ZXGD3003E6 5A(peak) gate driver in SOT23-6 General description The ZXGD3003E6 is a high-speed non-inverting single MOSFET gate driver capable of driving up to 5A into a MOSFET or IGBT gate capacitive load from supply voltages up to 40V. With typical propagation delay times down to 2ns and rise/fall times down to 9ns this device ensures rapid switching of the power MOSFET or IGBT to minimize power losses and distortion in high current fast switching applications. The ZXGD3003E6 is inherently rugged to latch-up and shoot-through, and its wide supply voltage range allows full enhancement to minimize on-losses of the power MOSFET or IGBT. Its low input voltage requirement and high current gain allows high current driving from low voltage controller ICs, and the optimized pin-out SOT23-6 package with separate source and sink pins eases board layout, enabling reduced parasitic inductance and independent control of rise and fall slew rates. Features • • • • • • • • • • 40V operating voltage range 5 amps peak output current Fast switching emitter-follower configuration • 2ns propagation delay time • 19ns rise/fall time, 1000pF load Low input current requirement • 1.6A(source)/1.4A(sink) output current from 10mA input SOT23-6 package Separate source and sink outputs for independent control of rise and fall time Optimized pin-out to ease board layout and minimize trace inductance No Latch Up No shoot through Near - Zero quiescent and output leakage current Typical application circuit VS VCC V CC SOURCE IN 1 Input ZXGD3003 IN 2 Issue 2 - October 2007 © Zetex Semiconductors plc 2007 SINK GND 1 www.zetex.com ZXGD3003E6 Applications Power MOSFET and IGBT Gate Driving in • Synchronous switch-mode power supplies • Secondary side synchronous rectification • Plasma Display Panel power modules • 1, 2 and 3-phase motor control circuits • Audio switching amplifier power output stages Pin configuration VCC SOURCE IN1 IN2 GND SINK SOT236 Top view Pin description Pin Name Pin Function VCC Driver supply IN1 / IN2 Driver input pins. These are normally connected together by circuit tracks. GND Ground SOURCE Source current output. SINK Sink current output. Ordering information Device Reel size (inches) Tape width (mm) Quantity per reel 7 8 embossed 3000 ZXGD3003E6TA Device marking 3003 Issue 2 - October 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXGD3003E6 Absolute maximum ratings Parameter Symbol Limit Unit Supply voltage VCC 40 V Input voltage VIN 40 V Peak sink current(c) I(sink)PK 5 A Source current @ IIN1 + IIN2 =10mA(a) I(source) 1.6 A I(sink) 1.4 A IIN1, IIN2 1 A PD 1.1 W 8.8 mW/°C Tj, Tstg -55 to +150 °C Symbol Value Unit R⍜JC 113 °C/W Sink current @ IIN1 + IIN2 =10mA(a) Input current(c) Power dissipation at TA =25°C(a)(b) Linear derating factor Operating and storage temperature range Thermal resistance Parameter Junction to ambient(a)(b) NOTES: (a) For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For device with two active dice running at equal power. (c) Pulse width <=300us limit repetition rate to comply with maximum junction temperature. Issue 2 - October 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXGD3003E6 Electrical characteristics (at Tamb = 25°C unless otherwise stated). Parameter Symbol Min. Typ. Max. Unit Conditions Output voltage, high VOH VCC – 0.4 V Isource = 1A Output voltage, low VOL 0.4 V Isink = 1A Source output leakage IL(source) current 1 A VCC = 40V, VIN1 = VIN2 = 0V Sink output leakage current IL(sink) 1 A VCC = 40V, VIN1 = VIN2 = VCC Quiescent current IQ 20 nA VCC = 32V, VIN1 = VIN2 = 0V Source output current I(source) 1 1.6 A IIN1+IIN2 = 10mA Sink output current 1 1.4 A IIN1+IIN2 = 10mA Source output current I(source)PK 5 A IIN1+IIN2 = 500mA Sink output current I(sink)PK 5 A IIN1+IIN2 = 500mA Gate driver switching times td(rise) tr td(fall) tf 1.8 8.9 1.7 8.9 ns ns ns ns CL=1nF, RL=1⍀, VCC=12V, VIN=10V, RS=25⍀ Gate driver switching times td(rise) tr td(fall) tf 4 77 4 85 ns ns ns ns CL=1nF, RL=1⍀, VCC=12V, VIN=10V, RS=1k⍀ I(sink) Switching time test circuits Issue 2 - October 2007 © Zetex Semiconductors plc 2007 Timing diagram 4 www.zetex.com ZXGD3003E6 Typical gate driver characteristics Issue 2 - October 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXGD3003E6 Issue 2 - October 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXGD3003E6 SOT23-6 Package outline 0.95 0.037 1.06 0.042 2.2 0.087 mm inches 0.65 0.026 DIM A A1 A2 b C D E E1 L e e1 L Millimeters Min. 0.90 0.00 0.90 0.35 0.09 2.70 2.20 1.30 0.10 Inches Max. 1.45 0.15 1.30 0.50 0.26 3.10 3.20 1.80 0.60 Min. 0.0354 0.00 0.0354 0.0078 0.0035 0.1062 0.0866 0.0511 0.0039 0.95 REF 1.90 REF 0° Max. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 0.1181 0.0708 0.0236 0.0374 REF 0.0748 REF 30° 0° 30° Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 2 - October 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXGD3003E6 Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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