TI 74LVTH162245GRDR

SN54LVTH162245,, SN74LVTH162245
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
FEATURES
•
•
•
•
•
•
•
•
•
•
•
Members of the Texas Instruments Widebus™
Family
A-Port Outputs Have Equivalent 22-Ω Series
Resistors, So No External Resistors Are
Required
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC)
Support Unregulated Battery Operation Down
to 2.7 V
Typical VOLP (Output Ground Bounce) <0.8 V
at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SCBS260Q – JUNE 1993 – REVISED NOVEMBER 2006
SN54LVTH162245 . . . WD PACKAGE
SN74LVTH162245 . . . DGG OR DL PACKAGE
(TOP VIEW)
1DIR
1B1
1B2
GND
1B3
1B4
VCC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCC
2B5
2B6
GND
2B7
2B8
2DIR
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2OE
DESCRIPTION/ORDERING INFORMATION
The 'LVTH162245 devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for low-voltage
(3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
These devices can be used as two 8-bit transceivers or one 16-bit transceiver. The devices allow data
transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses
are effectively isolated.
The logic levels of the direction-control (DIR) input and the output-enable (OE) input activate either the B-port
outputs or the A-port outputs or place both output ports into the high-impedance mode. The device transmits
data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when
the A-port outputs are activated. The input circuitry on both A and B ports is always active and must have a logic
HIGH or LOW level applied to prevent excess ICC and ICCZ.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown
resistors with the bus-hold circuitry is not recommended.
The A-port outputs, which are designed to source or sink up to 12 mA, include equivalent 22-Ω series resistors
to reduce overshoot and undershoot.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1993–2006, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are
tested unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54LVTH162245,, SN74LVTH162245
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS260Q – JUNE 1993 – REVISED NOVEMBER 2006
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
ORDERING INFORMATION
PACKAGE (1)
TA
FBGA – GRD
FBGA – ZRD (Pb-free)
ORDERABLE PART NUMBER
Reel of 1000
Tube of 25
SSOP – DL
Reel of 1000
–40°C to 85°C
74LVTH162245GRDR
TOP-SIDE MARKING
LL2245
74LVTH162245ZRDR
SN74LVTH162245DL
SN74LVTH162245DLG4
LVTH162245
SN74LVTH162245DLR
74LVTH162245DLRG4
SN74LVTH162245DGGR
TSSOP – DGG
Reel of 2000
74LVTH162245DGGRG4
LVTH162245
74LVTH162245GRE4
VFBGA – GQL
VFBGA – ZQL (Pb-free)
–55°C to 125°C
(1)
CFP – WD
Reel of 1000
Tube
SN74LVTH162245KR
LL2245
74LVTH162245ZQLR
SNJ54LVTH162245WD
SNJ54LVTH162245WD
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
GQL OR ZQL PACKAGE
(TOP VIEW)
TERMINAL ASSIGNMENTS (1)
(56-Ball GQL/ZQL Package)
1 2 3 4 5 6
1
A
B
C
D
E
F
G
H
J
K
abc
abc
2
2
3
4
5
6
A
1DIR
NC
NC
NC
NC
1OE
B
1B2
1B1
GND
GND
1A1
1A2
C
1B4
1B3
VCC
VCC
1A3
1A4
D
1B6
1B5
GND
GND
1A5
1A6
E
1B8
1B7
1A7
1A8
F
2B1
2B2
2A2
2A1
G
2B3
2B4
GND
2A4
2A3
H
2B5
2B6
VCC
VCC
2A6
2A5
J
2B7
2B8
GND
GND
2A8
2A7
K
2DIR
NC
NC
NC
NC
2OE
(1)
GND
NC – No internal connection
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SN54LVTH162245,, SN74LVTH162245
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS260Q – JUNE 1993 – REVISED NOVEMBER 2006
TERMINAL ASSIGNMENTS (1)
(54-Ball GRD/ZRD Package)
GRD OR ZRD PACKAGE
(TOP VIEW)
1
2
3
4
5
6
A
1
2
3
4
5
6
A
1B1
NC
1DIR
1OE
NC
1A1
NC
NC
1A2
1A3
B
1B3
1B2
B
C
1B5
1B4
VCC
VCC
1A4
1A5
C
D
1B7
1B6
GND
GND
1A6
1A7
E
2B1
1B8
GND
GND
1A8
2A1
D
F
2B3
2B2
GND
GND
2A2
2A3
G
2B5
2B4
VCC
VCC
2A4
2A5
F
H
2B7
2B6
NC
NC
2A6
2A7
G
J
2B8
NC
2DIR
2OE
NC
2A8
E
H
J
(1)
NC – No internal connection
FUNCTION TABLE (1)
(EACH 8-BIT SECTION)
CONTROL INPUTS
(1)
OUTPUT CIRCUITS
OPERATION
OE
DIR
A PORT
B PORT
L
L
Enabled
Hi-Z
B data to A bus
L
H
Hi-Z
Enabled
A data to B bus
H
X
Hi-Z
Hi-Z
Isolation
Input circuits of the data I/Os always are active.
LOGIC DIAGRAM (POSITIVE LOGIC)
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
2OE
36
13
1B1
2B1
To Seven Other Channels
To Seven Other Channels
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3
SN54LVTH162245,, SN74LVTH162245
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS260Q – JUNE 1993 – REVISED NOVEMBER 2006
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VI
Input voltage range (2)
–0.5
7
V
–0.5
7
V
–0.5
VCC + 0.5
V
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high state (2)
IO
Current into any output in the low state
IO
Current into any output in the high
state (3)
state (2)
SN54LVTH162245 (B port)
96
SN74LVTH162245 (B port)
128
A port
30
SN54LVTH162245 (B port)
48
SN74LVTH162245 (B port)
64
A port
30
UNIT
mA
mA
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DGG package
70
DL package
63
GQL/ZQL package
42
GRD/ZRD package
(1)
(2)
(3)
(4)
°C/W
36
–65
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This current flows only when the output is in the high state and VO > VCC.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
SN54LVTH162245
MAX
MIN
MAX
2.7
3.6
2.7
3.6
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
0.8
V
VI
Input voltage
5.5
5.5
V
IOH
High-level output current
A port
–12
–12
B port
–24
–32
IOL
Low-level output current
A port
12
12
B port
48
64
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
Power-up ramp rate
200
TA
Operating free-air temperature
–55
(1)
4
SN74LVTH162245
MIN
2
Outputs enabled
2
10
V
10
–40
mA
mA
ns/V
µs/V
200
125
V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SN54LVTH162245,, SN74LVTH162245
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS260Q – JUNE 1993 – REVISED NOVEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
VCC = 2.7 V,
A port
VOH
B port
TYP (1)
SN74LVTH162245
MAX
MIN TYP (1)
–1.2
VCC – 0.2
2
VCC = 2.7 V to 3.6 V, IOH = –100 µA
VCC – 0.2
VCC – 0.2
2.4
2.4
IOH = –8 mA
IOH = –24 mA
2
IOH = –32 mA
2
0.2
0.2
VCC = 3 V,
IOL = 12 mA
0.8
0.8
IOL = 100 µA
0.2
0.2
IOL = 24 mA
0.5
0.5
IOL = 16 mA
0.4
0.4
IOL = 32 mA
0.5
0.5
IOL = 48 mA
0.55
VOL
B port
VCC = 3 V
IOL = 64 mA
Control
inputs
II
A or B
port (2)
VI = VCC or GND
±1
±1
VCC = 0 or 3.6 V,
VI = 5.5 V
10
10
VI = 5.5 V
20
20
5
5
VI = VCC
VI = 0
Ioff
VCC = 0,
II(hold)
A or B
port
VCC = 3 V
VCC = 3.6 V, (3)
–10
VI = 2 V
µA
–10
±100
VI or VO = 0 to 4.5 V
VI = 0.8 V
V
0.55
VCC = 3.6 V,
VCC = 3.6 V
V
V
VCC = 2.7 V to 3.6 V, IOL = 100 µA
VCC = 2.7 V
UNIT
VCC – 0.2
2
VCC = 2.7 V,
MAX
–1.2
IOH = –12 mA
VCC = 3 V
A port
MIN
II = –18 mA
VCC = 2.7 V to 3.6 V, IOH = –100 µA
VCC = 3 V,
SN54LVTH162245
75
75
–75
–75
µA
µA
500
–750
VI = 0 to 3.6 V
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
OE = don't care
±100 (4)
±100
µA
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V,
OE = don't care
±100 (4)
±100
µA
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
Outputs high
0.19
0.19
ICC
5
5
0.19
0.19
∆ICC (5)
VCC = 3 V to 3.6 V,
One input at VCC – 0.6 V,
Other inputs at VCC or GND
0.3
0.2
CI
VI = 3 V or 0
4
4
pF
Cio
VO = 3 V or 0
10
10
pF
(1)
(2)
(3)
(4)
(5)
Outputs low
Outputs disabled
mA
mA
All typical values are at VCC = 3.3 V, TA = 25°C.
Unused pins at VCC or GND
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
On products compliant to MIL-PRF-38535, this parameter is not production tested.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
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5
SN54LVTH162245,, SN74LVTH162245
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS260Q – JUNE 1993 – REVISED NOVEMBER 2006
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54LVTH162245
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V
± 0.3 V
MIN MAX
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZH
tPHZ
tPLZ
tPHZ
tPLZ
(1)
6
A
B
B
A
OE
B
OE
A
OE
B
OE
A
SN74LVTH162245
VCC = 2.7 V
MIN
MAX
VCC = 3.3 V
± 0.3 V
MIN TYP (1)
VCC = 2.7 V
MAX
MIN
MAX
1
3.5
4
1
2.3
3.3
3.7
1
3.5
3.9
1
2.2
3.3
3.5
1
4.3
5.3
1
2.8
4
4.6
1
4.2
4.5
1
2.5
3.4
3.6
1
4.8
5.9
1
2.8
4.6
5.4
1
4.8
5.5
1
3
4.6
5.2
1
5.5
7.2
1
3.3
5.3
6.3
1
5.4
6.4
1
3.3
5.1
5.8
1.5
5.5
5.8
1.5
3.8
5.2
5.5
1.5
5.5
5.8
1.5
3.5
5.1
5.4
1.5
5.8
6.5
1.5
4
5.6
5.9
1.2
6.3
6.3
1.5
3.8
5.5
5.5
tsk(LH)
0.5
tsk(HL)
0.5
All typical values are at VCC = 3.3 V, TA = 25°C.
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UNIT
ns
ns
ns
ns
ns
ns
ns
SN54LVTH162245,, SN74LVTH162245
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS260Q – JUNE 1993 – REVISED NOVEMBER 2006
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
6V
Open
S1
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
2.7 V
1.5 V
Input
1.5 V
th
2.7 V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
VOH
1.5 V
Output
1.5 V
VOL
tPHL
Output
Waveform 1
S1 at 6 V
(see Note B)
1.5 V
1.5 V
1.5 V
VOL
tPZL
tPLZ
3V
1.5 V
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZH
tPLH
VOH
Output
2.7 V
Output
Control
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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7
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
5962-9678001QXA
ACTIVE
CFP
WD
48
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9678001QX
A
SNJ54LVTH16224
5WD
5962-9678001VXA
ACTIVE
CFP
WD
48
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9678001VX
A
SNV54LVTH16224
5WD
74LVTH162245DGGRG4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVTH162245
74LVTH162245DLRG4
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVTH162245
74LVTH162245GRDR
OBSOLETE
BGA
MICROSTAR
JUNIOR
GRD
54
TBD
Call TI
Call TI
-40 to 85
LL2245
74LVTH162245GRE4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVTH162245
74LVTH162245ZQLR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
56
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
LL2245
74LVTH162245ZRDR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZRD
54
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
LL2245
SN74LVTH162245DGGR
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVTH162245
SN74LVTH162245DL
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVTH162245
SN74LVTH162245DLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVTH162245
SN74LVTH162245DLR
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVTH162245
SN74LVTH162245KR
OBSOLETE
BGA
MICROSTAR
JUNIOR
GQL
56
TBD
Call TI
Call TI
-40 to 85
LL2245
SNJ54LVTH162245WD
ACTIVE
CFP
WD
48
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9678001QX
1
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Sep-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
A
SNJ54LVTH16224
5WD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LVTH162245, SN54LVTH162245-SP, SN74LVTH162245 :
• Catalog: SN74LVTH162245, SN54LVTH162245
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
• Enhanced Product: SN74LVTH162245-EP, SN74LVTH162245-EP
• Military: SN54LVTH162245
• Space: SN54LVTH162245-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Oct-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
74LVTH162245ZQLR
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
74LVTH162245ZRDR
BGA MI
CROSTA
R JUNI
OR
ZRD
54
1000
330.0
16.4
5.8
8.3
1.55
8.0
16.0
Q1
SN74LVTH162245DGGR TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
SN74LVTH162245DLR
SSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Oct-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74LVTH162245ZQLR
BGA MICROSTAR
JUNIOR
ZQL
56
1000
333.2
345.9
28.6
74LVTH162245ZRDR
BGA MICROSTAR
JUNIOR
ZRD
54
1000
333.2
345.9
28.6
SN74LVTH162245DGGR
TSSOP
DGG
48
2000
367.0
367.0
45.0
SN74LVTH162245DLR
SSOP
DL
48
1000
367.0
367.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
WD (R-GDFP-F**)
CERAMIC DUAL FLATPACK
48 LEADS SHOWN
0.120 (3,05)
0.075 (1,91)
0.009 (0,23)
0.004 (0,10)
1.130 (28,70)
0.870 (22,10)
0.370 (9,40)
0.250 (6,35)
0.390 (9,91)
0.370 (9,40)
0.370 (9,40)
0.250 (6,35)
48
1
0.025 (0,635)
A
0.014 (0,36)
0.008 (0,20)
25
24
NO. OF
LEADS**
48
56
A MAX
0.640
(16,26)
0.740
(18,80)
A MIN
0.610
(15,49)
0.710
(18,03)
4040176 / D 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification only
Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA
GDFP1-F56 and JEDEC MO -146AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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