74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
D 3-State Outputs Drive Bus Lines or Buffer
DB, DW, NT, OR PW PACKAGE
(TOP VIEW)
Memory Address Registers
Inputs Are TTL-Voltage Compatible
Flow-Through Architecture Optimizes
PCB Layout
Center-Pin VCC and GND Configurations to
Minimize High-Speed Switching Noise
EPICt (Enhanced-Performance Implanted
CMOS) 1-mm Process
500-mA Typical Latch-Up Immunity at
125°C
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, and Standard Plastic 300-mil
DIPs (NT)
D
D
D
D
D
D
1Y1
1Y2
1Y3
1Y4
GND
GND
GND
GND
2Y1
2Y2
2Y3
2Y4
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
1OE
1A1
1A2
1A3
1A4
VCC
VCC
2A1
2A2
2A3
2A4
2OE
description
ThIs octal buffer or line driver is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the
’ACT11240, this device provides the choice of various combinations of inverting and noninverting outputs.
The 74ACT11244 is characterized for operation from −40°C to 85°C.
FUNCTION TABLE
OUTPUT
ENABLE
1OE, 2OE
DATA
INPUT
A
OUTPUT
Y
H
X
Z
L
L
L
L
H
H
logic symbol†
1OE
1A1
1A2
1A3
1A4
†
24
23
2OE
EN
1
20
22
2
21
3
20
4
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
13
EN
17
9
16
10
15
11
14
12
2Y1
2Y2
2Y3
2Y4
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright © 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
24
2OE
23
22
21
20
1
2
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
13
17
9
16
10
15
11
14
12
3
4
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W
DW package . . . . . . . . . . . . . . . . . . 1.7 W
NT package . . . . . . . . . . . . . . . . . . . 1.3 W
PW package . . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
recommended operating conditions
2
MIN
MAX
4.5
5.5
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
−24
mA
IOL
Low-level output current
24
mA
Dt/Dv
Input transition rise or fall rate
0
10
ns/V
TA
Operating free-air temperature
−40
85
°C
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
V
74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = −50
50 mA
A
VOH
24 mA
IOH = −24
IOH = −75 mA{
IOL = 24 mA
MIN
4.5 V
4.4
4.4
5.5 V
5.4
5.4
4.5 V
3.94
3.8
5.5 V
4.94
4.8
MAX
UNIT
V
3.85
4.5 V
0.1
5.5 V
0.1
0.1
0.1
4.5 V
0.36
0.44
5.5 V
0.36
0.44
V
5.5 V
IOZ
VO = VCC or GND
5.5 V
±0.5
±5
mA
II
VI = VCC or GND
5.5 V
±0.1
±1
mA
DICC
‡
MAX
IOL = 75 mA{
ICC
†
TYP
5.5 V
IOL = 50 mA
A
VOL
TA = 25°C
MIN
}
1.65
VI = VCC or GND,
IO = 0
5.5 V
8
80
mA
One input at 3.4 V,
Other inputs at GND or VCC
5.5 V
0.9
1
mA
Ci
VI = VCC or GND
5V
4
pF
Co
VO = VCC or GND
5V
10
pF
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
A
Y
OE
Y
OE
Y
TA = 25°C
MIN
MAX
8.9
1.5
9.9
8.6
1.5
9.2
6.6
11.3
1.5
12.5
6.7
10.5
1.5
11.4
1.5
7.4
9.8
1.5
10.4
1.5
7.8
10.6
1.5
11.2
MIN
TYP
MAX
1.5
6
1.5
5.4
1.5
1.5
UNIT
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
Outputs enabled
Cpd
Power dissipation capacitance per buffer
POST OFFICE BOX 655303
Outputs disabled
• DALLAS, TEXAS 75265
TYP
UNIT
27
CL = 50 pF,
pF
f = 1 MHz
9
pF
3
74ACT11244
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS006C − AUGUST 1987 − REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
Output
Control
(low-level
enabling)
3V
1.5 V
1.5 V
0V
tPLH
tPHL
VOH
Output
S1
Open
2 × VCC
GND
500 Ω
LOAD CIRCUIT
Input
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
50% VCC
50% VCC
VOL
3V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
1.5 V
1.5 V
50% VCC
20% VCC
VOL
tPHZ
tPZH
VOLTAGE WAVEFORMS
[ VCC
50% VCC
80% VCC
VOH
[0V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
1-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ACT11244DBLE
OBSOLETE
SSOP
DB
24
74ACT11244DBR
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DBRE4
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DBRG4
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244DWRG4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244NT
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
74ACT11244NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
74ACT11244PW
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244PWE4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244PWG4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244PWLE
OBSOLETE
TSSOP
PW
24
74ACT11244PWR
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244PWRE4
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT11244PWRG4
ACTIVE
TSSOP
PW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
TBD
Lead/Ball Finish
Call TI
Call TI
MSL Peak Temp (3)
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Apr-2010
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74ACT11244DBR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
74ACT11244DWR
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
74ACT11244PWR
TSSOP
PW
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74ACT11244DBR
SSOP
DB
24
2000
367.0
367.0
38.0
74ACT11244DWR
SOIC
DW
24
2000
367.0
367.0
45.0
74ACT11244PWR
TSSOP
PW
24
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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