ZXTN19020CFF 20V, SOT23F, NPN high gain power transistor Summary BVCEX > 65V BVCEO > 20V BVECO > 4.5V IC(cont) = 7A VCE(sat) < 30mV @ 1A RCE(sat) = 18m⍀ PD = 1.5W Complementary part number ZXTP19020CFF C Description Advanced process capability has been used to maximize the performance of this transistor. The SOT23F package is compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance. B E Features • Very low saturation voltage • High gain • High forward blocking voltage • Low profile high dissipation package E C Applications • MOSFET and IGBT gate driving • LED driving • Strobe flash • Motor drive • Micro buffers B Pinout - top view Ordering information Device ZXTN19020CFFTA Reel size (inches) Tape width (mm) Quantity per reel 7 8 3000 Device marking 1E2 Issue 1 - February 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXTN19020CFF Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO 65 V Collector-emitter voltage (forward blocking) VCEX 65 V Collector-emitter voltage (base open) VCEO 20 V Emitter-collector voltage (reverse blocking) VECO 4.5 V Emitter-base voltage VEBO 7 V Continuous collector current(c) IC 7 A Base current IB 1 A Peak pulse current ICM 15 A Power dissipation at Tamb =25°C(a) PD 0.84 W 6.72 mW/°C 1.34 W 10.72 mW/°C 1.5 W 12.0 mW/°C 2.0 W 16.0 mW/°C Tj, Tstg - 55 to 150 °C Symbol Limit Unit Junction to ambient(a) R⍜JA 149.3 °C/W Junction to ambient(b) R⍜JA 93.4 °C/W Junction to ambient(c) R⍜JA 83.3 °C/W Junction to ambient(d) R⍜JA 60 °C/W Linear derating factor PD Power dissipation at Tamb =25°C(b) Linear derating factor PD Power dissipation at Tamb =25°C(c) Linear derating factor Power dissipation at Tamb PD =25°C(d) Linear derating factor Operating and storage temperature range Thermal resistance Parameter NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs. Issue 1 - February 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXTN19020CFF Characteristics Issue 1 - February 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXTN19020CFF Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Collector-base breakdown voltage BVCBO 65 85 V IC = 100A Collector-emitter breakdown voltage (forward blocking) BVCEX 65 85 V IC = 100A, RBE < 1k⍀ or -1V < VBE < 0.25V Collector-emitter breakdown voltage (base open) BVCEO 20 25 V IC = 10mA (*) Emitter-base breakdown voltage BVEBO 7 8.3 V IE = 100A Emitter-collector breakdown voltage (reverse blocking) BVECX 6 8.2 V IE = 100A, RBC < 1k⍀ or 0.25V > VBC > -0.25V Emitter-collector breakdown voltage (base open) BVECO 4.5 5.3 V IE = 100A, Collector-base cut-off current ICBO <1 50 20 nA A VCB = 50V VCB = 50V, Tamb= 100°C Collector-base cut-off current ICEX <1 100 nA VCE = 50V, RBE < 1k⍀ or -1V < VBE < 0.25V Emitter-base cut-off current IEBO <1 50 nA VEB = 5.6V Collector-emitter saturation voltage VCE(sat) 23 30 mV IC = 1A, IB = 100mA(*) 45 65 mV IC = 1A, IB = 10mA(*) 55 70 mV IC = 2A, IB = 40mA(*) 135 175 mV IC = 7A, IB = 280mA(*) Base-emitter saturation voltage VBE(sat) 960 1050 mV IC = 7A, IB = 280mA(*) Base-emitter turn-on voltage VBE(on) 840 950 mV IC = 7A, VCE = 2V(*) Static forward current transfer ratio hFE 200 350 500 180 340 IC = 2A, VCE = 2V(*) 100 220 IC = 7A, VCE = 2V(*) 45 95 IC = 15A, VCE = 2V(*) Transition frequency fT 150 Input capacitance Cibo 315 Output capacitance Cobo 40 Delay time td Rise time Max. Unit Conditions IC = 0.1A, VCE = 2V(*) MHz IC = 50mA, VCE = 10V f =50MHz pF VEB = 0.5V, f = 1MHz(*) pF VCB = 10V, f = 1MHz(*) 135 ns tr 117 ns Storage time ts 285 ns VCC =10 V. IC =1A, IB1 = IB2=10mA. Fall time tf 88 ns 50 NOTES: (*) Measured under pulsed conditions. Pulse width ⱕ300s; duty cycle ⱕ2%. Issue 1 - February 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXTN19020CFF Typical characteristics Issue 1 - February 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXTN19020CFF Intentionally left blank Issue 1 - February 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXTN19020CFF Package outline - SOT23F c D b e1 b e L1 L E E1 b E2 A1 R A Dim. Millimeters Inches Min. Max. Min. Max. A 0.80 1.00 0.0315 0.0394 A1 0.00 0.10 0.00 b 0.35 0.45 c 0.10 D 2.80 e e1 Millimeters Inches Min. Max. Max. Max. E 2.30 2.50 0.0906 0.0984 0.0043 E1 1.50 1.70 0.0590 0.0669 0.0153 0.0161 E2 1.10 1.26 0.0433 0.0496 0.20 0.0043 0.0079 L 0.48 0.68 0.0189 0.0268 3.00 0.1102 0.1181 L1 0.30 0.50 0.0153 0.0161 R 0.05 0.15 0.0019 0.0059 O 0° 12° 0° 12° 0.95 ref 1.80 Dim. 2.00 0.0374 ref 0.0709 0.0787 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 1 - February 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXTN19020CFF Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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