74AHC164; 74AHCT164 8-bit serial-in/parallel-out shift register Rev. 03 — 24 April 2008 Product data sheet 1. General description The 74AHC164; 74AHCT164 shift register is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A. The 74AHC164; 74AHCT164 input signals are 8-bit serial through one of two inputs (DSA or DSB); either input can be used as an active HIGH enable for data entry through the other input. Both inputs must be connected together or an unused input must be tied HIGH. Data shifts one place to the right on each LOW-to-HIGH transition of the clock input (CP) and enters into output Q0, which is a logical AND of the two data inputs (DSA and DSB) that existed one set-up time prior to the rising clock edge. A LOW-level on the master reset (MR) input overrides all other inputs and clears the register asynchronously, forcing all outputs LOW. 2. Features n n n n Balanced propagation delays All inputs have Schmitt-trigger actions Inputs accept voltages higher than VCC Input levels: u For 74AHC164: CMOS level u For 74AHCT164: TTL level n ESD protection: u HBM EIA/JESD22-A114E exceeds 2000 V u MM EIA/JESD22-A115-A exceeds 200 V u CDM EIA/JESD22-C101C exceeds 1000 V n Multiple package options n Specified from −40 °C to +85 °C and from −40 °C to +125 °C 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AHC164D −40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74AHC164PW −40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 74AHC164BQ −40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1 thin quad flat package; no leads; 14 terminals; body 2.5 × 3 × 0.85 mm 74AHCT164D −40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 74AHCT164PW −40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 74AHCT164BQ −40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1 thin quad flat package; no leads; 14 terminals; body 2.5 × 3 × 0.85 mm 74AHC164 74AHCT164 4. Functional diagram DSA DSB CP MR 1 2 8 8-BIT SERIAL−IN/PARALLEL−OUT SHIFT REGISTER 9 3 4 5 6 10 11 12 13 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 001aac425 Fig 1. Functional diagram 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 2 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register SRG8 8 C1/ 9 R 1 2 & 3 1D 4 DSA DSB 1 2 8 CP 9 MR 5 3 Q0 4 Q1 6 5 Q2 10 6 Q3 10 Q4 11 Q5 12 Q6 13 Q7 11 12 13 001aac424 001aac423 Fig 2. Logic symbol Fig 3. IEC logic symbol DSA D Q D CP FF1 RD DSB Q D CP FF2 RD Q D CP FF3 RD Q D CP FF4 RD Q D CP FF5 RD Q D CP FF6 RD Q D CP FF7 RD Q CP FF8 RD CP MR Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 001aac616 Fig 4. Logic diagram 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 3 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 5. Pinning information 14 VCC DSB 2 13 Q7 Q0 3 Q1 4 164 terminal 1 index area 14 VCC 1 1 DSA DSA 5.1 Pinning DSB 2 13 Q7 12 Q6 Q0 3 12 Q6 11 Q5 Q1 4 164 11 Q5 Q2 5 GND(1) 10 Q4 Q3 6 5 Q3 6 9 MR 7 8 GND 7 8 CP GND CP 10 Q4 Q2 9 MR 001aac828 Transparent top view 001aac422 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig 5. Pin configuration SO14 and TSSOP14 Fig 6. Pin configuration DHVQFN14 5.2 Pin description Table 2. Pin description Symbol Pin Description DSA 1 serial data input A DSB 2 serial data input B Q0 3 output 0 Q1 4 output 1 Q2 5 output 2 Q3 6 output 3 GND 7 ground (0 V) CP 8 clock input (LOW-to-HIGH edge-triggered) MR 9 master reset input (active LOW) Q4 10 output 4 Q5 11 output 5 Q6 12 output 6 Q7 13 output 7 VCC 14 supply voltage 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 4 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 6. Functional description Table 3. Function table[1] Operating mode Control Input Output MR CP DSA DSB Q0 Q1 to Q7 Reset (clear) L X X X L L to L Shift H ↑ l l L q0 to q6 l h L q0 to q6 h l L q0 to q6 h h H q0 to q6 [1] H = HIGH voltage level; h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition; L = LOW voltage level; l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition; ↑ = LOW-to-HIGH transition; X = don’t care; q = lower case letter indicates the state of the referenced input one set-up time prior to the LOW-to-HIGH transition. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage VI input voltage Conditions input clamping current VI < −0.5 V [1] IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V [1] IO output current VO = −0.5 V to (VCC + 0.5 V) ICC IIK Min Max Unit −0.5 +7.0 V −0.5 +7.0 V −20 - mA −20 +20 mA −25 +25 mA supply current - +75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation - 500 mW Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K. For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K. For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K. 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 5 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 8. Recommended operating conditions Table 5. Operating conditions Symbol Parameter Conditions Min Typ Max Unit 74AHC164 VCC supply voltage 2.0 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate VCC = 3.0 V to 3.6 V - - 100 ns/V VCC = 4.5 V to 5.5 V - - 20 ns/V 74AHCT164 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C ∆t/∆V input transition rise and fall rate - - 20 ns/V VCC = 4.5 V to 5.5 V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max 74AHC164 VIH VIL VOH VOL HIGH-level input voltage VCC = 2.0 V 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V LOW-level input voltage VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.80 - 3.70 - V LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 6 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions VI = 5.5 V or GND; VCC = 0 V to 5.5 V −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max - - 0.1 - 1.0 - 2.0 µA II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 µA CI input capacitance - 3 10 - - - - pF 74AHCT164 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −50 µA 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.80 - 3.70 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA IO = −8.0 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 µA IO = 8.0 mA II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 µA ∆ICC additional per input pin; supply current VI = VCC − 2.1 V; IO = 0 A; other pins at VCC or GND; VCC = 4.5 V to 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 3 10 - - - - pF 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 7 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ[1] Max Min Max Min Max CL = 15 pF - 6.5 12.8 1.0 15.0 1.0 16.0 ns CL = 50 pF - 9.3 16.3 1.0 18.5 1.0 20.5 ns - 4.5 9.0 1.0 10.5 1.0 11.5 ns - 6.4 11.0 1.0 12.5 1.0 14.0 ns CL = 15 pF - 5.3 12.8 1.0 15.0 1.0 16.0 ns CL = 50 pF - 7.6 16.3 1.0 18.5 1.0 20.5 ns CL = 15 pF - 4.0 8.6 1.0 10.0 1.0 11.0 ns CL = 50 pF - 5.8 10.6 1.0 12.0 1.0 13.5 ns CL = 15 pF 80 125 - 65 - 50 - MHz CL = 50 pF 50 75 - 45 - 35 - MHz 74AHC164 tpd propagation CP to Qn; see Figure 7 delay VCC = 3.0 V to 3.6 V [2] VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF MR to Qn; see Figure 8 [3] VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V fmax maximum frequency see Figure 7 VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V tW tWL tsu th pulse width CL = 15 pF 125 175 - 105 - 85 - MHz CL = 50 pF 85 115 - 75 - 65 - MHz VCC = 3.0 V to 3.6 V 5.0 - - 5.0 - 5.0 - ns VCC = 4.5 V to 5.5 V 5.0 - - 5.0 - 5.0 - ns VCC = 3.0 V to 3.6 V 5.0 - - 5.0 - 5.0 - ns VCC = 4.5 V to 5.5 V 5.0 - - 5.0 - 5.0 - ns VCC = 3.0 V to 3.6 V 5.0 - - 6.0 - 6.0 - ns VCC = 4.5 V to 5.5 V 4.5 - - 4.5 - 4.5 - ns VCC = 3.0 V to 3.6 V 1.5 - - 1.5 - 1.5 - ns VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - ns CP HIGH or LOW; see Figure 7 pulse width LOW MR; see Figure 8 set-up time DSA, DSB to CP; see Figure 9 hold time DSA, DSB to CP; see Figure 9 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 8 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10. Symbol Parameter trec CPD recovery time 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ[1] Max Min Max Min Max VCC = 3.0 V to 3.6 V 2.5 - - 2.5 - 2.5 - ns VCC = 4.5 V to 5.5 V 2.5 - - 2.5 - 2.5 - ns - 48 - - - - - pF - 3.4 9.0 1.0 10.5 1.0 11.5 ns - 4.9 11.0 1.0 12.5 1.0 14.0 ns CL = 15 pF - 3.5 8.6 1.0 10.0 1.0 11.0 ns CL = 50 pF - 5.0 10.6 1.0 12.0 1.0 13.5 ns CL = 15 pF 125 175 - 105 - 85 - MHz CL = 50 pF 85 115 - 75 - 65 - MHz MR to CP; see Figure 8 fi = 1 MHz; VI = GND to VCC power dissipation capacitance [4] 74AHCT164; VCC = 4.5 V to 5.5 V tpd [2] propagation CP to Qn; see Figure 7 delay CL = 15 pF CL = 50 pF [3] MR to Qn; see Figure 8 fmax maximum frequency see Figure 7 tW pulse width CP HIGH or LOW; see Figure 7 5.0 - - 5.0 - 5.0 - ns tWL pulse width LOW MR; see Figure 8 5.0 - - 5.0 - 5.0 - ns tsu set-up time DSA, DSB to CP; see Figure 9 4.5 - - 4.5 - 4.5 - ns th hold time DSA, DSB to CP; see Figure 9 2.0 - - 2.0 - 2.0 - ns trec recovery time MR to CP; see Figure 8 2.5 - - 2.5 - 2.5 - ns CPD power fi = 1 MHz; VI = GND to VCC dissipation capacitance - 51 - - - - - pF [4] [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL. [3] tpd is the same as tPHL only. [4] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 9 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 11. Waveforms 1/fmax VI CP input VM GND tW t PHL t PLH VOH VM Qn output 001aac426 VOL Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Clock pulse width, maximum frequency and input to output propagation delays VI VM MR input GND t WL t rec VI CP input VM GND t PHL VOH VM Qn output VOL 001aac446 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 8. Master reset pulse width, recovery time and propagation delays 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 10 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register VI VM CP input GND t su t su th th VI VM DSA, DSB input GND VOH VM Qn output VOL 001aaf612 Measurement points are given in Table 8. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical voltage output levels that occur with the output load. Fig 9. Data set-up and hold times Table 8. Measurement points Type Input Output VM VM 74AHC164 0.5 × VCC 0.5 × VCC 74AHCT164 1.5 V 0.5 × VCC 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 11 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register VI negative pulse tW 90 % VM VM 10 % GND tr tf tr VI positive pulse GND tf 90 % VM VM 10 % tW VCC G VI VO DUT RT CL 001aah768 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance Fig 10. Load circuitry for measuring switching times Table 9. Test data Type Input Load Test VI tr, tf CL 74AHC164 VCC ≤ 3.0 ns 15 pF, 50 pF tPLH, tPHL 74AHCT164 3.0 V ≤ 3.0 ns 15 pF, 50 pF tPLH, tPHL 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 12 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 12. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT108-1 (SO14) 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 13 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 Fig 12. Package outline SOT402-1 (TSSOP14) 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 14 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B w M C b L 1 7 Eh e 14 8 13 9 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b 1 0.05 0.00 0.30 0.18 mm c D (1) Dh E (1) Eh 0.2 3.1 2.9 1.65 1.35 2.6 2.4 1.15 0.85 e 0.5 e1 L v w y y1 2 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT762-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 13. Package outline SOT762-1 (DHVQFN14) 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 15 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 13. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT164_3 20080424 Product data sheet - 74AHC_AHCT164_2 Modifications: • Table 6: the conditions for input leakage current have been changed. 74AHC_AHCT164_2 20061129 Product data sheet - 74AHC_AHCT164_1 74AHC_AHCT164_1 (9397 750 07332) 20000815 Product specification - - 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 16 of 18 74AHC164; 74AHCT164 NXP Semiconductors 8-bit serial-in/parallel-out shift register 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. 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However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AHC_AHCT164_3 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 03 — 24 April 2008 17 of 18 NXP Semiconductors 74AHC164; 74AHCT164 8-bit serial-in/parallel-out shift register 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 24 April 2008 Document identifier: 74AHC_AHCT164_3