ZXTP19020DFF 20V, SOT23F, PNP medium power transistor Summary BVCEO > -20V BVECO > -4V IC(cont) = 5.5A VCE(sat) < 44mV @ 1A RCE(sat) = 26mΩ PD = 1.5W Complementary part number: ZXTN19020DFF Description C Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium B Features E • High power dissipation SOT23 package • 15A peak current • Guaranteed gain at a collector current of 10A • Very low saturation voltage Applications • MOSFET and IGBT gate driving • Power switches • Motor control Ordering information Device Reel size (inches) Tape width Quantity per reel 7 8 3000 ZXTP19020DFFTA Device marking © Zetex Semiconductors plc 2007 C B 1D8 Issue 1 - September 2007 E Pinout - top view 1 www.zetex.com ZXTP19020DFF Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO -25 V Collector-emitter voltage VCEO -20 V Emitter-collector voltage (reverse blocking) VECO -4 V Emitter-base voltage VEBO -7 V IC -5.5 A ICM -15 A Base current IB -1 A Power dissipation at Tamb = 25°C(a) PD 0.84 W 6.72 mW/°C 1.34 W 10.72 mW/°C 1.5 W 12 mW/°C 2 W 16 mW/°C Tj, Tstg -55 to 150 °C Symbol Value Unit Junction to ambient(a) RJA 149.3 °C/W Junction to ambient(b) RJA 93.4 °C/W Junction to ambient(c) RJA 83.3 °C/W Junction to ambient(d) RJA 60 °C/W Junction to case(e) RJC 38 °C/W Continuous collector current(c) Peak pulse current Linear derating factor Power dissipation at Tamb = PD 25°C(b) Linear derating factor PD Power dissipation at Tamb = 25°C(c) Linear derating factor PD Power dissipation at Tamb = 25°C(d) linear derating factor Operating and storage temperature range Thermal resistance Parameter NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs (e) Junction to case from collector tab Issue 1 - September 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXTP19020DFF Characteristics Issue 1 - September 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXTP19020DFF Electrical characteristics (at Tamb = 25°C unless otherwise stated). Parameter Symbol Min. Typ. Collector-base breakdown voltage BVCBO -25 Collector-emitter breakdown voltage (base open) BVCEO Emitter-collector breakdown voltage (reverse blocking) Max. Unit Conditions -55 V IC = -100A -20 -50 V IC = -10mA (*) BVECX -4 -8.6 V IE = -100A, RBC < 1kΩ or 0.25V > VBC > -0.25V Emitter-collector breakdown voltage (base open) BVECO -4 -8.6 V IE = -100A Emitter-base breakdown voltage BVEBO -7 -8.2 V IE = -100A Collector-base cut-off current ICBO <-1 -50 -0.5 nA A VCB = -25V VCB = -25V, Tamb= 100°C Emitter-base cut-off current IEBO <-1 -50 nA VEB = -5.6V Collector-emitter saturation voltage VCE(sat) -37 -44 mV IC = -1A, IB = -100mA(*) -90 -125 mV IC = -1A, IB = -10mA(*) -105 -140 mV IC = -2A, IB = -40mA(*) -160 -210 mV IC = -5A, IB = -250mA(*) -145 -175 mV IC = -5.5A, IB = -550mA(*) Base-emitter saturation voltage VBE(sat) -975 -1050 mV IC = -5.5A, IB = -550mA(*) Base-emitter turn-on voltage VBE(on) -830 -900 mV IC = -5.5A, VCE = -2V(*) 300 450 900 200 310 IC = -2A, VCE = -2V(*) 85 130 IC = -5.5A, VCE = -2V(*) 25 50 IC = -10A, VCE = -2V(*) 20 IC = -15A, VCE = -2V(*) Static forward current transfer ratio Transition frequency hFE fT 176 IC = -100mA, VCE = -2V(*) MHz IC = -50mA, VCE = -10V f = 50MHz 400 pF VEB = -0.5V, f = 1MHz(*) 45 pF VCB = -10V, f = 1MHz(*) IC = -1A, VCC = -10V IB1 = -IB2= -50mA. Input capacitance Cibo Output capacitance Cobo 36 Delay time td 23 ns Rise time tr 18.4 ns Storage time ts 266 ns Fall time tf 49.6 ns NOTES: (*) Measured under pulsed conditions. Pulse width 300s; duty cycle 2%. Issue 1 - September 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXTP19020DFF Typical characteristics Issue 1 - September 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXTP19020DFF SOT23F Package outline c D b e1 b e L1 L E E1 b A1 R A Dim. Millimeters Inches Min. Max. Min. Max. A 0.80 1.00 0.0315 0.0394 A1 0.00 0.10 0.00 b 0.35 0.45 c 0.10 D 2.80 e e1 Millimeters Inches Min. Max. Min. Max. E 2.30 2.50 0.0906 0.0984 0.0043 E1 1.50 1.70 0.0590 0.0669 0.0153 0.0161 L 0.48 0.68 0.0189 0.0268 0.20 0.0043 0.0079 L1 0.30 0.50 0.0153 0.0161 3.00 0.1102 0.1181 R 0.05 0.15 0.0019 0.0059 O 0° 12° 0° 12° - - - - - 0.95 ref 1.80 Dim. 2.00 0.0374 ref 0.0709 0.0787 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 1 - September 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXTP19020DFF Intentionally left blank Issue 1 - September 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXTP19020DFF Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. 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A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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