TI 74ACT16823DL

54ACT16823, 74ACT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS160A – APRIL 1991 – REVISED APRIL 1996
D
D
D
D
D
D
D
Members of the Texas Instruments
Widebus  Family
Inputs Are TTL-Voltage Compatible
Provide Extra Data Width Necessary for
Wider Address/Data Paths or Buses With
Parity
Flow-Through Architecture Optimizes PCB
Layout
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
EPIC (Enhanced-Performance Implanted
CMOS) 1-µm Process
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) Packages Using
25-mil Center-to-Center Pin Spacings and
380-mil Fine-Pitch Ceramic Flat (WD)
Packages Using 25-mil Center-to-Center
Pin Spacings
54ACT16823 . . . WD PACKAGE
74ACT16823 . . . DL PACKAGE
(TOP VIEW)
1CLR
1OE
1Q1
GND
1Q2
1Q3
VCC
1Q4
1Q5
1Q6
GND
1Q7
1Q8
1Q9
2Q1
2Q2
2Q3
GND
2Q4
2Q5
2Q6
VCC
2Q7
2Q8
GND
2Q9
2OE
2CLR
description
These 18-bit flip-flops feature 3-state outputs
designed specifically for driving highly-capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing wider buffer
registers, I/O ports, parity bus interfacing, and
working registers.
The ’ACT16823 can be used as two 9-bit flip-flops
or one 18-bit flip-flop. With the clock-enable
(CLKEN) input low, the D-type flip-flops enter data
on the low-to-high transitions of the clock. Taking
CLKEN high disables the clock buffer, thus
latching the outputs. Taking the clear (CLR) input
low causes the Q outputs to go low independently
of the clock.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1CLK
1CLKEN
1D1
GND
1D2
1D3
VCC
1D4
1D5
1D6
GND
1D7
1D8
1D9
2D1
2D2
2D3
GND
2D4
2D5
2D6
VCC
2D7
2D8
GND
2D9
2CLKEN
2CLK
A buffered output-enable (OE) input can be used to place the outputs in either a normal logic state (high or low
logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus
lines significantly.
OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
The 74ACT16823 is packaged in theTI shrink small-outline package, which provides twice the I/O pin count and
functionality of standard small-outline packages in the same printed-circuit-board area.
The 54ACT16823 is characterized for operation over the full military temperature range of 55°C to 125°C. The
74ACT16823 is characterized for operation from –40°C to 85°C
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
Copyright  1996, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
54ACT16823, 74ACT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS160A – APRIL 1991 – REVISED APRIL 1996
FUNCTION TABLE
(each 9-bit stage)
INPUTS
OE
D
OUTPUT
Q
CLR
CLKEN
CLK
L
L
X
X
X
L
L
H
L
↑
H
H
L
H
L
↑
L
L
L
H
L
L
X
Q0
L
H
H
X
X
Q0
H
X
X
X
X
Z
logic symbol†
2
1OE
1CLR
EN1
1
R2
55
1CLKEN
1CLK
2OE
56
27
28
2CLR
2CLKEN
2CLK
1D1
1D2
1D3
1D4
1D5
1D6
1D7
1D8
1D9
2D1
2D2
2D3
2D4
2D5
2D6
2D7
2D8
2D9
30
29
54
G3
3C4
EN5
R6
G7
7C8
4D
52
1, 2
5
51
6
49
8
48
9
47
10
45
12
44
13
43
14
42
15
8D
41
5, 6
16
40
17
38
19
37
20
36
21
34
23
33
24
31
25
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1Q1
1Q2
1Q3
1Q4
1Q5
1Q6
1Q7
1Q8
1Q9
2Q1
2Q2
2Q3
2Q4
2Q5
2Q6
2Q7
2Q8
2Q9
54ACT16823, 74ACT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS160A – APRIL 1991 – REVISED APRIL 1996
logic diagram (positive logic)
1OE
1CLR
2
1
R
1CLKEN
1CLK
1D1
55
CE
56
C1
54
3
1Q1
1D
One of Nine Channels
To Eight Other Channels
2OE
2CLR
27
28
R
2CLKEN
2CLK
2D1
30
CE
29
C1
42
15
2Q1
1D
One of Nine Channels
To Eight Other Channels
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
54ACT16823, 74ACT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS160A – APRIL 1991 – REVISED APRIL 1996
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±450 mA
Maximum package power dissipation at TA = 55°C (in still air) (see Note 2): DL package . . . . . . . . . . . 1.4 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils.
recommended operating conditions (see Note 2)
54ACT16823
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level output current
IOL
∆t/∆v
Low-level output current
High-level input voltage
2
2
0.8
Input transition rise or fall rate
TA
Operating free-air temperature
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
POST OFFICE BOX 655303
UNIT
V
V
0.8
V
VCC
VCC
V
–24
–24
mA
24
24
mA
VCC
VCC
0
0
V
0
10
0
10
ns/V
–55
125
–40
85
°C
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
74ACT16823
MIN
• DALLAS, TEXAS 75265
54ACT16823, 74ACT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS160A – APRIL 1991 – REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –50
50 µA
VOH
24 mA
IOH = –24
IOH= –75 mA†
II
IOZ
ICC
IOL = 75 mA†
VI = VCC or GND
54ACT16823
MIN
∆ICC‡
One input at 3.4 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
VO = VCC or GND
74ACT16823
MIN
4.4
4.4
4.4
5.5 V
5.4
5.4
5.4
4.5 V
3.94
3.8
3.8
5.5 V
4.94
4.8
4.8
3.85
3.85
0.1
0.1
MAX
UNIT
V
0.1
5.5 V
0.1
0.1
0.1
4.5 V
0.36
0.44
0.44
5.5 V
0.36
0.44
0.44
1.65
1.65
±1
±1
µA
5.5 V
IO = 0
MAX
4.5 V
4.5 V
IOL = 24 mA
VO = VCC or GND
VI = VCC or GND,
TA = 25°C
TYP
MAX
5.5 V
IOL = 50 µA
VOL
MIN
V
5.5 V
±0.1
5.5 V
±0.5
±5
±5
µA
5.5 V
8
80
80
µA
5.5 V
0.9
1
1
mA
5V
3
pF
Co
5V
12
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
pF
timing requirements over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
fclock
Clock frequency
tw
Pulse duration
tsu
th
Setup time before CLK↑
↑
Hold time after CLK↑
0
90
54ACT16823
74ACT16823
MIN
MAX
MIN
MAX
0
90
0
90
CLR low
3.3
3.3
3.3
CLK high or low
5.5
5.5
5.5
CLR inactive
0.5
0.5
0.5
Data
7
7
7
CLKEN low
3.5
3.5
3.5
Data
0.5
0.5
0.5
CLKEN high or low
2.5
2.5
2.5
UNIT
MHz
ns
ns
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
54ACT16823, 74ACT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS160A – APRIL 1991 – REVISED APRIL 1996
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPHL
FROM
(INPUT)
TO
(OUTPUT)
MIN
TA = 25°C
TYP
MAX
90
CLK
Q
CLR
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
54ACT16823
MIN
74ACT16823
MAX
MIN
90
MAX
90
UNIT
MHz
4.2
7.5
10.6
4.2
12.1
4.2
12.1
4.8
8.3
11.5
4.8
12.9
4.8
12.9
3.4
7.3
11.2
3.4
12.5
3.4
12.5
2.4
5.9
9.5
2.4
10.7
2.4
10.7
3.3
7.1
11.3
3.3
12.8
3.3
12.8
5.5
7.6
9.7
5.5
10.3
5.5
10.3
4.6
6.7
8.8
4.6
9.4
4.6
9.4
ns
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
d
flip flop
Power dissipation capacitance per flip-flop
TEST CONDITIONS
Outputs enabled
Outputs disabled
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
pF
CL = 50 pF,
f = 1 MHz
TYP
42
24
UNIT
pF
54ACT16823, 74ACT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS160A – APRIL 1991 – REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
500 Ω
CL = 50 pF
(see Note A)
LOAD CIRCUIT
3V
Timing Input
1.5 V
0V
tw
tsu
3V
Input
1.5 V
th
1.5 V
3V
1.5 V
1.5 V
Data Input
0V
0V
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
3V
1.5 V
Input
1.5 V
0V
tPHL
tPLH
In-Phase
Output
50% VCC
50% VCC
0V
tPZL
VOH
50% VCC
VOL
Output
Waveform 2
S1 at GND
(see Note B)
[ VCC
tPLZ
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
3V
1.5 V
1.5 V
50% VCC
VOL
tPHZ
tPZH
VOLTAGE WAVEFORMS
20% VCC
50% VCC
80% VCC
VOH
[0V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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7
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ACT16823DL
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT16823DLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT16823DLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ACT16823DLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74ACT16823DLR
Package Package Pins
Type Drawing
SSOP
DL
56
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
1000
330.0
32.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
11.35
18.67
3.1
16.0
32.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74ACT16823DLR
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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