ZXTP19100CFF 100V, SOT23F, PNP medium power transistor Summary BVCEO > -100V BVECO > -7V IC(cont) = -2A VCE(sat) < 120mV @ 1A RCE(sat) = 95m⍀ PD = 1.5W Complementary part number: ZXTN19100CFF Description C Packaged in the SOT23 outline this new low saturation 100V PNP transistor offers extremely low on state losses making it ideal for use in DC-DC circuits and various driving and power management functions. B Features • 2 amps continuous current • Very low saturation voltages E Applications E • Emergency lighting circuits • Motor driving (including DC fans) • Solenoid, relay and actuator drivers • DC-DC modules • Backlight inverters • Power switches • MOSFET gate drivers C B Top view Ordering information DEVICE ZXTP19100CFFTA Reel size (inches) Tape width (mm) Quantity per reel 7 8 3000 Device marking 1E1 Issue 1 - October 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXTP19100CFF Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO -110 V Collector-emitter voltage (forward blocking) VCEX -110 V Collector-emitter voltage VCEO -100 V Emitter-collector voltage (reverse blocking) VECO -7 V Emitter-base voltage VEBO -7 V IC -2 A ICM -3 A Base current IB -1 A Power dissipation at TA =25°C(a) Linear derating factor PD 0.84 W mW/°C Power dissipation at TA =25°C(b) Linear derating factor PD 1.34 W mW/°C Power dissipation at TA =25°C(c) Linear derating factor PD 1.5 W mW/°C Power dissipation at TA =25°C(d) Linear derating factor PD 2 W mW/°C Tj, Tstg -55 to 150 °C Symbol Value Unit Junction to Ambient(a) RJA 149.3 °C/W Junction to Ambient(b) RJA 93.4 °C/W Junction to Ambient(c) RJA 83.3 °C/W Junction to Ambient(d) RJA 60 °C/W Junction to Case(e) RJC 38 °C/W Continuous collector current(c) Peak pulse current Operating and storage temperature range Thermal resistance Parameter NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs (e) Junction to Case from Collector Tab. Issue 1 - October 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXTP19100CFF Thermal characteristics Issue 1 - October 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXTP19100CFF Electrical characteristics (at Tamb = 25°C unless otherwise stated). Parameter Symbol Min. Typ. Collector-Base Breakdown BVCBO Voltage -110 Collector-Emitter Breakdown Voltage (Base open) BVCEX Collector-Emitter Breakdown Voltage (Base open) Max. Unit Conditions -135 V IC = -100A -110 -135 V IC = -100A, RBC < 1kΩ or 0.25V > VBC > -0.25V BVCEO -100 -135 V IC = -10mA (*) Emitter-Base Breakdown Voltage BVEBO -7 -8.3 V IE = -100A Emitter-Collector Breakdown Voltage (Reverse Blocking) BVECX -7 -8.3 V IE = -100A, RBC < 1k⑁ or 0.25V > VBC > -0.25V Emitter-Collector Breakdown Voltage (Base open) BVECO -7 -8.7 V IE = -100A Collector-Base Cut-Off Current ICBO <-1 -50 -0.5 nA A VCB = -110V VCB = -110V, Tamb= 100°C Emitter-Base Cut-Off Current IEBO <-1 -50 nA VEB = -5.6V Collector-Emitter Saturation Voltage VCE(sat) -100 -130 mV IC = -0.5A, IB = -20mA(*) -95 -120 mV IC = -1A, IB = -100mA(*) -175 -225 mV IC = -1A, IB = -50mA(*) -215 -275 mV IC = -2A, IB = -200mA(*) Base-Emitter Saturation Voltage VBE(sat) -870 -950 mV IC = -2A, IB = -200mA(*) Base-Emitter Turn-On Voltage VBE(on) -810 -900 mV IC = -2A, VCE = -2V(*) Static Forward Current Transfer Ratio hFE 200 330 500 70 135 IC = -1A, VCE = -2V(*) 20 30 IC = -2A, VCE = -2V(*) Transition Frequency fT 142 Input Capacitance Cibo 291 Output Capacitance Cobo Delay Time IC = -100mA, VCE = -2V(*) MHz IC = -100mA, VCE = -10V f = 50MHz pF VEB = -0.5V, f = 1MHz(*) 23.5 pF VCB = -10V, f = 1MHz(*) td 24.7 ns Rise Time tr 22.4 ns Storage Time ts 660 ns Fall Time tf 107 ns 400 IC = -500mA, VCC = -10V IB1 = -IB2= -50mA NOTES: (*) Measured under pulsed conditions. Pulse width ≤ 300s; duty cycle ≤ 2%. Issue 1 - October 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXTP19100CFF Typical characteristics Issue 1 - October 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXTP19100CFF Package outline - SOT23F c D b e1 b e L1 L E E1 b A1 R A Dim. Millimeters Inches Min. Max. Min. Max. A 0.80 1.00 0.0315 0.0394 A1 0.00 0.10 0.00 b 0.35 0.45 c 0.10 D 2.80 e e1 Millimeters Inches Min. Max. Min. Max. E 2.30 2.50 0.0906 0.0984 0.0043 E1 1.50 1.70 0.0590 0.0669 0.0153 0.0161 L 0.48 0.68 0.0189 0.0268 0.20 0.0043 0.0079 L1 0.30 0.50 0.0153 0.0161 3.00 0.1102 0.1181 R 0.05 0.15 0.0019 0.0059 O 0° 12° 0° 12° - - - - - 0.95 ref 1.80 Dim. 2.00 0.0374 ref 0.0709 0.0787 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 1 - October 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXTP19100CFF Intentionally left blank Issue 1 - October 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXTP19100CFF Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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