54ACT16863, 74ACT16863 18-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS162B – JUNE 1990 – REVISED NOVEMBER 1996 D D D D D D D D 54ACT16863 . . . WD PACKAGE 74ACT16863 . . . DL PACKAGE (TOP VIEW) Members of the Texas Instruments Widebus Family Inputs Are TTL-Voltage Compatible 3-State Outputs Drive Bus Lines Directly Flow-Through Architecture Optimizes PCB Layout Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings 1OEAB 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 1B7 GND 1B8 1B9 GND GND 2B1 2B2 GND 2B3 2B4 2B5 VCC 2B6 2B7 GND 2B8 2B9 2OEAB description The ’ACT16863 are 18-bit noninverting transceivers designed for asynchronous communication between data buses. The control-function implementation minimizes external timing requirements. The ’ACT16863 can be used as two 9-bit transceivers or one 18-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the output-enable (OEAB or OEBA) inputs. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1OEBA 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 1A7 GND 1A8 1A9 GND GND 2A1 2A2 GND 2A3 2A4 2A5 VCC 2A6 2A7 GND 2A8 2A9 2OEBA The 74ACT16863 is packaged in TI’s shrink small-outline package (DL), which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The 54ACT16863 is characterized for operation over the full military temperature range of –55°C to 125°C. The 74ACT16863 is characterized for operation from –40°C to 85°C. FUNCTION TABLE (each 9-bit section) INPUTS OPERATION OEAB OEBA H L B data to A bus L H A data to B bus H H Isolation Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated. Copyright 1996, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 54ACT16863, 74ACT16863 18-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS162B – JUNE 1990 – REVISED NOVEMBER 1996 logic symbol† 56 EN1 1OEBA 1OEAB 1 EN2 29 EN3 2OEBA 2OEAB 1A1 28 EN4 55 1 1 1A2 1A3 1A4 1A5 1A6 1A7 1A8 1A9 2A1 3 52 5 51 6 49 8 48 9 47 10 45 12 44 13 41 16 3 2A3 2A4 2A5 2A6 2A7 2A8 2A9 1B1 2 54 1 1 2A2 2 1 1B2 1B3 1B4 1B5 1B6 1B7 1B8 1B9 2B1 4 40 17 38 19 37 20 36 21 34 23 33 24 31 26 30 27 2B2 2B3 2B4 2B5 2B6 2B7 2B8 2B9 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OEBA 1OEAB 1A1 56 2OEBA 1 2OEAB 55 2 1B1 2A1 29 28 41 To Eight Other Channels 2 POST OFFICE BOX 655303 16 To Eight Other Channels • DALLAS, TEXAS 75265 2B1 54ACT16863, 74ACT16863 18-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS162B – JUNE 1990 – REVISED NOVEMBER 1996 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±450 mA Maximum package power dissipation at TA = 55°C (in still air) (see Note 2): DL package . . . . . . . . . . . 1.4 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils. recommended operating conditions (see Note 2) 54ACT16863 NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level output current IOL ∆t/∆v Low-level output current High-level input voltage 74ACT16863 MIN 2 2 0.8 Input transition rise or fall rate 0 TA Operating free-air temperature –55 NOTE 3: Unused pins (input or I/O) must be held high or low to prevent them from floating. UNIT V V 0.8 V VCC VCC V –24 –24 mA 24 24 mA VCC VCC 0 0 V 10 0 10 ns/V 125 –40 85 °C PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 54ACT16863, 74ACT16863 18-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS162B – JUNE 1990 – REVISED NOVEMBER 1996 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC 4.5 V IOH = –50 50 µA VOH 24 mA IOH = –24 IOH = –50 mA† IOH = –75 mA† TA = 25°C TYP MAX 54ACT16863 MIN MAX MIN 4.4 4.4 5.5 V 5.4 5.4 5.4 4.5 V 3.94 3.7 3.8 5.5 V 4.94 4.7 4.8 MAX V 3.85 4.5 V 0.1 0.1 5.5 V 0.1 0.1 0.1 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 IOL = 50 mA† IOL = 75 mA† 5.5 V UNIT 3.85 5.5 V IOL = 24 mA 74ACT16863 4.4 5.5 V IOL = 50 µA VOL MIN 0.1 V 1.65 5.5 V 1.65 II Control inputs VI = VCC or GND 5.5 V ±0.1 ±1 ±1 µA IOZ‡ ICC A or B ports VO = VCC or GND 5.5 V ±0.5 ±10 ±5 µA VI = VCC or GND, IO = 0 One input at 3.4 V, Other inputs at VCC or GND 5.5 V 8 160 80 µA 5.5 V 0.9 1 1 mA ∆ICC§ Ci Control inputs VI = VCC or GND VO = VCC or GND 5V 4.5 pF Cio A or B ports 5V 17 † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. ‡ For I/O ports, the parameter IOZ includes the input leakage current. § This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC. pF switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OEBA or OEAB A or B tPHZ tPLZ OEBA or OEAB A or B MIN TA = 25°C TYP MAX 54ACT16863 74ACT16863 MIN MAX MIN MAX 4.1 7 9.9 4.1 12.1 4.1 11.1 3.1 6.4 10.6 3.1 12.5 3.1 11.8 3 5.9 9.6 3 11.5 3 10.6 3.9 7.4 12.3 3.9 14.7 3.9 13.6 5.7 8.2 10.6 5.7 12.3 5.7 11.6 5.4 7.7 10 5.4 11.6 5.4 11 UNIT ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd Power dissipation capacitance per transceiver TEST CONDITIONS Outputs enabled PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CL = 50 pF, f = 1 MHz TYP 62 UNIT pF 54ACT16863, 74ACT16863 18-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS162B – JUNE 1990 – REVISED NOVEMBER 1996 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) Output Control (low-level enabling) 3V 1.5 V 1.5 V 0V tPLH tPHL VOH Output S1 Open 2 × VCC GND 500 Ω LOAD CIRCUIT Input TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 50% VCC 50% VCC VOL 3V 0V tPZL [ VCC tPLZ Output Waveform 1 S1 at 2 × VCC (see Note B) Output Waveform 2 S1 at GND (see Note B) 1.5 V 1.5 V 50% VCC VOL tPHZ tPZH VOLTAGE WAVEFORMS 20% VCC 50% VCC 80% VCC VOH [0V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ACT16863DL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT16863DLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT16863DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT16863DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74ACT16863DLR Package Package Pins Type Drawing SSOP DL 56 SPQ Reel Reel Diameter Width (mm) W1 (mm) 1000 330.0 32.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 11.35 18.67 3.1 16.0 32.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74ACT16863DLR SSOP DL 56 1000 346.0 346.0 49.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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