to VCC +0.5V -0.5V to VCC +0.5V VEE -0.5V to VCC +0.5V 40mA Operating Ambient Temperature Range Operating Junction temperature TJMAX -40⬚C to 85⬚C Storage -65⬚C to 150⬚C 150⬚C** **The thermal resistance from the semiconductor die to ambient is typically 120⬚C/W when the SO16 package is mounted on a PCB in free air. The power dissipation of the device when loaded must be designed to keep the device junction temperature below TJMAX. *During power-up and power-down, these voltage ratings require an appropriate sequence of applying and removing signals and power supplies. ELECTRICAL CHARACTERISTICS ⫾5V power supplies, Tamb = 25⬚C unless otherwise stated. RL = 150⍀, CL = 10pF Characteristics apply to channel selected, and EN input HIGH unless otherwise stated Test level: P = 100% production test C = characterised only PARAMETER CONDITIONS TEST MIN TYP MAX UNIT Supply Voltage V+ 4.75 5 5.25 V Supply Voltage V- -5.25 -5 -4.75 V Positive supply current P 13 17 21 mA Negative supply current P 9 13 18 mA Voltage gain DC P 0.99 1.000 1.01 V/V Input Common mode Voltage P ⫾3 V Input resistance P 45 k⍀ Output offset Voltage All channels held at 0V P -10 +11 +30 mV Input bias current Active channels held at 0V P -25 -11 +5 A Output Voltage swing P Output drive current P Output resistance Output resistance ⫾3 mA C Disabled (EN low) V 40 1 ⍀ 4.5 M⍀ P 1.5 3 P 40 54 Negative PSRR P 30 51 dB Small signal bandwidth 1 C 300 MHz C 450 Positive PSRR Slew rate, 25% to 75% 2V pk-pk C Logic input HIGH V Hmin Logic input LOW V Lmax C dB V/s 2 0.8 V V Logic input current I INHIGH logic input voltage = 5V C 5 pA Logic input current I INLOW logic input voltage = 0V C -70 A ISSUE 4 - NOVEMBER 2002 2 ZXFV302 ELECTRICAL CHARACTERISTICS ⫾5V power supplies, Tamb = 25⬚C unless otherwise stated. RL = 150⍀, CL = 10pF Characteristics apply to channel selected, and EN input HIGH unless otherwise stated Test level:P = 100% production test C = characterised only PARAMETER CONDITIONS TEST MIN TYP MAX UNIT t ON Vout = ⫾2V, see timing diagram C 35 ns t OFF Vout = ⫾2V, see timing diagram C 10 ns t LOW Vout = ⫾2V, see timing diagram C 50 ns t HIGH Vout = ⫾2V, see timing diagram C 40 ns Cross-talk, all hostile 1 10MHz, 0dBm in C 75 dB Differential Gain C 0.01 % Differential Phase C 0.04 deg All channels held at 0V C 50 mV All channels held at 0V C 25 ns Switching transients, magnitude Switching transients, duration Notes: 1. Bandwidth and cross talk measured using Zetex Evaluation Circuit Board detailed later in this datasheet. Truth table for selection of input channel A1 A0 EN X X 0 Hi Z 0 0 1 IN 1 0 1 1 IN 2 1 0 1 IN 3 1 1 1 IN 4 Fig.2: TIMING DIAGRAM Notes: The ‘select’ waveform represents a change in the the 2 bit control word A0 and A1. tHIGH is equivalent to tLOW but , applies for a positive going transition of OUT. ISSUE 4 - NOVEMBER 2002 3 OUT ZXFV302 CHARACTERISTICS ISSUE 4 - NOVEMBER 2002 4 ZXFV302 APPLICATIONS INFORMATION BNC connector sockets allow connection to test instruments via 50⍀ cables. The output circuit includes a resistor matching circuit to present a load of 150⍀ to the device and simultaneously provide 50⍀ output impedance. The attenuation of this matching circuit is 15.45 dB. As the device has unity voltage gain, the overall loss when loaded by 75⍀ is also 15.45 dB. Introduction A typical circuit application is outlined in Figure 1, above, where two devices are combined to provide 8-to-1 multiplexing. A more detailed basic application circuit for 4 dc-coupled channels is given in Figure 3, and an AC coupled circuit for 8 channels is shown in Figure 4. These circuits are suitable for 75⍀ transmission line connections at both the input and the output and are useful for distribution of wide-band signals such as video via cables. The 75⍀ reverse terminating resistor at the output gives the correct matching condition to a terminated video cable. The amplifier load is then 150⍀. EVALUATION CIRCUIT PARTS LIST: QTY CCT-REF VALUE DESCRIPTION Resistors, surface mount The wide bandwidth of this device necessitates some care in the layout of the printed circuit. Partly for this reason, an Evaluation Circuit board is available and is described in a later paragraph. A continuous ground plane is required under the device and its signal connection paths, to provide the shortest possible ground return paths for signals and power supply filtering. A double-sided or multi-layer PCB construction is required, with plated-through via holes providing closely spaced low-inductance connections from some components to the continuous ground plane (some of these holes are not visible in the figures for the Evaluation Circuit Board – artworks and NC drill output can be provided if required). 4 R1,R2,R3,R4 51R 0805 4 R5,R6,R7,R8 22k 0805 1 R9 120R 0805 1 R10 62R 0805 1 R11 10R 0805 5 R12 to R16 47k 0805 Capacitors, surface mount For the power supply filtering, low inductance surface mount capacitors are normally required. It has been found that very good RF decoupling is provided on each supply using a 1000 pF NPO size 0805 ceramic surface mount capacitor, closest to the device pin, with an adjacent 0.1 F X7R capacitor. Other configurations are possible and it may be found that a single 0.01 F or 0.1 F X7R capacitor, size 0805 or smaller, on each supply gives good results. However this should be supported by larger decoupling capacitors elsewhere on the printed circuit board. Values of 1 to 10 F are recommended, particularly where the voltage regulators are located more than a few inches from the device. These larger capacitors are recommended to be solid tantalum electrolytic or ceramic types. 6 100nF 25V ceramic 0805 X7R 2 1nF 50V ceramic 0805 NPO 2 10F 16V Tant Elec size C ᎏ Zetex ZXF 301N16 or ZXFV302N16 5 ᎏ BNC Socket, PCB straight flange, e.g. Tyco B35N14H999X99 1 ᎏ 3-way PCB screw terminal block IMO 20.501/3SB Integrated Circuits 1 U1 Miscellaneous Evaluation Circuit An evaluation circuit is available, constructed on a double-side printed circuit board. The circuit is suitable for both the ZXFV301 and ZXFV302 and either device may be fitted. Figures 5 and 6 show the circuit diagram, and the layout of components and copper. A parts list is provided below. This layout serves as a useful example for many applications, showing the practical implementation of the advice given above in the Introduction. ISSUE 4 - NOVEMBER 2002 5 1 SW1 ᎏ DIL switch, 8 way 10 TP1 to TP10 ᎏ PCB test terminal, red, W.Hughes 100-107 ZXFV302 6 ISSUE 4 - NOVEMBER 2002 Figure 3: BASIC APPLICATION CIRCUIT, 4 CHANNEL DC COUPLED, DUAL SUPPLIES ISSUE 4 - NOVEMBER 2002 7 ZXFV302 Figure 4: CCTV CIRCUIT WITH 8 CAMERA FROM SINGLE SUPPLY ZXFV302 Figure 5: EVALUATION CIRCUIT & PRINTED BOARD LAYOUT SHOWING TOP COPPER (overall dimensions 4x3 inches) ISSUE 4 - NOVEMBER 2002 8 ZXFV302 Figure 6: EVALUATION CIRCUIT BOARD BOTTOM COPPER (viewed through from top) ISSUE 4 - NOVEMBER 2002 9 ZXFV302 Notes ISSUE 4 - NOVEMBER 2002 10 ZXFV302 Notes ISSUE 4 - NOVEMBER 2002 11 ZXFV302 PACKAGE OUTLINE DIM Millimetres Inches MIN MAX MIN MAX A 9.80 10.00 0.386 0.394 B 1.27 BSC 0.05 BSC C 0.53 REF 0.02 REF D 0.33 0.51 0.013 0.020 E 3.80 4.00 0.15 0.157 F 1.35 1.75 0.053 0.069 G 0.10 0.25 0.004 0.01 H 0° 8° 0° 8° I 0.40 1.27 0.016 0.05 J 5.80 6.20 0.228 0.244 Conforms to JEDEC MS-012AC Iss C (SO16N) © Zetex plc 2002 Americas Asia Pacific Zetex GmbH Streitfeldstraße 19 D-81673 München Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY11788 Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 [email protected] USA Telephone: (631) 360 2222 Fax: (631) 360 8222 [email protected] Zetex (Asia) Ltd 3701-04 Metroplaza, Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 [email protected] Europe Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4422 Fax: (44) 161 622 4420 [email protected] These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 4 - NOVEMBER 2002 12